ATMEL AT42QT2160-MMU

Features
• Number of keys: up to 16 keys, and one slider (constructed from 2 to 8 keys)
• Number of I/O lines: 11 (3 dedicated - configurable for input or output, 8 shared output only), PWM control for LED driving
• Technology: patented spread-spectrum charge-transfer (transverse mode)
• Key outline sizes: 6 mm x 6 mm or larger (panel thickness dependent); widely different
sizes and shapes possible
• Key spacings: 8 mm or wider, center to center (panel thickness dependent)
• Slider design: 2 to 8 keys placed in sequence, same design as keys
• Electrode design: two-part electrode shapes (drive-receive); wide variety of possible
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layouts
PCB layers required: one layer (with jumpers), two layers (no jumpers)
Electrode materials: PCB, FPCB, silver or carbon on film, ITO on film
Panel materials: plastic, glass, composites, painted surfaces (low particle density
metallic paints possible)
Adjacent metal: compatible with grounded metal immediately next to keys
Panel thickness: up to 3 mm glass, 2.5 mm plastic (key size dependent)
Key sensitivity: individually settable via simple commands over I2C-compatible
interface
Interface: I2C-compatible slave mode (100kHz)
Moisture tolerance: best in class
Power: 1.8 V to 5.5 V
Package: 28-pin 4 x 4 mm MLF RoHS compliant
Signal processing: self-calibration, auto drift compensation, noise filtering, Adjacent
Key SuppressionTM technology
Applications: laptop, mobile, consumer appliances, PC peripheral etc.
Patents: AKS™ (patented Adjacent Key Suppression™) technology
QMatrix™ (patented charge-transfer method)
QSlide™ (patented charge-transfer method) (patent-pending QSlide sensing
configuration)
This datasheet is applicable to revision 4R0 chips only
QSlide™, 16-key
QMatrix™
Sensor IC
AT42QT2160
1. Overview
The AT42QT2160-MMU ( QT2160 ) is designed for use with up to 16 keys and a slider
(constructed from 2 keys up to 8 keys). There are three dedicated General Purpose
Input/Outputs (GPIOs) which can be used as inputs for mechanical switches etc. or as driven
outputs. There are eight shared General Purpose Outputs (GPOs) (X0...X7) which are driven
outputs only. There is PWM control for all GPIO/GPOs.
The QMatrix™ technology employs transverse charge-transfer sensing electrode
designs which can be made very compact and are easily wired. Charge is forced from
an emitting electrode into the overlying panel dielectric, and then collected on a
receiver electrode. This directs the charge into a sampling capacitor which is then
converted directly to digital form, without the use of amplifiers.
The keys are configured in a matrix format that minimizes the number of required scan
lines and device pins. The key electrodes can be designed into a conventional Printed
Circuit Board (PCB) or Flexible Printed Circuit Board (FPCB) as a copper pattern, or
as printed conductive ink on plastic film.
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2. Pinout and Pin Listing Description
2.1
Pinout Description
I2CA1
SDA
SCL
RST
Y0A
1
28 27 26 25 24 23 22
21
GPIO3
2
20
Y1B
VDD
3
19
Y0B
VSS
4
18
VSS
X6
5
17
VDD
X7
6
16
VDD
CHANGE
7
QT2160
8 9
15
10 11 12 13 14
I2CA0
X5
X4
X3
X2
X1
X0
SMP
VRef
2.2
Y1A
GPIO1
GPIO2
Pin Listing Description
Table 2-1.Pin Listing
2
Comments
If Unused,
Connect To...
Pin
Function
I/O
1
GPIO2
I/O
General purpose input/output 2
-
2
GPIO3
I/O
General purpose input/output 3
-
3
Vdd
P
Power
-
4
Vss
P
Supply ground
-
5
X6
O
X matrix drive line / shared GPO X6
Leave open
6
X7
O
X matrix drive line / shared GPO X7
Leave open
7
CHANGE
OD
State change notification
Leave open
8
Vref
P
Supply ground
-
9
SMP
O
Sample output.
-
10
X0
O
X matrix drive line / shared GPO X0
Leave open
11
X1
O
X matrix drive line / shared GPO X1
Leave open
12
X2
O
X matrix drive line / shared GPO X2
Leave open
13
X3
O
X matrix drive line / shared GPO X3
Leave open
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Table 2-1.Pin Listing (continued)
Comments
If Unused,
Connect To...
Pin
Function
I/O
14
X4
O
X matrix drive line / shared GPO X4
Leave open
15
X5
O
X matrix drive line / shared GPO X5
Leave open
16
Vdd
P
Power
-
17
Vdd
P
Power
-
18
Vss
P
Supply ground
-
19
Y0B
I/O
Y line connection
Leave open
20
Y1B
I/O
Y line connection
Leave open
21
I2CA0
I
I2C-compatible address select
-
22
I2CA1
I
I2C-compatible address select
-
23
SDA
OD
Serial Interface Data
-
24
SCL
OD
Serial Interface Clock
-
25
RST
I
26
Y0A
I/O
Y line connection
Leave open
27
Y1A
I/O
Y line connection
Leave open
28
GPIO1
I/O
General purpose input/output 1
Reset low; has internal 30k - 60k pullup
Leave open or
Vdd
3. Introduction
The QT2160 device is a digital burst mode charge-transfer (QT) sensor designed specifically for
matrix layout touch controls; it includes all signal processing functions necessary to provide
stable sensing under a wide variety of changing conditions. Only a few external parts are
required for operation. The entire circuit can be built within a few square centimeters of
single-sided PCB area. CEM-1 and FR1 punched, single-sided materials can be used for the
lowest possible cost. The PCB’s rear can be mounted flush on the back of a glass or plastic
panel using a conventional adhesive, such as 3M VHB two-sided adhesive acrylic film.
The QT2160 employs transverse charge-transfer (QT) sensing, a technology that senses
changes in electrical charge forced across two electrode elements by a pulse edge (see
Figure 3-1). The QT2160 allows a wide range of key sizes and shapes to be mixed together in a
single touch panel.
The device uses an I2C-compatible interface to allow key data to be extracted and to permit
individual key parameter setup. The command structure is designed to minimize the amount of
data traffic while maximizing the amount of information conveyed.
In addition to normal operating and setup functions the device can also report back actual signal
strengths.
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Figure 3-1.
Field Flow Between X and Y Elements
overlying panel
X
element
3.1
Y
elem ent
Keys and Slider
The QT2160 is capable of a maximum of 16 keys. These can be located anywhere within an
electrical grid of 8X and 2Y scan lines.
A lesser number of enabled keys will cause any unused acquisition burst timeslots to be pared
from the sampling sequence, to optimize acquire speed and lessen power consumption. Thus, if
only 8 keys are actually enabled, only 8 timeslots are used for scanning.
Additional processing can be done on the keys to form a slider. The slider will have to start at X0
and use only Y0. The slider can consist of a minimum of 2 keys and a maximum of 8 keys.
3.2
Enabling/Disabling Keys
Keys can be enabled by setting a nonzero burst length. A zero burst length disables the key.
4. Hardware and Functional
4.1
Matrix Scan Sequence
The circuit operates by scanning each key sequentially, key by key. Key scanning begins with
location X = 0, Y = 0 (key 0). X axis keys are known as rows while Y axis keys are referred to as
columns although this has no reflection on actual wiring. Keys are scanned sequentially by row,
for example the sequence X0Y0 X1Y0...X7Y0, X0Y1, X1Y1... etc. Keys are also numbered from
0...15. Key 0 is located at X0Y0. Table 4-1 shows the key numbering.
Table 4-1.
Key Numbers
X7
X6
X5
X4
X3
X2
X1
X0
Y0
7
6
5
4
3
2
1
0
Y1
15
14
13
12
11
10
9
8
Key numbers
Each key is sampled in a burst of acquisition pulses whose length is determined by the Setups
parameter BL (Section 4.2 on page 5); this can be set on a per-key basis. A burst is completed
entirely before the next key is sampled; at the end of each burst the resulting signal is converted
to digital form and processed. The burst length directly impacts key gain; each key can have a
unique burst length in order to allow tailoring of key sensitivity on a key-by-key basis.
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4.2
Burst Paring
Keys that are disabled by setting their burst length to zero have their bursts removed from the
scan sequence to save scan time and thus power. The QT2160 operates on a fixed 16 ms cycle
and will go to sleep after all acquisitions and processing is done till the next 16ms cycle starts.
As a consequence, the fewer keys, the less power is consumed.
4.3
Cs Sample Capacitor Operation
Cs capacitors (Cs0...Cs1) absorb charge from the key electrodes on the rising edge of each X
pulse. On each falling edge of X, the Y matrix line is clamped to ground to allow the electrode
and wiring charges to neutralize in preparation for the next pulse. With each X pulse charge
accumulates on Cs causing a staircase increase in its differential voltage.
After the burst completes, the device clamps the Y line to ground causing the opposite terminal
to go negative. The charge on Cs is then measured using an external resistor to ramp the
negative terminal upwards until a zero crossing is achieved. The time required to zero cross
becomes the measurement result.
The Cs capacitors should be connected as shown in Figure 4-8 on page 15. The value of these
capacitors is not critical but 4.7 nF is recommended for most cases. They should be 10 percent
X7R ceramic. If the transverse capacitive coupling from X to Y is large enough the voltage on a
Cs capacitor can saturate, destroying gain. In such cases the burst length should be reduced
and/or the Cs value increased. See Section 4.4.
If a Y line is not used its corresponding Cs capacitor may be omitted and the pins left floating.
4.4
Sample Capacitor Saturation
Cs voltage saturation at a pin YnB is shown in Figure 4-1. Saturation begins to occur when the
voltage at a YnB pin becomes more negative than -0.25V at the end of the burst. This
nonlinearity is caused by excessive voltage accumulation on Cs inducing conduction in the pin
protection diodes. This badly saturated signal destroys key gain and introduces a strong thermal
coefficient which can cause phantom detection. The cause of this is either from the burst length
being too long, the Cs value being too small, or the X-Y transfer coupling being too large.
Solutions include loosening up the key structure interleaving, more separation of the X and Y
lines on the PCB, increasing Cs, and decreasing the burst length.
Increasing Cs will make the part slower; decreasing burst length will make it less sensitive. A
better PCB layout and a looser key structure (up to a point) have no negative effects.
Cs voltages should be observed on an oscilloscope with the matrix layer bonded to the panel
material; if the Rs side of any Cs ramps more negative than -0.25 volts during any burst (not
counting overshoot spikes which are probe artifacts), there is a potential saturation problem.
Figure 4-2 shows a defective waveform similar to that of Figure 4-1, but in this case the
distortion is caused by excessive stray capacitance coupling from the Y line to AC ground; for
example, from running too near and too far alongside a ground trace, ground plane, or other
traces. The excess coupling causes the charge-transfer effect to dissipate a significant portion of
the received charge from a key into the stray capacitance. This phenomenon is more subtle; it
can be best detected by increasing BL to a high count and watching what the waveform does as
it descends towards and below -0.25V. The waveform will appear deceptively straight, but it will
slowly start to flatten even before the -0.25V level is reached.
A correct waveform is shown in Figure 4-3. Note that the bottom edge of the bottom trace is
substantially straight (ignoring the downward spikes).
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Unlike other QT circuits, the Cs capacitor values on QT2160 devices have no effect on
conversion gain. However, they do affect conversion time.
Unused Y lines should be left open.
Figure 4-1.
VCs – Nonlinear During Burst
(Burst too long, or Cs too small, or X-Y transcapacitance too large)
X Drive
YnB
Figure 4-2.
VCs – Poor Gain, Nonlinear During Burst
(Excess capacitance from Y line to Gnd)
X Drive
YnB
Figure 4-3.
VCs – Correct
X Drive
YnB
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Figure 4-4.
Drive Pulse Roll-off and Dwell Time
X drive
Lost charge due to
inadequate settling
before end of dwell time
Dwell time
Y gate
Note:
4.5
The Dwell time is a minimum of ~250ns - see Section 4.7
Sample Resistors
The sample resistors (Rs0...Rs1) are used to perform single-slope ADC conversion of the
acquired charge on each Cs capacitor. These resistors directly control acquisition gain; larger
values of Rs will proportionately increase signal gain. For most applications Rs should be 1MΩ.
Unused Y lines do not require an Rs resistor.
4.6
Signal Levels
The signal values should normally be in the range of 200 to 750 counts with properly designed
key shapes and values of Rs. However, long adjacent runs of X and Y lines can also artificially
boost the signal values, and induce signal saturation; this is to be avoided. The X-to-Y coupling
should come mostly from intra-key electrode coupling, not from stray X-to-Y trace coupling.
The signal swing from the smallest finger touch should preferably exceed 8 counts, with 12
being a reasonable target. The signal threshold setting (NTHR) should be set to a value
guaranteed to be less than the signal swing caused by the smallest touch.
Increasing the burst length (BL) parameter will increase the signal strengths, as will increasing
the sampling resistor (Rs) values.
4.7
Matrix Series Resistors
The X and Y matrix scan lines can use series resistors (Rx0...Rx7 and Ry0...Ry1 respectively)
for improved EMC performance (Figure 4-8 on page 15).
X drive lines require Rx in most cases to reduce edge rates and thus reduce RF emissions.
Values range from 1 kΩ to 20 kΩ, typically 1 kΩ.
Y lines need Ry to reduce EMC susceptibility problems and in some extreme cases, ESD.
Typical Y values are about 1 kΩ. Y resistors act to reduce noise susceptibility problems by
forming a natural low-pass filter with the Cs capacitors.
It is essential that the Rx and Ry resistors and Cs capacitors be placed very close to the chip.
Placing these parts more than a few millimeters away opens the circuit up to high frequency
interference problems (above 20 MHz) as the trace lengths between the components and the
chip start to act as RF antennae.
The upper limits of Rx and Ry are reached when the signal level and hence key sensitivity are
clearly reduced. The limits of Rx and Ry will depend on key geometry and stray capacitance,
and thus an oscilloscope is required to determine optimum values of both.
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Dwell time is the duration in which charge coupled from X to Y is captured (Figure 4-4
on page 7). Increasing Rx values will cause the leading edge of the X pulses to increasingly roll
off, causing the loss of captured charge (and hence loss of signal strength) from the keys.
The dwell time is a minimum of 250 ns. If the X pulses have not settled within 250 ns, key gain
will be reduced; if this happens, either the stray capacitance on the X line(s) should be reduced
(by a layout change, for example by reducing X line exposure to nearby ground planes or
traces), or, the Rx resistor needs to be reduced in value (or a combination of both approaches).
One way to determine X line settling time is to monitor the fields using a patch of metal foil or a
small coin over the key (Figure 4-5). Only one key along a particular X line needs to be
observed, 250 ns dwell time should exceed the observed 95 percent settling of the X-pulse by
25 percent or more.
In almost all cases, Ry should be set equal to Rx, which will ensure that the charge on the Y line
is fully captured into the Cs capacitor.
Figure 4-5.
4.8
Probing X-Drive Waveforms With a Coin
Key Design
Circuits can be constructed out of a variety of materials including conventional FR-4, Flexible
Printed Circuit Boards (FPCB), silver silk-screened on PET plastic film, and even inexpensive
punched single-sided CEM-1 and FR-2.
The actual internal pattern style is not as important as the need to achieve regular X and Y
widths and spacings of sufficient size to cover the desired graphical key area or a little bit more;
~3mm oversize is acceptable in most cases, since the key’s electric fields drop off near the
edges anyway. The overall key size can range from 6mm x 6mm up to 100mm x 100mm but
these are not hard limits. The keys can be any shape including round, rectangular, square, etc.
The internal pattern can be interdigitated as shown in Figure 4-6.
For small, dense keypads, electrodes such as shown in the lower half of Figure 4-6 can be used.
Where the panels are thin (under 2 mm thick) the electrode density can be quite high.
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For better surface moisture suppression, the outer perimeter of X should be as wide as possible,
and there should be no ground planes near the keys. The variable “T" in this drawing represents
the total thickness of all materials that the keys must penetrate.
Figure 4-6.
Recommended Key Structure
Y0
X0
Y1
Note:
4.9
4.9.1
“T" should ideally be similar to the complete thickness the fields need to penetrate to the touch
surface. Smaller dimensions will also work but will give less signal strength. If in doubt, make the
pattern coarser. The lower figure shows a simpler structure used for compact key layouts, for
example for mobile phones. A layout with a common X drive and two receive electrodes is
depicted
Setting the Slider
Introduction
Groups of keys can be configured as a slider, in addition to their use as keys. The slider uses the
Y0 line of the matrix and must start at X0, with the keys placed in consecutive numerical order.
The slider can take up a programmable number of keys on the Y0 line. The remaining keys on
that Y line behave as normal.
Positional data is calculated in a customizable range of 2 bits (0-3) to 8 bits (0-255). Geometric
constraints may mean that the data will not reach the full range. Thinner dielectric or the use of
more keys in a slider will increase the data range towards the ends.
Stability of the reported position will be dependent on the amount of signal on the slider keys.
Running at higher resolutions, with a thick panel might produce a fluctuating reported position.
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Key sizes should be in the 5-7mm range when used in the slider to get the best linearity. The
slider should be made up of however many of these elements are required to fit their
dimensions.
The slider will be treated as an object in the Adjacent Key Suppression (AKS) groupings. The
keys in the slider would normally be set to the same burst length and threshold, although
adjustments can be made in these at the expense of linearity.
4.9.2
AKS Technology and the Slider
There can be up to three AKS groups, implemented so that only one key in each group may be
reported as being touched at any one time. The AKS technique will lock onto the dominant key,
and until this key is released, other keys in the group will not be reported as in detection. This
allows a user to slide a finger across multiple keys with only the dominant key reporting touch.
Each key may be in one of the groups 1...3, or in group 0 meaning that it is not AKS enabled.
Keys in the slider are not able to use AKS technique against each other. This is necessary to
enable smooth scrolling. Multiple keys within the slider can be in detect at the same time,
regardless of the AKS settings. The AKS technique will, however, work against keys outside the
object or within another object. For example, if a slider is in the same AKS group as keys, then
touching anywhere on the slider will cause the AKS technique to suppress the keys. Similarly
touching the keys first will suppress the slider.
Note:
4.10
4.10.1
For normal operation all keys in the slider should be placed in the same AKS group.
PCB Layout, Construction
Overview
It is best to place the chip near the touch keys on the same PCB so as to reduce X and Y trace
lengths, thereby reducing the chances for EMC problems. Long connection traces act as RF
antennae. The Y (receive) lines are much more susceptible to noise pickup than the X (drive)
lines.
Even more importantly, all signal related discrete parts (resistors and capacitors) should be very
close to the body of the chip. Wiring between the chip and the various resistors and capacitors
should be as short and direct as possible to suppress noise pickup.
Ground planes, if used, should be placed under or around the QT chip itself and the associated
resistors and capacitors in the circuit, under or around the power supply, and back to a
connector. Ground planes can be used to shield against radiated noise, but at the expense of a
reduction in sensitivity as described previously.
Note:
4.10.2
10
When using ground planes/floods, parasitic capacitance on Y lines can lead to reduced chargetransfer efficiency. For noise suppression, ground planes/floods can be beneficial around and
between keys on the touch side of the PCB. However, it is advisable to route Y lines on the PCB
layer furthest away from the plane/flood, to reduce parasitic capacitance. Cross-hatched ground
patterns can act as effective shields, while helping to reduce parasitic capacitance. Ground
planes/floods around the chip are generally acceptable, taking into account the same considerations as for the Y line parasitics.
LED Traces and Other Switching Signals
Digital switching signals near the Y lines will induce transients into the acquired signals,
deteriorating the SNR performance of the device. Such signals should be routed away from the
Y lines, or the design should be such that these lines are not switched during the course of
signal acquisition (bursts).
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LED terminals which are multiplexed or switched into a floating state and which are within or
physically very near a key structure (even if on another nearby PCB) should be bypassed to
either Vss or Vdd with at least a 10nF capacitor to suppress capacitive coupling effects which
can induce false signal shifts. The bypass capacitor does not need to be next to the LED, in fact
it can be quite distant. The bypass capacitor is noncritical and can be of any type.
LED terminals which are constantly connected to Vss or Vdd do not need further bypassing.
4.10.3
Tracks
The central pad on the underside of the chip should be connected to ground. Do not run any
tracks underneath the body of the chip, only ground.
Figure 4-7.
Position of Tracks
Example of good tracking
4.10.4
Example of bad tracking
PCB Cleanliness
All capacitive sensors should be treated as highly sensitive circuits which can be influenced by
stray conductive leakage paths. QT devices have a basic resolution in the femtofarad range; in
this region, there is no such thing as “clean flux". Flux absorbs moisture and becomes
conductive between solder joints, causing signal drift and resultant false detections or transient
losses of sensitivity or instability. Conformal coatings will trap in existing amounts of moisture
which will then become highly temperature sensitive.
The designer should specify ultrasonic cleaning as part of the manufacturing process, and in
cases where a high level of humidity is anticipated, the use of conformal coatings after cleaning
to keep out moisture.
4.11
Power Supply Considerations
See Section 10.2 on page 43 for the Vdd range and short-term power supply fluctuations. If the
power supply fluctuates slowly with temperature, the device will track and compensate for these
changes automatically with only minor changes in sensitivity. If the supply voltage drifts or shifts
quickly, the drift compensation mechanism will not be able to keep up, causing sensitivity
anomalies or false detections.
As the device uses the power supply itself as an analog reference, the power should be very
clean and come from a separate regulator. A standard inexpensive Low Dropout (LDO) type
regulator should be used that is not also used to power other loads such as LEDs, relays, or
other high current devices. Load shifts on the output of the LDO can cause Vdd to fluctuate
enough to cause false detection or sensitivity shifts.
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Caution: A regulator IC shared with other logic devices can result in erratic operation and is not
advised.
A regulator can be shared among two or more QT devices on one board. Refer to page 15 for
suggested regulator manufacturers.
A single ceramic 0.1uF bypass capacitor, with short traces, should be placed very close to
supply pins 3 and 4 of the IC. Failure to do so can result in device oscillation, high current
consumption, erratic operation etc. Pins 16 and 17 do not require bypassing if the traces
between these pins and power traces are short.
4.12
Startup/Calibration Times
The device requires initialization times of approximately 70ms. The CHANGE line will go low and
calibration will start (takes 15 matrix scans), after this start up period is over.
4.13
Calibration
Calibration does not occur periodically. Keys are only calibrated on power-up and when:
• Enabled
AND
– held in detect for too long. The negative recalibration delay (NRD) period is specified
by the user
OR
– the signal delta value is greater than the positive threshold value, defined as
reference value plus three-quarters of the negative threshold
OR
– the user issues a recalibrate command
An interrupt on the CHANGE pin occurs when there is a change in the key status bytes. An
interrupt will occur on calibration only if at least one of the keys or objects was in detect as
recalibration will then cause a status change.
4.14
Reset Input
The RST pin can be used to reset the device to simulate a power-down cycle, in order to bring
the device up into a known state should communications with the device be lost. The pin is
active low, and a low pulse lasting at least 10µs must be applied to this pin to cause a reset.
If an external hardware reset is not used, the reset pin may be connected to Vdd.
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4.15
Spread Spectrum Acquisitions
QT2160 uses spread-spectrum burst modulation. This has the effect of drastically reducing the
possibility of EMI effects on the sensor keys, while simultaneously spreading RF emissions. This
feature is hard-wired into the device and cannot be disabled or modified.
Spread spectrum is configured as a frequency chirp over a wide range of frequencies for robust
operation.
4.16
Detection Integrator
See also Section 4.2 on page 5.
The device features a detection integration mechanism, which acts to confirm a detection in a
robust fashion. A per-key counter is incremented each time the key has exceeded its threshold
and stayed there for a number of acquisitions. When this counter reaches a preset limit the key
is finally declared to be touched.
For example, if the limit value is 10, then the device has to exceed its threshold and stay there
for 10 acquisitions in succession without going below the threshold level, before the key is
declared to be touched. If on any acquisition the signal is not seen to exceed the threshold level,
the counter is cleared and the process has to start from the beginning.
4.17
Sleep
The device operates on a fixed 16ms cycle time basis. The device will perform a set of
measurements and then sleep for the rest of the cycle to conserve power.
There are two user-configurable sleep modes; Low Power (LP) mode and SLEEP mode.
The LP setting (see Section 4.2 on page 5) is used for conserving power when there are no
touches and is set to be a long time period. This will determine how often the device wakes up to
do drift compensation. It also determines the maximum response time to the first touch after
inactivity.
When a valid touch is registered, the device enters minimum cycle time (16ms) for a faster
response to key touch and object operation. The device will stay in this mode if it continues to
see keys being touched and released. There is a user-selectable inactivity timeout i.e. the
awake timeout.
The measurement period needs to be shorter than the 16ms fixed cycle time for optimum
operation. If the measurement time exceeds the 16ms fixed cycle time, a CYCLE OVERRUN bit
is set in the general status register. The QT2160 will still operate if the 16ms fixed cycle time is
exceeded, but the timing for the timed parameters, e.g. drift compensation negative recalibration
time out etc. will slightly change.
A low power setting of zero causes the device to enter an ultra-low power mode (SLEEP), where
no measurements are carried out. SLEEP mode also stops the internal watchdog timer, so that
the part is totally dormant, and current drain is <2µA. The PWM function will not be carried out
during SLEEP, therefore it is recommended driving the GPIOs/GPOs to known states before
entering SLEEP mode.
The QT2160 wakes from SLEEP mode if there is an address match on the I2C-compatible bus, a
hardware reset on the RST pin or an LP mode is set. If the Wake option is set for the dedicated
GPIO inputs, then the QT2160 will trigger the CHANGE line if a change in status (either positive
or negative going edge) of the respective GPIO is detected, in SLEEP mode.
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4.18
General Purpose Inputs/Outputs
There are three dedicated GPIOs (GPIO1...3) and eight GPOs shared with X lines (X0...7).
Shared GPOs are always outputs, whereas dedicated GPIOs can be set to be outputs or inputs.
GPIOs set to input can be used for reading dome switches or logic signals. Outputs can be used
to drive LEDs, or other devices. It is recommended driving external devices through the use of
bipolar transistors or MOSFETs, so as not to affect capacitive sensing if a load fluctuates the
power rail by drawing/sinking too much current.
All GPOs and GPIOs set to output can be PWM driven, if the corresponding PWM bit is set. Note
that the PWM duty cycle will be an approximation, as GPIOs will not be switched during
acquisition bursts.
The dedicated GPIOs have a Wake option, that if enabled will enable dedicated GPIOs set as
inputs, to be read in SLEEP mode.
Note that shared GPOs (X0...X7) are driven by the burst pulses during acquisition bursts, if the
corresponding X line is used in the keys/slider. A low pass filter can be inserted to eliminate
these burst pulses, as shown in Figure 4-9 on page 16.
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4.19
Wiring
Figure 4-8.
Wiring Diagram
Vunreg
follow regulator manufacturers recommended values for input
and output bypass capacitors.
VDD
VREG
tightly wire a 100nF bypass capacitor between Vdd and Vss (pins 3 and 4).
Rx7
MATRIX X DRIVE
Rx6
Rx5
VDD
Rx4
Rp
I2C
Rp
Rx3
QT2160
Rx2
Rx1
SDA
Rx0
SCL
VDD
General purpose
inputs/outputs
Rchg
CHANGE
I2C ADDRESS
SELECT
Cs0
Ry1
Cs1
Rs1
Rs0
MATRIX Y SCAN IN
Ry0
Notes:
1) the central pad on the underside of the chip is a
Vss pin and should be connected to ground.
Do not put any other tracks underneath the body
of the chip.
2) it is important to place all Rx, Ry, Cs and Rs
components physically near to the chip.
3) leave YnA, YnB unconnected
if not used.
Suggested regulator manufacturers:
• Toko (XC6215 series)
• Seiko (S817 series)
• BCDSemi (AP2121 series)
Re Figure 4-8 check the following sections for component values:
• Section 4.3 on page 5: Cs capacitors (Cs0...Cs1)
• Section Note: on page 7: Sample resistors (Rs0...Rs1)
• Section 4.7 on page 7: Matrix resistors (Rx0...Rx7, Ry0...Ry1)
• Section 4.11 on page 11: Voltage levels
• Section 6.4 on page 22: SDA, SCL pull-up resistors (Rp)
• Section 4.2 on page 5: CHANGE resistor (Rchg)
• Section 4.2 on page 5: I2C-compatible addresses
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Figure 4-9.
16
Inputs/Outputs
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5. I2C-compatible Bus Operation
5.1
Interface Bus
More detailed information about the I 2 C -compatible bus protocol is available from
www.i2C-bus.org. Devices are connected onto the I2C-compatible bus as shown in Figure 5-1.
Both bus lines are connected to Vdd via pull-up resistors. The bus drivers of all I2C-compatible
devices must be open-drain type. This implements a wired-AND function which allows any and
all devices to drive the bus, one at a time. A low level on the bus is generated when a device
outputs a zero.
Figure 5-1.
I2C-compatible Interface Bus
Vdd
Device 1
Device 2
Device 3
Device n
R1
R2
SDA
SCL
Table 5-1.
5.2
I2C-compatible Bus Specifications
Parameter
Unit
Address space
7-bit
Maximum bus speed (SCL)
100 kHz
Hold time START condition
4 µs minimum
Setup time for STOP condition
4 µs minimum
Bus free time between a STOP and START condition
4.7 µs minimum
Rise times on SDA and SCL
1 µs maximum
Transferring Data Bits
Each data bit transferred on the bus is accompanied by a pulse on the clock line. The level of the
data line must be stable when the clock line is high; The only exception to this rule is for
generating START and STOP conditions.
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Figure 5-2.
Data Transfer
SDA
SCL
Data Stable
Data Stable
Data Change
5.3
START and STOP Conditions
The host initiates and terminates a data transmission. The transmission is initiated when the
host issues a START condition on the bus, and is terminated when the host issues a STOP
condition. Between START and STOP conditions, the bus is considered busy. As shown below,
START and STOP conditions are signaled by changing the level of the SDA line when the SCL
line is high.
Figure 5-3.
START and STOP Conditions
SDA
SCL
START
5.4
STOP
Address Packet Format
All address packets are 9 bits long, consisting of 7 address bits, one READ/WRITE control bit
and an acknowledge bit. If the READ/WRITE bit is set, a read operation is performed, otherwise
a write operation is performed. When the device recognizes that it is being addressed, it will
acknowledge by pulling SDA low in the ninth SCL (ACK) cycle. An address packet consisting of
a slave address and a READ or a WRITE bit is called SLA+R or SLA+W, respectively.
The most significant bit of the address byte is transmitted first. The address sent by the host
must be consistent with that selected with the option jumpers.
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Figure 5-4.
Address Packet Format
Addr MSB
Addr LSB
R/W
ACK
7
8
9
SDA
SCL
1
2
START
5.5
Data Packet Format
All data packets are 9 bits long, consisting of one data byte and an acknowledge bit. During a
data transfer, the host generates the clock and the START and STOP conditions, while the
Receiver is responsible for acknowledging the reception. An acknowledge (ACK) is signaled by
the Receiver pulling the SDA line low during the ninth SCL cycle. If the Receiver leaves the SDA
line high, a NACK is signaled.
5.6
Combining Address and Data Packets Into a Transmission
A transmission consists of a START condition, an SLA+R/W, one or more data packets and a
STOP condition. The wired-ANDing of the SCL line is used to implement handshaking between
the host and the device. The device extends the SCL low period by pulling the SCL line low
whenever it needs extra time for processing between the data transmissions.
Holding down either SCL or SDA for clock stretching or any other purpose will slow down the
operation of the QT2160. If SCL or SDA is continuously held low for more than ~12ms, this will
be deemed as a error condition and the I2C-compatible unit reset.
Note: Each write or read cycle must end with a STOP condition. The QT2160 may not respond
correctly if a cycle is terminated by a new START condition.
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Figure 5-6 shows a typical data transmission. Note that several data bytes can be transmitted
between the SLA+R/W and the STOP.
Figure 5-5.
Data Packet Format
Data MSB
Data LSB
ACK
Aggregate
SDA
SDA from
Transmitter
SDA from
Receiver
SCL from
Master
1
2
7
Data Byte
SLA+R/W
Figure 5-6.
8
9
STOP or
Next Data Byte
Packet Transmission
Addr MSB
Addr LSB
R/W
ACK
Data MSB
7
8
9
1
Data LSB
ACK
8
9
SDA
SCL
1
START
20
2
SLA+R/W
2
7
Data Byte
STOP
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6. Interfaces
6.1
I2C-compatible Protocol
The I2C-compatible protocol is based around access to an address table and supports multibyte
reads and writes.
Note: Each write or read cycle must end with a stop condition. The QT2160 may not respond
correctly if a cycle is terminated by a new start condition.
6.2
I2C-compatible Addresses
Four preset I2C-compatible addresses are selectable through pin I2CA0 and I2CA1 (Table 6-1).
I2C-compatible Addresses
Table 6-1.
6.3
6.3.1
I2CA1
I2CA0
Address
0
0
0x0D
0
1
0x17
1
0
0x44
1
1
0x6B
Data Read/Write
Writing Data to the Device
The sequence of events required to write data to the device is shown next.
Host to Device
S
SLA+W
A
MemAddress
Device to Host
A
Data
A
P
Key
S
Start condition
SLA+W
Slave address plus write bit
A
Acknowledge bit
MemAddress
Target memory address within device
Data
Data to be written
P
Stop condition
The host initiates the transfer by sending the START condition, and follows this by sending the
slave address of the device together with the Write-bit. The device sends an ACK. The host then
sends the memory address within the device it wishes to write to. The device sends an ACK.
The host transmits one or more data bytes; each will be acknowledged by the device.
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If the host sends more than one data byte, they will be written to consecutive memory
addresses. The device automatically increments the target memory address after writing each
data byte. After writing the last data byte, the host should send the STOP condition.
The host should not try to write beyond address 255 because the device will not increment the
internal memory address beyond this.
6.3.2
Reading Data From the Device
The sequence of events required to read data from the device is shown next.
Host to Device
S
SLA+W
A
Data 1
A
Device to Host
MemAddress A P
Data 2
A
S
SLA+R
Data n
A
/A P
The host initiates the transfer by sending the START condition, and follows this by sending the
slave address of the device together with the Write-bit. The device sends an ACK. The host then
sends the memory address within the device it wishes to read from. The device sends an ACK.
The host must then send a STOP and a START condition followed by the slave address again
but this time accompanied by the Read-bit. The device will return an ACK, followed by a data
byte. The host must return either an ACK or NACK. If the host returns an ACK, the device will
subsequently transmit the data byte from the next address. Each time a data byte is transmitted,
the device automatically increments the internal address. The device will continue to return data
bytes until the host responds with a NACK. The host should terminate the transfer by issuing the
STOP condition.
6.4
SDA, SCL
The I2C-compatible bus transmits data and clock with SDA and SCL. They are open-drain; that is
I2C-compatible master and slave devices can only drive these lines low or leave them open. The
termination resistors (Rp) pull the line up to Vdd if no I2C-compatible device is pulling it down.
The termination resistors commonly range from 1kΩ to 10kΩ and should be chosen so that the
rise times on SDA and SCL meet the I2C-compatible specifications (1µs maximum).
6.5
CHANGE Pin
The CHANGE pin is an active low open drain output that can be used to alert the host of any
changes to any of the 5 status bytes (address 2 to 6), thus reducing the need for wasteful
I 2 C -compatible communications. After setting up the QT2160, the host can simply not
communicate with the device, except when the CHANGE pin goes active.
CHANGE goes inactive again only when the host performs a read from all status bytes which
have changed.
Poll rate: The host can make use of the CHANGE pin output to initiate a communication; this will
guarantee the optimal polling rate.
If the host cannot make use of the CHANGE pin, the poll rate should be no faster than once per
matrix scan (see Section 10.4 on page 44). Anything faster will not provide new information and
will slow down the chip operation.
The CHANGE pin requires a pull-up resistor, with a typical value of ~100kΩ.
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7. Communications Protocol
7.1
Introduction
The device is address mapped. All communications consist of writes to, and reads from,
locations in an 8-bit address map. Table 7-1 shows the address map of QT2160.
Table 7-1.
Memory Map
Address
Use
Access
0
Chip ID
Read
1
Major/minor code version
Read
2
General Status
Read
3
Key Status 1
Read
4
Key Status 2
Read
5
Slider Touch Position
Read
6
GPIO Read
Read
7
Sub-revision
-
Reserved - 0x00
-
8...9
10
Calibrate
Read/Write
11
Reset
Read/Write
12
LP Mode
Read/Write
13
Burst Repetition
Read/Write
14
Reserved - 0x00
Read/Write
15
Neg Drift Compensation
Read/Write
16
Pos Drift Compensation
Read/Write
17
Normal DI Limit
Read/Write
18
Neg Recal Delay
Read/Write
19
Drift Hold Time/AWAKE
Read/Write
20
Slider Control
Read/Write
21
Slider Options
Read/Write
22...37
Key 0 - 15 Key Control
Read/Write
38...53
Key 0 - 15 Neg Threshold
Read/Write
54...69
Key 0 - 15 Burst Length
Read/Write
GPIO/GPO Drive 1
Read/Write
70
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Table 7-1.
Memory Map (continued)
Address
Use
Access
71
GPIO/GPO Drive 2
Read/Write
72
Reserved - 0x00
Read/Write
73
GPIO Direction 2
Read/Write
74
GPIO/GPO PWM 1
Read/Write
75
GPIO/GPO PWM 2
Read/Write
76
PWM Level
Read/Write
77
GPIO Wake
Read/Write
78
Common change Keys 1
Read/Write
79
Common change Keys 2
Read/Write
80...99
Reserved - 0x00
-
100...131
Key 0 - 15 Signals
Read
132...163
Key 0 - 15 References
Read
Note: Reserved areas can be read or written to, to simplify communications. If written to, only
write 0x00.
7.2
Address 0: Chip ID
Table 7-2.
Address
Chip ID
b7
b6
b5
b4
0
b3
b2
b1
b0
b3
b2
b1
b0
Chip ID
There is an 8-bit chip ID, which is set at 0x11.
7.3
Address 1: Code Version
Table 7-3.
Address
1
Code Version
b7
b6
b5
Major Version
b4
Minor Version
There is an 8-bit major and minor version of firmware code revision. The top nibble of the
firmware version register contains the major version (e.g. 4.0) and the bottom nibble contains
the minor version (e.g. 4.0).
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7.4
Address 2: General Status
Table 7-4.
General Status
Address
b7
b6
b5
b4
b3
b2
b1
b0
2
RESET
CYCLE
OVER
RUN
0
0
0
0
CC
SDET
These bits indicate the general status of the device. A change in this byte will cause the
CHANGE line to trigger.
RESET: this bit is set after a reset. This bit is clear after this byte is read back by the host.
CYCLE OVERRUN: this bit is set if the cycle time is more than 16ms. It will be cleared when the
cycle time is less than 16ms.
Note: holding any of the I 2 C -compatible lines, for clock stretching or other purposes, will
increase the cycle time.
CC: this common change bit is set if all the selected keys (address 78...79) have a signal
change of more than half the detection threshold, NTHR. The CC bit is not debounced.
This bit can be used to indicate a common change in signals, e.g. In a notebook application,
where the cover is closing, so that the host can suppress key detections.
Note: the CC bit will be set to 1 if no keys are selected to be in the Common Change group (see
Section 7.27 on page 35).
SDET: this bit is set if a touch is detected on the slider.
7.5
Address 3...4: Key Status
Table 7-5.
Key Status and Numbering
Address
b7
b6
b5
b4
b3
b2
b1
b0
3
k7
k6
k5
k4
k3
k2
k1
k0
4
k15
k14
k13
k12
k11
k10
k9
k8
Address 3: detect status for keys 0 to 7
Address 4: detect status for keys 8 to 15
Each location indicates all keys in detection, if any, as a bitfield; touched keys report as “1”,
untouched or disabled keys report as “0”. A change in this byte will cause the CHANGE line to
trigger.
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7.6
Address 5: Slider Touch Position
Table 7-6.
Address
Slider Touch Position
b7
b6
b5
b4
5
b3
b2
b1
b0
Position
Position: Last position of the touch on the slider
A change in this byte will cause the CHANGE line to trigger.
7.7
Address 6: GPIO Read
Table 7-7.
GPIO Read
Address
b7
b6
b5
b4
b3
b2
b1
b0
6
0
0
0
GPIO3
GPIO2
GPIO1
0
0
GPIO1...3: If GPIO1...3 are set as inputs, returns the logic level on the respective pin. If a GPIO
is set as an output, the respective bit in GPIO Read will always report “0".
GPIOs set as inputs are only read once every cycle, i.e. every 16ms.
A change in this byte will cause the CHANGE line to trigger.
7.8
Address 7: Sub-revision
Table 7-8.
Address
Sub-revision
b7
b6
b5
7
b4
b3
b2
b1
b0
b1
b0
Sub-revision
This is an 8-bit sub-revision number that follows the code version (e.g. 4.0.0).
7.9
Address 10: Calibrate
Table 7-9.
Address
10
Calibrate
b7
b6
b5
b4
b3
b2
CALIBRATE
Writing any nonzero value into this address will trigger the QT2160 to start a recalibration on all
enabled keys.
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7.10
Address 11: Reset
Table 7-10.
Reset
Address
b7
b6
b5
b4
11
b3
b2
b1
b0
RESET
Any nonzero value will trigger the device to reset. After a reset, the device will revert to default
settings.
After receiving a reset command the QT2160 will start not acknowledging I 2 C -compatible
communications and make CHANGE inactive within 16ms. The chip will reset after another
~16ms.
7.11
Address 12: LP Mode
Table 7-11.
Address
LP Mode
b7
b6
b5
12
b4
b3
b2
b1
b0
LP_MODE
LP mode sets the sleep time between bursts. A higher value causes more sleep time between
acquisitions resulting in lower power consumption, but slower response time.
The values are between 1...255, with each incrementing the sleep time by 16ms steps. For
example, 1 = 16ms LP, 2 = 32ms LP, 3 = 48ms LP, etc.
A value of zero causes the device to enter an ultra-low power mode (SLEEP), where no
measurements are carried out (see Section 4.17 on page 13).
The QT2160 is designed to sleep as much as possible to conserve power.
Note: the longer the LP mode, the longer the response time at first touch. The response time for
the first touch includes the digital filter's settling time (a few measurement cycles) and the DI
process. Above 256ms LP mode the power consumption does not reduce as much, even with
longer LP mode durations. Refer to Table 10-1 on page 45 for typical power consumptions.
Default value: 1 (6ms LP)
7.12
Address 13: Burst Repetition
Table 7-12.
Burst Repetition
Address
b7
b6
13
0
0
b5
b4
b3
b2
b1
b0
BREP
Burst Repetition (BREP) is a feature that enables the QT2160 to make multiple measurements
and take the average result; this improves the device’s ability to operate in noisy environments.
The number of burst repetitions can be reduced in low noise environments for faster response
time. The BREP value can range between 1...63 repetitions. Do not set to 0 because it is not
valid.
Default value:1 (one measurement burst)
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7.13
Address 15...16: Neg/Pos Drift Compensation
Table 7-13.
Neg/Pos Drift Compensation
Address
b7
b6
b5
b4
b3
15
0
NDRIFT
16
0
PDRIFT
b2
b1
b0
Signals can drift because of changes in Cx and Cs over time and temperature. It is crucial that
such drift be compensated, else false detections and sensitivity shifts can occur.
Drift compensation (see Figure 7-1) is performed by making the reference level track the raw
signal at a slow rate, but only while there is no detection in effect. The rate of adjustment must
be performed slowly, otherwise legitimate detections could be ignored. The parameters can be
configured in increments of 0.16s.
Figure 7-1.
Thresholds and Drift Compensation
Reference
Hysteresis
Threshold
Signal
Output
The device drift compensates using a slew-rate limited change to the reference level; the
threshold and hysteresis values are slaved to this reference.
When a finger is sensed, the signal falls since the human body acts to absorb charge from the
cross-coupling between X and Y lines. An isolated, untouched foreign object (a coin, or a water
film) will cause the signal to rise very slightly due to an enhancement of coupling. This is contrary
to the way most capacitive sensors operate.
Once a finger is sensed, the drift compensation mechanism ceases since the signal is
legitimately detecting an object. Drift compensation only works when the signal in question has
not crossed the negative threshold level.
The drift compensation mechanism can be asymmetric; the drift-compensation can be made to
occur in one direction faster than it does in the other simply by changing the NDRIFT and
PDRIFT Setup parameters. This is a global configuration.
Specifically, drift compensation should be set to compensate faster for increasing signals than
for decreasing signals. Decreasing signals should not be compensated quickly, since an
approaching finger could be compensated for partially or entirely before even touching the
touchpad (NDRIFT).
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However, an obstruction over the sense pad, for which the sensor has already made full
allowance, could suddenly be removed leaving the sensor with an artificially suppressed
reference level and thus become insensitive to touch. In this latter case, the sensor should
compensate for the object's removal by raising the reference level relatively quickly (PDRIFT).
Drift compensation and the detection time-outs work together to provide for robust, adaptive
sensing. The time-outs provide abrupt changes in reference calibration depending on the
duration of the signal 'event'.
If PDRIFT or NDRIFT is set to 0 then the drift compensation in the respective direction is
disabled.
Note: it is recommended that the drift compensation rate be more than four times the LP mode
period. This is to prevent undersampling, which decreases the algorithm's efficiency.
Default NDRIFT: 20 (3.2s/reference level)
Default PDRIFT: 5 (0.8s/reference level)
7.14
Address 17: Detect Integrator
Table 7-14.
Detect Integrator
Address
b7
b6
b5
17
0
0
0
b4
b3
b2
b1
b0
NDIL
NDIL is used to provide signal filtering.
To suppress false detections caused by spurious events like electrical noise, the device
incorporates a 'detection integrator' or DI counter mechanism. A per-key counter is incremented
each time the key has exceeded its threshold and stayed there for a number of acquisitions in
succession, without going below the threshold level. When this counter reaches a preset limit
the key is finally declared to be touched.
If on any acquisition the signal is not seen to exceed the threshold level, the counter is cleared
and the process has to start from the beginning.
The QT2160 has a built in minimum of 1 DI counts in addition to the NDIL value. Therefore, if
setting a NDIL value of 3, the actual number of consecutive acquisitions is 4.
Available NDIL values are from 1 to 31.
Default: 3 (4 DI value)
7.15
Address 18: Negative Recal Delay
Table 7-15.
Address
18
Negative Recal Delay
b7
b6
b5
b4
b3
b2
b1
b0
NRD
If an object unintentionally contacts a key resulting in a detection for a prolonged interval it is
usually desirable to recalibrate the key in order to restore its function, perhaps after a time delay
of some seconds.
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9502A–AT42–07/08
The Negative Recal Delay timer monitors such detections; if a detection event exceeds the
timer's setting, the key will be automatically recalibrated. After a recalibration has taken place,
the affected key will once again function normally even if it is still being contacted by the foreign
object. This feature is set globally.
NRD can be disabled by setting it to zero (infinite timeout) in which case the key will never
autorecalibrate during a continuous detection (but the host could still command it).
NRD is set globally, which can range in value from 1...255. NRD above 0 is expressed in 0.16s
increments.
Default: 255 (40.8s)
7.16
Address 19: Drift Hold Time/Awake Timeout
Table 7-16.
Address
Drift Hold Time/Awake Timeout
b7
b6
19
b5
b4
b3
b2
b1
b0
DHT/AWAKE
The DHT/AWAKE value is used for Drift Hold Time and Awake Timeout parameters.
Drift Hold Time (DHT)
This is used to restrict drift on all keys while one or more keys are activated. DHT defines the
length of time the drift is halted after a key detection.
This feature is particularly useful in cases of high-density keypads where touching a key or
hovering a finger over the keypad would cause untouched keys to drift, and therefore create a
sensitivity shift, and ultimately inhibit any touch detection.
Awake Timeout (AWAKE)
After each matrix scan, the part will automatically go to sleep whenever possible to conserve
power, unless there has been a key state change. The AWAKE timeout feature determines how
long the device will remain in the minimum LP mode from the last key state change.
Subsequent key state changes reinitialize the AWAKE interval. Once the part has been
awakened by a change, the key response time will be fast for as long as the keyboard remains in
use. Once key activity lapses for a period longer than the AWAKE timeout, the part will return to
the assigned LP mode.
DHT/AWAKE can be configured to a value of between 0.32s and 40.8s, in increments of 0.16s.
Values of 0 and 1 are invalid and should not be used.
Note: It is recommended having a DHT/AWAKE of at least two seconds to prevent unintended
key sensitivity drifts and the slider being unresponsive in longer LP modes.
DHT/AWAKE Default: 25 (4s)
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7.17
Address 20: Slider Control
Table 7-17.
Slider Control
Address
b7
b6
20
b5
b4
b3
HYST
b2
b1
b0
NUM_KEYS
HSYT: Set the hysteresis value for the slider’s reported position. Hysteresis is the number of
positions the user has to move back, before the new touch position is reported when the
direction of scrolling is changed and during first scroll after touch down.
At lower resolutions, where skipping of reported positions will be noticed, hysteresis can be set
to 0 (1 position). At higher resolutions (6...8 bits), it would be recommended to have a hysteresis
of at least 2 positions or more.
HYST can range from 0 (1 position) to 15 (16 positions). The hysteresis is carried out at 8 bits
resolution internally and scaled to the desired resolution; therefore at resolutions lower than 8
bits, there might be a difference of 1 reported position from the HYST setting, depending on
where the touch down is.
Note: it is not valid to have a hysteresis value more than the available positions in a resolution.
For example, do not have a HYST of 5 positions with a resolution of 2 bits (4 positions).
NUM_KEYS: Set the number of keys to be used in the slider. For proper slider operation, valid
values are between 2 and 8. Setting a value of 0, will disable the slider.
HYST Default: 0 (1 position), NUM_KEYS Default: 5 (5 keys)
7.18
Address 21: Slider Options
Table 7-18.
Slider Options
Address
b7
b6
b5
b4
b3
21
0
0
0
0
0
b2
b1
b0
RESOLUTION
RESOLUTION: Resolution of reported position of touch on the slider. Valid values are between
0 (8 bits) to 6 (2 bits). The keys used for the slider starts at X0 and is on the Y0 line.
Table 7-19.
Resolution
Value
Resolution
Value
Resolution
0
8 bits (0-255)
4
4 bits (0-15)
1
7 bits (0-127)
5
3 bits (0-7)
2
6 bits (0-63)
6
2 bits (0-3)
3
5 bits (0-31)
Note: For better stability of the reported position at higher resolutions, increase the number of
keys used to construct the slider, reduce the front panel thickness, reduce the loading on the
slider keys or increase the burst length to gain more signal.
Default: 4 (4 bits)
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9502A–AT42–07/08
7.19
Address 22...37: Key Control
Table 7-20.
Key Control
Address
b7
b6
b5
b4
b3
b2
22...37
0
0
0
0
0
0
b1
b0
AKS GROUP
AKS GROUP: these bits configure which AKS group a key is within (0 - AKS disabled, 1, 2 or 3).
Keys in the same group cannot both be in detect at the same time, unless they both form part of
the slider (see Section 4.9.2 on page 10).
Default: 0 (AKS disabled)
7.20
Address 38...53: Negative Threshold
Table 7-21.
Address
Negative Threshold
b7
b6
b5
38...53
b4
b3
b2
b1
b0
THRESHOLD
The negative threshold value is established relative to a key’s signal reference value. The
threshold is used to determine key touch when crossed by a negative-going signal swing after
having been filtered by the detection integrator. Larger absolute values of threshold desensitize
keys since the signal must travel farther in order to cross the threshold level.
Conversely, lower thresholds make keys more sensitive.
As Cx and Cs drift, the reference point drift-compensates for these changes at a user-settable
rate; the threshold level is recomputed whenever the reference point moves, and thus it also is
drift compensated.
The amount of NTHR required depends on the amount of signal swing that occurs when a key is
touched. Thicker panels or smaller key geometries reduce “key gain", i.e. signal swing from
touch, thus requiring smaller NTHR values to detect touch.
Negative hysteresis: this is fixed at two less than the negative threshold value and cannot be
altered. It is implemented to stop keys from dithering in and out of detect.
NTHR Typical values:7 to 12
NTHR Default value: 10 (10 counts of threshold)
7.21
Address 54...69: Burst Length
Table 7-22.
Address
54...69
Burst Length
b7
b6
b5
b4
b3
b2
b1
b0
BURST LENGTH
The QT2160 uses a fixed number of pulses which are executed in burst mode. This number is
set in groups of four. Therefore, the value send to the QT2160 is multiplied by four to get the
actual number of burst pulses.
32
AT42QT2160
9502A–AT42–07/08
AT42QT2160
The burst length is the number of times the charge-transfer (QT) process is performed on a
given key. Each QT process is simply the pulsing of an X line once, with a corresponding Y line
enabled to capture the resulting charge passed through the key’s capacitance Cx.
Increasing burst length directly affects key sensitivity. This occurs because the accumulation of
charge in the charge integrator is directly linked to the burst length. The burst length of each key
can be set individually, allowing for direct digital control over the signal gains of each key
individually.
Apparent touch sensitivity is also controlled by the Negative Threshold level (NTHR). Burst
length and NTHR interact; normally burst lengths should be kept as short as possible to reduce
scan time and limit RF emissions, but NTHR should be kept above 6 to reduce false detections
due to external noise. The detection integrator mechanism also helps to prevent false
detections.
Note: setting a burst length of zero for a specific key, disables that key.
Typical values: 8 to 32 (32 to 128 burst pulses)
Default: 4 (16 burst pulses)
7.22
Address 70...71: GPIO/GPO Drive
Table 7-23.
GPIO/GPO Drive
Address
b7
b6
b5
b4
b3
b2
b1
b0
70
X7
X6
X5
X4
X3
X2
X1
X0
71
0
0
0
GPIO3
GPIO2
GPIO1
0
0
If the GPIOs are set to outputs, the drive for the individual GPIO is set according to the
corresponding bit in GPIO Drive bytes. Setting the bit to 1 will drive the corresponding GPIO pin
to Vdd, while setting it to 0, will drive the corresponding GPIO pin to ground.
Enabling PWM on a GPIO pin will override the drive on the pin.
Shared X line GPOs will be only driven when not doing any measurements. During
measurements, burst pulses will be driven from the X lines, make sure that the driven device will
not be affected.
Default: 0 (All driven low)
7.23
Address 73: GPIO Direction
Table 7-24.
GPIO Direction
Address
b7
b6
b5
b4
b3
b2
b1
b0
73
0
0
0
GPIO3
GPIO2
GPIO1
0
0
Sets the direction of the GPIOs: 1 = driven outputs, 0 = floating inputs.
If set as inputs, the GPIO will only be read every 16ms (fixed cycle time).
33
9502A–AT42–07/08
Shared X line GPOs are always outputs. By default, the dedicated GPIOs are set as inputs.
Make sure to drive (set to outputs) these GPIOs if not used, as floating pins may consume
unnecessary current.
Default: 0 (All inputs)
7.24
Address 74...75: GPIO/GPO PWM
Table 7-25.
GPIO/GPO PWM
Address
b7
b6
b5
b4
b3
b2
b1
b0
74
X7
X6
X5
X4
X3
X2
X1
X0
75
0
0
0
GPIO3
GPIO2
GPIO1
0
0
Setting the corresponding GPIO PWM bit to 1 will enable PWM on the respective pin. The pin
will be driven according to the duty cycle specified in PWM Level (address 76).
PWM will only be enabled on GPIOs that have their GPIO direction set to 1 (output).
Shared X line GPOs will only be driven when not doing any measurements. During
measurements, burst pulses will be driven from the X lines, making sure that the driven device
will not be affected.
All PWM enabled GPIOs/GPOs will only be switched when not doing any measurements.
Therefore, the PWM duty cycle’s accuracy will depend on the burst lengths of keys, as the
longer the burst length, the longer the periods of no PWM switching.
Default: 0 (PWM disabled)
7.25
Address 76: PWM Level
Table 7-26.
Address
PWM Level
b7
b6
76
b5
b4
b3
b2
b1
b0
DUTY_CYC
This sets the Duty Cycle of the PWM enabled pins. Valid values are between 0 to 255. A value
of 0...10 will be 100 percent duty cycle (always on), and a value of 250...255 will be 0 percent
duty cycle (always off).
Default: 0 (100 percent duty cycle)
34
AT42QT2160
9502A–AT42–07/08
AT42QT2160
7.26
Address 77: GPIO Wake
Table 7-27.
GPIO Wake
Address
b7
b6
b5
b4
b3
b2
b1
b0
77
0
0
0
GPIO3
GPIO2
GPIO1
0
0
If the corresponding bit is set to 1, dedicated GPIO pins set to inputs will still be read during
SLEEP mode (no capacitive sensing carried out). When a change in the state of the inputs is
detected, the CHANGE line will be triggered and the QT2160 will go back to SLEEP.
Default: 0 (Wake disabled)
7.27
Address 78...79: Common Change Keys
Table 7-28.
Common Change Keys
Address
b7
b6
b5
b4
b3
b2
b1
b0
78
k7
k6
k5
k4
k3
k2
k1
k0
79
k15
k14
k13
k12
k11
k10
k9
k8
k0...k15: represents the respective keys. If set to 1, the respective key is included in the
common change comparisons.
Note: if no keys are included in the Common Change group, the CC bit is set to 1.
Default: 0 (not included)
7.28
Address 100...163: Signals and References
Addresses 100...131 allow signal data to be read for each key. There are two bytes of data for
each key. These are the key’s 16-bit signal which is accessed as two 8-bit bytes, stored LSB
first.
Addresses 132...163 allow reference data to be read for each key. There are two bytes of data
for each key. These are the key’s 16-bit reference which is accessed as two 8-bit bytes, stored
LSB first.
There are a total of 16 keys and 4 bytes of data per key, yielding a total of 64 addresses. These
addresses are read-only.
Table 7-29.
Signal and References
Address
Key #
Use
Address
Key #
Use
100
0
Signal LSB
132
0
Reference LSB
101
0
Signal MSB
133
0
Reference MSB
102
1
Signal LSB
134
1
Reference LSB
103
1
Signal MSB
135
1
Reference MSB
104...131
2...15
136...163
2...15
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9502A–AT42–07/08
8. Setups Block
Setups data is sent from the host to the QT2160 using the I2C-compatible interface. The setups block is memory mapped
onto this interface. Thus each setup can be accessed by reading/writing the appropriate address. Setups can be accessed
individually or as a block.
Table 8-1.
Address
Bytes
Parameter
12
1
LP Mode
13
1
15
Symbol
Valid
Range
Bits
Key
Scope
Default
Value
Description
Page
0: SLEEP mode (no capacitive
sensing)
LP_MODE
0 - 255
8
16
1
Burst Repetition
BREP
1...63
6
16
1
Range is 1...63 burst repetitions
27
1
Neg Drift Comp
NDRIFT
0...127
7
16
20
Range is in 0.16s increments, 1 =
0.16s/reference level
28
16
1
Pos Drift Comp
PDRIFT
0...127
7
16
5
Range is in 0.16s increments, 1 =
0.16s/reference level
28
17
1
Normal DI Limit
NDIL
1...31
5
16
3
Normal DI limit: take the operand
and add 2 to get the value
29
18
1
Neg recal delay
NRD
0...255
8
16
255
(40.8s)
19
20
21
36
Setups Table
1
1
1
Drift Hold
Time/Awake
Timeout
DHT/AWAKE
2...255
8
16
25 (4s)
HYST
0...15
4
Slider
0 (1
position)
Range is in 0.16s increments; 0 =
infinite; default = 40.8s
NUM_KEYS
0, 2...8
4
Slider
5 (5 keys)
RESOLUTIO
N
0...6
3
Slider
25 (4s)
KEY_CONT
0...3
3
1
0 (AKS off)
27
29
Range is {infinite, 0.16...40.8s}
Range in 0.2s increments; default
= 4s
30
0...8: hysteresis for slider’s
reported position
0: disables slider mode
Slider Control
Slider Options
1- 255: Low Power mode,
increments in steps of 16ms
31
2...8: number of keys in slider
Slider Keys start at X0 and are on
Y0
Resolution of reported slider touch
position
31
8 bits (0) to 2 bits (6)
22...37
16
Key Control
38...53
16
Neg threshold
NTHR
1...255
8
1
10
54...69
16
Burst Length
BL
0...255
8
1
4 (16
pulses)
0: AKS disabled
32
1...3: AKS groups
32
0: Key disabled
1...255: Burst length = BL x 4
32
AT42QT2160
9502A–AT42–07/08
AT42QT2160
Table 8-1.
Address
Setups Table (continued)
Bytes
70
71
73
1
1
1
Parameter
Symbol
Valid
Range
Bits
Key
Scope
Default
Value
X7
0...1
1
-
0
X6
0...1
1
-
0
X5
0...1
1
-
0
X4
0...1
1
-
0
X3
0...1
1
-
0
X2
0...1
1
-
0
X1
0...1
1
-
0
X0
0...1
1
-
0
-
-
1
-
0
-
-
1
-
0
-
-
1
-
0
GPIO3
0...1
1
-
0
GPIO2
0...1
1
-
0
GPIO1
0...1
1
-
0
-
-
1
-
0
-
-
1
-
0
-
-
1
-
0
-
-
1
-
0
-
-
1
-
0
GPIO3
0...1
1
-
0
GPIO2
0...1
1
-
0
GPIO1
0...1
1
-
0
-
-
1
-
0
-
-
1
-
0
GPO Drive 1
GPIO Drive 2
Description
0: GPO driven low
1: GPO driven high
33
If GPIO set to output,
0: GPIO driven low
GPIO Direction
Page
33
1: GPIO driven high
0: GPIO is floating input
1: GPIO is push-pull output
33
37
9502A–AT42–07/08
Table 8-1.
Address
74
75
Setups Table (continued)
Bytes
1
1
Parameter
Symbol
Valid
Range
Bits
Key
Scope
Default
Value
X7
0...1
1
-
0
X6
0...1
1
-
0
X5
0...1
1
-
0
X4
0...1
1
-
0
X3
0...1
1
-
0
X2
0...1
1
-
0
X1
0...1
1
-
0
X0
0...1
1
-
0
-
-
1
-
0
-
-
1
-
0
-
-
1
-
0
GPIO3
0...1
1
-
0
GPIO2
0...1
1
-
0
GPIO1
0...1
1
-
0
-
-
1
-
0
-
-
1
-
0
GPO PWM 1
GPIO PWM 2
Description
Page
0: PWM disabled
34
1: PWM enabled
If GPIO set to output,
0: PWM disabled
34
1: PWM enabled
If PWM enabled,
76
1
PWM Level
DUTY_CYC
0...255
8
GPIOs
0
0...10: 100% duty cycle (always
ON)
11...249: varying duty cycles
34
250...255: 0% duty cycle (always
OFF)
77
78...79
38
1
2
-
-
1
-
0
-
-
1
-
0
-
-
1
-
0
GPIO3
0...1
1
-
0
GPIO2
0...1
1
-
0
GPIO1
0...1
1
-
0
-
-
1
-
0
-
-
1
-
0
k0...k15
0...1
16
16
0
GPIO Wake
Common
Change Keys
If GPIO set to output,
0: GPIO not read in SLEEP
35
1: GPIO read in SLEEP
35
AT42QT2160
9502A–AT42–07/08
AT42QT2160
9. Getting Started With the QT2160
9.1
Using the I2C-compatible Bus
The QT2160 is an address-mapped part. All commands and data transfers consist of reads
from, and writes to, memory locations.
9.2
Establishing Contact
To establish that the device is present and running, write a zero to it (see Section 9.3). Now read
a single byte (see Section 9.4). This byte should be the ID of the device (0x11). If this is the case
the device is present and running.
9.3
Writing to the Device
A write cycle to the device consists of a start condition followed by the I2C-compatible address of
the device (see Section 6.1). The next byte is the address of the location into which the writing
will start. This address is then stored as the address pointer.
Subsequent bytes in a multibyte transfer will be written to the location of the address pointer,
location of the address pointer +1, location of the address pointer +2 etc. This ends with the stop
condition on the I2C-compatible bus. A new write cycle will involve sending another address
pointer.
It is possible to stop the write after the address pointer is sent if no data is required to be written
to the device. This is done when setting the address pointer for reading data.
9.4
Reading From the Device
A read cycle consists of a start condition followed by the I2C-compatible address of the device
(see Section 6.1). Bytes can then be read starting at the location pointed to by the address
pointer set by the last write operation. The address is internally incremented for each byte read
during a multibyte read.
The stop condition at the end of the transfer causes the internal address pointer to revert to the
value written during the last write operation. This means that if a set of data bytes needs to be
read many times (such as the status bytes) then it is not necessary to keep sending an address
pointer. It can be set to the first location and multibyte reads will always then start there.
9.5
Keys
The default setting of the QT2160 is for 16 keys with AKS disabled. This will be the default
setting when the device first powers up. A coin placed over any key can be used to pick up the
burst signal to see the activity on the keys as explained in Section 3 of the application note
“Secrets of a Successful Touch Sensor Design" which can be downloaded from the Quantum
area of the Atmel website.
The CHANGE line will go low indicating there is new data to be read. Reading the status bytes
(address 2...6) will cause the CHANGE line to go inactive, as the data has been read.
If a key is now touched, the CHANGE line will go active again, indicating that there is new data
again. The CHANGE line will remain active until the status location containing the status for that
key is read. If the CHANGE line does not go low then it is likely the sensitivity of the key is not
high enough. The burst length should be increased to increase the sensitivity.
39
9502A–AT42–07/08
A change in burst length should be followed by a calibration command (set the calibration byte to
a nonzero value) to ensure reliable operation. It is also possible to adjust the sensitivity using the
negative threshold for that key. Note that thresholds below 6 counts may cause sensitivity to
noise and thresholds above 12 counts will require longer burst lengths than strictly necessary.
All unused keys should be switched off by setting their burst lengths to zero. This will reduce the
power requirements of the device.
9.6
Slider
A group of keys on the Y0 line can be configured as a slider. These have to be placed in
numerical order starting with X0 and with no missing keys in the sequence. The keys should be
5-7mm wide along the length of the slider for good linearity. The number of keys needed in a
slider will simply be the number of the size required to form the desired slider length.
The slider can now be enabled by setting the NUM_KEYS bits in Slider Control byte to the
number of keys which are used in the slider. This can be from 2 to 8 keys. For example, to
enable a slider of five keys, set NUM_KEYS to five. Note that the higher the resolution, the more
keys will be required to get a stable response out of the slider. As a general rule, the number of
keys must be at least the number of bits, e.g. at least 4 keys for a 4 bit slider.
Now the slider is enabled, touching it will result in a slider position being reported in the Slider
Touch Position byte. Note that the keys forming the slider will still cause key detections and will
still report their status in the key status registers.
If the slider position is noisy, try reducing the panel thickness or increasing the sensitivities of the
keys forming the slider, to get more signal for positional calculations. Increasing the hysteresis
(Section 4.2 on page 5) will also help.
Keys within the same slider are normally in the same AKS group and have the same burst length
and threshold.
9.7
Adjacent Key Suppression (AKS) Technology
Adjacent Key Suppression (AKS) technology is a patented method to detect which key is
pressed, when keys are located close together. A touch in a group of AKS keys will only be
indicated on the key with the largest signal. This is assumed to be the intended key.
Once a key in an AKS group is in detect, there can be no further detections on keys in that group
until the key is released. By default, the AKS technique is disabled on all keys; therefore, the
keys can detect, regardless of the state of any other keys.
The AKS technology works slightly differently when keys are in a slider which act like a single
AKS object. Any number of keys can go into detect with a slider but if any keys within one of
these objects are in detect then the AKS technology will lock out anything else in the same AKS
group. Similarly, a key in the same AKS group as the slider can lock out the slider as a whole
object.
Note: for normal operation all keys in the slider should be placed in the same AKS group.
40
AT42QT2160
9502A–AT42–07/08
AT42QT2160
9.8
GPIOs
By default, the dedicated GPIOs (GPIO1...GPIO3) are set as inputs. Make sure to drive (set to
outputs) these GPIOs if not used, as floating pins may consume unnecessary current.
By default, shared GPOs are push-pull outputs driven low when not measuring.
Table 9-1 shows a summary of the GPIO options, and the precedence of each setting.
9.9
GPIO
Direction
GPIO
PWM
GPIO
Drive
Wake
Dedicated GPIO Function
Shared GPO Function
0
X
X
X
Input - read only in LP mode so CHANGE
event possible only in LP mode
Always output
0
X
X
1
Input - read in LP and Sleep modes so
CHANGE event possible in both modes
Always output
1
0
0
X
Output - Gnd
Output - Gnd
1
0
1
X
Output - Vdd
Output - Vdd
1
1
X
X
Output - PWM
Output - PWM
Typical Initialization and Usage
Figure 9-1 on page 42 shows a typical example of communicating with the QT2160.
1. After a reset/power-up, wait for CHANGE to go low, indicating the QT2160 has
initialized and is ready to communicate.
2. Send all the setup parameters that need to be changed from the startup default values.
Drive all unused GPIOs to outputs, to prevent unnecessary increase in current
consumption.
3. After setting up the QT2160, send a Calibrate command.
4. Read all status bytes once (address 2 to 6), to return the CHANGE line to an inactive
state.
5. If CHANGE line goes low, perform a read of the required status byte. All the status
bytes that have changed need to be read, to ensure that the CHANGE line goes
inactive again.
6. Process the received byte accordingly.
7. Check the reset bit in the general status byte (address 2). If it is a 1, go to step 2 to
resend all the setup parameters, as a reset has occurred. If it is a 0, proceed to the next
step.
8. Repeat steps 5, 6 and 7. Steps 5 and 6 are the continuous normal operating loop
sequence after initialization.
41
9502A–AT42–07/08
Figure 9-1.
Typical Initialization and Usage
Reset/Power Up
CHANGE pin
active (low)?
No
Yes
Send setup parameters to set up
QT2160
Send Calibrate command
Read all status bytes (Address 2...6)
to restore CHANGE pin to inactive
(high)
CHANGE pin
active (low)?
No
Yes
Read required Status bytes and other
status bytes that changed, to restore
CHANGE pin to inactive (high).
Host processes received status bytes
Yes
‘Reset occurred’
bit = 1?
No
42
AT42QT2160
9502A–AT42–07/08
AT42QT2160
10. Specifications
10.1
Absolute Maximum Specifications
Vdd
-0.5 to +6V
Max continuous pin current, any control or drive pin
±10 mA
Short circuit duration to ground, any pin
infinite
Short circuit duration to Vdd, any pin
infinite
Voltage forced onto any pin
-0.6V to (Vdd + 0.6) Volts
CAUTION: Stresses beyond those listed under “Absolute Maximum Specifications" may cause permanent damage to
the device. This is a stress rating only and functional operation of the device at these or other conditions beyond those
indicated in the operational sections of this specification is not implied. Exposure to absolute maximum specification
conditions for extended periods may affect device reliability.
10.2
Recommended Operating Conditions
Operating temp
-40oC to +85oC
Storage temp
-55oC to +125oC
Vdd
+1.8V to 5.5V
Supply ripple+noise* (<1MHz)
±25 mV
Supply ripple+noise* (>1MHz)
±50 mV
Cx transverse load capacitance per key
2 to 20 pF
Note:
*Applicable to QT2160 on a typical setup, with Burst Repetition (BREP) = 2.
The effects of supply ripple and noise on performance is more prominent the nearer it is to the burst center frequency.
43
9502A–AT42–07/08
10.3
DC Specifications
Vdd = 5.0V, Cs = 4.7nF, Rs = 1MΩ, Ta = recommended range, unless otherwise noted
Parameter
Min
Typ
Max
Units
Notes
Iddr
Average supply current,
running (LP16ms)
476
955
1127
µA
Vdd = 1.8V
Vdd = 3.3V
Vdd = 5.0V
Idds
Average supply current,
sleeping (SLEEP)
<1.5
<2
<3
µA
Vdd = 1.8V
Vdd = 3.3V
Vdd = 5.0V
V
1.8V <Vdd <5V
V
1.8V <Vdd <5V
Vil
Low input logic level
Vhl
High input logic level
Vol
Low output voltage
Voh
High output voltage
Iil
Input leakage current
Ar
Acquisition resolution
10.4
0.2Vdd
0.6Vdd
0.2
4.2
V
V
1
10
Internal RST
pull-up resistor
Rrst
µA
bits
60
kΩ
Timing Specifications
Parameter
44
Description
Description
Min
Typ
Max
Units
TBS
Burst duration
40
80
120
160
Fc
Burst center frequency
400
kHz
Fm
Burst modulation, percentage
±8
%
TDW
Dwell time
TPW
Pulse width
250
500
1000
µs
Notes
BL = 4 (4x4 = 16 actual pulses)
BL = 8 (8x4 = 32 actual pulses)
BL = 12 (12x4 = 48 actual
pulses)
BL = 16 (16x4 = 64 actual
pulses)
ns
ns
AT42QT2160
9502A–AT42–07/08
AT42QT2160
10.5
Power Consumption
Table 10-1.
Average Current Consumption
Test condition: 16 keys enabled, BL = 16 (4 x 16 = 64 actual pulses), BREP = 1
Idd (µA) at Vdd =
LP Mode
1.8V
3.3V
5V
SLEEP
<1.5
<2
<3
LP 16 ms
476
955
1,127
LP 32 ms
311
609
770
LP 64 ms
229
436
592
LP 128 ms
188
350
502
LP 256 ms
167
306
458
LP 512 ms
157
285
435
LP 1024 ms
152
274
424
45
9502A–AT42–07/08
10.6
Mechanical Dimensions
Figure 10-1. Mechanical Dimensions
D
C
1
2
Pin 1 ID
3
E
SIDE VIEW
A1
TOP VIEW
A
y
K
D2
1
0.45
2
R 0.20
3
E2
b
COMMON DIMENSIONS
(Unit of Measure = mm)
SYMBOL
MIN
NOM
MAX
A
0.80
0.90
1.00
A1
0.00
0.02
0.05
b
0.17
0.22
0.27
C
L
e
BOTTOM VIEW
Note:
The terminal #1 ID is a Laser-marked Feature.
NOTE
0.20 REF
D
3.95
4.00
4.05
D2
2.35
2.40
2.45
E
3.95
4.00
4.05
E2
2.35
2.40
2.45
e
0.45
L
0.35
0.40
0.45
y
0.00
–
0.08
K
0.20
–
–
9/7/06
R
46
2325 Orchard Parkway
San Jose, CA 95131
TITLE
28M1, 28-pad, 4 x 4 x 1.0 mm Body, Lead Pitch 0.45 mm,
2.4 mm Exposed Pad, Micro Lead Frame Package (MLF)
DRAWING NO.
28M1
REV.
A
AT42QT2160
9502A–AT42–07/08
AT42QT2160
10.7
Marking
Either part marking can be supplied.
28
Pin 1 ID
1
Chip Assembly
Lotcode (for
traceability)
AT42
QT2160
-MMU
LTCODE
Part number;
AT42QT2160-MMU
28
Pin 1 ID
1
Abbreviation of
Part number;
AT42QT 2160
LTCODE
Chip Assembly
Lotcode
(for traceability)
2160
AT
Program week code number 1-52 where:
A = 1, B = 2...Z = 26
then using the underscore
A = 27...Z = 52
10.8
10.9
Part Number
Part Number
Description
AT42QT2160-MMU
28-pin 4 x 4mm MLF RoHS compliant IC
Moisture Sensitivity Level (MSL)
MSL Rating
Peak Body Temperature
Specifications
MSL3
260oC
IPC/JEDEC J-STD-020C
47
9502A–AT42–07/08
10.10 Revision History
48
Revision No.
History
Revision A – July 2008
•
Initial Release
AT42QT2160
9502A–AT42–07/08
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www.atmel.com/literature
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9502A–AT42–07/08