QTP 134802 24 QFN (4x4x0.6mm) Pure Sn, CuPd Wire MSL3, 260°C Reflow ASE-Taiwan (G).pdf

Document No.001-92434 Rev. **
ECN # 4374771
Cypress Semiconductor
Package Qualification Report
QTP# 134802 VERSION**
May, 2014
24 QFN (4x4x0.6mm)
Pure Sn, CuPd Wire
MSL3, 260°°C Reflow
ASE-Taiwan (G)
FOR ANY QUESTIONS ON THIS REPORT, PLEASE CONTACT
[email protected] or via a CYLINK CRM CASE
Prepared By:
Josephine Pineda
Reliability Engineer
Reviewed By:
Rene Rodgers
Reliability Manager
Approved By:
Richard Oshiro
Reliability Director
Company Confidential
A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision.
Page 1 of 7
Document No.001-92434 Rev. **
ECN # 4374771
PACKAGE QUALIFICATION HISTORY
QTP
Number
Description of Qualification Purpose
Date
134802
Qualification of WUSB-NX Device in LQ24A Package at ASE-Taiwan (G)
using EME-G700LA Mold Compound, FH-900 Die Attach Film (DAF),
Pure Sn Leadfinish, 0.8 mil CuPd Wire at MSL3, 260°C
April 2014
Company Confidential
A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision.
Page 2 of 7
Document No.001-92434 Rev. **
ECN # 4374771
MAJOR PACKAGE INFORMATION USED IN THIS QUALIFICATION
Package Designation:
LQ24A
Package Outline, Type, or Name:
Quad Flat No Lead (QFN) (4x4x0.6mm)
Mold Compound Name/Manufacturer:
EME-G700LA/Sumitomo
Mold Compound Flammability Rating:
UL-94 V-0
Mold Compound Alpha Emission Rate:
<0.1
Oxygen Rating Index: >28%
54%
Lead Frame Designation:
FMP
Lead Frame Material:
Copper
Substrate Material:
N/A
Lead Finish, Composition / Thickness:
Pure Sn
Die Backside Preparation Method/Metallization:
Backgrind
Die Separation Method:
Saw Process
Die Attach Supplier:
Hitachi
Die Attach Material:
DAF900
Bond Diagram Designation
001-89835
Wire Bond Method:
Thermosonic
Wire Material/Size:
0.8 mil /CuPd
Thermal Resistance Theta JA °C/W:
18.36 °C /W
Package Cross Section Yes/No:
Yes
Assembly Process Flow:
001-89390
Name/Location of Assembly (prime) facility:
ASE-Taiwan (G)
MSL Level
3
Reflow Profile
260C
ELECTRICAL TEST / FINISH DESCRIPTION
Test Location:
ASE-Taiwan (G)
Note: Please contact a Cypress Representative for other package availability.
Company Confidential
A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision.
Page 3 of 7
Document No.001-92434 Rev. **
ECN # 4374771
RELIABILITY TESTS PERFORMED PER SPECIFICATION REQUIREMENTS
Stress/Test
Test Condition (Temp/Bias)
Result
P/F
Acoustic Microscopy
J-STD-020
Precondition: JESD22 Moisture Sensitivity Level
(192 Hrs., 30 °C, 60% RH, 260°C Reflow)
P
Ball Shear
JESD22-B116, Cpk : 1.33, Ppk : 1.66
P
Bond Pull
MIL-STD-883 – Method 2011, Cpk : 1.33, Ppk : 1.66
P
Constructional Analysis
Criteria: Meet external and internal characteristics of Cypress
package
P
Final Visual Inspection
JESD22-B101
P
High Temperature Operating Life
Latent Failure Rate (LFR)
JEDEC STD 22-A110: 130C, 85%RH, 3.6V
Precondition: JESD22 Moisture Sensitivity Level
(192 Hrs., 30 °C, 60% RH, 260°C Reflow)
Dynamic Operating Condition, Vcc =3.78, 150C
JESD22-A108
High Temp Storage
JESD22-A103: 150 C, no bias
P
Internal Visual Inspection
MIL-STD-883-2014
P
High Accelerated Saturation Test
(HAST)
Pressure Cooker Test
Temperature Cycle
JESD22-A102, 121 °C, 100%RH, 15 PSIG
Precondition: JESD22 Moisture Sensitivity Level
(192 Hrs., 30 °C, 60% RH, 260°C Reflow)
MIL-STD-883, Method 1010, Condition C, -65 °C to 150 °C
Precondition: JESD22 Moisture Sensitivity Level
(192 Hrs., 30 °C, 60% RH, 260°C Reflow)
Company Confidential
A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision.
Page 4 of 7
P
P
P
P
Document No.001-92434 Rev. **
ECN # 4374771
Reliability Test Data
QTP #: 134802
Device
Fab Lot #
Assy Lot #
Assy Loc
Duration Samp
Rej
CYRF9935 (7CP99351A)
8342000
611342982/83/84
G-Taiwan
COMP
20
0
CYRF9935 (7CP99351A)
8342000
611344937/38/40
G-Taiwan
COMP
20
0
CYRF9935 (7CP99351A)
8342000
611345904/05/06
G-Taiwan
COMP
20
0
CYRF9935 (7CP99351A)
8345000
611346543
G-Taiwan
COMP
10
0
CYRF9935 (7CP99351A)
8345000
611346544
G-Taiwan
COMP
10
0
CYRF9935 (7CP99351A)
8345000
611346546
G-Taiwan
COMP
10
0
CYRF9935 (7CP99351A)
8345000
611346543
G-Taiwan
COMP
10
0
CYRF9935 (7CP99351A)
8345000
611346544
G-Taiwan
COMP
10
0
CYRF9935 (7CP99351A)
8345000
611346546
G-Taiwan
COMP
10
0
8342000
611342982/83/84
G-Taiwan
COMP
5
0
CYRF9935 (7CP99351A)
8342000
611342982/83/84
G-Taiwan
COMP
5
0
CYRF9935 (7CP99351A)
8342000
611344937/38/40
G-Taiwan
COMP
5
0
CYRF9935 (7CP99351A)
8342000
611345904/05/06
G-Taiwan
COMP
5
0
CYRF9935 (7CP99351A)
8345000
611346543
G-Taiwan
COMP
200
0
CYRF9935 (7CP99351A)
8345000
611346544
G-Taiwan
COMP
200
0
CYRF9935 (7CP99351A)
8345000
611346546
G-Taiwan
COMP
200
0
Failure Mechanism
STRESS: ACOUSTIC, MSL3
STRESS: BALL SHEAR
STRESS: BOND PULL
STRESS: CONSTRUCTIONAL ANALYSIS
CYRF9935 (7CP99351A)
STRESS: CROSS SECTION
STRESS: FINAL VISUAL
STRESS: HI-ACCEL SATURATION TEST, 130C, 3.6V, 85%RH, PRE COND 192 HR 30C/60%RH, MSL3
CYRF9935 (7CP99351A)
8342000
611342982/83/84
G-Taiwan
128
80
0
CYRF9935 (7CP99351A)
8342000
611344937/38/40
G-Taiwan
128
80
0
CYRF9935 (7CP99351A)
8342000
611345904/05/06
G-Taiwan
128
80
0
Company Confidential
A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision.
Page 5 of 7
Document No.001-92434 Rev. **
ECN # 4374771
Reliability Test Data
QTP #: 134802
Device
Fab Lot #
Assy Lot # Assy Loc
Duration Samp
Rej
Failure Mechanism
STRESS: HIGH TEMP STORAGE, 150C
CYRF9935 (7CP99351A)
8342000
611342982/83/84
G-Taiwan
500
84
0
CYRF9935 (7CP99351A)
8342000
611342982/83/84
G-Taiwan
1000
84
0
CYRF9935 (7CP99351A)
8342000
611344937/38/40
G-Taiwan
500
84
0
CYRF9935 (7CP99351A)
8342000
611344937/38/40
G-Taiwan
1000
84
0
CYRF9935 (7CP99351A)
8342000
611345904/05/06
G-Taiwan
500
80
0
CYRF9935 (7CP99351A)
8342000
611345904/05/06
G-Taiwan
1000
80
0
CYRF9935 (7CP99351A)
8342000
611342982/83/84
G-Taiwan
COMP
5
0
CYRF9935 (7CP99351A)
8342000
611344937/38/40
G-Taiwan
COMP
5
0
CYRF9935 (7CP99351A)
8342000
611345904/05/06
G-Taiwan
COMP
5
0
STRESS: INTERNAL VISUAL
STRESS: HIGH TEMP DYNAMIC OPERATING LIFE-LATENT FAILURE RATE (150C, 3.78V, Vcc Max)
CYRF9935 (7CP99351A)
8342000
611342982/83/84
G-Taiwan
80
116
0
CYRF9935 (7CP99351A)
8342000
611342982/83/84
G-Taiwan
524
116
0
STRESS: PRESSURE COOKER TEST (121C, 100%RH), 15 Psig, PRE COND 192 HR 30C/60%RH (MSL3)
CYRF9935 (7CP99351A)
8342000
611342982/83/84
G-Taiwan
168
78
0
CYRF9935 (7CP99351A)
8342000
611342982/83/84
G-Taiwan
288
78
0
CYRF9935 (7CP99351A)
8342000
611344937/38/40
G-Taiwan
168
80
0
CYRF9935 (7CP99351A)
8342000
611344937/38/40
G-Taiwan
288
80
0
CYRF9935 (7CP99351A)
8342000
611345904/05/06
G-Taiwan
168
80
0
CYRF9935 (7CP99351A)
8342000
611345904/05/06
G-Taiwan
288
80
0
STRESS: TC COND. C –65C TO 150C, PRE COND 192 HR 30C/60%RH, MSL3
CYRF9935 (7CP99351A)
8342000
611342982/83/84
G-Taiwan
500
80
0
CYRF9935 (7CP99351A)
8342000
611342982/83/84
G-Taiwan
1000
80
0
CYRF9935 (7CP99351A)
8342000
611344937/38/40
G-Taiwan
500
80
0
CYRF9935 (7CP99351A)
8342000
611344937/38/40
G-Taiwan
1000
80
0
CYRF9935 (7CP99351A)
8342000
611345904/05/06
G-Taiwan
500
80
0
CYRF9935 (7CP99351A)
8342000
611345904/05/06
G-Taiwan
1000
80
0
Company Confidential
A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision.
Page 6 of 7
Document No.001-92434 Rev. **
ECN # 4374771
Document History Page
Document Title:
TAIWAN (G)
Document Number:
QTP# 134802: 24 QFN (4X4X0.6MM) PURE SN, CUPD WIRE, MSL3, 260C REFLOW, ASE001-92434
Rev. ECN
Orig. of
No.
Change
**
4374771 JYF
Distribution: WEB
Posting:
Description of Change
Initial release.
None
Company Confidential
A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision.
Page 7 of 7
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