20L - SSOP PB-FREE Package Material Declaration Datasheet.pdf

20L - SSOP
Pb-Free Package
PACKAGE MATERIAL DECLARATION DATASHEET
Cypress Package Code
Package Weight – Site 1
Package Weight – Site 3
SP
B1: 172.8700 mg
B2: 160.0368 mg
B3: 169.2389 mg
B4: 172.2182 mg
B1: 159.0300 mg
B2: 158.3682 mg
Body Size (mil/mm)
Package Weight – Site 2
209 mil
B1:166.0000 mg
B2:161.0140 mg
SUMMARY
The 20L-SSOP Pb-Free package is qualified at two assembly sites. Packages from different assembly
sites may have different material composition. Cypress Ordering Part Numbers containing an “X” (e.g.
CY7C1328G-133AXI, CY2308SXC-1HT) meet the Directive 2002/95/EC (RoHS) requirement.
ASSEMBLY Site 1: Orient Semiconductor Electronics Taiwan (OSET)
Package Qualification Report #s 030604, 043102, 042702, 053005, 120410 (Note 1)
I. DECLARATION OF PACKAGED UNITS
A. BANNED SUBSTANCES
Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU
RoHS. Listed in the table below are materials that are neither contained nor intentionally added to this
product.
Pure Sn Lead Finish
Substances / Compounds
Cadmium and Cadmium Compounds
Hexavalent Chromium and its Compounds
Lead and Lead Compounds
Mercury and Mercury Compounds
Polybrominated Biphenyls (PBB)
Polybrominated Diphenylethers (PBDE)
Asbestos
Azo colorants
Ozone Depleting Substances
Polychlorinated Biphenyls (PCBs)
Polychlorinated Napthalenes
Radioactive Substances
Shortchain Chlorinated Paraffins
Tributyl Tin (TBT) and Triphenyl Tin (TPT)
Tributyl Tin Oxide (TBTO)
Formaldehyde
Weight by mg
PPM
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
0
0
0
0
0
0
0
0
0
0
Analysis Report
(Note 2)
CoA-SP20OSET
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural
impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress
Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-04102 Rev. *P
Page 1 of 13
20L - SSOP
Pb-Free Package
NiPdAu Lead Finish
Substances / Compounds
Cadmium and Cadmium Compounds
Hexavalent Chromium and its Compounds
Lead and Lead Compounds
Mercury and Mercury Compounds
Polybrominated Biphenyls (PBB)
Polybrominated Diphenylethers (PBDE)
Asbestos
Azo colorants
Ozone Depleting Substances
Polychlorinated Biphenyls (PCBs)
Polychlorinated Napthalenes
Radioactive Substances
Shortchain Chlorinated Paraffins
Tributyl Tin (TBT) and Triphenyl Tin (TPT)
Tributyl Tin Oxide (TBTO)
Formaldehyde
Weight by mg
PPM
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
0
0
0
0
0
0
0
0
0
0
Analysis Report
(Note 2)
CoA-SP20OSET
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
B1. MATERIAL COMPOSITION
Pure Tin Lead Finish (Note 3)
Material
Substance
Composition
Purpose of Use
Lead frame
Base Material
Lead Finish
External Plating
Die Attach
Adhesive
Die
Wire
Circuit
Interconnect
Mold
Compound
Encapsulation
Copper
Nickel
Magnesium
Silicon
Sn
Epoxy resin
Metal
Silver
Si
Au
Epoxy resin1
Epoxy resin2
Phenol resin
Aromatic
phosphate
Silica
Carbon black
Others
7440-50-8
7440-02-0
7439-95-4
7440-21-3
7440-31-5
Proprietary
Proprietary
7440-22-4
7440-21-3
7440-57-5
Proprietary
Proprietary
Proprietary
Proprietary
36.1500
1.1300
0.0800
0.3000
3.3200
0.0600
0.0200
0.3400
12.9700
0.6800
2.9500
2.3600
2.9500
1.7700
% weight
of
substance
per
Homogeno
us
material
95.9904%
3.0005%
0.2124%
0.7966%
100.0000%
14.2857%
4.7619%
80.9524%
100.0000%
100.0000%
2.5038%
2.0031%
2.5038%
1.5023%
60676-86-0
1333-86-4
Proprietary
106.3700
0.2400
1.1800
90.2818%
0.2037%
1.0015%
CAS Number
Package Weight (mg):
Weight by
mg
172.8700
PPM
% weight of
substance
per package
209,117
6,537
463
1,735
19,205
347
116
1,967
75,027
3,934
17,065
13,652
17,065
10,239
20.9117%
0.6537%
0.0463%
0.1735%
1.9205%
0.0347%
0.0116%
0.1967%
7.5027%
0.3934%
1.7065%
1.3652%
1.7065%
1.0239%
615,318
1,388
6,826
61.5318%
0.1388%
0.6826%
% Total:
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural
impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress
Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-04102 Rev. *P
Page 2 of 13
100.0000
20L - SSOP
Pb-Free Package
B2. MATERIAL COMPOSITION
NiPdAu Lead Finish (Note 3)
Material
Substance
Composition
Purpose of Use
Lead frame
Base Material
Lead Finish
External Plating
Die Attach
Adhesive
Die
Wire
Circuit
Interconnect
Mold
Compound
Encapsulation
Cu
Fe
P
Zn
Pb
Polyimide
NBR
Bismaleimide
Phenol resin
Ni
Pd
Au
Acrylic resin
Polybutadiene
derivative
Butadiene
copolymer
Epoxy resin
Acrylate
Peroxide
Additive
Silver
Silicon
Gold
Silica Fused
Epoxy Resin(1)
Epoxy Resin(2)
Phenol Resin
Carbon black
7440-50-8
7439-89-6
7723-14-0
7440-66-6
7439-92-1
Trade Secret
9003-18-3
79922-55-7
28453-20-5
7440-02-0
7440-05-3
7440-57-5
Trade Secret
Trade Secret
36.2400
0.8700
0.0600
0.0400
0.0100
0.0400
0.0100
0.0100
0.0100
0.3800
0.0400
0.0038
0.0200
0.0200
% weight of
substance
per
Homogenou
s
material
97.2700%
2.3300%
0.1500%
0.1000%
0.0200%
0.0900%
0.0200%
0.0200%
0.0100%
89.6649%
9.4384%
0.8966%
6.1920%
6.1920%
Trade Secret
0.0100
3.0960%
62
0.0062%
Trade Secret
Trade Secret
Trade Secret
Trade Secret
7440-22-4
7440-21-3
7440-57-5
60676-86-0
158117-90-9
85954-11-6
26834-02-6
1333-86-4
0.0100
0.0100
0.0030
0.0100
0.2400
7.3800
0.3700
103.8500
4.0000
2.2900
4.0000
0.1100
3.0960%
3.0960%
0.9288%
3.0960%
74.3034%
100.0000%
100.0000%
90.8972%
3.5011%
2.0044%
3.5011%
0.0963%
62
62
19
62
1,500
46,114
2,312
648,913
24,994
14,309
24,994
687
0.0062%
0.0062%
0.0019%
0.0062%
0.1500%
4.6114%
0.2312%
64.8913%
2.4994%
1.4309%
2.4994%
0.0687%
% Total:
100.0000
CAS Number
Package Weight (mg):
Weight by
mg
160.0368
% weight of
substance
per package
PPM
226,448
5,436
375
250
62
250
62
62
62
2,374
250
24
125
125
22.6448%
0.5436%
0.0375%
0.0250%
0.0062%
0.0250%
0.0062%
0.0062%
0.0062%
0.2374%
0.0250%
0.0024%
0.0125%
0.0125%
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural
impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress
Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-04102 Rev. *P
Page 3 of 13
20L - SSOP
Pb-Free Package
B3. MATERIAL COMPOSITION
Copper Wire and NiPdAu Lead Finish (Note 3)
Material
Lead frame
Base Material
Lead Finish
External Plating
Die Attach
Adhesive
Die
Wire
Circuit
Interconnect
Mold
Compound
Substance
Composition
Purpose of Use
Encapsulation
Cu
Fe
P
Zn
Pb
Polyimide
NBR
Bismaleimide
Phenol resin
Ni
Pd
Au
Silver
Epoxy resin A
Epoxy resin B
Dilute A
Dilute B
Hardener
Dicyandiamide
Organic
peroxide
Silicon
Copper
Epoxy Resin A
Epoxy , Cresol
Novolac
Phenol resin
Silica ,
Crystalline,
Quarts
Silica Fused
Carbon black
Metal Hydroxide
7440-50-8
7439-89-6
7723-14-0
7440-66-6
7439-92-1
Trade Secret
9003-18-3
79922-55-7
28453-20-5
7440-02-0
7440-05-3
7440-57-5
7440-22-4
9003-36-5
Trade Secret
Trade Secret
Trade Secret
Trade Secret
461-58-5
Trade Secret
33.4811
0.8169
0.0287
0.0435
0.0035
0.0313
0.0069
0.0070
0.0035
0.3080
0.0278
0.0049
0.0672
0.0036
0.0055
0.0036
0.0055
0.0045
0.0005
0.0005
% weight of
substance
per
Homogenou
s
material
97.2656%
2.3731%
0.0833%
0.1264%
0.0102%
0.0909%
0.0200%
0.0203%
0.0102%
90.4092%
8.1612%
1.4296%
74.0000%
4.0000%
6.0000%
4.0000%
6.0000%
5.0000%
0.5000%
0.5000%
7440-21-3
7440-50-8
Trade Secret
29690-82-2
1.9757
0.1849
6.6112
6.6112
100.0000%
100.0000%
5.0000%
5.0000%
11,674
1,093
39,064
39,064
1.1674%
0.1093%
3.9064%
3.9064%
Trade Secret
14808-60-7
6.6112
0.6509
5.0000%
0.4923%
39,064
3,846
3.9064%
0.3846%
60676-86-0
1333-86-4
Trade Secret
101.0326
0.3967
10.3105
76.4100%
0.3000%
7.7977%
596,983
2,344
60,923
59.6983%
0.2344%
6.0923%
% Total:
100.0000
CAS Number
Package Weight (mg):
Weight by
mg
169.2389
PPM
197,833
4,827
170
257
21
185
41
41
21
1,820
164
29
397
21
32
21
32
27
3
3
19.7833%
0.4827%
0.0170%
0.0257%
0.0021%
0.0185%
0.0041%
0.0041%
0.0021%
0.1820%
0.0164%
0.0029%
0.0397%
0.0021%
0.0032%
0.0021%
0.0032%
0.0027%
0.0003%
0.0003%
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural
impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress
Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-04102 Rev. *P
% weight of
substance
per package
Page 4 of 13
20L - SSOP
Pb-Free Package
B4. MATERIAL COMPOSITION
Copper Wire and Pure Tin Lead Finish (Note 3)
Material
Lead frame
Base Material
Lead Finish
External Plating
Die Attach
Adhesive
Die
Wire
Circuit
Interconnect
Mold
Compound
Substance
Composition
Purpose of Use
Encapsulation
Cu
Fe
P
Zn
Pb
Polyimide
NBR
Bismaleimide
Phenol resin
Tin
Silver
Epoxy resin A
Epoxy resin B
Dilute A
Dilute B
Hardener
Dicyandiamide
Organic
peroxide
Silicon
Copper
Epoxy Resin A
Epoxy , Cresol
Novolac
Phenol resin
Silica ,
Crystalline,
Quarts
Silica Fused
Carbon black
Metal Hydroxide
CAS Number
Weight by
mg
7440-50-8
7439-89-6
7723-14-0
7440-66-6
7439-92-1
Trade Secret
9003-18-3
79922-55-7
28453-20-5
7440-31-5
7440-22-4
9003-36-5
Trade Secret
Trade Secret
Trade Secret
Trade Secret
461-58-5
Trade Secret
33.4811
0.8169
0.0287
0.0435
0.0035
0.0313
0.0069
0.007
0.0035
3.3200
0.0672
0.0036
0.0055
0.0036
0.0055
0.0045
0.0005
0.0005
% weight of
substance
per
Homogenou
s
material
97.2654%
2.3732%
0.0834%
0.1264%
0.0102%
0.0909%
0.0200%
0.0203%
0.0102%
100.0000%
73.9274%
3.9604%
6.0506%
3.9604%
6.0506%
4.9505%
0.5501%
0.5501%
7440-21-3
7440-50-8
Trade Secret
29690-82-2
1.9757
0.1849
6.6112
6.6112
100.0000%
100.0000%
5.0000%
5.0000%
11,472
1,074
38,389
38,389
1.1472%
0.1074%
3.8388%
3.8388%
Trade Secret
14808-60-7
6.6112
0.6509
5.0000%
0.4923%
38,389
3,780
3.8388%
0.3780%
60676-86-0
1333-86-4
Trade Secret
101.0326
0.3967
10.3105
76.4100%
0.3000%
7.7976%
586,654
2,303
59,868
58.6655%
0.2303%
5.9869%
% Total:
100.0000
Package Weight (mg):
172.2182
PPM
% weight of
substance
per package
194,410
4,743
167
253
20
182
40
41
20
19,278
390
21
32
21
32
26
3
3
19.4411%
0.4743%
0.0167%
0.0253%
0.0020%
0.0182%
0.0040%
0.0041%
0.0020%
1.9278%
0.0390%
0.0021%
0.0032%
0.0021%
0.0032%
0.0026%
0.0003%
0.0003%
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity.
In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are
calculated using MSDS, Material Analysis Reports and Cypress Assembly site information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-04102 Rev. *P
Page 5 of 13
20L - SSOP
Pb-Free Package
ASSEMBLY Site 2: Amkor Technology Philippines (P1/P2)
Package Qualification Report # 040606, 072108, 063503 (Note 1)
I. DECLARATION OF PACKAGED UNITS
A. BANNED SUBSTANCES
Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU RoHS.
Listed in the table below are materials that are neither contained nor intentionally added to this product.
Pure Sn Lead Finish
Substances / Compounds
Cadmium and Cadmium Compounds
Hexavalent Chromium and its Compounds
Lead and Lead Compounds
Mercury and Mercury Compounds
Polybrominated Biphenyls (PBB)
Polybrominated Diphenylethers (PBDE)
Asbestos
Azo colorants
Ozone Depleting Substances
Polychlorinated Biphenyls (PCBs)
Polychlorinated Napthalenes
Radioactive Substances
Shortchain Chlorinated Paraffins
Tributyl Tin (TBT) and Triphenyl Tin (TPT)
Tributyl Tin Oxide (TBTO)
Formaldehyde
Weight by mg
PPM
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
0
0
0
0
0
0
0
0
0
0
Analysis Report
(Note 2)
CoA-SP20-Amkor
Philippines
(P1/P2)
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity.
In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are
calculated using MSDS, Material Analysis Reports and Cypress Assembly site information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-04102 Rev. *P
Page 6 of 13
20L - SSOP
Pb-Free Package
NiPdAu Lead Finish
Substances / Compounds
Cadmium and Cadmium Compounds
Hexavalent Chromium and its Compounds
Lead and Lead Compounds
Mercury and Mercury Compounds
Polybrominated Biphenyls (PBB)
Polybrominated Diphenylethers (PBDE)
Asbestos
Azo colorants
Ozone Depleting Substances
Polychlorinated Biphenyls (PCBs)
Polychlorinated Napthalenes
Radioactive Substances
Shortchain Chlorinated Paraffins
Tributyl Tin (TBT) and Triphenyl Tin (TPT)
Tributyl Tin Oxide (TBTO)
Formaldehyde
Weight by mg
PPM
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
0
0
0
0
0
0
0
0
0
0
Analysis Report
(Note 2)
CoA-SP20Amkor
Philippines
(P1/P2)
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
B1. MATERIAL COMPOSITION (Note 3)
Pure Sn Lead finish
Material
Purpose of Use
Lead frame
Base Material
Lead Finish
External Plating
Die Attach
Adhesive
Die
Wire
Circuit
Interconnect
Mold
Compound
Encapsulation
Substance
Composition
Cu
Fe
P
Zn
Ag
Sn
Resin
Ag
Metal oxide
Amine
Gamma
Butyrolactone
Si
Au
Multi-aromatic
Resin
SiO2
Carbon Black
Epoxy, Cresol
Novolac
Phenol Resin
7440-50-8
7439-89-6
7723-14-0
1314-13-2
7440-22-4
7440-31-5
Trade Secret
7440-22-4
Trade Secret
Trade Secret
Trade Secret
46.8400
1.1300
0.0100
0.0600
1.0400
2.6600
0.5800
1.9400
0.0800
0.0800
0.0800
% weight
of
substance
per
Homogeno
us
material
95.4360%
2.3024%
0.0204%
0.1222%
2.1190%
100.0000%
21.0145%
70.2899%
2.8986%
2.8986%
2.8986%
7440-21-3
7440-57-5
Trade secret
13.3400
0.4000
7.3300
100.0000%
100.0000%
7.4980%
60676-86-0
1333-86-4
29690-82-2
84.0700
0.4900
1.9600
85.9963%
0.5012%
2.0049%
Trade secret
3.9100
3.9996%
CAS Number
Package Weight (mg):
Weight by
mg
166.0000
PPM
282,169
6,807
60
361
6,265
16,024
3,494
11,687
482
482
482
80,361
2,410
44,157
506,446
2,952
11,807
23,554
% Total:
% weight of
substance
per
package
28.2200%
0.6800%
0.0100%
0.0400%
0.6300%
1.6000%
0.3500%
1.1700%
0.0500%
0.0500%
0.0500%
8.0400%
0.2400%
4.4200%
50.6400%
0.3000%
1.1800%
2.3600%
100.0000
B2. MATERIAL COMPOSITION (Note 3)
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity.
In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are
calculated using MSDS, Material Analysis Reports and Cypress Assembly site information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-04102 Rev. *P
Page 7 of 13
20L - SSOP
Pb-Free Package
NiPdAu Lead finish
Material
Lead
frame
Purpose of
Use
Base Material
Frame
Plating
Lead
Finish
External
Plating
Die Attach
Adhesive
Die
Wire
Mold
Compound
Circuit
Interconnect
Encapsulation
Substance
Composition
CAS Number
Cu
7440-50-8
Fe
P
Zn
Ni
Pd
Au
7439-89-6
7723-14-0
7440-66-6
7440-02-0
7440-05-3
7440-57-5
Ni
7440-02-0
Pd
Au
Resin
Ag
Metal Oxide
Amine
7440-05-3
7440-57-5
Trade Secret
7440-22-4
Trade Secret
Trade Secret
Gamma
Butyrolactone
Trade Secret
Silicon
Au
7440-21-3
7440-57-5
Multi-aromatic
Resin
Trade Secret
SiO2 Filler
Carbon Black
60676-86-0
1333-86-4
Epoxy Cresol
Novolac
Trade Secret
Phenol Resin
Trade Secret
Package Weight (mg):
Weight by
mg
% weight of
substance
per
Homogenous
material
PPM
% weight of
substance
per package
46.0000
1.1100
0.0100
0.0600
0.8600
0.0200
0.0040
97.4989%
2.3527%
0.0212%
0.1272%
97.2851%
2.2624%
0.4525%
285,689
6,894
62
373
5,341
124
25
28.5689%
0.6894%
0.0062%
0.0373%
0.5341%
0.0124%
0.0025%
0.3600
0.0080
0.0020
0.4000
1.3200
0.0600
0.0600
97.2973%
2.1622%
0.5405%
21.0526%
69.4737%
3.1579%
3.1579%
2,236
50
12
2,484
8,198
373
373
0.2236%
0.0050%
0.0012%
0.2484%
0.8198%
0.0373%
0.0373%
0.0600
5.4700
0.4000
3.1579%
100.0000%
99.9900%
373
33,972
2,484
0.0373%
3.3972%
0.2484%
7.9000
90.1000
0.5200
7.5374%
85.9651%
0.4961%
49,064
559,579
3,230
4.9064%
55.9579%
0.3230%
2.0900
4.2000
1.9941%
4.0073%
12,980
26,085
1.2980%
2.6085%
161.0140
% Total:
100.0000
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity.
In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are
calculated using MSDS, Material Analysis Reports and Cypress Assembly site information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-04102 Rev. *P
Page 8 of 13
20L - SSOP
Pb-Free Package
ASSEMBLY Site 3: Cypress Manufacturing Limited (CML)
Package Qualification Report #s 063711, 121405 (Note 1)
I.
DECLARATION OF PACKAGED UNITS
A. BANNED SUBSTANCES
Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU RoHS.
Listed in the table below are materials that are neither contained nor intentionally added to this product.
Substances / Compounds
Cadmium and Cadmium Compounds
Hexavalent Chromium and its Compounds
Lead and Lead Compounds
Mercury and Mercury Compounds
Polybrominated Biphenyls (PBB)
Polybrominated Diphenylethers (PBDE)
Asbestos
Azo colorants
Ozone Depleting Substances
Polychlorinated Biphenyls (PCBs)
Polychlorinated Napthalenes
Radioactive Substances
Shortchain Chlorinated Paraffins
Tributyl Tin (TBT) and Triphenyl Tin (TPT)
Tributyl Tin Oxide (TBTO)
Formaldehyde
Weight by mg
PPM
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
0
0
0
0
0
0
0
0
0
0
Analysis Report
(Note 2)
CoA-SP20- CML
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity.
In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are
calculated using MSDS, Material Analysis Reports and Cypress Assembly site information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-04102 Rev. *P
Page 9 of 13
20L - SSOP
Pb-Free Package
B. MATERIAL COMPOSITION (Note 3)
B1. Using Gold Wire
Material
Lead frame
Lead Finish
Die Attach
Purpose of
Use
Base Material
External
Plating
Adhesive
Die
Wire
Circuit
Interconnect
Mold
Compound
Encapsulation
42.4100
% weight of
substance per
Homogenous
material
96.1896%
266,679
26.6679%
7440-21-3
0.2900
0.6577%
1,824
0.1824%
Mg
7439-95-4
0.0700
0.1588%
440
0.0440%
Ni
Ni
Pd
Au
Ag
Proprietary
Bismeleide
Proprietary
Polymer
Methacrylate
Acrylate
Ester
Organic
Peroxide
Si
Au
SiO2
Phenol
Resin
Epoxy Resin
7440-02-0
7440-02-0
7440-05-3
7440-57-5
7440-22-4
Trade Secret
1.3200
0.8900
0.0200
0.0200
0.1920
0.0216
2.9939%
95.6989%
2.1505%
2.1505%
80.0000%
9.0000%
8,300
5,596
126
126
1,207
136
0.8300%
0.5596%
0.0126%
0.0126%
0.1207%
0.0136%
Trade Secret
0.0120
5.0000%
75
0.0075%
Trade Secret
Trade Secret
0.0048
0.0048
2.0000%
2.0000%
30
30
0.0030%
0.0030%
Trade Secret
0.0048
2.0000%
30
0.0030%
3.6700
1.2400
96.8900
5.4400
100.0000%
100.0000%
89.0042%
4.9972%
23,077
7,797
609,256
34,207
2.3077%
0.7797%
60.9256%
3.4207%
6.5300
5.9985%
Substance
Compositio
n
CAS Number
Cu
7440-50-8
Si
7440-21-3
7440-57-5
60676-86-0
Proprietary
Proprietary
Package Weight (mg):
Weight by
mg
159.0300
% weight of
substance
per package
PPM
41,061
4.1061%
% Total:
100.0000
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity.
In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are
calculated using MSDS, Material Analysis Reports and Cypress Assembly site information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-04102 Rev. *P
Page 10 of 13
20L - SSOP
Pb-Free Package
B2. Using Copper Wire
Purpose of
Use
Material
Lead frame
Base Material
Lead Finish
External
Plating
Die Attach
Adhesive
Die
Wire
Circuit
Interconnect
Mold
Compound
Encapsulation
42.4100
% weight of
substance per
Homogenous
material
96.1896%
267,794
26.7794%
7440-21-3
0.2900
0.6577%
1,831
0.1831%
Mg
7439-95-4
0.0700
0.1588%
442
0.0442%
Ni
Ni
Pd
Au
Ag
Proprietary
Bismeleide
Proprietary
Polymer
Methacrylate
Acrylate Ester
Organic
Peroxide
Si
Cu
SiO2
Phenol Resin
Epoxy Resin
7440-02-0
7440-02-0
7440-05-3
7440-57-5
7440-22-4
Trade Secret
1.3200
0.8900
0.0200
0.0200
0.1920
0.0216
2.9939%
95.6989%
2.1505%
2.1505%
80.0000%
9.0000%
8,335
5,620
126
126
1,212
136
0.8335%
0.5620%
0.0126%
0.0126%
0.1212%
0.0136%
Trade Secret
0.0120
5.0000%
76
0.0076%
Trade Secret
Trade Secret
Trade Secret
0.0048
0.0048
0.0048
2.0000%
2.0000%
2.0000%
30
30
30
0.0030%
0.0030%
0.0030%
3.6700
0.5782
96.8900
5.4400
6.5300
100.0000%
100.0000%
89.0044%
4.9972%
5.9985%
23,174
3,651
611,804
34,350
41,233
2.3174%
0.3651%
61.1804%
3.4350%
4.1233%
% Total:
100.0000
Substance
Composition
CAS
Number
Weight by
mg
Cu
7440-50-8
Si
7440-21-3
7440-50-8
60676-86-0
Proprietary
Proprietary
Package Weight (mg):
158.3682
% weight of
substance
per package
PPM
II. DECLARATION OF PACKAGING INDIRECT MATERIALS
Type
Tape & Reel
Tube
HIC
Others
Material
Cover tape
Carrier tape
End Pin
End Plug
Humidity Indicator
Shielding bag
Lead
PPM
<2.0
<2.0
<2.0
<2.0
<10.0
<2.0
Cadmium
PPM
<2.0
<2.0
<2.0
<2.0
< 5.0
<2.0
Cr VI
PPM
<2.0
<2.0
<2.0
<2.0
< 4.0
<2.0
Mercury
PPM
<2.0
<2.0
<2.0
<2.0
< 1.0
<2.0
PBB
PPM
<0.0005
<0.0005
<0.0005
<0.0005
< 100.0
<5.0
PBDE
PPM
<0.0005
<0.0005
<0.0005
<0.0005
< 100.0
<5.0
Analysis Report
(Note2)
CoA-COVT-R
CoA-CART-R
CoA-ENDP-R
CoA-EPLG-R
CoA-HIC-R
CoA-SBAG-R
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity.
In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are
calculated using MSDS, Material Analysis Reports and Cypress Assembly site information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-04102 Rev. *P
Page 11 of 13
20L - SSOP
Pb-Free Package
Document History Page
Document Title:
Document Number:
Rev.
20L - SSOP PB-FREE PACKAGE MATERIAL DECLARATION DATASHEET
001-04102
**
*A
ECN No. Orig. of
Change
388679
EML
417225
YXP
*B
432489
MRB
*C
602516
MRB
*D
2602510 MAHA
DCON
Description of Change
New document
Edited Summary section – edited package weight for
assembly site 1, and added package weight for assembly
site 2.
Added “(PMDD)” on title page.
Edited Note 3 on footer section.
Added Note 4 on footer section.
Added qual report # 043102 for assembly site 1.
Revised section I-B of assembly site 1 to reflect updated
package weight.
Added PMDD data for assembly site 2.
Added referencing to the automotive qualification report
number 042702 for assembly site 1.
1. Updated Cypress Logo
2. Added package weight on Site 3
3. Added on the material composition the percent weight
per homogeneous material and weight of substance
per package on assembly site 1 and 2.
4. Added PMDD for assembly site 3
5. Deleted assembly site 1 and 2 on the declaration of
Packaging/Indirect.
6. Update Lead, CrIV, PBB and PBDE on the
Declaration of Packaging/Indirect Materials.
1.Added the following for assembly site 1:
a. Package weight for NiPdAu lead finish
b. Table A for NiPdAu lead finish
c. Reference QTP 053005
d. Material composition table for NiPdAu lead finish
2. Changed CoA-SP28-R to CoA-SP20-R for assembly
site 3.
Changed CML to WEB in distribution list.
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity.
In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are
calculated using MSDS, Material Analysis Reports and Cypress Assembly site information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-04102 Rev. *P
Page 12 of 13
20L - SSOP
Pb-Free Package
Document History Page
Document Title:
Document Number:
Rev.
20L - SSOP PB-FREE PACKAGE MATERIAL DECLARATION DATASHEET
001-04102
*E
ECN
Orig. of
No.
Change
2819624 MAHA
*F
2915244 SMYU
*G
3067069 MAHA
*H
3440953 MAHA
*I
3562734 UDR
*J
3645620 COPI
*K
4032303 YUM
*L
*M
4086966 YUM
4146716 UDR
*N
*O
*P
4426949 HLR
4594594 HLR
5052095 HLR
SLLO
Description of Change
Corrected the CAS number of Magnesium and Silica on
Table B1 of assembly site 1. Corrected the spelling of
Proprietary in Proprietary Polymer on the material
composition table of assembly site 3. Added the CAS
number of SiO2 on the material composition table of
assembly site 3. Corrected the CAS number of Magnesium
on the material composition table of assembly site 3.
1.Added the following for assembly site 2:
a. Package weight for NiPdAu lead finish
b. Table A for NiPdAu lead finish
c. Reference QTP 074606
d. Material composition table for NiPdAu lead finish
Added percent signs to the percent weight per
homogeneous material and weight of substance per
package values on the following:
1. Table B1 of assembly site 1
2. Assembly site 3
Added percent signs to the percent weight per
homogeneous material values on Assembly site 2.
Expressed the weight by mg, package weight, % weight of
substance per Homogeneous material, and % weight of
substance per package in four decimal places; and
recalculated the PPM values for all assembly sites.
Added B3 under Site 1 with reference QTP # 120410 for
SSOP 20L Copper Wire Qualification.
Added PMDD B2 for Assembly Site 3. CML-RA Copper
wire qualification under QTP # 121405.
Added assembly site name in the Assembly heading.
Changed Assembly Code to Assembly Site Name.
Added “P1/P2” in the assembly heading in site 2.
Added B4 under Site 1 with reference QTP # 120410 for
SSOP 20L Copper Wire Qualification.
Added 063503 on the QTP reference for Assembly Site 2.
Sunset Due – No Change
Changed the substances with “------------- “to “Trade Secret
Removed Distribution and Posting.
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity.
In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are
calculated using MSDS, Material Analysis Reports and Cypress Assembly site information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-04102 Rev. *P
Page 13 of 13