20L-SOIC PB-FREE PACKAGE MATERIAL DECLARATION DATASHEET.pdf

20L -SOIC
Pb-Free Package
PACKAGE MATERIAL DECLARATION DATASHEET
Cypress Package Code
Package Weight – Site 1
SZ
B1: 549.9901 mg
B2: 550.0000 mg
B3: 550.4266 mg
Body Size (mil/mm)
Package Weight – Site 2
300 mils
B1: 550.0000 mg
B2: 544.3501 mg
SUMMARY
The 20L- SOIC Pb-Free package is compliant to RoHS. Cypress Ordering Part Numbers containing an “X”
(e.g. CY7C1328G-133AXI, CY2308SXC-1HT) meet the Directive 2002/95/EC (RoHS) requirement.
ASSEMBLY Site 1: Cypress Manufacturing Limited (CML)
Package Qualification Report # 030802, 041601, 054502, 125106 (Note 1)
I. DECLARATION OF PACKAGED UNITS
A. BANNED SUBSTANCES
Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU
RoHS. Listed in the table below are materials that are neither contained nor intentionally added to this
product.
Substances / Compounds
Cadmium and Cadmium Compounds
Hexavalent Chromium and its Compounds
Lead and Lead Compounds
Mercury and Mercury Compounds
Polybrominated Biphenyls (PBB)
Polybrominated Diphenylethers (PBDE)
Asbestos
Azo colorants
Ozone Depleting Substances
Polychlorinated Biphenyls (PCBs)
Polychlorinated Napthalenes
Radioactive Substances
Shortchain Chlorinated Paraffins
Tributyl Tin (TBT) and Triphenyl Tin (TPT)
Tributyl Tin Oxide (TBTO)
Formaldehyde
Weight by
mg
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
PPM
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
0
0
0
0
0
0
0
0
0
0
Analysis Report
(Note 2)
CoA-SZ20CML
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to
report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material
information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data,
Document No. 001-03049 Rev. *L
Page 1 of 11
20L -SOIC
Pb-Free Package
B1. MATERIAL COMPOSITION (Note 3)
Using Standard Mold Compound
Material
Purpose of
Use
Leadframe
Base Material
Lead Finish
External
Plating
Die Attach
Adhesive
Die
Wire
Circuit
Interconnect
Mold Compound
Encapsulation
Substance
Composition
Cu
Fe
P
Zn
Ni
Pd
Au
Ag
Bismaleimide
Polymer
Methacrylate
Acylate ester
Organic
Peroxide
Si
Au
Fused Silica
Solid Epoxy
Resin
Phenol Resin
Antimony
Trioxide
Crystalline
Silica
Carbon Black
7440-50-8
7439-89-6
7723-14-0
7440-66-6
7440-02-0
7440-05-3
7440-57-5
7440-22-4
Trade Secret
Trade Secret
Trade Secret
Trade Secret
Trade Secret
210.5517
5.1876
0.1513
0.2594
0.1930
0.0035
0.0035
0.1596
0.0190
0.0095
0.0008
0.0008
0.0004
% weight of
substance per
Homogenous
material
97.4100%
2.4000%
0.0700%
0.1200%
96.5200%
1.7400%
1.7400%
84.0000%
10.0000%
5.0000%
0.4000%
0.4000%
0.2000%
7440-21-3
7440-57-5
60676-86-0
Trade Secret
2.8100
1.0700
243.5522
32.9570
100.0000%
100.0000%
73.9000%
10.0000%
Trade Secret
1309-64-4
36.2527
4.2844
11.0000%
1.3000%
9.8871
3.0000%
CAS Number
Weight by
mg
PPM
382,828
9,432
275
472
351
6
6
290
35
17
1
1
1
5,109
1,945
442,830
59,923
65,915
0.5109%
0.1945%
44.2830%
5.9923%
6.5915%
0.7790%
7,790
14808-60-7
1333-86-4
Package Weight (mg):
2.6366
549.9901
0.8000%
1.7977%
17,977
4,794
% Total:
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to
report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material
information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data,
Document No. 001-03049 Rev. *L
% weight of
substance
per
package
38.2828%
0.9432%
0.0275%
0.0472%
0.0351%
0.0006%
0.0006%
0.0290%
0.0035%
0.0017%
0.0001%
0.0001%
0.0001%
Page 2 of 11
0.4794%
100.0000
20L -SOIC
Pb-Free Package
B2. Material Composition (Note 3)
Using Green Molding Compound
Material
Purpose of Use
Lead frame
Base Material
Lead Finish
External Plating
Die Attach
Die
Wire
Adhesive
Circuit
Interconnect
Substance
Composition
Cu
Fe
P
Zn
Ni
Pd
Au
Ag
Proprietary
Bismaleimide
Proprietary
Polymer
Methacrylate
Acylate ester
Organic
Peroxide
Si
Au
Silica
Phenol Resin
Epoxy Resin
CAS Number
7440-50-8
7439-89-6
7723-14-0
7440-66-6
7440-02-0
7440-05-3
7440-57-5
7440-22-4
Trade Secret
173.1842
4.2669
0.1245
0.2133
2.1342
0.0384
0.0385
0.1584
%weight of
substance
per
Homogeneo
us material
97.4100%
2.4000%
0.0700%
0.1200%
96.5204%
1.7370%
1.7427%
80.0000%
0.0178
Weight by
mg
% weight of
substance
per
package
PPM
314,880
7,758
226
388
3,880
70
70
288
31.4880%
0.7758%
0.0226%
0.0388%
0.3880%
0.0070%
0.0070%
0.0288%
9.0000%
32
0.0032%
0.0099
0.0040
0.0040
5.0000%
2.0000%
2.0000%
18
7
7
0.0018%
0.0007%
0.0007%
0.0040
2.7720
1.1183
325.6613
18.2956
21.9547
2.0000%
100.0000%
100.0000%
89.0000%
5.0000%
6.0000%
7
5,040
2,033
592,112
33,265
39,918
0.0007%
0.5040%
0.2033%
59.2112%
3.3265%
3.9918%
Trade Secret
Trade Secret
Trade Secret
Trade Secret
7440-21-3
7440-57-5
60676-86-0
Trade Secret
Trade Secret
Package Weight (mg):
550.0000
% Total:
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to
report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material
information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data,
Document No. 001-03049 Rev. *L
Page 3 of 11
100.0000
20L -SOIC
Pb-Free Package
B3. Material Composition (Note 3)
Copper wire using NiPdAu and Halogen-free Molding Compound
Material
Purpose of Use
Lead frame
Base Material
Lead Finish
External Plating
Die Attach
Adhesive
Die
Wire
Circuit
Interconnect
Mold Compound
Encapsulation
Substance
Composition
Cu
Fe
P
Zn
Ni
Pd
Au
Ag
Proprietary
Bismaleimide
Proprietary
Polymer
Methacrylate
Acylate ester
Organic
Peroxide
Si
Cu
Silica
Phenol Resin
Epoxy Resin
Carbon Black
CAS Number
7440-50-8
7439-89-6
7723-14-0
7440-66-6
7440-02-0
7440-05-3
7440-57-5
7440-22-4
Trade Secret
173.1842
4.2669
0.1245
0.2133
2.1341
0.0385
0.0385
0.1584
%weight of
substance
per
Homogeneo
us material
97.4100%
2.4000%
0.0700%
0.1200%
96.5200%
1.7400%
1.7400%
80.0000%
0.0178
Weight by
mg
% weight of
substance
per package
PPM
314,637
7,752
226
388
3,877
70
70
288
31.4637%
0.7752%
0.0226%
0.0388%
0.3877%
0.0070%
0.0070%
0.0288%
9.0000%
32
0.0032%
0.0099
5.0000%
18
0.0018%
Trade Secret
Trade Secret
Trade Secret
0.0040
0.0040
2.0000%
2.0000%
7
7
0.0007%
0.0007%
0.0040
2.0000%
7
0.0007%
7440-21-3
7440-50-8
60676-86-0
Trade Secret
Trade Secret
1333-86-4
2.7720
0.5215
326.5721
18.3468
21.0988
0.9173
100.0000%
100.0000%
89.0000%
5.0000%
5.7500%
0.2500%
5,036
947
593,307
33,332
38,332
1,667
0.5036%
0.0947%
59.3307%
3.3332%
3.8332%
0.1667%
Trade Secret
Package Weight (mg):
550.4266
%Total:
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to
report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material
information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data,
Document No. 001-03049 Rev. *L
Page 4 of 11
100.0000
20L -SOIC
Pb-Free Package
II. DECLARATION OF PACKAGING / INDIRECT MATERIALS
Type
Tape & Reel
Tube
Others
Material
Cover tape
Carrier tape
Plastic Reel
Plastic Tube
End Plug
Shielding bag
Moisture Barrier bag
Protective Band
Shipping and Inner
Box
Dessicant
Bubble Pack
Lead
PPM
< 2.0
< 2.0
< 2.0
< 5.0
< 5.0
< 2.0
< 2.0
< 2.0
< 10.0
Cadmium
PPM
< 2.0
< 2.0
< 2.0
< 5.0
< 5.0
< 2.0
< 2.0
< 2.0
< 4.0
Cr VI
PPM
< 2.0
< 2.0
< 2.0
< 5.0
< 5.0
< 2.0
< 2.0
< 2.0
< 4.0
Mercury
PPM
< 2.0
< 2.0
< 2.0
< 5.0
< 5.0
< 2.0
< 2.0
< 2.0
< 5.0
PBB
PPM
<5.0
<5.0
<5.0
< 1.0
< 1.0
<5.0
<5.0
<5.0
---------
PBDE
PPM
<5.0
<5.0
<5.0
< 1.0
< 1.0
<5.0
<5.0
<5.0
-----------
< 10.0
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
< 1.0
< 2.0
< 3.0
< 100.0
< 3.0
< 90.0
Analysis Report
(Note2)
CoA-COVT-R
CoA-CART-R
CoA-PLRL-R
CoA-PLTB-R
CoA-EPLG-R
CoA-SBAG –R
CoA-MBBG-R
CoA-PROB-R
CoA-ABOX-R
CoA-DESS-R
CoA-BUBP-R
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to
report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material
information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data,
Document No. 001-03049 Rev. *L
Page 5 of 11
20L -SOIC
Pb-Free Package
ASSEMBLY Site 2: Jiangsu Changjiang Electronics Technology (JCET)
Package Qualification Report # 113906, 113907, 143703 (Note 1)
I. DECLARATION OF PACKAGED UNITS
A. BANNED SUBSTANCES
Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU
RoHS. Listed in the table below are materials that are neither contained nor intentionally added to this
product.
Substances / Compounds
Cadmium and Cadmium Compounds
Hexavalent Chromium and its Compounds
Lead and Lead Compounds
Mercury and Mercury Compounds
Polybrominated Biphenyls (PBB)
Polybrominated Diphenylethers (PBDE)
Asbestos
Azo colorants
Ozone Depleting Substances
Polychlorinated Biphenyls (PCBs)
Polychlorinated Napthalenes
Radioactive Substances
Shortchain Chlorinated Paraffins
Tributyl Tin (TBT) and Triphenyl Tin (TPT)
Tributyl Tin Oxide (TBTO)
Formaldehyde
Weight by
mg
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
PPM
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
0
0
0
0
0
0
0
0
0
0
Analysis Report
(Note 2)
CoA-SZ20JCET
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to
report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material
information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data,
Document No. 001-03049 Rev. *L
Page 6 of 11
20L -SOIC
Pb-Free Package
B. MATERIAL COMPOSITION (Note 3)
B1: USING GOLD WIRE
Material
Purpose of Use
Lead frame
Base Material
Lead Finish
External Plating
Die Attach
Die
Wire
Adhesive
Circuit
Interconnect
Substance
Composition
Cu
Fe
P
Zn
Ni
Pd
Au
Ag
Proprietary
Bismaleimide
Proprietary
Polymer
Methacrylate
Acylate ester
Organic
Peroxide
Si
Au
Silica
Phenol Resin
Epoxy Resin
CAS Number
7440-50-8
7439-89-6
7723-14-0
7440-66-6
7440-02-0
7440-05-3
7440-57-5
7440-22-4
Trade Secret
173.1842
4.2669
0.1245
0.2133
2.1342
0.0384
0.0385
0.1584
%weight of
substance
per
Homogeneo
us material
97.4100%
2.4000%
0.0700%
0.1200%
96.5204%
1.7370%
1.7427%
80.0000%
0.0178
Weight by
mg
% weight of
substance
per
package
PPM
314,880
7,758
226
388
3,880
70
70
288
31.4880%
0.7758%
0.0226%
0.0388%
0.3880%
0.0070%
0.0070%
0.0288%
9.0000%
32
0.0032%
0.0099
0.0040
0.0040
5.0000%
2.0000%
2.0000%
18
7
7
0.0018%
0.0007%
0.0007%
0.0040
2.7720
1.1183
325.6613
18.2956
21.9547
2.0000%
100.0000%
100.0000%
89.0000%
5.0000%
6.0000%
7
5,040
2,033
592,112
33,265
39,918
0.0007%
0.5040%
0.2033%
59.2112%
3.3265%
3.9918%
Trade Secret
Trade Secret
Trade Secret
Trade Secret
7440-21-3
7440-57-5
60676-86-0
Trade Secret
Trade Secret
Package Weight (mg):
550.0000
% Total:
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to
report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material
information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data,
Document No. 001-03049 Rev. *L
Page 7 of 11
100.0000
20L -SOIC
Pb-Free Package
B2: USING COPPER PALLADIUM WIRE
Material
Leadframe
Lead
Finish
Die Attach
Purpose of
Use
Base Material
External
Plating
Adhesive
Die
Circuit
Wire
Interconnect
Mold
Compound
Encapsulation
Substance
Composition
CAS Number
Weight
by mg
% weight of
substance per
Homogeneous
0.0220
0.0045
0.0015
7440-22-4
3.9160
0.8010
0.2670
4.0940
7440-50-8
168.9220
Nickel
Silicon
Magnesium
7440-02-0
7440-21-3
7439-95-4
Silver
Copper
Tin
7440-31-5
Silver
Proprietary
Bismaleimide
Proprietary Polymer
Methacrylate
7440-22-4
Trade Secret
Acrylate Ester
Organic Peroxide
Silicon
Copper
Palladium
Epoxy Resin A
Epoxy Resin B
Phenol Resin
Silica(Amorphous)
Carbon Black
Trade Secret
Trade Secret
Trade Secret
Trade Secret
7440-21-3
7440-50-8
7440-05-3
Trade Secret
Trade Secret
Trade Secret
60676-86-0
1333-86-4
Package Weight (mg):
2.8600
PPM
%% Weight
of Substance
per package
0.0230
7,194
1,471
490
7,521
0.7194%
0.1471%
0.0490%
0.7521%
0.9490
310,319
31.0319%
5,254
0.5254%
291
0.0291%
33
0.0033%
0.0018%
0.0007%
1.0000
0.1584
0.8000
0.0178
0.0099
0.0900
0.0500
0.0040
0.0200
18
7
0.0040
0.0040
2.7720
0.5109
0.0091
10.8000
10.8000
18.0000
319.3200
1.0800
0.0200
0.0200
1.0000
0.9825
0.0175
0.0300
0.0300
0.0500
0.8870
0.0030
7
7
5,092
939
17
19,840
19,840
33,067
586,608
1,984
0.0007%
0.0007%
0.5092%
0.0939%
0.0017%
1.9840%
1.9840%
3.3067%
58.6608%
0.1984%
% Total:
100.0000
544.3501
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to
report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material
information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data,
Document No. 001-03049 Rev. *L
Page 8 of 11
20L -SOIC
Pb-Free Package
II. DECLARATION OF PACKAGING / INDIRECT MATERIALS
Type
Tape & Reel
Tube
Others
Material
Cover tape
Carrier tape
Plastic Reel
Plastic Tube
End Plug
Shielding bag
Moisture Barrier bag
Protective Band
Shipping and Inner
Box
Dessicant
Bubble Pack
Lead
PPM
< 2.0
< 2.0
< 2.0
< 5.0
< 5.0
< 2.0
< 2.0
< 2.0
< 10.0
Cadmium
PPM
< 2.0
< 2.0
< 2.0
< 5.0
< 5.0
< 2.0
< 2.0
< 2.0
< 4.0
Cr VI
PPM
< 2.0
< 2.0
< 2.0
< 5.0
< 5.0
< 2.0
< 2.0
< 2.0
< 4.0
Mercury
PPM
< 2.0
< 2.0
< 2.0
< 5.0
< 5.0
< 2.0
< 2.0
< 2.0
< 5.0
PBB
PPM
<5.0
<5.0
<5.0
< 1.0
< 1.0
<5.0
<5.0
<5.0
---------
PBDE
PPM
<5.0
<5.0
<5.0
< 1.0
< 1.0
<5.0
<5.0
<5.0
-----------
< 10.0
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
< 1.0
< 2.0
< 3.0
< 100.0
< 3.0
< 90.0
Analysis Report
(Note2)
CoA-COVT-R
CoA-CART-R
CoA-PLRL-R
CoA-PLTB-R
CoA-EPLG-R
CoA-SBAG –R
CoA-MBBG-R
CoA-PROB-R
CoA-ABOX-R
CoA-DESS-R
CoA-BUBP-R
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to
report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material
information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data,
Document No. 001-03049 Rev. *L
Page 9 of 11
20L -SOIC
Pb-Free Package
Document History Page
Document Title:
Document Number:
Rev.
20L-SOIC PB-FREE PACKAGE MATERIAL DECLARATION DATASHEET
001-03049
**
*A
ECN No. Orig. of
Change
385598
GFJ
2264886
HLR
*B
2678536
HLR
*C
2882692
HLR
*D
3290724
MAHA
*E
*F
3392264
3589011
REYD
HLR
*G
4007746
UDR
*H
4065631
YUM
*I
4354901
HLR
Description of Change
New document
Updated Cypress Logo
Added % weight of substance per Homogenous Material
and % weight of substance per package on the Material
Composition.
Added CAS Number for Antimony Trioxide
Completed the RoHS Substances namely; Lead
Cadmium, Mercury, Chromium VI, PBB and PBDE on
Declaration of Packaging Indirect Materials table
Added Note 4 on Footer Section and added CAS number
for Fused Silica.
Added CAS number for Crystalline Silica and Carbon
Black
Added package weight and QTP reference 054502 for
B2 of assembly site 1. Added Table B2. NiPdAu using
Green Molding Compound to assembly site 1.
Added Assembly Site 2 – JCET.
Updated the material composition table to reflect 4
decimal places on values on Assembly Site 1 – B1.
Added B3 for Assembly Site 1
Added QTP # 125106 at Assembly Site 1 Package
Qualification Reports.
Added B3. Material Composition - Using Copper Wire
using NiPdAu and Halogen-free Mold Compound.
Added assembly site name in the assembly heading in
site 1 and 2.
Changed assembly code to assembly site name in 1 and
2.
Removed Tray and End Pin in the Indirect Materials
section.
Changed the total package weight of Assembly Site 1.B2
and Assembly Site 2 material composition.
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to
report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material
information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data,
Document No. 001-03049 Rev. *L
Page 10 of 11
20L -SOIC
Pb-Free Package
Rev.
*J
ECN No. Orig. of
Change
4498496
REYD
*K
*L
4743012
5261331
HLR
HLR
MEL
Description of Change
Added B2 in Package Weight and QTP# 143703 under
Site 2.
Updated Material Composition Table under Assembly
Site 2-B2.
Sunset Due – No Change.
Changed the substances with “------------- “ and
Proprietary to “Trade Secret
Removed distribution and posting from the document
history page.
Changed Cypress Logo.
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to
report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material
information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data,
Document No. 001-03049 Rev. *L
Page 11 of 11