IRF IR53HD420-P2

Preliminary Data Sheet No. PD60140J
IR53H(D)420(-P2)
SELF-OSCILLATING HALF BRIDGE
Features
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Product Summary
Output power MOSFETs in half-bridge configuration
High side gate drive designed for bootstrap operation
Bootstrap diode integrated into package (HD type)
Tighter initial deadtime control
Low temperature coefficient deadtime
15.6V zener clamped Vcc for offline operation
Half-bridge output is out of phase with RT
True micropower startup
Shutdown feature (1/6th VCC) on CT lead
Increased undervoltage lockout hysteresis (1Volt)
Lower power level-shifting circuit
Lower di/dt gate drive for better noise immunity
Excellent latch immunity on all inputs and outputs
ESD protection on all leads
Constant VO pulse width at startup
Heatsink package version (P2 type)
VIN (max)
500V
Duty Cycle
50%
Deadtime (type.)
1.2µs
Rds(on)
3.0Ω
PD (TA = 25oC) 2.0W or 3.0W
Package
Description
The IR53H(D)420(-P2) are complete high voltage, high speed,
self-oscillating half-bridge circuits. Proprietary HVIC and latch
immune CMOS technologies, along with the HEXFET® power
MOSFET technology, enable ruggedized single package construction. The front-end features a programmable oscillator
which functions similar to the CMOS 555 timer. The supply to
the control circuit has a zener clamp to simplify offline operation. The output features two HEXFETs in a half-bridge configuration with an internally set deadtime designed for minimum cross-conduction in the half-bridge. Propagation delays
7 Pin Lead SIP
for the high and low side power MOSFETs
are matched to simplify use in 50% duty
cycle applications. The device can operate up to the VIN (max) rating.
Typical Connection
HV DC Bus
IR53H(D)420(-P2)
VIN
D1
1
2
Vcc
VB
RT
VIN
CT
VO
6
External
Fast recovery diode D1 is not
required for HD type
9
RT
3
7
CT
4
COM
COM
TO,
LOAD
IR53H(D)420(-P2)
Absolute Maximum Ratings
Absolute maximum ratings indicate sustained limits beyond which damage to the device may occur. All voltage parameters are absolute voltages referenced to COM, unless stated otherwise. All currents are defined
positive into any lead. The thermal resistance and power dissipation ratings are measured under board
mounted and still air conditions.
Symbol
Definition
VIN
High voltage supply
VB
VO
VRT
VCT
Icc
IRT
dV/dt
PD
High side floating supply
Half-bridge output
RT voltage
CT voltage
Supply current (note 1)
RT output current
Peak diode recovery
Package power dissipation @ TA ≤ +25°C
Minimum
-P2
RthJA
Thermal resistance, junction to ambient
RthJC
Thermal resistance, junction to case
(heatsink)
Junction temperature
Storage temperature
Lead temperature (soldering, 10 seconds)
TJ
TS
TL
-P2
-P2
Maximum
- 0.3
500
Vo - 0.3
-0.3
- 0.3
- 0.3
—
-5
—
—
—
—
—
—
Vo + 25
VIN + 0.3
Vcc + 0.3
Vcc + 0.3
25
5
3.50
2
3
60
40
20
-55
-55
—
150
150
300
Units
V
mA
V/ns
W
oC/W
°C
NOTE 1:
This IC contains a zener clamp structure between VCC and COM which has a nominal breakdown voltage of 15.6V.
Please note that this supply pin should not be driven by a DC, low impedance power source greater than the VCLAMP
specified in the Electrical Characteristics Section
2
IR53H(D)420(-P2)
Recommended Component Values
Symbol
Definition
RT
Minimum
Timing resistor value
CT
CT pin capacitor value
Maximum
10
—
330
—
Units
kΩ
pF
IR53H(D)420(-P2)
RTFrequency
vs Frequency
IR2153 RT vs
1000000
Frequency (Hz)
100000
330pf
10000
470pF
1nF
1000
CT Values
2.2nF
4.7nF
10nF
100
10
10
100
1000
10000
RT (ohms)
3
100000
1000000
IR53H(D)420(-P2)
Recommended Operating Conditions
The input/output logic timing diagram is shown in figure 1. For proper operation, the device should be used
within the recommended conditions.
Symbol
Definition
VB
VIN
VO
ID
High side floating supply absolute voltage
High voltage supply
Half-bridge output voltage
Continuous drain current (TA = 25°C)
Minimum
Maximum
Units
Vo + 10
—
Vo + V clamp
500
V
-3.0 (note 3)
—
-P2
—
-P2
—
—
500
0.7
0.85
0.5
0.6
—
(note 3)
-40
1.2
5
125
(TA = 85°C)
(TC = 25°C)
ICC
TA
-P2
Supply current
Ambient temperature
A
mA
°C
NOTE 2:
Care should be taken to avoid switching conditions where the VS node flies inductively below ground by more than 5V.
NOTE 3:
Enough current should be supplied to the VCC lead of the IC to keep the internal 15.6V zener diode clamping the
voltage at this lead.
Electrical Characteristics
VBIAS (VCC, VBS) = 12V, CT = 1 nF and TA = 25°C unless otherwise specified. The VIN, VTH and I IN parameters are
referenced to COM.
MOSFET Characteristics
Symbol Definition
trr
Qrr
Rds(on)
VSD
Reverse recovery time (MOSFET body diode)
Reverse recovery charge (MOSFET body diode)
Static drain-to-source on resistance
Diode forward voltage
Min.
Typ.
—
—
—
—
240
0.5
3.0
0.8
Min.
Typ.
—
—
50
660
Max. Units Test Conditions
—
—
—
—
µC
Ω
V
di/dt =
IF=700mA 100
A/µs
Dynamic Characteristics
Symbol Definition
D
tsd
RT duty cycle
Shutdown propagation delay
4
Max. Units Test Conditions
—
—
%
nsec
fosc = 20 kHz
IR53H(D)420(-P2)
Electrical Characteristics
VBIAS (VCC, VBS) = 12V, CT = 1 nF and TA = 25°C unless otherwise specified. The VIN, VTH and IIN parameters are
referenced to COM.
Low Voltage Supply Characteristics
Symbol Definition
Min.
Typ.
Max.
Units Test Conditions
VCCUV+
VCCUVVCCUVH
IQCCUV
IQCC
Rising VCC undervoltage lockout threshold
Falling VCC undervoltage lockout threshold
VCC undervoltage lockout Hysteresis
Micropower startup VCC supply current
Quiescent VCC supply current
8.1
7.2
0.5
—
—
9.0
8.0
1.0
75
500
9.9
8.8
1.5
150
950
VCLAMP
VCC zener clamp voltage
14.4
15.6
16.8
V
Min.
Typ.
Max.
Units
—
—
—
0
30
4.0
10
50
5.0
µA
V
—
0.5
—
—
50
1.0
µA
V
Symbol Definition
Min.
Typ.
Max.
fosc
Oscillator frequency
d
ICT
ICTUV
VCT+
VCTVCTSD
VRT+
RT pin duty cycle
CT pin current
UV-mode CT pin pulldown current
Upper C T ramp voltage threshold
Lower CT ramp voltage threshold
CT voltage shutdown threshold
High-level R T output voltage, V CC - VRT
VRT-
Low-level RT output voltage
VRTUV
VRTSD
UV-mode RT output voltage
SD-Mode RT output voltage, VCC - VRT
19.4
94
48
—
0.30
—
—
1.8
—
—
—
—
—
—
20
100
50
0.001
0.70
8.0
4.0
2.1
10
100
10
100
0
10
20.6
106
52
1.0
1.2
—
—
2.4
50
300
50
300
100
50
—
10
300
V
µA
VCC ≤ VCCUVICC = 5mA
Floating Supply Characteristics
Symbol Definition
IQBSUV
IQBS
VBSMIN
IOS
VF
Micropower startup VBS supply current
Quiescent VBS supply current
Minimum required VBS voltage for proper
functionality from RT to HO
Offset supply leakage current
Bootstrap diode forward voltage (IR2153D)
Test Conditions
VCC ≤ VCCUVV CC=VCCUV+ + 0.1V
VB = VS = 600V
IF = 250mA
Oscillator I/O Characteristics
5
Units Test Conditions
kHz
%
uA
mA
RT = 36.9kΩ
RT = 7.43kΩ
fo < 100kHz
VCC = 7V
V
mV
IRT = 100µA
IRT = 1mA
IRT = 100µA
IRT = 1mA
VCC ≤ VCCUVIRT = 100µA,
VCT = 0V
IRT = 1mA,
VCT = 0V
IR53H(D)420(-P2)
Functional Block Diagram
V
VIN
B
6
D1
9
1
IRFCXXX
Vcc
2
R
IR2153 C
H
O
V
S
L
3
C
7
VO
T
O
IRFCXXX
T
4
COM
Fast recovery diode D1 is
incorporated in IR53HDXXX only
6
IR53H(D)420(-P2)
Case Outline - 7 pin
4X
5.08 (.100)
2X
16.89 (.665)
16.63 (.655)
3.18 (.125)
2.92 (.115)
NOTES:
1. Dimensioning and tolerancing per
ANSI Y14.5M-1982
2. Controlling dimension: Inch
3. Dimensions are shown in
millimeters (inches)
7
IR53H(D)420(-P2)
Lead Assignments
1
2
3
4
9
6
1
2
3
Vcc
RT
CT
COM
6
7
9
VB
VO
VIN
7
4
9 Lead SIP without Leads 5 and 8
Lead Definitions
Symbol
Lead Description
VCC
RT
CT
VB
VIN
VO
COM
Logic and internal gate drive supply voltage.
Oscillator timing resistor output
Oscillator timing capacitor input
High side gate drive floating supply.
High voltage supply
Half Bridge output
Logic and low side of half bridge return
Vccuv+
V CLAMP
Vcc
RT
CT
V+
VO
0
Figure 1. Input/Output Timing Diagram
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Data and specifications subject to change without notice. 3/22/99
8