NSC SCAN18541T

SCAN18541T
Non-Inverting Line Driver with TRI-STATE ® Outputs
General Description
The SCAN18541T is a high speed, low-power line driver featuring separate data inputs organized into dual 9-bit bytes
with byte-oriented paired output enable control signals. This
device is compliant with IEEE 1149.1 Standard Test Access
Port and Boundary Scan Architecture with the incorporation
of the defined boundary-scan test logic and test access port
consisting of Test Data Input (TDI), Test Data Out (TDO),
Test Mode Select (TMS), and Test Clock (TCK).
Features
n
n
n
n
n
n
n
n
n
Dual output enable signals per byte
TRI-STATE outputs for bus-oriented applications
9-bit data busses for parity applications
Reduced-swing outputs source 24 mA/sink 48 mA (Mil)
Guaranteed to drive 50Ω transmission line to TTL input
levels of 0.8V and 2.0V
TTL compatible inputs
25 mil pitch Cerpack packaging
Includes CLAMP and HIGHZ instructions
Standard Microcircuit Drawing (SMD) 5962-9311601
n IEEE 1149.1 (JTAG) Compliant
Connection Diagram
Pin Names
Description
AOE1,
AOE2
TRI-STATE Output Enable Input Pins,
A Side
BOE1,
BOE2
TRI-STATE Output Enable Input Pins,
B Side
AO(0–8)
Output Pins, A Side
AO(0–8)
Output Pins, B Side
DS100324-1
Pin Names
Pin Names
Description
AI(0–8)
Input Pins, A Side
BI(0–8)
Input Pins, B Side
TRI-STATE ®
is a registered trademark of National Semiconductor Corporation.
© 1998 National Semiconductor Corporation
DS100324
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SCAN18541T Non-Inverting Line Driver with TRI-STATE Outputs
September 1998
Truth Tables
Inputs
AOE1
AO (0–8)
AOE2
AI (0–8)
L
L
H
H
X
X
Z
X
H
X
Z
L
L
L
Inputs
H
L
BO (0–8)
BOE1
BOE2
BI (0–8)
L
L
H
H
X
X
Z
X
H
X
Z
L
L
L
L
H
H = HIGH Voltage Level
L = LOW Voltage Level
X = Immaterial
Z = High Impedance
Block Diagrams
Byte A
DS100324-2
Tap Controller
DS100324-3
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2
Block Diagrams
(Continued)
Byte B
DS100324-4
Note: BSR stands for Boundary Scan Register.
3
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Description of Boundary-Scan Circuitry
device. SCAN CMOS Test Access Logic devices do not include the IEEE 1149.1 optional identification register. Therefore, this unique captured value can be used as a “pseudo
ID” code to confirm that the correct device is placed in the
appropriate location in the boundary scan chain.
The scan cells used in the BOUNDARY-SCAN register are
one of the following two types depending upon their location.
Scan cell TYPE1 is intended to solely observe system data,
while TYPE2 has the additional ability to control system
data. (See IEEE Standard 1149.1 Figure10–11 for a further
description of scan cell TYPE1 and Figure 10–12 for a further description of scan cell TYPE2.)
Instruction Register Scan Chain Definition
Scan cell TYPE1 is located on each system input pin while
scan cell TYPE2 is located at each system output pin as well
as at each of the two internal active-high output enable signals. AOE controls the activity of the A-outputs while BOE
controls the activity of the B-outputs. Each will activate their
respective outputs by loading a logic high.
DS100324-10
The BYPASS register is a single bit shift register stage identical to scan cell TYPE1. It captures a fixed logic low.
MSB→LSB
Instruction Code
Bypass Register Scan Chain Definition
Logic 0
DS100324-9
The INSTRUCTION register is an 8-bit register which captures the default value of 10000001. The two least significant
bits of this captured value (01) are required by IEEE Std
1149.1. The upper six bits are unique to the SCAN18541T
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4
Instruction
00000000
EXTEST
10000001
SAMPLE/PRELOAD
10000010
CLAMP
00000011
HIGH-Z
All Others
BYPASS
Description of Boundary-Scan Circuitry
(Continued)
Scan Cell TYPE1
DS100324-7
Scan Cell TYPE2
DS100324-8
5
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Description of Boundary-Scan Circuitry
(Continued)
Boundary-Scan Register
Scan Chain Definition (42 Bits in Length)
DS100324-23
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6
Description of Boundary-Scan Circuitry
(Continued)
Boundary-Scan Register Definition Index
Bit No.
Pin Name
Pin No.
Pin Type
41
AOE1
3
Input
TYPE1
Scan Cell Type
40
AOE2
54
Input
TYPE1
39
AOE
Internal
TYPE2
38
BOE1
26
Input
TYPE1
37
BOE2
31
Input
TYPE1
36
BOE
Internal
TYPE2
35
AI0
55
Input
TYPE1
34
AI1
53
Input
TYPE1
33
AI2
52
Input
TYPE1
32
AI3
50
Input
TYPE1
31
AI4
49
Input
TYPE1
30
AI5
47
Input
TYPE1
29
AI6
46
Input
TYPE1
28
AI7
44
Input
TYPE1
27
AI8
43
Input
TYPE1
26
BI0
42
Input
TYPE1
25
BI1
41
Input
TYPE1
24
BI2
39
Input
TYPE1
23
BI3
38
Input
TYPE1
22
BI4
36
Input
TYPE1
21
BI5
35
Input
TYPE1
20
BI6
33
Input
TYPE1
19
BI7
32
Input
TYPE1
18
BI8
30
Input
TYPE1
17
AO0
2
Output
TYPE2
16
AO1
4
Output
TYPE2
15
AO2
5
Output
TYPE2
14
AO3
7
Output
TYPE2
13
AO4
8
Output
TYPE2
12
AO5
10
Output
TYPE2
11
AO6
11
Output
TYPE2
10
AO7
13
Output
TYPE2
9
AO8
14
Output
TYPE2
8
BO0
15
Output
TYPE2
7
BO1
16
Output
TYPE2
6
BO2
18
Output
TYPE2
5
BO3
19
Output
TYPE2
4
BO4
21
Output
TYPE2
3
BO5
22
Output
TYPE2
2
BO6
24
Output
TYPE2
1
BO7
25
Output
TYPE2
0
BO8
27
Output
TYPE2
7
Control
Signals
A–in
B–in
A–out
B–out
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Absolute Maximum Ratings (Note 1)
ESD (Min)
If Military/Aerospace specified devices are required,
please contact the National Semiconductor Sales Office/
Distributors for availability and specifications.
Supply Voltage (VCC)
DC Input Diode Current (IIK)
VI = −0.5V
VI = VCC +0.5V
DC Output Diode Current (IOK)
VO = −0.5V
VO = VCC +0.5V
DC Output Voltage (VO)
DC Output Source/Sink Current (IO)
DC VCC or Ground Current
Per Output Pin
Junction Temperature
Cerpack
Storage Temperature
2000V
Recommended Operating
Conditions
−0.5V to +7.0V
Supply Voltage (VCC)
SCAN Products
Input Voltage (VI)
Output Voltage (VO)
Operating Temperature (TA)
Military
Minimum Input Edge Rate dV/dt
VIN from 0.8V to 2.0V
VCC @ 4.5V, 5.5V
−20 mA
+20 mA
−20 mA
+20 mA
−0.5V to VCC +0.5V
± 70 mA
4.5V to 5.5V
0V to VCC
0V to VCC
−55˚C to +125˚C
125 mV/ns
Note 1: Absolute maximum ratings are those values beyond which damage
to the device may occur. The databook specifications should be met, without
exception, to ensure that the system design is reliable over its power supply,
temperature, and output/input loading variables. National does not recommend operation of SCAN circuits outside databook specifications.
± 70 mA
+175˚C
−65˚C to +150˚C
DC Electrical Characteristics
Symbol
Parameter
VCC
(V)
Military
TA = −55˚C to +125˚C
Units
Conditions
Guaranteed Limits
VIH
VIL
VOH
VOL
IIN
Minimum High
4.5
2.0
Input Voltage
5.5
2.0
Maximum Low
4.5
0.8
Input Voltage
5.5
0.8
Minimum High
4.5
3.15
Output Voltage
5.5
4.15
4.5
2.4
5.5
2.4
Maximum Low
4.5
0.1
Output Voltage
5.5
0.1
4.5
0.55
5.5
0.55
5.5
± 1.0
Maximum Input
V
VOUT = 0.1V
V
or VCC −0.1V
VOUT = 0.1V
V
or VCC −0.1V
IOUT = −50 µA
V
V
VIN = VIL or VIH
IOH = −24 mA
IOUT = 50 µA
V
VIN = VIL or VIH
IOL = 48 mA
µA
VI = VCC, GND
Leakage Current
IIN
Maximum Input
TDI, TMS
Leakage
Minimum Input
5.5
5.5
3.7
µA
−385
µA
−160
µA
VI = VCC
VI = GND
VI = GND
63
mA
VOLD = 0.8V Max
Leakage
IOLD
Minimum Dynamic
(Note 2)
IOHD
Output Current
IOZ
Maximum Output
5.5
−27
mA
5.5
± 10.0
µA
VOHD = 2.0V Min
VI (OE) = VIL, VIH
5.5
−100
mA
VO = 0V
Leakage Current
IOS
Output Short
Circuit Current
ICC
Maximum Quiescent
(min)
5.5
168
µA
5.5
930
µA
Supply Current
VO = Open
TDI, TMS = VCC
VO = Open
TDI, TMS = GND
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8
DC Electrical Characteristics
Symbol
Parameter
(Continued)
Military
TA = −55˚C to +125˚C
VCC
(V)
Units
Conditions
Guaranteed Limits
ICCt
Maximum ICC
5.5
2.0
Per Input
5.5
2.15
VI = VCC–2.1V
VI = VCC–2.1V
mA
mA
TDI/TMS Pin,
Test One with
the Other Floating
Note 2: Maximum test duration 2.0 ms, one output loaded at a time.
Note 3: All outputs loaded; thresholds associated with output under test.
Noise Specifications
Symbol
Military
TA = −55˚C to +125˚C
Units
Parameter
VCC
(V)
Maximum High
5.0
0.8
V
5.0
-0.8
V
Guaranteed Limits
VOLP
Output Noise
(Notes 4, 5)
VOLV
Minimum Low
Output Noise
(Notes 4, 5)
Note 4: Maximum number of outputs that can switch simultaneously is n. (n-1) outputs are switched LOW and one output held LOW.
Note 5: Maximum number of outputs that can switch simultaneously is n. (n-1) outputs are switched HIGH and one output held HIGH.
AC Electrical Characteristics
Normal Operation
Symbol
Parameter
tPLH,
Propagation Delay
tPHL
Data to Q
tPLZ,
Disable Time
Military
TA =
VCC
(V)
(Note 6)
−55˚C to +125˚C
CL = 50 pF
5.0
5.0
tPHZ
tPZL,
Enable Time
Units
5.0
tPZH
Min
Max
2.5
10.5
2.5
10.5
1.5
11.2
1.5
11.2
2.0
14.0
2.0
12.0
ns
ns
ns
Note 6: Voltage Range 5.0 is 5.0V ± 0.5V.
9
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AC Electrical Characteristics
Scan Test Operation
Symbol
Parameter
tPLH,
Propagation Delay
tPHL
TCK to TDO
tPLZ,
Disable Time
tPHZ
TCK to TDO
tPZL,
Enable Time
tPZH
TCK to TDO
tPLH,
Propagation Delay
tPHL
TCK to Data Out
Military
TA =
VCC
(V)
(Note 7)
Units
−55˚C to +125˚C
CL = 50 pF
5.0
5.0
5.0
5.0
Min
Max
3.5
15.8
3.5
15.8
2.5
13.2
2.5
13.2
ns
ns
3.0
17.0
3.0
17.0
ns
5.0
21.7
5.0
21.7
5.0
21.2
5.0
21.2
ns
ns
ns
During Update-DR State
tPLH,
Propagation Delay
tPHL
TCK to Data Out
5.0
During Update-IR State
tPLH,
Propagation Delay
tPHL
TCK to Data Out
5.0
During Test Logic
5.5
23.0
5.5
23.0
4.0
19.6
4.0
19.6
5.0
22.4
5.0
22.4
ns
ns
Reset State
tPLZ,
Propagation Delay
tPHZ
TCK to Data Out
5.0
ns
During Update-DR State
tPLZ,
Propagation Delay
tPHZ
TCK to Data Out
5.0
During Update-IR State
tPLZ,
Propagation Delay
tPHZ
TCK to Data Out
5.0
During Test Logic
5.0
23.3
5.0
23.3
5.0
22.6
5.0
22.6
6.5
26.2
6.5
26.2
ns
7.0
27.4
ns
7.0
27.4
Reset State
tPZL,
Propagation Delay
tPZH
TCK to Data Out
5.0
ns
During Update-DR State
tPZL,
Propagation Delay
tPZH
TCK to Data Out
5.0
During Update-IR State
tPZL,
Propagation Delay
tPZH
TCK to Data Out
5.0
During Test Logic
Reset State
Note 7: Voltage Range 5.0 is 5.0V ± 0.5V.
Note 8: All Propagation Delays involving TCK are measured from the falling edge of TCK.
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10
AC Operating Requirements
Scan Test Operation
Symbol
Parameter
VCC
(V)
(Note 9)
Military
TA = −55˚C to +125˚C
CL = 50 pF
Units
Guaranteed Minimum
tS
Setup Time, H or L
5.0
3.0
ns
5.0
5.0
ns
5.0
3.0
ns
5.0
4.5
ns
5.0
3.0
ns
5.0
3.0
ns
5.0
8.0
ns
5.0
2.0
ns
5.0
4.0
ns
5.0
4.5
ns
H
12.0
ns
L
5.0
Data to TCK (Note 10)
tH
Hold Time, H or L
TCK to Data (Note 10)
tS
Setup Time, H or L
AOEn, BOEn
to TCK (Note 12)
tH
Hold Time, H or L
TCK to AOEn,
BOEn (Note 12)
tS
Setup Time, H or L
Internal AOE, BOE,
to TCK (Note 11)
tH
Hold Time, H or L
TCK to Internal
AOE, BOE (Note 11)
tS
Setup Time, H or L
TMS to TCK
tH
Hold Time, H or L
TCK to TMS
tS
Setup Time, H or L
TDI to TCK
tH
Hold Time, H or L
TCK to TDI
tW
fmax
Pulse Width TCK
5.0
Maximum TCK
5.0
25
MHz
5.0
100
ns
0.0
100
ms
Clock Frequency
TPU
Wait Time, Power Up
to TCK
TDN
Power Down Delay
Note 9: Voltage Range 5.0 is 5.0V ± 0.5V.
All Input Timing Delays involving TCK are measured from the rising edge of TCK.
Note 10: This delay represents the timing relationship between the data input and TCK at the associated scan cells numbered 0-8, 9-17, 18-26 and 27-35.
Note 11: This delay represents the timing relationship between AOE/BOE and TCK for scan cells 36 and 39 only.
Note 12: Timing pertains to BSR 37, 38, 40 and 41 only.
11
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Capacitance
Symbol
Max
Units
Input Pin Capacitance
5.0
pF
COUT
Output Pin Capacitance
15.0
pF
CPD
Power Dissipation
35.0
pF
CIN
Parameter
Capacitance
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12
Conditions
VCC = 5.0V
VCC = 5.0V
VCC = 5.0V
13
SCAN18541T Non-Inverting Line Driver with TRI-STATE Outputs
Physical Dimensions
inches (millimeters) unless otherwise noted
56-Lead Ceramic Flatpak (F)
NS Package Number WA56A
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with instructions for use provided in the labeling, can
be reasonably expected to result in a significant injury
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