SOT669 LFPAK; Reel pack, SMD, 7" T1 standard product orientation Ordering code (12NC) ending 115 Rev. 2 — 12 November 2014 Packing information 1. Packing method Printed plano box Barcode label Reel Tape QA Seal Preprinted ESD warning Circular sprocket holes opposite the label side of reel PQ-label (permanent) Cover tape Carrier tape 001aak603 Fig 1. Reel pack for SMD SOT669 NXP Semiconductors LFPAK; Reel pack, SMD, 7" T1 standard product orientation Ordering code (12NC) ending 115 Table 1. Dimensions and quantities Reel dimensions d w (mm) [1] SPQ/PQ (pcs) [2] Reels per box Outer box dimensions l w h (mm) 180 12 1500 1 190 190 26 [1] d = reel diameter; w = tape width. [2] Packing quantity dependent on specific product type. View ordering and availability details at NXP order portal, or contact your local NXP representative. 2. Product orientation FLUFXODU 627 627 SLQ 627 627 627 GLUHFWLRQRIIHHG FLUFXODU 627 627 627%& 627$ 627$ $$ 627$ SLQ PJX GLUHFWLRQRIIHHG Fig 2. SOT669_115 Packing information Product orientation in carrier tape All information provided in this document is subject to legal disclaimers. Rev. 2 — 12 November 2014 © NXP Semiconductors N.V. 2014. All rights reserved. 2 of 6 SOT669 NXP Semiconductors LFPAK; Reel pack, SMD, 7" T1 standard product orientation Ordering code (12NC) ending 115 3. Carrier tape dimensions 4 mm W K0 A0 B0 P1 T direction of feed Fig 3. 001aao148 Carrier tape dimensions Table 2. Carrier tape dimensions In accordance with IEC 60286-3. SOT669_115 Packing information A0 (mm) B0 (mm) K0 (mm) T (mm) P1 (mm) W (mm) 6.4 5.3 1.25 - 8.0 12 All information provided in this document is subject to legal disclaimers. Rev. 2 — 12 November 2014 © NXP Semiconductors N.V. 2014. All rights reserved. 3 of 6 SOT669 NXP Semiconductors LFPAK; Reel pack, SMD, 7" T1 standard product orientation Ordering code (12NC) ending 115 4. Reel dimensions A Z W2 B ØC ØD detail Z 001aao149 Fig 4. Schematic view of reel Table 3. Reel dimensions In accordance with IEC 60286-3. SOT669_115 Packing information A [nom] (mm) W2 [max] (mm) B [min] (mm) C [min] (mm) D [min] (mm) 180 18.4 1.5 12.8 20.2 All information provided in this document is subject to legal disclaimers. Rev. 2 — 12 November 2014 © NXP Semiconductors N.V. 2014. All rights reserved. 4 of 6 SOT669 NXP Semiconductors LFPAK; Reel pack, SMD, 7" T1 standard product orientation Ordering code (12NC) ending 115 5. Barcode label Fixed text Country of origin i.e. "Made in....." or "Diffused in EU [+] Assembled in...... Packing unit (PQ) identification 2nd traceability lot number* 2nd (youngest) date code* 2nd Quantity* Traceability lot number Date code With linear barcode Quantity With linear barcode Type number NXP 12NC With linear barcode NXP SEMICONDUCTORS MADE IN >COUNTRY< [PRODUCT INFO] (Q) QTY Optional product information* Re-approval date code* Origin code Product Manufacturing Code MSL at the Peak Body solder temperature with tin/lead* MSL at the higher lead-free Peak Body Temperature* 2D matrix with all data (including the data identifiers) HALOGEN FREE (30P) TYPE RoHS compliant (1P) CODENO Additional info if halogen free product Additional info on RoHS (33T) PUID: B.0987654321 (30T) LOT2 (31D) REDATE (30D) DATE2 (32T) ORIG (30Q) QTY2 (31T) PMC (31P) MSL/PBT (1T) LOT MSL/PBT (9D) DATE Lead-free symbol 001aak714 Fig 5. Example of typical box information barcode label NXP -ASSEMBLED IN >COUNTRY< (30P)TYPE HALOGEN FREE EU/CN RoHS compliant (1T)LOT (Q)QTY (9D)DATE (1P)CODENO 001aak715 Fig 6. Table 4. SOT669_115 Packing information Example of typical reel information barcode label Barcode label dimensions Box barcode label l w (mm) Reel barcode label l w (mm) 100 75 36 75 All information provided in this document is subject to legal disclaimers. Rev. 2 — 12 November 2014 © NXP Semiconductors N.V. 2014. All rights reserved. 5 of 6 SOT669 NXP Semiconductors LFPAK; Reel pack, SMD, 7" T1 standard product orientation Ordering code (12NC) ending 115 6. Revision history Table 5. Revision history Document ID Release date Packing document status Change notice Supersedes SOT669_115 v.2 20141112 Packing information - SOT669_115 v.1 Modifications: • The format of this packing document has been redesigned to comply with the new identity guidelines of NXP Semiconductors. • • Legal texts have been adapted to the new company name where appropriate. Dimension B0 corrected: 5.2 changed to 5.3; see Table 2 “Carrier tape dimensions” Limited warranty and liability © NXP Semiconductors N.V. 2014. Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] Date of release: 12 November 2014 Document identifier: SOT669_115 All rights reserved.