PMEG2010AEK 1 A very low VF MEGA Schottky barrier rectifier Rev. 01 — 30 March 2007 Product data sheet 1. Product profile 1.1 General description Planar Maximum Efficiency General Application (MEGA) Schottky barrier rectifier with an integrated guard ring for stress protection, encapsulated in a SOT346 (SC-59A/TO-236) small Surface-Mounted Device (SMD) plastic package. 1.2 Features n n n n Forward current: IF ≤ 1 A Reverse voltage: VR ≤ 20 V Very low forward voltage Small SMD plastic package 1.3 Applications n n n n n Low voltage rectification High efficiency DC-to-DC conversion Switch mode power supply Reverse polarity protection Low power consumption applications 1.4 Quick reference data Table 1. Quick reference data Symbol Parameter Conditions Min Typ Max Unit IF forward current Tsp ≤ 55 °C - - 1 A VR reverse voltage - - 20 V VF forward voltage - 400 450 mV [1] Pulse test: tp ≤ 300 µs; δ ≤ 0.02. IF = 1 A [1] PMEG2010AEK NXP Semiconductors 1 A very low VF MEGA Schottky barrier rectifier 2. Pinning information Table 2. Pinning Pin Description 1 anode 2 not connected 3 cathode Simplified outline Symbol 3 3 2 n.c. 1 1 006aaa436 2 3. Ordering information Table 3. Ordering information Type number PMEG2010AEK Package Name Description Version SC-59A plastic surface-mounted package; 3 leads SOT346 4. Marking Table 4. Marking codes Type number Marking code PMEG2010AEK H1 5. Limiting values Table 5. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Conditions Max Unit VR reverse voltage - 20 V IF forward current Tsp ≤ 55 °C - 1 A IFRM repetitive peak forward current tp ≤ 1 ms; δ ≤ 0.25 - 3 A IFSM non-repetitive peak forward current square wave; tp = 8 ms - 4.5 A Ptot total power dissipation Tamb ≤ 25 °C [1] - 250 mW [2] - 350 mW Tj junction temperature - 150 °C Tamb ambient temperature −65 +150 °C Tstg storage temperature −65 +150 °C [1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard footprint. [2] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm2. PMEG2010AEK_1 Product data sheet Min © NXP B.V. 2007. All rights reserved. Rev. 01 — 30 March 2007 2 of 9 PMEG2010AEK NXP Semiconductors 1 A very low VF MEGA Schottky barrier rectifier 6. Thermal characteristics Table 6. Thermal characteristics Symbol Parameter Rth(j-a) Rth(j-sp) Conditions thermal resistance from junction to ambient Min Typ Max Unit [2] - - 500 K/W [3] - - 360 K/W [4] - - 150 K/W [1] in free air thermal resistance from junction to solder point [1] For Schottky barrier diodes thermal runaway has to be considered, as in some applications the reverse power losses PR are a significant part of the total power losses. [2] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint. [3] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm2. [4] Soldering point of cathode tab. 7. Characteristics Table 7. Characteristics Tamb = 25 °C unless otherwise specified. Symbol VF Parameter Conditions forward voltage IF = 10 mA IR Cd [1] reverse current diode capacitance Typ Max Unit - 200 220 mV IF = 100 mA - 265 290 mV IF = 1 A - 400 450 mV VR = 5 V - 15 20 µA VR = 10 V - 20 80 µA VR = 20 V - 50 200 µA VR = 5 V; f = 1 MHz - 55 70 pF Pulse test: tp ≤ 300 µs; δ ≤ 0.02. PMEG2010AEK_1 Product data sheet Min [1] © NXP B.V. 2007. All rights reserved. Rev. 01 — 30 March 2007 3 of 9 PMEG2010AEK NXP Semiconductors 1 A very low VF MEGA Schottky barrier rectifier 006aab032 104 IR (µA) IF (mA) 006aab033 105 104 (1) 103 (2) 103 (1) 102 (2) (3) (4) 102 (5) (3) 10 10 1 10−1 1 (4) 10−2 10−1 10−3 0 0.2 0.4 0.6 0 5 VF (V) 10 15 20 VR (V) (1) Tamb = 150 °C (1) Tamb = 125 °C (2) Tamb = 125 °C (2) Tamb = 85 °C (3) Tamb = 85 °C (3) Tamb = 25 °C (4) Tamb = 25 °C (4) Tamb = −40 °C (5) Tamb = −40 °C Fig 1. Forward current as a function of forward voltage; typical values Fig 2. Reverse current as a function of reverse voltage; typical values mdb824 200 Cd (pF) 150 100 50 0 0 5 10 15 VR (V) 20 f = 1 MHz; Tamb = 25 °C Fig 3. Diode capacitance as a function of reverse voltage; typical values PMEG2010AEK_1 Product data sheet © NXP B.V. 2007. All rights reserved. Rev. 01 — 30 March 2007 4 of 9 PMEG2010AEK NXP Semiconductors 1 A very low VF MEGA Schottky barrier rectifier 8. Test information P t2 duty cycle δ = t1 t2 t1 t 006aaa812 Fig 4. Duty cycle definition 9. Package outline 1.3 1.0 3.1 2.7 3 0.6 0.2 3.0 1.7 2.5 1.3 1 2 1.9 0.50 0.35 Dimensions in mm 0.26 0.10 04-11-11 Fig 5. Package outline SOT346 (SC-59A/TO-236) 10. Packing information Table 8. Packing methods The indicated -xxx are the last three digits of the 12NC ordering code.[1] Type number PMEG2010AEK [1] Package SOT346 Description 4 mm pitch, 8 mm tape and reel 3000 10000 -115 -135 For further information and the availability of packing methods, see Section 14. PMEG2010AEK_1 Product data sheet Packing quantity © NXP B.V. 2007. All rights reserved. Rev. 01 — 30 March 2007 5 of 9 PMEG2010AEK NXP Semiconductors 1 A very low VF MEGA Schottky barrier rectifier 11. Soldering 3.30 1.00 0.70 (3x) 0.60 (3x) 0.70 (3x) 3 0.95 3.15 3.40 1.55 0.95 1 2 1.20 2.60 2.90 solder lands solder resist solder paste occupied area sot346 Dimensions in mm Fig 6. Reflow soldering footprint SOT346 (SC-59A/TO-236) 4.70 2.80 solder lands solder resist occupied area Dimensions in mm 3 5.20 4.60 1.20 1 2 sot346 1.20 (2x) 3.40 preferred transport direction during soldering Fig 7. Wave soldering footprint SOT346 (SC-59A/TO-236) PMEG2010AEK_1 Product data sheet © NXP B.V. 2007. All rights reserved. Rev. 01 — 30 March 2007 6 of 9 PMEG2010AEK NXP Semiconductors 1 A very low VF MEGA Schottky barrier rectifier 12. Revision history Table 9. Revision history Document ID Release date Data sheet status Change notice Supersedes PMEG2010AEK_1 20070330 Product data sheet - - PMEG2010AEK_1 Product data sheet © NXP B.V. 2007. All rights reserved. Rev. 01 — 30 March 2007 7 of 9 PMEG2010AEK NXP Semiconductors 1 A very low VF MEGA Schottky barrier rectifier 13. Legal information 13.1 Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 13.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. 13.3 Disclaimers General — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of a NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. Terms and conditions of sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. 13.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 14. Contact information For additional information, please visit: http://www.nxp.com For sales office addresses, send an email to: [email protected] PMEG2010AEK_1 Product data sheet © NXP B.V. 2007. All rights reserved. Rev. 01 — 30 March 2007 8 of 9 PMEG2010AEK NXP Semiconductors 1 A very low VF MEGA Schottky barrier rectifier 15. Contents 1 1.1 1.2 1.3 1.4 2 3 4 5 6 7 8 9 10 11 12 13 13.1 13.2 13.3 13.4 14 15 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . General description. . . . . . . . . . . . . . . . . . . . . . Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . Quick reference data. . . . . . . . . . . . . . . . . . . . . Pinning information . . . . . . . . . . . . . . . . . . . . . . Ordering information . . . . . . . . . . . . . . . . . . . . . Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . Thermal characteristics. . . . . . . . . . . . . . . . . . . Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . Test information . . . . . . . . . . . . . . . . . . . . . . . . . Package outline . . . . . . . . . . . . . . . . . . . . . . . . . Packing information. . . . . . . . . . . . . . . . . . . . . . Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Revision history . . . . . . . . . . . . . . . . . . . . . . . . . Legal information. . . . . . . . . . . . . . . . . . . . . . . . Data sheet status . . . . . . . . . . . . . . . . . . . . . . . Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . . Contact information. . . . . . . . . . . . . . . . . . . . . . Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1 1 1 1 2 2 2 2 3 3 5 5 5 6 7 8 8 8 8 8 8 9 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2007. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] Date of release: 30 March 2007 Document identifier: PMEG2010AEK_1