BU90002GWZ Datasheet Single-chip Type with Built-in FET Switching Regulator Series Step-down Switching regulators with Built-in Power MOSFET BU9000xGWZ series ●General Description The BU9000xGWZ are a high efficiency 6MHz synchronous step-down switching regulator with ultra low current PFM mode. It provides up to 1.0A load current and an input voltage range from 3.0V to 5.5V, optimized for battery powered portable applications. BU9000xGWZ has a mode control pin that allows the user to select Forced PWM(Pulse Width Modulation)mode or PFM(Pulse Frequency Modulation) and PWM auto change mode utilized power save operation at light load current. ●Applications Smart phones, Cell phones, Portable applications and Micro DC/DC modules, USB accessories ●Package(s) UCSP35L1 W(Typ.) x D(Typ.) x H(Max.) 1.30mm x 0.90mm x 0.40mm ●Typical Application Circuit(s) ●Features Fast transient response Automatic PFM/PWM operation Forced PWM operation Internal Soft Start Under voltage lockout Over current protection Thermal shutdown Figure 1. Typical Application Circuit(s) ●Lineup Operating mode Part No. Output voltage Input voltage Switching frequency BU90002GWZ 3.30V 4.0V to 5.5V 5.4MHz to 6.6MHz BU90003GWZ 1.20V 2.3V to 5.5V 3.6MHz to 4.4MHz BU90004GWZ 1.80V 2.3V to 5.5V 4.8MHz to 6.0MHz BU90005GWZ 2.50V 2.3V to 5.5V 5.4MHz to 6.6MHz Forced PFM BU90006GWZ 3.00V 2.3V to 5.5V 5.4MHz to 6.6MHz BU90007GWZ 1.25V 2.3V to 5.5V 3.6MHz to 4.4MHz Automatic PFM/PWM ●Pin Configuration(s) MODE=L MODE=H Automatic PFM/PWM Forced PWM ●Pin Description(s) (BOTTOM VIEW) B1 M ODE B2 LX B3 FB A1 V IN A2 EN A3 GND Pin No. Symbol Function A1 VIN Power supply input pin A2 EN Enable pin A3 GND B1 MODE Forced PWM mode pin GND pin B2 LX Inductor connection pin B3 FB Feedback voltage input pin Figure 2. Pin Configuration(s) ○Product structure： ：Silicon monolithic integrated circuit ○This product is not designed protection against radioactive rays www.rohm.co TSZ02201-0F2F0AG00010-1-2 © 2012 ROHM Co., Ltd. All rights reserved. m 1/21 TSZ22111・ ・ 14・ ・001 04.Jul.2012 Rev.001 Datasheet BU9000xGWZ series ●Block Diagram(s) L ： PWM/PFM MODE H ： PWM MODE MODE B1 VIN A1 TSD UVLO 2.3～5.5V PWM/PFM control FB B3 VOUT EN + ERROR COMP 1.5～0.47uH Switching Control Logic and Gate Driver B2 VOUT 4.7uF LX VREF EN H ： ON L ： OFF A2 SHUTDOWN Frequency control GND A3 Figure 3. Block Diagram(s) ●Description of Block(s) The BU9000xGWZ are a synchronous step-down DC/DC converter that achieves fast transient response from light load to heavy load by hysteretic PWM control system and current constant PFM control system. ○PWM control BU9000xGWZ operates by hysteretic PWM control. This scheme ensures fast switching, high efficiency, and fast transient response. When the output voltage is below the VREF voltage, the error comparator output is low to high and turning on P-channel MOSFET until above the VREF voltage and minimum on time. ○PFM control At light load the regulator and MODE=low, the regulator operates with reduced switching frequency and improves the efficiency.During PFM operation, the output voltage slightly higher than typical output voltage. output PWM mode voltage PFM (constant current)Threshold. turn off Pch FET PFM Threshold. turn on PFET PFM Mode at Light Load PWM Mode at Moderate to Heavy Loads Figure 4. Operation of PFM mode and PWM mode www.rohm.co © 2012 ROHM Co., Ltd. All rights reserved. m TSZ22111・ ・ 15・ ・001 2/21 TSZ02201-0F2F0AG00010-1-2 04.Jul.2012 Rev.001 Datasheet BU9000xGWZ series ●Description of operations 1) Shutdown If the EN input pin set to low (<0.4V), all circuit are shut down and the regulator is standby mode. Do not leave the EN pin floating. 2) Soft start function The regulator has a soft start circuit that reduces in-rush current at start-up.Typical start up times with a 4.7uF output capacitor is 120usec. 3) Current limit The BU9000xGWZ has a current limit circuit that protects itself and external components during overload condition. 4) UVLO The BU9000xGWZ has a Under Voltage Lock Out circuit that turn off device when VIN>2.05V(typ.) 5) FORCED PWM MODE Setting MODE pin high (>1.4V) places the regulator in forced PWM.This control provides noise reduction and output stability.Do not leave the MODE pin floating. 6) FORCED PFM MODE ( BU90005GWZ) Setting MODE pin low (<0.4V) places the regulator in forced PFM. It is effective in light load mode. 7) TSD The BU9000xGWZ has a thermal shutdown feature to protect the device if the junction temperature exceeds 150℃. In thermal shutdown, the DRIVER is disabled. This circuit is only to cut off the IC from thermal runaway, and has not been design to protect or guarantee the IC. Therefore, the user should not plan to activate this circuit with continued operation in mind. ●Absolute Maximum Ratings (Ta=25℃) Parameter Symbol Rating Unit VIN 7 V VEN, VFB, VLX, VMODE 7 V Pd 0.39(*1) W Topr -40 to +85 ℃ Tstg -55 to +125 ℃ Tjmax +125 ℃ Maximum input power supply voltage Maximum voltage at EN, FB, LX, MODE Power dissipation Operating temperature range Storage temperature range Junction temperature (*1) When mounted on the specified PCB (55mm x 63mm), Deducted by 3.9m W/c when used over Ta=25c ●Recommended Operating Rating(s) Parameter Symbol Input voltage VIN www.rohm.co © 2012 ROHM Co., Ltd. All rights reserved. m TSZ22111・ ・ 15・ ・001 Rating Min. Typ. Max. 4.0 - 5.5 2.3 - 5.5 3/21 Unit V Serise BU90002GWZ BU90003～BU90007GWZ TSZ02201-0F2F0AG00010-1-2 04.Jul.2012 Rev.001 Datasheet BU9000xGWZ series ●Electrical Characteristic(s) (unless otherwise specified VIN=5.0V, Ta=25℃) Item Symbol Min. Rating Typ. Max. Unit Condition 【Switching regulator】 Output voltage accuracy Maximum load current -2 - +2 IoutMAX1 IoutMAX2 IoutMAX3 -2 - - +3 1.0 0.8 0.6 IoutMAX4 - - 0.1 A Tss 65 120 240 usec 5.4 6.0 6.6 MHz 4.8 5.4 6.0 MHz No load, MODE:H No load, MODE:H VOUTA % A A A MODE:H(PWM Operation) MODE:L(PFM Operation) 3.0V≦VIN＜5.5V 2.7V≦VIN＜3.0V 2.3V≦VIN＜2.7V MODE:L(PFM Operation) (BU90005GWZ,) 【Soft start】 Soft start time 【Frequency control】 Switching frequency fosc No load, MODE:H (BU90002GWZ,BU90005GWZ, BU90006GWZ) (BU90004GWZ) 3.6 4.0 4.4 MHz RonP1 RonP2 RonN1 RonN2 - 250 300 220 250 400 450 350 380 mOhm mOhm mOhm mOhm Operation VENH 1.4 - VIN V Non Operation VENL 0 - 0.4 V Operation VMODEH 1.4 - VIN V Forced PWM Non Operation VMODEL 0 - 0.4 V Automatic PFM/PWM Uvth Uvhy 1.95 50 2.05 100 2.15 150 V mV Current limit threshold ILIMIT 1.5 1.7 1.9 A 【Output discharge】 Output discharge resistance 【Circuit current】 DRES 55 110 220 Ohm (BU90003GWZ) 【Driver】 PchFET on resistance NchFET on resistance - VIN=5.0V VIN=3.6V VIN=5.0V VIN=3.6V 【Control】 EN pin control voltage MODE pin control voltage (BU90005GWZ:Forced PFM) 【UVLO】 Protect threshold voltage Hysteresis 【Current limit】 IINS1 - 45 65 uA PMOS current detect, Open loop EN=0V EN:H, MODE:L, VOUT=3.6V forced Not switching (BU90003GWZ,BU90004GWZ, BU90005GWZ,BU90007GWZ) Operating quiescent current IINS2 - 55 80 uA EN:H, MODE:L, VOUT=3.6V forced Not switching SHD - 0 1 uA EN=0V (BU90002GWZ,BU90006GWZ) Shutdown current www.rohm.co © 2012 ROHM Co., Ltd. All rights reserved. m TSZ22111・ ・ 15・ ・001 4/21 TSZ02201-0F2F0AG00010-1-2 04.Jul.2012 Rev.001 Datasheet BU9000xGWZ series ●Electrical characteristic curves (Reference data) BU90002GWZ (3.3V OUTPUT) Parts L:LQM21MPN1R0NG0 (2.0mm×1.6mm×1.0mm Murata) COUT:GRM155R60J475M(1.0mm×0.5mm×0.5mm Murata) EN 2V/div EN 2V/div VOUT 2V/div VOUT 2V/div 20us IL 500mA/div 100us Figure 6. Shut down Figure 5. Start up Vout 50mV/div ac coupled Vout 50mV/div ac coupled 10us 4us IOUT 50mA/div IOUT 200mA/div Figure 7. Load transient response 5mA to 50mA tr=tf=100ns, MODE : Low www.rohm.co © 2012 ROHM Co., Ltd. All rights reserved. m TSZ22111・ ・ 15・ ・001 Figure 8. Load transient response 50mA to 350mA tr=tf=100ns, MODE : Low 5/21 TSZ02201-0F2F0AG00010-1-2 04.Jul.2012 Rev.001 Datasheet BU9000xGWZ series Vout 20mV/div ac coupled Vout 50mV/div ac coupled 400ns 4us LX 5V/div IOUT 200mA/div IL 500mA/div Figure 10. PFM mode Operation Iout=40mA Figure 9. Load transient response 150mA to 500mA tr=tf=100ns, MODE : High Vout 20mV/div ac coupled MODE 2V/div 4us 80ns Vout 20mV/div ac coupled LX 5V/div IL 500mA/div IL 500mA/div Figure 11. PWM mode Operation Iout=100mA www.rohm.co © 2012 ROHM Co., Ltd. All rights reserved. m TSZ22111・ ・ 15・ ・001 Figure 12. Mode Change Response MODE : High to Low 6/21 TSZ02201-0F2F0AG00010-1-2 04.Jul.2012 Rev.001 Datasheet BU9000xGWZ series 100 4us MODE 2V/div 95 Efficiency[%] 90 Vout 20mV/div ac coupled 85 80 75 70 IL 500mA/div 65 60 1 10 100 1000 Load current[mA] Figure 13. Mode Change Response MODE : Low to High Figure 14. Efficiency vs Load current VIN=5V PWM/PFM Auto mode 3.38 30 3.37 Vout Ripple Voltage[mv] 25 Output Voltage[v] 3.36 3.35 3.34 3.33 20 15 10 5 3.32 0 3.31 0 200 400 600 800 1000 0 200 400 600 800 Load current[mA] Load current[mA] Figure 15. Load regulation VIN=5V PWM/PFM Auto mode Figure 16. Vout Ripple Voltage VIN=5V PWM/PFM Auto mode www.rohm.co © 2012 ROHM Co., Ltd. All rights reserved. m TSZ22111・ ・ 15・ ・001 7/21 1000 TSZ02201-0F2F0AG00010-1-2 04.Jul.2012 Rev.001 Datasheet BU9000xGWZ series ●Electrical characteristic curves (Reference data) BU90003GWZ(1.2V OUTPUT) EN 2V/div EN 2V/div VOUT 500mV/div 40us VOUT 500m/div IL 200mA/div 100us Figure 17. Start up Figure 18. Shut down Vout 50mV/div 1.2V offset Vout 50mV/div 1.2V offset 10us 4us IOUT 200mA/div IOUT 200mA/div Figure 20. Load transient response 50mA to 350mA tr=tf=100ns, MODE : Low Figure 19. Load transient response 5mA to 200mA tr=tf=100ns, MODE : Low www.rohm.co © 2012 ROHM Co., Ltd. All rights reserved. m TSZ22111・ ・ 15・ ・001 8/21 TSZ02201-0F2F0AG00010-1-2 04.Jul.2012 Rev.001 Datasheet BU9000xGWZ series Vout 20mV/div ac coupled 4us Vout 50mV/div ac coupled 400ns LX 2V/div IOUT 500mA/div IL 500mA/div Figure 22. PFM mode Operation Iout=50mA Figure 21. Load transient response 400mA to 1000mA tr=tf=100ns, MODE : Low 2us Vout 20mV/div ac coupled MODE 2V/div 80ns Vout 50mV/div ac coupled LX 2V/div IL 500mA/div IL 200mA/div Figure 23. Fig.23 PWM mode Operation Iout=100mA www.rohm.co © 2012 ROHM Co., Ltd. All rights reserved. m TSZ22111・ ・ 15・ ・001 9/21 Figure 24. Mode Change Response MODE : High to Low TSZ02201-0F2F0AG00010-1-2 04.Jul.2012 Rev.001 Datasheet BU9000xGWZ series 100 2us MODE 2V/div 90 80 VIN=2.7V VIN=3.6V VIN=4.2V Efficiency[%] 70 Vout 50mV/div ac coupled 60 50 40 30 IL 200mA/div 20 10 0 0.1 1 10 100 1000 Load current[mA] Figure 26. Efficiency vs Load current PWM/PFM Auto mode Figure 25. Mode Change Response MODE : Low to High 1.236 Output Voltage[V] 1.224 VIN=4.2 VIN=3.6 VIN=2.7 1.212 1.200 1.188 0 200 400 600 800 1000 Load current[mA] Figure 27. Load regulation PWM/PFM Auto mode www.rohm.co © 2012 ROHM Co., Ltd. All rights reserved. m TSZ22111・ ・ 15・ ・001 10/21 TSZ02201-0F2F0AG00010-1-2 04.Jul.2012 Rev.001 Datasheet BU9000xGWZ series ●Electrical characteristic curves (Reference data) BU90004GWZ(1.80V OUTPUT) EN 5V/div EN 5V/div VOUT 1V/div VOUT 1V/div 40us 100us IL 200mA/div Figure 28. Start up Figure 29. Shut down Vout 50mV/div ac coupled Vout 50mV/div ac coupled 4us 4us IOUT 200mA/div IOUT 200mA/div Figure 30. Load transient response 5mA to 200mA tr=tf=100ns, Mode : Low www.rohm.co © 2012 ROHM Co., Ltd. All rights reserved. m TSZ22111・ ・ 15・ ・001 11/21 Figure 31. Load transient response 50mA to 350mA tr=tf=100ns, Mode :Low TSZ02201-0F2F0AG00010-1-2 04.Jul.2012 Rev.001 Datasheet BU9000xGWZ series 4us Vout 50mV/div ac coupled Vout 20mV/div ac coupled 400ns IOUT 200mA/div LX 2V/div Figure 33. PFM mode Operation IIout=50mA Figure 32. Load transient response 200mA to 600mA tr=tf=100ns, MODE : Low 80ns Vout 20mV/div ac coupled MODE 5V/div 4us Vout 50mV/div ac coupled LX 2V/div LX 200mA/div Figure 34. PWM mode Operation Iout=100mA www.rohm.co © 2012 ROHM Co., Ltd. All rights reserved. m TSZ22111・ ・ 15・ ・001 Figure 35. Mode Change Response MODE : High to Low 12/21 TSZ02201-0F2F0AG00010-1-2 04.Jul.2012 Rev.001 Datasheet BU9000xGWZ series 100 90 2us MODE 5V/div 80 VIN=2.7V VIN=3.6V VIN=4.2V Efficiency[%] 70 Vout 50mV/div ac coupled 60 50 40 30 20 LX 200mA/div 10 0 0.1 1 10 100 1000 Load current[mA] Figure 37. Efficiency vs Load current PWM/PFM Auto mode Figure 36. Mode Change Response MODE : Low to High 1.854 Output Voltage[V] 1.836 VIN=2.7V VIN=3.6V VIN=4.2V 1.818 1.800 1.782 1.764 0 200 400 600 800 1000 Load current[mA] Figure 38. Load regulation PWM/PFM Auto mode www.rohm.co © 2012 ROHM Co., Ltd. All rights reserved. m TSZ22111・ ・ 15・ ・001 13/21 TSZ02201-0F2F0AG00010-1-2 04.Jul.2012 Rev.001 Datasheet BU9000xGWZ series ●Electrical characteristic curves (Reference data) BU90005GWZ(2.50V OUTPUT) EN 1V/div EN 2V/div 40us VOUT 1V/div 100us VOUT 1V/div IL 200mA/div Figure 39. Start up Figure 40. Shut down Vout 100mV/div ac coupled Vout 50mV/div ac coupled 4us 4us IOUT 200mA/div IOUT 100mA/div Figure 41. Load transient response 5mA to 100mA tr=tf=100ns, MODE : Low www.rohm.co © 2012 ROHM Co., Ltd. All rights reserved. m TSZ22111・ ・ 15・ ・001 14/21 Figure 42. Load transient response 50mA to 350mA tr=tf=100ns, MODE : High TSZ02201-0F2F0AG00010-1-2 04.Jul.2012 Rev.001 Datasheet BU9000xGWZ series Vout 50mV/div ac coupled Vout 100mV/div ac coupled 1us LX 2V/div 10us IOUT 200mA/div IL 500mA/div Figure 44. PFM mode Operation Iout=50mA Figure 43. Load transient response 200mA to 600mA tr=tf=100ns, MODE : High Vout 20mV/div ac coupled 80ns MODE 2V/div LX 2V/div Vout 50mV/div ac coupled IL 200mA/div IL 200mA/div Figure 45. PWM mode Operation Iout=100mA www.rohm.co © 2012 ROHM Co., Ltd. All rights reserved. m TSZ22111・ ・ 15・ ・001 4us Figure 46. Mode Change Response MODE : High to Low 15/21 TSZ02201-0F2F0AG00010-1-2 04.Jul.2012 Rev.001 Datasheet BU9000xGWZ series 100 MODE 2V/div 90 4us 80 VIN=2.7V VIN=3.6V VIN=4.2V Efficiency[%] 70 Vout 50mV/div ac coupled 60 50 40 30 20 IL 200mA/div 10 0 0.1 1 10 100 Load current[mA] Figure 47. Mode Change Response MODE : Low to High Figure 48. Efficiency vs Load current PFM mode 100 90 VIN=2.7V VIN=3.6V VIN=4.2V 80 Efficiency[%] 70 60 50 40 30 20 10 0 0.1 1 10 100 1000 Load current[mA] Figure 49. Efficiency vs Load current PWM mode www.rohm.co © 2012 ROHM Co., Ltd. All rights reserved. m TSZ22111・ ・ 15・ ・001 16/21 TSZ02201-0F2F0AG00010-1-2 04.Jul.2012 Rev.001 Datasheet BU9000xGWZ series ●PC Board layout The suggested PCB layout for the BU9000xGWZ are shown in Figure. The following guidelines should be used to ensure a proper layout. 1) The input capacitor CIN should be connect as closely possible to VIN pin and GND pin. 2) From the output voltage to the FB pin line should be as separate as possible. 3) COUT and L should be connected as closely as possible. The connection of L to the LX pin should be as short as possible. Figure 50. PCB layout ●External parts selection Inductor selection The inductance significantly depends on output ripple current. As shown by following equation, the ripple current decreases as the inductor and/or switching frequency increase. (VIN-VOUT)×VOUT ⊿IL= L×VIN×f f: switching frequency L: inductance ⊿IL: inductor current ripple As a minimum requirement, the DC current rating of the inductor should be equal to the maximum load current plus half of the inductor current ripple as shown by the following equation. ILPEAK= IOUTMAX + ⊿IL 2 www.rohm.co © 2012 ROHM Co., Ltd. All rights reserved. m TSZ22111・ ・ 15・ ・001 17/21 TSZ02201-0F2F0AG00010-1-2 04.Jul.2012 Rev.001 Datasheet BU9000xGWZ series 1) Recommended inductor selection ・Iout≦1A LQM21MPN1R0NG0 (2.0mm×1.6mm×1.0mm Murata) DFE252012C 1R0 (2.5mm×2.0mm×1.0mm TOKO) ・Iout≦0.6A LQM21PN1R0NGC (2.0mm×1.2mm×1.0mm Murata) MLP2012H1R0M(2.0mm×1.2mm×1.0mm TDK) CKP2012N1R0N(2.0mm×1.2mm×1.0mm Taiyo Yuden) 2) Recommended input capacitor(CIN) selection GRM155R60J225M(1.0mm×0.5mm×0.5mm Murata) GRM155R60J475M(1.0mm×0.5mm×0.5mm Murata) GRM155R60G106M(1.0mm×0.5mm×0.5mm Murata) 3) Recommended output capacitor(COUT) selection GRM155R60J225M(1.0mm×0.5mm×0.5mm Murata) GRM155R60J475M(1.0mm×0.5mm×0.5mm Murata) GRM155R60G106M(1.0mm×0.5mm×0.5mm Murata) www.rohm.co © 2012 ROHM Co., Ltd. All rights reserved. m TSZ22111・ ・ 15・ ・001 18/21 TSZ02201-0F2F0AG00010-1-2 04.Jul.2012 Rev.001 Datasheet BU9000xGWZ series ●Caution of use 1) Absolute maximum ratings An excess in the absolute maximum rating, such as supply voltage, temperature range of operating conditions, etc., can break down the devices, thus making impossible to identify breaking mode, such as a short circuit or an open circuit. If any over rated values will expect to exceed the absolute maximum ratings, consider adding circuit protection devices, such as fuses. 2) GND voltage The potential of GND pin must be minimum potential in all condition. As an exception, the circuit design allows voltages up to -0.3 V to be applied to the IC pin. 3) Thermal design Use a thermal design that allows for a sufficient margin in light of the power dissipation (Pd) in actual operating conditions. 4) Inter-pin shorts and mounting errors Use caution when positioning the IC for mounting on printed circuit boards. The IC may be damaged if there is any connection error or if pins are shorted together. 5) Actions in strong electromagnetic field Use caution when using the IC in the presence of a strong electromagnetic field as doing so may cause the IC to malfunction. 6) Mutual impedance Power supply and ground wiring should reflect consideration of the need to lower mutual impedance and minimize ripple as much as possible (by making wiring as short and thick as possible or rejecting ripple by incorporating inductance and capacitance). 7) Thermal shutdown Circuit (TSD Circuit) This model IC has a built-in TSD circuit. This circuit is only to cut off the IC from thermal runaway, and has not been design to protect or guarantee the IC. Therefore, the user should not plan to activate this circuit with continued operation in mind. 8) Regarding input pin of the IC This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them isolated. P-N junctions are formed at the intersection of these P layers with the N layers of other elements, creating a parasitic diode or transistor. For example, as shown in the figures below, the relation between each potential is as follows: When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode. When GND > Pin B, the P-N junction operates as a parasitic transistor. Parasitic diodes can occur inevitable in the structure of the IC. The operation of parasitic diodes can result in mutual interference among circuits, operational faults, or physical damage. Accordingly, methods by which parasitic diodes operate, such as applying a voltage that is lower than the GND (P substrate) voltage to an input pin, should not be used. Status of this document The Japanese version of this document is formal specification. A customer may use this translation version only for a reference to help reading the formal version. If there are any differences in translation version of this document formal version takes priority www.rohm.co © 2012 ROHM Co., Ltd. All rights reserved. m TSZ22111・ ・ 15・ ・001 19/21 TSZ02201-0F2F0AG00010-1-2 04.Jul.2012 Rev.001 Datasheet BU9000xGWZ series ●Ordering Information B U 9 0 0 0 x G W Z E2 Package GWZ: UCSP35L1 Part Number Packaging and forming specification E2: Embossed tape and reel (UCSP35L1) ●Physical Dimension Tape and Reel Information 1234 1234 Reel 1234 1234 1pin 1234 1234 Direction of feed ●Marking Diagram(s)(TOP VIEW) UCSP35L1 (TOP VIEW) 1PIN MARK Series Part Number Marking LOT Number www.rohm.co © 2012 ROHM Co., Ltd. All rights reserved. m TSZ22111・ ・ 15・ ・001 20/21 BU90002GWZ Part Number Marking AB4 BU90003GWZ AB6 BU90004GWZ AB7 BU90005GWZ AB8 BU90006GWZ AB9 BU90007GWZ ACM TSZ02201-0F2F0AG00010-1-2 04.Jul.2012 Rev.001 Datasheet BU9000xGWZ series ●Revision History Date Revision 04.Jul,2012 001 Changes New Release www.rohm.co © 2012 ROHM Co., Ltd. All rights reserved. m TSZ22111・ ・ 15・ ・001 21/21 TSZ02201-0F2F0AG00010-1-2 04.Jul.2012 Rev.001 Datasheet Notice ●General Precaution 1) Before you use our Products, you are requested to carefully read this document and fully understand its contents. ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any ROHM’s Products against warning, caution or note contained in this document. 2) All information contained in this document is current as of the issuing date and subject to change without any prior notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales representative. ●Precaution on using ROHM Products 1) Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment, OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment, transport equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific Applications. 2) ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which a failure or malfunction of our Products may cause. The following are examples of safety measures: [a] Installation of protection circuits or other protective devices to improve system safety [b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure 3) Our Products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our Products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents [b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust [c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves [e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items [f] Sealing or coating our Products with resin or other coating materials [g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] Use of the Products in places subject to dew condensation 4) The Products are not subject to radiation-proof design. 5) Please verify and confirm characteristics of the final or mounted products in using the Products. 6) In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse) is applied, confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability. 7) De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual ambient temperature. 8) Confirm that operation temperature is within the specified range described in the product specification. 9) ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. Notice - Rev.003 © 2012 ROHM Co., Ltd. All rights reserved. Datasheet ●Precaution for Mounting / Circuit board design 1) When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2) In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the ROHM representative in advance. For details, please refer to ROHM Mounting specification ●Precautions Regarding Application Examples and External Circuits 1) If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the characteristics of the Products and external components, including transient characteristics, as well as static characteristics. 2) You agree that application notes, reference designs, and associated data and information contained in this document are presented only as guidance for Products use. Therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. ●Precaution for Electrostatic This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron, isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control). ●Precaution for Storage / Transportation 1) Product performance and soldered connections may deteriorate if the Products are stored in the places where: [a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [b] the temperature or humidity exceeds those recommended by ROHM [c] the Products are exposed to direct sunshine or condensation [d] the Products are exposed to high Electrostatic 2) Even under ROHM recommended storage condition, solderability of products out of recommended storage time period may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is exceeding the recommended storage time period. 3) Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4) Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of which storage time is exceeding the recommended storage time period. ●Precaution for Product Label QR code printed on ROHM Products label is for ROHM’s internal use only. ●Precaution for Disposition When disposing Products please dispose them properly using an authorized industry waste company. ●Precaution for Foreign Exchange and Foreign Trade act Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act, please consult with ROHM representative in case of export. ●Precaution Regarding Intellectual Property Rights 1) All information and data including but not limited to application example contained in this document is for reference only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable for infringement of any intellectual property rights or other damages arising from use of such information or data.: 2) No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any third parties with respect to the information contained in this document. Notice - Rev.003 © 2012 ROHM Co., Ltd. All rights reserved. Datasheet ●Other Precaution 1) The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or concerning such information. 2) This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM. 3) The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of ROHM. 4) In no event shall you use in any way whatsoever the Products and the related technical information contained in the Products or this document for any military purposes, including but not limited to, the development of mass-destruction weapons. 5) The proper names of companies or products described in this document are trademarks or registered trademarks of ROHM, its affiliated companies or third parties. Notice - Rev.003 © 2012 ROHM Co., Ltd. All rights reserved.