IP3253/IP3254-TTL Integrated 4-, 6- and 8-channel passive EMI-filter network with high-level ESD protection Rev. 1 — 5 May 2011 Product data sheet 1. Product profile 1.1 General description The IP3253/IP3254-TTL family consists of 4-, 6- and 8-channel LC low-pass filter arrays designed to filter unwanted RF signals on the I/O ports of portable communication and computing devices. In addition, the IP3253/IP3254-TTL family incorporates diodes which protect downstream components from ElectroStatic Discharge (ESD) voltages up to ±15 kV. These devices are fabricated using monolithic silicon technology integrating up to 8 inductors and 16 diodes in a 0.4 mm pitch 8-, 12- or 16-pin ultra-thin leadless Quad Flat No-leads (QFN) plastic package. 1.2 Features and benefits Pb-free, Restriction of Hazardous Substances (RoHS) compliant and free of halogen and antimony (Dark Green compliant) 4-, 6- and 8-channel integrated π-type LC filter network ESD protection to ±15 kV contact discharge according to IEC 61000-4-2, level 4 ESD protection to ±30 kV contact discharge according to MIL-STD-883 (method 3015) Human Body Model (HBM) QFN plastic package with 0.4 mm pitch and 0.5 mm height 1.3 Applications General-purpose ElectroMagnetic Interference (EMI), Radio-Frequency Interference (RFI) filtering and downstream ESD protection for: Cellular phone and Personal Communication System (PCS) mobile handsets Cordless telephones Wireless data (WAN/LAN) systems IP3253/IP3254-TTL NXP Semiconductors Integrated 4-, 6- and 8-channel passive EMI-filter network 2. Pinning information Table 1. Pin Pinning Description Simplified outline Graphic symbol IP3253CZ8-4-TTL; IP3254CZ8-4-TTL (SOT1166-1) 1 and 8 filter channel 1 2 and 7 filter channel 2 3 and 6 filter channel 3 4 and 5 filter channel 4 ground pad ground 8 5 Ls(ch) 1, 2, 3, 4 1 4 Transparent top view 5, 6, 7, 8 GND 001aaj745 IP3253CZ12-6-TTL; IP3254CZ12-6-TTL (SOT1167-1) 1 and 12 filter channel 1 2 and 11 filter channel 2 3 and 10 filter channel 3 4 and 9 filter channel 4 5 and 8 filter channel 5 6 and 7 filter channel 6 ground pad ground 12 7 Ls(ch) 1, 2, 3, 4, 5, 6 1 7, 8, 9, 10, 11, 12 6 Transparent top view GND 001aaj746 IP3253CZ16-8-TTL; IP3254CZ16-8-TTL (SOT1168-1) IP3253_IP3254-TTL Product data sheet 1 and 16 filter channel 1 2 and 15 filter channel 2 3 and 14 filter channel 3 4 and 13 filter channel 4 5 and 12 filter channel 5 6 and 11 filter channel 6 7 and 10 filter channel 7 8 and 9 filter channel 8 ground pad ground 16 9 Ls(ch) 1, 2, 3, 4, 5, 6, 7, 8 1 9, 10, 11, 12, 13, 14, 15, 16 8 Transparent top view All information provided in this document is subject to legal disclaimers. Rev. 1 — 5 May 2011 GND 001aaj747 © NXP B.V. 2011. All rights reserved. 2 of 13 IP3253/IP3254-TTL NXP Semiconductors Integrated 4-, 6- and 8-channel passive EMI-filter network 3. Ordering information Table 2. Ordering information Type number Package Name Description Version HUSON8 plastic, thermal enhanced ultra thin small outline package; no leads; 8 terminals; body 1.35 × 1.7 × 0.55 mm SOT1166-1 IP3253CZ12-6-TTL HUSON12 plastic, thermal enhanced ultra thin small outline package; no leads; 12 terminals; body 1.35 × 2.5 × 0.55 mm SOT1167-1 IP3253CZ16-8-TTL HUSON16 plastic, thermal enhanced ultra thin small outline package; no leads; 16 terminals; body 1.35 × 3.3 × 0.55 mm SOT1168-1 IP3254CZ8-4-TTL plastic, thermal enhanced ultra thin small outline package; no leads; 8 terminals; body 1.35 × 1.7 × 0.55 mm SOT1166-1 IP3254CZ12-6-TTL HUSON12 plastic, thermal enhanced ultra thin small outline package; no leads; 12 terminals; body 1.35 × 2.5 × 0.55 mm SOT1167-1 IP3254CZ16-8-TTL HUSON16 plastic, thermal enhanced ultra thin small outline package; no leads; 16 terminals; body 1.35 × 3.3 × 0.55 mm SOT1168-1 IP3253CZ8-4-TTL HUSON8 4. Limiting values Table 3. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Conditions VCC supply voltage VESD electrostatic discharge voltage IEC 61000-4-2, level 4 Unit −0.5 +5.6 V - ±30 kV Tamb = 85 °C [1] - ±15 kV - 30 mA - 10 mW - 500 mW Ich channel current (DC) Pch channel power dissipation Ptot/pack total power dissipation per package Tstg storage temperature −65 +150 °C Tamb ambient temperature −40 +85 °C [1] Product data sheet Max all pins to ground; contact discharge HBM; MIL-STD-883, method 3015 IP3253_IP3254-TTL Min Tamb = 85 °C Device tested with 1000 pulses of ±15 kV contact discharges, according to the IEC 61000-4-2 model, far exceeding IEC 61000-4-2 level 4 (8 kV contact discharge). All information provided in this document is subject to legal disclaimers. Rev. 1 — 5 May 2011 © NXP B.V. 2011. All rights reserved. 3 of 13 IP3253/IP3254-TTL NXP Semiconductors Integrated 4-, 6- and 8-channel passive EMI-filter network 5. Characteristics Table 4. Channel characteristics Tamb = 25 °C unless otherwise specified. Symbol Parameter Ls(ch) Conditions Typ Max Unit - 18 - nH Vbias(DC) = 2.5 V 20 25 28.2 pF Vbias(DC) = 0 V 34 43 48 pF Vbias(DC) = 2.5 V 25 33 40 pF Vbias(DC) = 0 V 38 50 60 pF channel series inductance channel capacitance Cch Min IP3253CZx-y-TTL IP3254CZx-y-TTL for the total channel; fi = 100 kHz [1] ILR reverse leakage current per channel; VI = 3.5 V - - 0.1 μA VBR breakdown voltage positive clamp; II = 1 mA 5.8 - 10 V VF forward voltage negative clamp; IF = −1 mA −1.5 - −0.4 V R(ch-ch) resistance between channels VI = 3.5 V 10 - - MΩ Rs(ch) channel series resistance - 8 - Ω [1] Guaranteed by design. Table 5. Frequency characteristics Tamb = 25 °C unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit αil insertion loss Rsource = 50 Ω; RL = 50 Ω; 1 GHz < fi < 4 GHz - 30 - dB f−3dB cut-off frequency Rsource = 50 Ω; RL = 50 Ω; VI = 0 V IP3253CZx-y-TTL - 175 - MHz IP3254CZx-y-TTL - 145 - MHz IP3253CZx-y-TTL - 350 - MHz IP3254CZx-y-TTL - 315 - MHz frolloff [1] IP3253_IP3254-TTL Product data sheet Rsource = 50 Ω; RL = 50 Ω; VI = 0 V roll-off frequency [1] Measured at 6 dB attenuation. All information provided in this document is subject to legal disclaimers. Rev. 1 — 5 May 2011 © NXP B.V. 2011. All rights reserved. 4 of 13 IP3253/IP3254-TTL NXP Semiconductors Integrated 4-, 6- and 8-channel passive EMI-filter network 6. Application information 6.1 Insertion loss The devices are specifically designed as EMI/RFI filters for multichannel interfaces. The block schematic for measuring insertion loss in a 50 Ω system is shown in Figure 1. An example of the measurement curves for all channels is shown in Figure 2. DUT IN 50 Ω OUT TEST BOARD 50 Ω Vgen 018aaa016 Test Printed-Circuit Board (PCB) utilizes laser-drilled micro-via holes which connect the ground plane to the device ground pins. Fig 1. Frequency response setup 001aak301 0 001aak302 0 s21 (dB) s21 (dB) −10 −10 −20 −20 (1) −30 (2) −40 −50 (1) −30 1 10 102 103 (2) −40 −50 104 1 10 102 f (MHz) 104 f (MHz) (1) Channel 1 (pin 1 to pin 8) (1) Channel 3 (pin 3 to pin 6) (2) Channel 4 (pin 4 to pin 5) (2) Channel 2 (pin 2 to pin 7) Fig 2. 103 IP3253CZ8-4-TTL measured insertion loss magnitudes IP3253_IP3254-TTL Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 — 5 May 2011 © NXP B.V. 2011. All rights reserved. 5 of 13 IP3253/IP3254-TTL NXP Semiconductors Integrated 4-, 6- and 8-channel passive EMI-filter network 001aal112 0 001aal389 0 s21 (dB) s21 (dB) −10 −10 −20 −20 −30 (2) −30 (1) −40 (1) −40 (2) −50 1 10 102 103 −50 104 1 10 102 f (MHz) 104 f (MHz) (1) Channel 1 (pin 1 to pin 8) (1) Channel 3 (pin 3 to pin 6) (2) Channel 4 (pin 4 to pin 5) (2) Channel 2 (pin 2 to pin 7) Fig 3. 103 IP3254CZ8-4-TTL measured insertion loss magnitudes IP3253_IP3254-TTL Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 — 5 May 2011 © NXP B.V. 2011. All rights reserved. 6 of 13 IP3253/IP3254-TTL NXP Semiconductors Integrated 4-, 6- and 8-channel passive EMI-filter network 7. Package outline HUSON8: plastic, thermal enhanced ultra thin small outline package; no leads; 8 terminals; body 1.35 x 1.7 x 0.55 mm SOT1166-1 X A B D A E A1 c terminal 1 index area detail X e1 terminal 1 index area e 1 4 C C A B C v w b y1 C y L k Eh 8 5 Dh tiebars are indicated on arbitrary location and size 0 1 scale Dimensions Unit(1) mm 2 mm A A1 b c D max 0.55 0.05 0.25 1.8 nom 0.20 0.127 1.7 min 0.00 0.15 1.6 Dh 1.3 1.2 1.1 E Eh 1.45 0.45 1.35 0.40 1.25 0.35 e e1 0.4 k L v 0.1 0.2 0.30 0.25 0.20 1.2 w y y1 0.05 0.05 0.05 Note 1. Plastic or metal protrusions of 0.075 mm maximum per side are not included. Fig 4. References Outline version IEC JEDEC JEITA SOT1166-1 --- --- --- sot1166-1_po European projection Issue date 10-03-18 10-03-22 Package outline SOT1166-1 (HUSON8) IP3253_IP3254-TTL Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 — 5 May 2011 © NXP B.V. 2011. All rights reserved. 7 of 13 IP3253/IP3254-TTL NXP Semiconductors Integrated 4-, 6- and 8-channel passive EMI-filter network HUSON12: plastic, thermal enhanced ultra thin small outline package; no leads; 12 terminals; body 1.35 x 2.5 x 0.55 mm SOT1167-1 X A B D A E A1 c terminal 1 index area detail X e1 terminal 1 index area e v w b 1 6 C C A B C y1 C y L k Eh 12 7 Dh tiebars are indicated on arbitrary location and size 0 1 scale Dimensions Unit(1) mm 2 mm A A1 b c D max 0.55 0.05 0.25 2.6 nom 0.20 0.127 2.5 min 0.00 0.15 2.4 Dh 2.1 2.0 1.9 E Eh 1.45 0.45 1.35 0.40 1.25 0.35 e e1 0.4 k L v 0.1 0.2 0.30 0.25 0.20 2.0 w y y1 0.05 0.05 0.05 Note 1. Plastic or metal protrusions of 0.075 mm maximum per side are not included. Fig 5. References Outline version IEC JEDEC JEITA SOT1167-1 --- --- --- sot1167-1_po European projection Issue date 10-03-18 10-03-22 Package outline SOT1167-1 (HUSON12) IP3253_IP3254-TTL Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 — 5 May 2011 © NXP B.V. 2011. All rights reserved. 8 of 13 IP3253/IP3254-TTL NXP Semiconductors Integrated 4-, 6- and 8-channel passive EMI-filter network HUSON16: plastic, thermal enhanced ultra thin small outline package; no leads; 16 terminals; body 1.35 x 3.3 x 0.55 mm SOT1168-1 X A B D A E A1 c terminal 1 index area detail X e1 terminal 1 index area e v w b 1 8 C C A B C y1 C y L k Eh 16 9 Dh tiebars are indicated on arbitrary location and size 0 1 Dimensions Unit(1) mm 2 mm scale A A1 b c D max 0.55 0.05 0.25 3.4 nom 0.20 0.127 3.3 min 0.00 0.15 3.2 Dh 2.9 2.8 2.7 E Eh 1.45 0.45 1.35 0.40 1.25 0.35 e e1 0.4 2.8 k L v 0.1 0.2 0.30 0.25 0.20 w y y1 0.05 0.05 0.05 Note 1. Plastic or metal protrusions of 0.075 mm maximum per side are not included. Fig 6. References Outline version IEC JEDEC JEITA SOT1168-1 --- --- --- sot1168-1_po European projection Issue date 10-03-18 10-03-22 Package outline SOT1168-1 (HUSON16) IP3253_IP3254-TTL Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 — 5 May 2011 © NXP B.V. 2011. All rights reserved. 9 of 13 IP3253/IP3254-TTL NXP Semiconductors Integrated 4-, 6- and 8-channel passive EMI-filter network 8. Revision history Table 6. Revision history Document ID Release date Data sheet status Change notice Supersedes IP3253_IP3254-TTL v.1 20110505 Product data sheet - - IP3253_IP3254-TTL Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 — 5 May 2011 © NXP B.V. 2011. All rights reserved. 10 of 13 IP3253/IP3254-TTL NXP Semiconductors Integrated 4-, 6- and 8-channel passive EMI-filter network 9. Legal information 9.1 Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 9.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. Product specification — The information and data provided in a Product data sheet shall define the specification of the product as agreed between NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the Product data sheet. 9.3 Disclaimers Limited warranty and liability — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third party customer(s). NXP does not accept any liability in this respect. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. Terms and conditions of commercial sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer’s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities. IP3253_IP3254-TTL Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 — 5 May 2011 © NXP B.V. 2011. All rights reserved. 11 of 13 IP3253/IP3254-TTL NXP Semiconductors Integrated 4-, 6- and 8-channel passive EMI-filter network Non-automotive qualified products — Unless this data sheet expressly states that this specific NXP Semiconductors product is automotive qualified, the product is not suitable for automotive use. It is neither qualified nor tested in accordance with automotive testing or application requirements. NXP Semiconductors accepts no liability for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ standard warranty and NXP Semiconductors’ product specifications. In the event that customer uses the product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without NXP Semiconductors’ warranty of the product for such automotive applications, use and specifications, and (b) whenever customer uses the product for automotive applications beyond 9.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 10. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] IP3253_IP3254-TTL Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 — 5 May 2011 © NXP B.V. 2011. All rights reserved. 12 of 13 IP3253/IP3254-TTL NXP Semiconductors Integrated 4-, 6- and 8-channel passive EMI-filter network 11. Contents 1 1.1 1.2 1.3 2 3 4 5 6 6.1 7 8 9 9.1 9.2 9.3 9.4 10 11 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 General description . . . . . . . . . . . . . . . . . . . . . 1 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 Ordering information . . . . . . . . . . . . . . . . . . . . . 3 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Application information. . . . . . . . . . . . . . . . . . . 5 Insertion loss . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 7 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 10 Legal information. . . . . . . . . . . . . . . . . . . . . . . 11 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 11 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Contact information. . . . . . . . . . . . . . . . . . . . . 12 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2011. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] Date of release: 5 May 2011 Document identifier: IP3253_IP3254-TTL