INTEGRATED CIRCUITS DATA SHEET SAA6581 RDS/RBDS demodulator Product specification Supersedes data of 2002 Jan 14 2003 Oct 10 Philips Semiconductors Product specification RDS/RBDS demodulator SAA6581 FEATURES APPLICATIONS • Integrated switched capacitor filter • Demodulates European Radio Data System (RDS) or the USA Radio Broadcast Data System (RBDS) signals The RDS/RBDS system offers a large range of applications from the many functions that can be implemented. For car radios the most important are: • Oscillator frequencies: 4.332 or 8.664 MHz • Program Service (PS) name • Traffic Program (TP) identification • Integrated ARI clamping • Traffic Announcement (TA) signal • CMOS device • Alternative Frequency (AF) list • Single supply voltage: 5 V • Program Identification (PI) • Extended temperature range: −40 to +85 °C • Enhanced Other Networks (EON) information. • Low number of external components. GENERAL DESCRIPTION The RDS/RBDS demodulator is a CMOS device with integrated filtering and demodulating of RDS/RBDS signals coming from a multiplexed input data stream. Data signal RDDA and clock signal RDCL are provided as outputs for further processing by a suitable microcomputer, for example CCR921 and CCR922. The SAA6581T replaces SAA6579 in function and pin-compatibility. QUICK REFERENCE DATA SYMBOL PARAMETER MIN. TYP. MAX. UNIT VDDA analog supply voltage VDDD digital supply voltage 4.0 5.0 5.5 V IDD(tot) total supply current − 6.0 − mA Vi(MPX) RDS input sensitivity at pin MPX 1 − − mV fi(xtal) crystal input frequency − 4.332 − MHz − 8.664 − MHz 4.0 5.0 5.5 V ORDERING INFORMATION TYPE NUMBER SAA6581T SAA6581HN 2003 Oct 10 PACKAGE NAME SO16 HVQFN32 DESCRIPTION VERSION plastic small outline package; 16 leads; body width 7.5 mm SOT162-1 plastic thermal enhanced very thin quad flat package; no leads; 32 terminals; body 5 × 5 × 0.85 mm SOT617-1 2 Philips Semiconductors Product specification RDS/RBDS demodulator SAA6581 BLOCK DIAGRAM 560 pF handbook, full pagewidth +5 V SCOUT C6 C7 100 nF VDDD CIN 12 (28) 8 (20) 7 (18) (23) 10 SYNC multiplex input C1 MPX 4 (12) 330 pF (4) 16 RDCL 57 kHz 8th ORDER BANDPASS FILTER CLOCKED COMPARATOR RDS/RBDS DEMODULATOR SIGNAL QUALITY DETECTOR SAA6581 +5 V C2 100 nF VDDA 5 (13) POWER SUPPLY AND RESET 6 (16) VSSA TEST CONTROL 3 (9) Vref 15 (2) TCON (5) 1 QUAL OSCILLATOR AND CLOCK 9 (21) MODE C3 2.2 µF 13 (29) OSCI 14 (32) OSCO Q1 C5 56 pF C4 47 pF Pin numbers for the SAA6581HN are given in parenthesis. Fig.1 Block diagram. 2003 Oct 10 (6) 2 RDDA 3 11 (27) VSSD MHC651 Philips Semiconductors Product specification RDS/RBDS demodulator SAA6581 PINNING PIN SYMBOL PIN SYMBOL DESCRIPTION SO16 HVQFN32 QUAL 1 5 DESCRIPTION SO16 HVQFN32 MODE 9 21 signal quality indication output oscillator frequency select input n.c. − 22 not connected SYNC 10 23 ARI clamping control input RDDA 2 6 RDS data output n.c. − 7 not connected n.c. − 8 not connected n.c. − 24 not connected n.c. − 25 not connected Vref 3 9 reference voltage output (1/2VDDA) n.c. − 26 not connected n.c. − 10 not connected VSSD 11 27 digital ground (0 V) n.c. − 11 not connected VDDD 12 28 digital supply voltage (5 V) MPX 4 12 multiplex signal input VDDA 5 13 analog supply voltage (5 V) OSCI 13 29 oscillator input n.c. − 30 not connected n.c. − 14 not connected n.c. − 31 not connected 14 32 oscillator output 1 not connected 17 not connected TCON 15 2 test control input CIN 7 18 comparator input n.c. − 3 not connected n.c. − 19 not connected RDCL 16 4 RDS clock output SCOUT 8 20 switched capacitor filter output handbook, halfpage handbook, halfpage 16 VSSA − − 15 n.c. n.c. n.c. 14 n.c. OSCO analog ground (0 V) 13 VDDA not connected 16 11 n.c. 15 6 12 MPX − VSSA 9 Vref 10 n.c. n.c. QUAL 1 16 RDCL n.c. 8 17 n.c. RDDA 2 15 TCON n.c. 7 18 CIN Vref 3 14 OSCO RDDA 6 19 n.c. 10 SYNC SCOUT 8 9 MODE 22 n.c. 23 SYNC 24 n.c. MHB900 n.c. 25 CIN 7 n.c. 1 21 MODE n.c. 26 TCON 2 VSSD 27 11 VSSD VDDD 28 n.c. 3 VSSA 6 OSCO 32 12 VDDD OSCI 29 SAA6581T VDDA 5 20 SCOUT SAA6581HN RDCL 4 n.c. 30 13 OSCI n.c. 31 MPX 4 QUAL 5 MHC652 Bottom view. Fig.2 Pin configuration for SO16. 2003 Oct 10 Fig.3 Pin configuration for HVQFN32. 4 Philips Semiconductors Product specification RDS/RBDS demodulator SAA6581 Table 1 FUNCTIONAL DESCRIPTION Control pin SYNC RDS/RBDS signal demodulation SYNC ARI CLAMPING BANDPASS FILTER LOW internal ARI clamping disabled The bandpass filter has a centre frequency of 57 kHz. It selects the RDS/RBDS sub-band from the multiplex signal MPX and suppresses the audio signal components. The filter block contains an analog anti-aliasing filter at the input followed by an 8th order switched capacitor bandpass filter and a reconstruction filter at the output. HIGH ARI clamping allowed to be logged SIGNAL QUALITY DETECTION Output QUAL indicates the safety of the regenerated RDS data (HIGH = ‘good’ data; LOW = ‘unsafe’ data). Oscillator and system clock generator CLOCKED COMPARATOR For good performance of the bandpass and demodulator stages, the demodulator requires a crystal oscillator with a frequency of 4.332 or 8.664 MHz. The demodulator can operate with either frequency (see Table 2), so that a radio set with a microcontroller can run, in this case, with one crystal only. The demodulator oscillator can drive the microcontroller, or vice versa. The comparator digitizes the output signal from the 57 kHz bandpass filter for further processing by the digital RDS/RBDS demodulator. To attain high sensitivity and to avoid phase distortion, the comparator input stage has automatic offset compensation. DEMODULATOR Table 2 The demodulator provides all functions of the SAA6579 and improves performance under weak signal conditions. Control pins TCON and MODE TCON MODE Demodulator functions include: HIGH LOW 4.332 MHz • 57 kHz carrier regeneration from the two sidebands (Costas loop) HIGH HIGH 8.664 MHz • Symbol integration over one RDS clock period OSCILLATOR FREQUENCY The clock generator generates the internal 4.332 MHz system clock and timing signal derivatives. • Bi-phase symbol decoding • Differential decoding Power supply and internal reset • Synchronization of RDS/RBDS output data. The demodulator has separate power supply inputs for the digital and analog parts of the device. For the analog functions an additional reference voltage (1⁄2VDDA) is internally generated and available via the output pin Vref. The demodulator requires a defined reset condition. The demodulator generates automatically a reset signal after the power supply VDDA is switched on, or at a voltage-drop. The RDS/RBDS demodulator recovers and regenerates the continuously transmitted RDS/RBDS data stream in the MPX signal and provides clock RDCL for the output signals and data output RDDA for further processing by an RDS/RBDS decoder, for example CCR921 or CCR922. ARI CLAMP The demodulator checks the input signal for presence of RDS only, or RDS plus ARI transmissions. After a fixed test period, if the SYNC input is set HIGH the demodulator locks in the ‘verified’ condition (see Table 1). If SYNC is set LOW, the ARI clamping is reset (disabled). After SYNC returns to HIGH, the demodulator resumes checking the input signal. 2003 Oct 10 5 Philips Semiconductors Product specification RDS/RBDS demodulator SAA6581 LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 60134). SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT VDD supply voltage 0 6.5 V Vn voltage at pins QUAL, RDDA, Vref, MPX, pins VDDA and VDDD are CIN, SCOUT, MODE, SYNC, OSCI, OSCO, connected to VDD TCON and RDCL with respect to pins VSSA and VSSD −0.5 VDD + 0.5 ≤ 6.5 V Vi(MPX)(p-p) input voltage at pin MPX (peak-to-peak value) note 1 − 6 V Ii input current at pins QUAL, RDDA, Vref, MPX, VDDA, CIN, SCOUT, MODE, SYNC, VDDD, OSCI, OSCO, TCON and RDCL pins VSSA and VSSD are connected to ground −10 +10 mA Ilu(prot) latch-up protection current in pulsed mode Tamb = −40 to +85 °C with −100 voltage limiting −2 to +10 V +100 mA Tamb = 25 °C with voltage limiting −2 to +12 V −200 +200 mA Tamb = −40 to +85 °C without voltage limiting −10 +10 mA Tamb ambient temperature −40 +85 °C Tstg storage temperature −65 +150 °C Ves electrostatic handling voltage note 2 −3000 +3000 V note 3 −400 V +400 Notes 1. Without latching in the entire temperature range. 2. Human body model (equivalent to discharging a 100 pF capacitor through a 1.5 kΩ series resistor). 3. Machine model (equivalent to discharging a 200 pF capacitor through a 0 Ω series resistor and 0.75 µH inductance). THERMAL CHARACTERISTICS SYMBOL Rth(j-a) PARAMETER CONDITIONS UNIT 104 K/W 100 K/W thermal resistance from junction to ambient in free air SAA6581T (SO16) SAA6581HN (HVQFN32) 2003 Oct 10 VALUE with soldered heatsink 6 Philips Semiconductors Product specification RDS/RBDS demodulator SAA6581 CHARACTERISTICS: DIGITAL PART VDDA = VDDD = 5 V; Tamb = 25 °C; unless otherwise specified. SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT Supply VDDD digital supply voltage 4.0 5.0 5.5 V IDDD digital supply current − 1.5 − mA Ptot total power dissipation − 30 − mW VIL LOW-level input voltage at pins TCON, OSCI, SYNC and MODE − − 0.3VDDD V VIH HIGH-level input voltage at pins TCON, OSCI, SYNC and MODE 0.7VDDD − − V Ii(pu) input pull-up current at pins TCON and MODE VIH = 3.5 V −10 −20 − µA VOL LOW-level output voltage at pins QUAL, RDDA and RDCL IOL = 2 mA − − 0.4 V VOH HIGH-level output voltage at pins QUAL, RDDA and RDCL IOH = −0.02 mA 4.0 − − V TCON = HIGH; MODE = LOW − 4.332 − MHz TCON = HIGH; MODE = HIGH − 8.664 − MHz − − 30 × 10−6 Tamb = −40 to +85 °C − − 30 × 10−6 Inputs Outputs Crystal parameters fi(xtal) crystal input frequency ∆fosc adjustment tolerance of oscillator frequency ∆fosc(T) temperature drift of oscillator frequency CL load capacitance − 30 − pF Rxtal crystal resonance resistance − − 120 Ω 2003 Oct 10 7 Philips Semiconductors Product specification RDS/RBDS demodulator SAA6581 CHARACTERISTICS: ANALOG PART VDDA = VDDD = 5 V; Tamb = 25 °C; measurements taken in Fig.1; unless otherwise specified. SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT Supply VDDA analog supply voltage 4.0 5.0 5.5 V VDDA − VDDD difference between analog and digital supply voltages − 0 0.5 V IDD(tot) total supply current − 6.0 − mA Vref reference voltage 2.25 2.5 2.75 V Zo(Vref) output impedance at pin Vref − 25 − kΩ 1 − − mV VDDA = 5 V MPX input (signal before the capacitor on pin MPX) Vi(MPX)(rms) RDS amplitude (RMS value) Vi(max)(p-p) maximum input signal capability (peak-to-peak value) Ri(MPX) input resistance ∆f = ±1.2 kHz RDS-signal; ∆f = ±3.2 kHz ARI-signal f = 57 ±2 kHz 200 − − mV f < 50 kHz 1.4 − − V f < 15 kHz 2.8 − − V f > 70 kHz 3.5 − − V f = 0 to 100 kHz 40 − − kΩ Tamb = −40 to +85 °C 56.5 57.0 57.5 kHz 2.5 3.0 3.5 kHz 17 20 23 dB 57 kHz bandpass filter fc centre frequency B−3dB −3 dB bandwidth GSCOUT-MPX signal gain αsb stop band attenuation Ro(SCOUT) output resistance at pin SCOUT f = 57 kHz ∆f = ±7 kHz 31 − − dB f < 45 kHz 40 − − dB f < 20 kHz 50 − − dB f > 70 kHz 40 − − dB f = 57 kHz − 30 60 Ω f = 57 kHz − 1 10 mV 70 110 150 kΩ Comparator input (pin CIN) Vi(min)(rms) minimum input level (RMS value) Ri input resistance 2003 Oct 10 8 Philips Semiconductors Product specification RDS/RBDS demodulator SAA6581 TIMING DATA tCLKH handbook, full pagewidth RDCL td(clk) TCLK td(clk) RDDA MHB901 Tbit(slipped) Fig.4 RDS timing diagram including a phase change. Table 3 RDS timing (see Fig.4) SYMBOL PARAMETER TYP. UNIT td(clk) clock-data delay 4 µs TCLK clock period 842 µs tCLKH clock HIGH time 421 µs Tbit(slipped) slipped data bit period 1263 µs 2003 Oct 10 9 Philips Semiconductors Product specification RDS/RBDS demodulator SAA6581 PACKAGE OUTLINES SO16: plastic small outline package; 16 leads; body width 7.5 mm SOT162-1 D E A X c HE y v M A Z 9 16 Q A2 A (A 3) A1 pin 1 index θ Lp L 1 8 e detail X w M bp 0 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (1) e HE L Lp Q v w y mm 2.65 0.3 0.1 2.45 2.25 0.25 0.49 0.36 0.32 0.23 10.5 10.1 7.6 7.4 1.27 10.65 10.00 1.4 1.1 0.4 1.1 1.0 0.25 0.25 0.1 0.9 0.4 inches 0.1 0.012 0.096 0.004 0.089 0.01 0.019 0.013 0.014 0.009 0.41 0.40 0.30 0.29 0.05 0.419 0.043 0.055 0.394 0.016 0.043 0.039 0.01 0.01 0.004 0.035 0.016 Z (1) θ 8o 0o Note 1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC SOT162-1 075E03 MS-013 2003 Oct 10 JEITA EUROPEAN PROJECTION ISSUE DATE 99-12-27 03-02-19 10 Philips Semiconductors Product specification RDS/RBDS demodulator SAA6581 HVQFN32: plastic thermal enhanced very thin quad flat package; no leads; 32 terminals; body 5 x 5 x 0.85 mm A B D SOT617-1 terminal 1 index area A A1 E c detail X C e1 e 1/2 e 16 y y1 C v M C A B w M C b 9 L 17 8 e e2 Eh 1/2 e 1 terminal 1 index area 24 32 25 X Dh 0 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) UNIT A(1) max. A1 b c D (1) Dh E (1) Eh e e1 e2 L v w y y1 mm 1 0.05 0.00 0.30 0.18 0.2 5.1 4.9 3.25 2.95 5.1 4.9 3.25 2.95 0.5 3.5 3.5 0.5 0.3 0.1 0.05 0.05 0.1 Note 1. Plastic or metal protrusions of 0.075 mm maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC JEITA SOT617-1 --- MO-220 --- 2003 Oct 10 11 EUROPEAN PROJECTION ISSUE DATE 01-08-08 02-10-18 Philips Semiconductors Product specification RDS/RBDS demodulator SAA6581 SOLDERING cooling) vary between 100 and 200 seconds depending on heating method. Introduction Typical reflow peak temperatures range from 215 to 270 °C depending on solder paste material. The top-surface temperature of the packages should preferably be kept: This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our “Data Handbook IC26; Integrated Circuit Packages” (document order number 9398 652 90011). • below 220 °C (SnPb process) or below 245 °C (Pb-free process) There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mount components are mixed on one printed-circuit board. Wave soldering can still be used for certain surface mount ICs, but it is not suitable for fine pitch SMDs. In these situations reflow soldering is recommended. Driven by legislation and environmental forces the worldwide use of lead-free solder pastes is increasing. – for all the BGA and SSOP-T packages – for packages with a thickness ≥ 2.5 mm – for packages with a thickness < 2.5 mm and a volume ≥ 350 mm3 so called thick/large packages. • below 235 °C (SnPb process) or below 260 °C (Pb-free process) for packages with a thickness < 2.5 mm and a volume < 350 mm3 so called small/thin packages. Moisture sensitivity precautions, as indicated on packing, must be respected at all times. Through-hole mount packages SOLDERING BY DIPPING OR BY SOLDER WAVE Typical dwell time of the leads in the wave ranges from 3 to 4 seconds at 250 °C or 265 °C, depending on solder material applied, SnPb or Pb-free respectively. WAVE SOLDERING Conventional single wave soldering is not recommended for surface mount devices (SMDs) or printed-circuit boards with a high component density, as solder bridging and non-wetting can present major problems. The total contact time of successive solder waves must not exceed 5 seconds. To overcome these problems the double-wave soldering method was specifically developed. The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (Tstg(max)). If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. If wave soldering is used the following conditions must be observed for optimal results: • Use a double-wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave. MANUAL SOLDERING • For packages with leads on two sides and a pitch (e): Apply the soldering iron (24 V or less) to the lead(s) of the package, either below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 °C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400 °C, contact may be up to 5 seconds. – larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of the printed-circuit board; – smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board. Surface mount packages The footprint must incorporate solder thieves at the downstream end. REFLOW SOLDERING Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. • For packages with leads on four sides, the footprint must be placed at a 45° angle to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves downstream and at the side corners. Several methods exist for reflowing; for example, convection or convection/infrared heating in a conveyor type oven. Throughput times (preheating, soldering and During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe 2003 Oct 10 12 Philips Semiconductors Product specification RDS/RBDS demodulator SAA6581 dispensing. The package can be soldered after the adhesive is cured. MANUAL SOLDERING Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage (24 V or less) soldering iron applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 °C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 °C. Typical dwell time of the leads in the wave ranges from 3 to 4 seconds at 250 °C or 265 °C, depending on solder material applied, SnPb or Pb-free respectively. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. Suitability of IC packages for wave, reflow and dipping soldering methods SOLDERING METHOD PACKAGE(1) MOUNTING WAVE REFLOW(2) DIPPING suitable(3) − suitable Through-holesurface mount PMFP(9) not suitable not suitable − Surface mount BGA, LBGA, LFBGA, SQFP, SSOP-T(4), TFBGA, VFBGA not suitable suitable − DHVQFN, HBCC, HBGA, HLQFP, HSQFP, HSOP, HTQFP, HTSSOP, HVQFN, HVSON, SMS not suitable(5) suitable − PLCC(6), SO, SOJ suitable suitable − suitable − suitable − Through-hole mount DBS, DIP, HDIP, RDBS, SDIP, SIL recommended(6)(7) LQFP, QFP, TQFP not SSOP, TSSOP, VSO, VSSOP not recommended(8) Notes 1. For more detailed information on the BGA packages refer to the “(LF)BGA Application Note” (AN01026); order a copy from your Philips Semiconductors sales office. 2. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the Drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”. 3. For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board. 4. These transparent plastic packages are extremely sensitive to reflow soldering conditions and must on no account be processed through more than one soldering cycle or subjected to infrared reflow soldering with peak temperature exceeding 217 °C ± 10 °C measured in the atmosphere of the reflow oven. The package body peak temperature must be kept as low as possible. 5. These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the solder cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink on the top side, the solder might be deposited on the heatsink surface. 6. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction. The package footprint must incorporate solder thieves downstream and at the side corners. 7. Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm. 8. Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm. 9. Hot bar soldering or manual soldering is suitable for PMFP packages. 2003 Oct 10 13 Philips Semiconductors Product specification RDS/RBDS demodulator SAA6581 DATA SHEET STATUS LEVEL DATA SHEET STATUS(1) PRODUCT STATUS(2)(3) Development DEFINITION I Objective data II Preliminary data Qualification This data sheet contains data from the preliminary specification. Supplementary data will be published at a later date. Philips Semiconductors reserves the right to change the specification without notice, in order to improve the design and supply the best possible product. III Product data This data sheet contains data from the product specification. Philips Semiconductors reserves the right to make changes at any time in order to improve the design, manufacturing and supply. Relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN). Production This data sheet contains data from the objective specification for product development. Philips Semiconductors reserves the right to change the specification in any manner without notice. Notes 1. Please consult the most recently issued data sheet before initiating or completing a design. 2. The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com. 3. For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status. DEFINITIONS DISCLAIMERS Short-form specification The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. Life support applications These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application. Limiting values definition Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Right to make changes Philips Semiconductors reserves the right to make changes in the products including circuits, standard cells, and/or software described or contained herein in order to improve design and/or performance. When the product is in full production (status ‘Production’), relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN). Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no licence or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified. Application information Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification. 2003 Oct 10 14 Philips Semiconductors – a worldwide company Contact information For additional information please visit http://www.semiconductors.philips.com. Fax: +31 40 27 24825 For sales offices addresses send e-mail to: [email protected]. SCA75 © Koninklijke Philips Electronics N.V. 2003 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Printed in The Netherlands R32/03/pp15 Date of release: 2003 Oct 10 Document order number: 9397 750 12035