PHILIPS XC7WT14

XC7WT14
Triple inverting Schmitt trigger
Rev. 2 — 3 November 2011
Product data sheet
1. General description
The XC7WT14 is a high-speed Si-gate CMOS device. This device provides three inverting
buffers with Schmitt trigger action. This device is capable of transforming slowly changing
input signals into sharply defined, jitter-free output signals.
2. Features and benefits
 Symmetrical output impedance
 High noise immunity
 ESD protection:
 HBM JESD22-A114F exceeds 2000 V
 MM JESD22-A115-A exceeds 200 V
 CDM JESD22-C101D exceeds 1000 V
 Low power dissipation
 Balanced propagation delays
 Multiple package options
 Specified from 40 C to +85 C and 40 C to +125 C
3. Applications
 Wave and pulse shaper for highly noisy environment
 Astable multivibrator
 Monostable multivibrator
4. Ordering information
Table 1.
Ordering information
Type number
Package
Temperature range
Name
Description
Version
XC7WT14DP
40 C to +125 C
TSSOP8
plastic thin shrink small outline package; 8 leads;
body width 3 mm; lead length 0.5 mm
SOT505-2
XC7WT14DC
40 C to +125 C
VSSOP8
plastic very thin shrink small outline package; 8 leads; SOT765-1
body width 2.3 mm
XC7WT14GT
40 C to +125 C
XSON8
plastic extremely thin small outline package; no leads; SOT833-1
8 terminals; body 1  1.95  0.5 mm
XC7WT14GD
40 C to +125 C
XSON8U
plastic extremely thin small outline package; no leads; SOT996-2
8 terminals; UTLP based; body 3  2  0.5 mm
XC7WT14
NXP Semiconductors
Triple inverting Schmitt trigger
5. Marking
Table 2.
Marking codes
Type number
Marking code[1]
XC7WT14DP
g14
XC7WT14DC
g14
XC7WT14GT
g14
XC7WT14GD
g14
[1]
The pin 1 indicator is located on the lower left corner of the device, below the marking code.
6. Functional diagram
1A
1Y
3Y
3A
2A
2Y
A
001aah728
Fig 1.
Y
mna025
001aah729
Logic symbol
Fig 2.
IEC logic symbol
Fig 3.
Logic diagram
(one Schmitt trigger)
7. Pinning information
7.1 Pinning
XC7WT14
1A
1
8
VCC
3Y
2
7
1Y
2A
3
6
3A
GND
4
5
2Y
XC7WT14
1A
1
8
VCC
3Y
2
7
1Y
2A
3
6
3A
GND
4
5
2Y
001aam984
Transparent top view
001aam983
Fig 4.
Pin configuration SOT505-2 and SOT765-1
XC7WT14
Product data sheet
Fig 5.
Pin configuration SOT833-1
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Triple inverting Schmitt trigger
XC7WT14
1A
1
8
VCC
3Y
2
7
1Y
2A
3
6
3A
GND
4
5
2Y
001aam985
Transparent top view
Fig 6.
Pin configuration SOT996-2
7.2 Pin description
Table 3.
Pin description
Symbol
Pin
Description
1A, 2A, 3A
1, 3, 6
data input
GND
4
ground (0 V)
1Y, 2Y, 3Y
7, 5, 2
data output
VCC
8
supply voltage
8. Functional description
Table 4.
Function table [1]
Input nA
Output nY
L
H
H
L
[1]
H = HIGH voltage level; L = LOW voltage level
XC7WT14
Product data sheet
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Triple inverting Schmitt trigger
9. Limiting values
Table 5.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
VCC
supply voltage
VI
input voltage
IIK
input clamping current
VI < 0.5 V
IOK
output clamping current
VO < 0.5 V or VO > VCC + 0.5 V
IO
output current
0.5 V < VO < VCC + 0.5 V
ICC
IGND
Tstg
storage temperature
[1]
[2]
Min
Max
Unit
0.5
+7.0
V
0.5
+7.0
V
20
-
mA
-
20
mA
-
25
mA
supply current
-
75
mA
ground current
75
-
mA
65
+150
C
-
250
mW
total power dissipation
Ptot
Conditions
[1]
Tamb = 40 C to +125 C
[2]
The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
For TSSOP8 package: above 55 C the value of Ptot derates linearly at 2.5 mW/K.
For VSSOP8 package: above 110 C the value of Ptot derates linearly at 8 mW/K.
For XSON8 and XSON8U package: above 118 C the value of Ptot derates linearly with 7.8 mW/K.
10. Recommended operating conditions
Table 6.
Recommended operating conditions
Voltages are referenced to GND (ground = 0 V).
Symbol Parameter
VCC
supply voltage
VI
VO
Tamb
ambient temperature
Conditions
Min
Typ
Max
4.5
5.0
input voltage
0
output voltage
0
40
XC7WT14
Product data sheet
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Rev. 2 — 3 November 2011
Unit
5.5
V
-
5.5
V
-
VCC
V
+25
+125
C
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NXP Semiconductors
Triple inverting Schmitt trigger
11. Static characteristics
Table 7.
Static characteristics
Voltages are referenced to GND (ground = 0 V).
Symbol Parameter
VOH
25 C
Conditions
HIGH-level
VI = VT+ or VT; VCC = 4.5 V
output voltage
IO = 50 A
IO = 8.0 mA
VOL
LOW-level
VI = VT+ or VT; VCC = 4.5 V
output voltage
IO = 50 A
IO = 8.0 mA
Min
Typ
Max
Min
Max
Min
Max
4.4
4.5
-
4.4
-
4.4
-
V
3.94
-
-
3.8
-
3.70
-
V
-
0
0.1
-
0.1
-
0.1
V
-
-
0.36
-
0.44
-
0.55
V
-
-
0.1
-
1.0
-
2.0
A
II
input leakage
current
ICC
supply current VI = VCC or GND; IO = 0 A;
VCC = 5.5 V
-
-
1.0
-
10
-
40
A
ICC
additional
per input pin; VI = 3.4 V;
supply current other inputs at VCC or GND;
IO = 0 A; VCC = 5.5 V
-
-
1.35
-
1.5
-
1.5
mA
CI
input
capacitance
-
1.5
10
-
10
-
10
pF
XC7WT14
Product data sheet
VI = 5.5 V or GND;
VCC = 0 V to 5.5 V
40 C to +85 C 40 C to +125 C Unit
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Triple inverting Schmitt trigger
11.1 Transfer characteristics
Table 8.
Transfer characteristics
At recommended operating conditions; voltages are referenced to GND (ground = 0 V). See Figure 9 and Figure 10.
Symbol Parameter
positive-going
threshold
voltage
VT+
VT
VH
25 C
Conditions
40 C to +85 C 40 C to +125 C Unit
Min
Typ
Max
Min
Max
Min
Max
VCC = 4.5 V
-
-
2.0
-
2.0
-
2.0
V
VCC = 5.5 V
-
-
2.0
-
2.0
-
2.0
V
negative-going
threshold
voltage
VCC = 4.5 V
0.5
-
-
0.5
-
0.5
-
V
VCC = 5.5 V
0.6
-
-
0.6
-
0.6
-
V
hysteresis
voltage
VCC = 4.5 V
0.4
-
1.4
0.4
1.4
0.35
1.4
V
VCC = 5.5 V
0.4
-
1.6
0.4
1.6
0.35
1.6
V
12. Dynamic characteristics
Table 9.
Dynamic characteristics
GND = 0 V; for test circuit see Figure 8.
Symbol Parameter
tpd
25 C
Conditions
propagation
delay
nA to nY; Figure 7
power
dissipation
capacitance
per buffer;
VI = GND to VCC
[1]
40 C to +125 C Unit
Typ
Max
Min
Max
Min
Max
-
4.1
7.0
1.0
8.0
1.0
9.0
ns
-
5.9
8.5
1.0
10.0
1.0
11.0
ns
-
12
-
-
-
-
-
pF
[1] [2]
CL = 15 pF
CL = 50 pF
CPD
40 C to +85 C
Min
[3]
tpd is the same as tPLH and tPHL.
[2]
Typical values are measured at VCC = 5.0 V.
[3]
CPD is used to determine the dynamic power dissipation PD (W).
PD = CPD  VCC2  fi + (CL  VCC2  fo) where:
fi = input frequency in MHz;
fo = output frequency in MHz;
CL = output load capacitance in pF;
VCC = supply voltage in V;
(CL  VCC2  fo) = sum of the outputs.
XC7WT14
Product data sheet
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Rev. 2 — 3 November 2011
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Triple inverting Schmitt trigger
13. Waveforms
VM
A input
tPHL
tPLH
VM
Y output
mna033
Measurement points are given in Table 10.
Fig 7.
The input (nA) to output (nY) propagation delays
Table 10.
Measurement points
Type number
Input
XC7WT14
Output
VI
VM
VM
GND to 3.0 V
1.5 V
0.5 VCC
VCC
PULSE
GENERATOR
VI
VO
DUT
CL
RT
mna101
Test data is given in Table 11.
Definitions for test circuit:
CL = Load capacitance including jig and probe capacitance.
RT = Termination resistance should be equal to output impedance Zo of the pulse generator.
Fig 8.
Test circuit for measuring switching times
Table 11.
Test data
Type
XC7WT14
XC7WT14
Product data sheet
Input
Load
VI
tr, tf
CL
3.0 V
 3.0 ns
15 pF, 50 pF
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Rev. 2 — 3 November 2011
Test
tPLH, tPHL
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XC7WT14
NXP Semiconductors
Triple inverting Schmitt trigger
13.1 Transfer characteristic waveforms
VO
VI
VT+
VH
VT−
VH
VT−
Fig 9.
VO
VI
VT+
mna027
mna026
Transfer characteristic
Fig 10. The definitions of VT+, VT and VH
mna404
5
ICC
(mA)
mna405
8
ICC
(mA)
4
6
3
4
2
2
1
0
0
0
1
2
3
4 V (V) 5
I
VCC = 4.5 V.
Product data sheet
2
4
VI (V)
6
VCC = 5.5 V.
Fig 11. Typical transfer characteristics
XC7WT14
0
Fig 12. Typical transfer characteristics
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Triple inverting Schmitt trigger
14. Application information
The slow input rise and fall times cause additional power dissipation, which can be
calculated using the following formula:
Padd = fi  (tr  ICC(AV) + tf  ICC(AV))  VCC where:
Padd = additional power dissipation (W);
fi = input frequency (MHz);
tr = input rise time (ns); 10 % to 90 %;
tf = input fall time (ns); 90 % to 10 %;
ICC(AV) = average additional supply current (A).
ICC(AV) differs with positive or negative input transitions, as shown in Figure 13.
For XC7WT14 used in relaxation oscillator circuit, see Figure 14.
Note to the application information:
1. All values given are typical unless otherwise specified.
mna058
200
ΔICC(AV)
(μA)
150
positive-going
edge
100
negative-going
edge
50
0
0
2
4
VCC (V)
6
Linear change of VI between 0.1VCC to 0.9VCC
Fig 13. Average additional ICC
XC7WT14
Product data sheet
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Triple inverting Schmitt trigger
R
C
mna035
1
1
f = ---  -----------------------T 0.60  RC
Fig 14. Relaxation oscillator using the XC7WT14
XC7WT14
Product data sheet
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Triple inverting Schmitt trigger
15. Package outline
TSSOP8: plastic thin shrink small outline package; 8 leads; body width 3 mm; lead length 0.5 mm
D
E
A
SOT505-2
X
c
HE
y
v M A
Z
5
8
A
A2
(A3)
A1
pin 1 index
θ
Lp
L
1
4
e
detail X
w M
bp
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
max.
A1
A2
A3
bp
c
D(1)
E(1)
e
HE
L
Lp
v
w
y
Z(1)
θ
mm
1.1
0.15
0.00
0.95
0.75
0.25
0.38
0.22
0.18
0.08
3.1
2.9
3.1
2.9
0.65
4.1
3.9
0.5
0.47
0.33
0.2
0.13
0.1
0.70
0.35
8°
0°
Note
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
OUTLINE
VERSION
SOT505-2
REFERENCES
IEC
JEDEC
JEITA
EUROPEAN
PROJECTION
ISSUE DATE
02-01-16
---
Fig 15. Package outline SOT505-2 (TSSOP8)
XC7WT14
Product data sheet
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Rev. 2 — 3 November 2011
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XC7WT14
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Triple inverting Schmitt trigger
VSSOP8: plastic very thin shrink small outline package; 8 leads; body width 2.3 mm
D
E
SOT765-1
A
X
c
y
HE
v M A
Z
5
8
Q
A
A2
A1
pin 1 index
(A3)
θ
Lp
1
4
e
L
detail X
w M
bp
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
max.
A1
A2
A3
bp
c
D(1)
E(2)
e
HE
L
Lp
Q
v
w
y
Z(1)
θ
mm
1
0.15
0.00
0.85
0.60
0.12
0.27
0.17
0.23
0.08
2.1
1.9
2.4
2.2
0.5
3.2
3.0
0.4
0.40
0.15
0.21
0.19
0.2
0.13
0.1
0.4
0.1
8°
0°
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
OUTLINE
VERSION
SOT765-1
REFERENCES
IEC
JEDEC
JEITA
EUROPEAN
PROJECTION
ISSUE DATE
02-06-07
MO-187
Fig 16. Package outline SOT765-1 (VSSOP8)
XC7WT14
Product data sheet
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Rev. 2 — 3 November 2011
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XC7WT14
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Triple inverting Schmitt trigger
XSON8: plastic extremely thin small outline package; no leads; 8 terminals; body 1 x 1.95 x 0.5 mm
1
2
SOT833-1
b
4
3
4×
(2)
L
L1
e
8
7
6
e1
5
e1
e1
8×
A
(2)
A1
D
E
terminal 1
index area
0
1
2 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A(1)
max
A1
max
b
D
E
e
e1
L
L1
mm
0.5
0.04
0.25
0.17
2.0
1.9
1.05
0.95
0.6
0.5
0.35
0.27
0.40
0.32
Notes
1. Including plating thickness.
2. Can be visible in some manufacturing processes.
REFERENCES
OUTLINE
VERSION
IEC
JEDEC
JEITA
SOT833-1
---
MO-252
---
EUROPEAN
PROJECTION
ISSUE DATE
07-11-14
07-12-07
Fig 17. Package outline SOT833-1 (XSON8)
XC7WT14
Product data sheet
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XC7WT14
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Triple inverting Schmitt trigger
XSON8U: plastic extremely thin small outline package; no leads;
8 terminals; UTLP based; body 3 x 2 x 0.5 mm
B
D
SOT996-2
A
E
A
A1
detail X
terminal 1
index area
e1
v
w
b
e
L1
1
4
8
5
C
C A B
C
M
M
y
y1 C
L2
L
X
0
1
2 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
max
A1
b
D
E
e
e1
L
L1
L2
v
w
y
y1
mm
0.5
0.05
0.00
0.35
0.15
2.1
1.9
3.1
2.9
0.5
1.5
0.5
0.3
0.15
0.05
0.6
0.4
0.1
0.05
0.05
0.1
REFERENCES
OUTLINE
VERSION
IEC
SOT996-2
---
JEDEC
JEITA
---
EUROPEAN
PROJECTION
ISSUE DATE
07-12-18
07-12-21
Fig 18. Package outline SOT996-2 (XSON8U)
XC7WT14
Product data sheet
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Triple inverting Schmitt trigger
16. Abbreviations
Table 12.
Abbreviations
Acronym
Description
CMOS
Complementary Metal-Oxide Semiconductor
DUT
Device Under Test
ESD
ElectroStatic Discharge
HBM
Human Body Model
MM
Machine Model
17. Revision history
Table 13.
Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
XC7WT14 v.2
20111103
Product data sheet
-
XC7WT14 v.1
-
-
Modifications:
XC7WT14 v.1
XC7WT14
Product data sheet
•
Legal pages updated
20110119
Product data sheet
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Triple inverting Schmitt trigger
18. Legal information
18.1 Data sheet status
Document status[1][2]
Product status[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
The term ‘short data sheet’ is explained in section “Definitions”.
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
18.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
18.3 Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from competent authorities.
XC7WT14
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 3 November 2011
© NXP B.V. 2011. All rights reserved.
16 of 18
XC7WT14
NXP Semiconductors
Triple inverting Schmitt trigger
Non-automotive qualified products — Unless this data sheet expressly
states that this specific NXP Semiconductors product is automotive qualified,
the product is not suitable for automotive use. It is neither qualified nor tested
in accordance with automotive testing or application requirements. NXP
Semiconductors accepts no liability for inclusion and/or use of
non-automotive qualified products in automotive equipment or applications.
NXP Semiconductors’ specifications such use shall be solely at customer’s
own risk, and (c) customer fully indemnifies NXP Semiconductors for any
liability, damages or failed product claims resulting from customer design and
use of the product for automotive applications beyond NXP Semiconductors’
standard warranty and NXP Semiconductors’ product specifications.
In the event that customer uses the product for design-in and use in
automotive applications to automotive specifications and standards, customer
(a) shall use the product without NXP Semiconductors’ warranty of the
product for such automotive applications, use and specifications, and (b)
whenever customer uses the product for automotive applications beyond
18.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
19. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
XC7WT14
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 3 November 2011
© NXP B.V. 2011. All rights reserved.
17 of 18
XC7WT14
NXP Semiconductors
Triple inverting Schmitt trigger
20. Contents
1
2
3
4
5
6
7
7.1
7.2
8
9
10
11
11.1
12
13
13.1
14
15
16
17
18
18.1
18.2
18.3
18.4
19
20
General description . . . . . . . . . . . . . . . . . . . . . . 1
Features and benefits . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Ordering information . . . . . . . . . . . . . . . . . . . . . 1
Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2
Pinning information . . . . . . . . . . . . . . . . . . . . . . 2
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3
Functional description . . . . . . . . . . . . . . . . . . . 3
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 4
Recommended operating conditions. . . . . . . . 4
Static characteristics. . . . . . . . . . . . . . . . . . . . . 5
Transfer characteristics . . . . . . . . . . . . . . . . . . 6
Dynamic characteristics . . . . . . . . . . . . . . . . . . 6
Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Transfer characteristic waveforms . . . . . . . . . . 8
Application information. . . . . . . . . . . . . . . . . . . 9
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 11
Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Revision history . . . . . . . . . . . . . . . . . . . . . . . . 15
Legal information. . . . . . . . . . . . . . . . . . . . . . . 16
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 16
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Contact information. . . . . . . . . . . . . . . . . . . . . 17
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2011.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
Date of release: 3 November 2011
Document identifier: XC7WT14