INTEGRATED CIRCUITS MIPS PR31100 Highly integrated embedded processor Preliminary specification Version 1.2 1996 Aug 07 Philips Semiconductors Preliminary specification MIPS PR31100 Highly integrated embedded processor Version 1.2 GENERAL DESCRIPTION FEATURES • 32-bit R3000 RISC static CMOS CPU • 4 KByte instruction cache • 1 KByte data cache • Multiply/accumulator • On-chip peripherals with individual power-down PR31100 Processor is a single-chip, low-cost, integrated embedded processor consisting of MIPS R3000 core and system support logic to interface with various types of devices. PR31100 consists of a MIPS R3000 RISC CPU with 4 KBytes of instruction cache memory and 1 KByte of data cache memory, plus integrated functions for interfacing to numerous system components and external I/O modules. The R3000 RISC CPU is also augmented with a multiply/accumulate module to allow integrated DSP functions, such as a software modem for high-performance standard data and fax protocols. PR31100 also contains multiple DMA channels and a high-performance and flexible Bus Interface Unit (BIU) for providing an efficient means for transferring data between external system memory, cache memory, the CPU core, and external I/O modules. The types of external memory devices supported include dynamic random access memory (DRAM), synchronous dynamic random access memory (SDRAM), static random access memory (SRAM), Flash memory, read-only memory (ROM), and expansion cards (PCMCIA and/or MagicCard). PR31100 also contains a System Interface Module (SIM) containing integrated functions for interfacing to numerous external I/O modules such as liquid crystal displays (LCDs), the UCB1100 (which handles most of the analog functions of the system, including sound and telecom codecs and touchscreen ADC), ISDN/high-speed serial, infrared, wireless peripherals, Magicbus, etc. Lastly, PR31100 contains support for implementation of power management, whereby various PR31100 internal modules and external subsystems can be individually (under software control) powered up and down. – Multi-channel DMA controller – Bus interface unit – Memory controller for ROM, Flash, RAM, DRAM, SDRAM, SRAM, and PCMCIA and/or MagicCard – Power management module – Video module – Real-time clock 32.760KHz reference – High-speed serial interface – Infrared module – Dual-UART – SPI bus • 3.3V supply voltage • 208-pin LQFP (Low profile quad flat pack) • 40MHz operation frequency Figure 1 shows an External Block Diagram of PR31100. ORDERING INFORMATION PART NUMBER TEMPERATURE RANGE (°C) AND PACKAGE FREQUENCY (MHz) DRAWING NUMBER PR31100ABC 0 to +70, 208-pin Low Profile Quad Flat Pack 40 LQFP208 1996 Aug 07 2 Philips Semiconductors Preliminary specification MIPS PR31100 Highly integrated embedded processor ICache (S)DRAM/PCMCIA/ROM Data R3000 RISC CPU Core Addr MAC CPU Module Bus Interface Unit (BIU) Module DATA ADDR TAG 4KByte Data to Memory Addr Control DCache ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ 1KByte System Interface Unit (SIU) Module Arbitration/DMA/AddrDecode Addr Data to UCB1100 SIB Module CHI Module to LCD to high speed serial Video Module to IR IR Module to Magicbus Magicbus Module UART Module to UART (dual UART) to general purpose I/O 32 KHz IO Module SPI Module Timer Module (+ RTC) Power Module SYSCLK Clock Module Interrupt Module System Interface Module (SIM) Figure 1. PR31100 Block Diagram 1996 Aug 07 3 to Power Supply Philips Semiconductors Preliminary specification MIPS PR31100 Highly integrated embedded processor – separate read and write protection control for kernel and user space OVERVIEW Each of the on-chip peripherals consist of: – 8 total protectable regions available, each individually programmable, using breakpoint address, mask, control, and status registers BIU Module • System memory and PR31100 Bus Interface Unit (BIU) – causes address exception on illegal reads or writes – supports up to 2 banks of physical memory • high–speed multiplier/accumulator – supports self–refreshing DRAM and SDRAM – programmable parameters for each bank of DRAM or SDRAM (row/column address configuration, refresh, burst modes, etc.) – on–chip hardware multiplier – supports 16x16 or 32x32 multiplier operations, with 64–bit accumulator • programmable chip select memory access – existing multiply instructions are enhanced and new multiply and add instructions are added to R3000 instruction set to improve the performance of DSP applications – 4 programmable (size, wait states, burst mode control) memory device and general purpose chip selects available for system ROM, SRAM, Flash • CPU interface available for external port expansion registers – handles data bus, address bus, and control interface between CPU core and rest of PR31100 logic – 4 programmable (wait states, burst mode control) MagicCard or general purpose chip selects available for (future) MagicCard expansion memory Clock Module PR31100 provides the chip select and card detect signals • PR31100 supports system–wide single crystal configuration, supports card insertion/removal timeouts besides the 32 KHz RTC XTAL (reduces cost, power, and board space) MagicCard requires minimal number of unique control/status signals per port • common crystal rate divided to generate clock for CPU, video, • supports up to 2 identical full PCMCIA ports sound, telecom, UARTs, etc. – PR31100 and UCB1100 provide the control signals and accepts the status signals which conform to the PCMCIA version 2.01 standard • external system crystal rate is vendor–dependent • independent enabling or disabling of individual clocks under – appropriate connector keying and level–shifting buffers required for 3.3V versus 5V PCMCIA interface implementations software control, for power management CHI Module • high–speed serial Concentration Highway Interface (CHI) contains SIU Module • multi–channel 32–bit DMA controller and System Interface Unit logic for interfacing to external full–duplex serial time–division–multiplexed (TDM) communication peripherals (SIU) • supports ISDN line interface chips and other PCM/TDM serial • independent DMA channels for video, Magicbus, SIB to/from devices UCB1100 audio/telecom codecs, high–speed serial port, IR UART, and general purpose UART • CHI interface is programmable (number of channels, frame rate, • address decoding for submodules within System Interface Module bit rate, etc.) to provide support for a variety of formats • supports data rates up to 4.096 Mbps • independent DMA support for CHI receive and transmit (SIM) CPU Module • R3000 RISC central processing unit core Interrupt Module – full 32–bit operation (registers, instructions, addresses) • contains logic for individually enabling, reading, and clearing all – 32 general purpose 32–bit registers; 32–bit program counter PR31100 interrupt sources – MIPS RISC Instruction Set Architecture (ISA) supported • interrupts generated from internal PR31100 modules or from edge • on–chip cache transitions on external signal pins – 4 KByte direct–mapped instruction cache (I–cache) IO Module physical address tag and valid bit per cache line • contains support for reading and writing the 7 bi–directional programmable burst size instruction streaming mode supported general purpose IO pins and the 32 bi–directional multi–function IO pins – 1 KByte data cache (D–cache) • each IO port can generate a separate positive and negative edge physical address tag and valid bit per cache line programmable burst size interrupt • independently configurable IO ports allow PR31100 to support a write–through – cache address snoop mode supported for DMA flexible and wide range of system applications and configurations – 4–level deep write buffer • programmable memory protection 1996 Aug 07 4 Philips Semiconductors Preliminary specification MIPS PR31100 Highly integrated embedded processor • independent DMA support for audio receive and transmit, telecom IR Module • IR consumer mode receive and transmit • supports 8–bit or 16–bit mono telecom formats • supports 8–bit or 16–bit mono or stereo audio formats • independently programmable audio and telecom sample rates • CPU read/write registers for subframe control and status – allows control of consumer electronic devices such as stereos, TVs, VCRs, etc. – programmable pulse parameters – external analog LED circuitry • IRDA communication mode – allows communication with other IRDA devices such as FAX machines, copiers, printers, etc. System Peripheral Interface (SPI) Module • provides interface to SPI peripherals and devices • full–duplex, synchronous serial data transfers (data in, data out, – supported by UART module within PR31100 – external analog receiver preamp and LED circuitry – data rate = up to 115 Kbps at 1 meter and clock signals) • IR FSK communication mode • PR31100 supplies dedicated chip select and interrupt for an SPI – supported by UART module within PR31100 interface serial power supply • 8–bit or 16–bit data word lengths for the SPI interface • programmable SPI baud rate – external analog IR chip(s) perform frequency modulation to generate the desired IR communication mode protocol – data rate = up to 36000 bps at 3 meters • carrier detect state machine Timer Module • Real Time Clock (RTC) and Timer • 40–bit counter (30.517 µsec granularity); – periodically enables IR receiver to check if a valid carrier is present Magicbus Module maximum uninterrupted time = 388.36 days • synchronous, serial 2–wire (clock and data), half–duplex • 40–bit alarm register (30.517 µsec granularity) • 16–bit periodic timer (0.868 µsec granularity); communications protocol • supports low–cost, low–power peripherals • supports maximum data rate of 14.75 Mbps • DMA support for Magicbus receive and transmit maximum timeout = 56.8 msec • interrupts on alarm, timer, and prior to RTC roll–over UART Module • 2 independent full–duplex UARTs • programmable baud rate generator • UART–A port used for serial control interface to external IR Power Module • power–down modes for individual internal peripheral modules • serial (SPI port) power supply control interface supported • power management state machine has 4 states: RUNNING, module • UART–B port used for general purpose serial control interface • UART–A and UART–B DMA support for receive and transmit DOZING, SLEEP, and COMA Serial Interconnect Bus (SIB) Module • PR31100 contains holding and shift registers to support the serial Video Module interface to the UCB1100 and/or other optional codec devices • bit–mapped graphics • supports monochrome, grey scale, or color modes • time–based dithering algorithm for grey scale and color modes • supports multiple screen sizes • supports split and non–split displays • variable size and relocatable video buffer • DMA support for fetching image data from video buffer • interface compatible with slave mode 3 of Crystal CS4216 codec • synchronous, frame–based protocol • PR31100 always master source of clock and frame frequency and phase; programmable clock frequency • each SIB frame consists of 128 clock cycles, further divided into 2 subframes or words of 64 bits each (supports up to 2 devices simultaneously) 1996 Aug 07 5 Philips Semiconductors Preliminary specification MIPS PR31100 Highly integrated embedded processor Figure 2 shows a typical system block diagram cosisting of PR31100 and UCB1100 for a total system solution. ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ 1–2 PCMCIA Slots 32 KHz RISC DRAM/SDRAM Interface R3000 PCMCIA/ROM I/F I–Cache/RAM SYSCLK Timers Real–time Clock Memory Protection 3.3V 32–bit Bus CPU core Serial I/F and Magicbus LCD Interface PR31100 1–64 MBytes ROM D–Cache/ RAM 1–16 MBytes (S)DRAM ID ROM AC Adapter Power Supply LCD Backup Main Thermistor (Lithium) T MagicBus Jack IR ISDN or other peripherals High speed serial port UCB1100 Touchscreen (Resistive) 3.3V Phone Jack DAA or RF Xceiver Figure 2. System Block Diagram 1996 Aug 07 6 ÎÎ ÎÎ ÎÎ ÎÎ Philips Semiconductors Preliminary specification MIPS PR31100 Highly integrated embedded processor PIN CONFIGURATION 208 157 1 156 208-PIN PLASTIC QUAD FLAT PACK 52 105 53 104 TOP VIEW 1996 Aug 07 Pin 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 Function VDD D(0) VSS D(1) D(2) VDD D(3) VSS D(4) VDD D(5) D(6) VSS D(7) VSS D(8) VDD D(9) D(10) VSS D(11) VDD D(12) D(13) VSS D(14) D(15) VDD MFIO(1) MBUSINT MBUSDATA VSS MBUSCLK VDD VDD SIBMCLK VSS SIBSCLK SIBSYNC SIBDIN SIBDOUT VDD SIBIRQ MFIO(0) IO(6) IO(50 VSS chiclk chifs chidin chidout Pin 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 81 82 83 84 85 86 87 88 89 90 91 92 93 94 95 96 97 98 99 100 101 102 103 104 7 Function VDD RXD TXD IO(4) IRIN IROUT VSS VDD CARDET TXPWR IO(3) IO(2) VSS SPICLK SPIIN SPIOUT VDD TESTCPU TESTIN TESTOUT TESTSIU VSS VCC3 BC32K VDD C32KIN C32KOUT VSS PWRCS PWRINT PWROK ONBUTN /PON /CPURES VDD DISPON FRAME VSS DF LOAD CP VSS VDD VDAT(0) VDAT(1) VDAT(2) VDAT(3) VSS IO(1) VDD Pin 105 106 107 108 109 110 111 112 113 114 115 116 117 118 119 120 121 122 123 124 125 126 127 128 129 130 131 132 133 134 135 136 137 138 139 140 141 142 143 144 145 146 147 148 149 150 151 152 153 154 155 156 Function /CARD2WAIT /CARD2CSH /CARD2CSL IO(0) VSS /IORD /IOWR /CARDREG /CARD1WAIT VDD MFIO(2) VDD /CARD1CSL /CARD1CSH VSS /MCS3 /MCS2 /MCS1 /MCS0 /CS3 /CS2 /CS1 VDD SYSCLKIN SYSCLKOUT VSS VSS VDD D(31) D(30) VSS D(29) VDD D(28) D(27) VSS D(26) VSS D(250 VDD D(24) D(23) VDD D(22) VSS D(21) VDD D(20) D(19) VSS D(18) VDD Pin 157 158 159 160 161 162 163 164 165 166 167 168 169 170 171 172 173 174 175 176 177 178 179 180 181 182 183 184 185 186 187 188 189 190 191 192 193 194 195 196 197 198 199 200 201 202 203 204 205 206 207 208 Function D(17) VSS D(16) VDD /CS0 /RD VSS VDD /DGRNT /DREQ ALE /WE VDD A(12) A(11) VSS A(10) A(9) VDD A(8) A(7) VSS A(6) A(5) VDD A(4) VSS A(3) A(2) VDD A(1) A(0) VSS VSS /DCS0 /RAS1 /RAS0 /CAS3 VDD /CAS2 /CAS1 /CAS0 VSS VDD DCKE VSS DCLKIN DCLKOUT VDD DQMH DQML Philips Semiconductors Preliminary specification MIPS PR31100 Highly integrated embedded processor PIN DESCRIPTIONS Overview The PR31100 processor contains 208 pins consisting of input, output, bi–directional, and power and ground pins. These pins are used to support various functions. The following sections will describe the function of each pin including any special power–down considerations for each pin. Pins The PR31100 PROCESSOR contains 208 total pins, consisting of 136 signal pins, 4 spare pins, 34 power pins, and 34 ground pins. Of the 136 signal pins, 32 of them are multi–function and can be independently programmed either as IO ports or for an alternate standard/normal function. As an IO port, any of these pins can be programmed as an input or output port, with the capability of generating a separate positive and negative edge interrupt. See Section 2.3 for a summary of the multi–function IO ports versus their standard functions. PIN # NAME TYPE NAME AND FUNCTION Memory Pins D(31:0) I/O These pins are the data bus for the system. 8–bit SDRAMs should be connected to bits 7:0 and 16–bit SDRAMs and DRAMs should be connected to bits 15:0. All other 16–bit ports should be connected to bits 31:16. Of course, 32–bit ports should be connected to bits 31:0. These pins are normally outputs and only become inputs during reads, thus no resistors are required since the bus will only float for a short period of time during bus turn–around. A(12:0) O These pins are the address bus for the system. The address lines are multiplexed and can be connected directly to SDRAM and DRAM devices. To generate the full 26–bit address for static devices, an external latch must be used to latch the signals using the ALE signal. For static devices, address bits 25:13 are provided by the external latch and address bits 12:0 (directly connected from PR31100’s address bus) are held afterward by PR31100 processor for the remainder of the address bus cycle. 168 ALE O This pin is used as the address latch enable to latch A(12:0) using an external latch, for generating the upper address bits 25:13. 163 /RD O This pin is used as the read signal for static devices. This signal is asserted for reads from /MCS3–0, /CS3–0, /CARD2CS and /CARD1CS for memory and attribute space, and for reads from PR31100 processor accesses if SHOWPR31100 is enabled (for debugging purposes). 169 /WE O This pin is used as the write signal for the system. This signal is asserted for writes to /MCS3–0, /CS3–0, /CARD2CS and /CARD1CS for memory and attribute space, and for writes to DRAM and SDRAM. 199 /CAS0 (/WE0) O This pin is used as the CAS signal for SDRAMs, the CAS signal for D(7:0) for DRAMs, and the write enable signal for D(7:0) for static devices. 198 /CAS1 (/WE1) O This pin is used as the CAS signal for D(15:8) for DRAMs and the write enable signal for D(15:8) for static devices. 197 /CAS2 (/WE2) O This pin is used as the CAS signal for D(23:16) for DRAMs and the write enable signal for D(23:16) for static devices. 195 /CAS3 (/WE3) O This pin is used as the CAS signal for D(31:24) for DRAMs and the write enable signal for D(31:24) for static devices. 194 /RAS0 O This pin is used as the RAS signal for SDRAMs and the RAS signal for Bank0 DRAMs. 193 /RAS1 (/DCS1) O This pin is used as the chip select signal for Bank1 SDRAMs and the RAS signal for Bank1 DRAMs. 192 /DCS0 O This pin is used as the chip select signal for Bank0 SDRAMs. 202 DCKE O This pin is used as the clock enable for SDRAMs. 204 DCLKIN I This pin must be tied externally to the DCLKOUT signal and is used to match skew for the data input when reading from SDRAM and DRAM devices. 205 DCLKOUT O This pin is the (nominal) 73.728 MHz clock for the SDRAMs. 207 DQMH O This pin is the upper data mask for a 16–bit SDRAM configuration. 208 DQML O This pin is the lower data mask for a 16–bit SDRAM or 8–bit SDRAM configuration. 124–126, 162 /CS3–0 O These pins are the Chip Select 3 through 0 signals. They can be configured to support either 32–bit or 16–bit ports. 120–123 /MCS3–0 O These pins are the MagicCard Chip Select 3 through 0 signals. They only support 16–bit ports. 106, 107 /CARD2CSH,L O These pins are the Chip Select signals for PCMCIA card slot 2. 1996 Aug 07 8 Philips Semiconductors Preliminary specification MIPS PR31100 Highly integrated embedded processor PIN # NAME TYPE NAME AND FUNCTION Memory Pins (continued) 117, 118 /CARD1CSH,L O These pins are the Chip Select signals for PCMCIA card slot 1. 112 /CARDREG O This pin is the /REG signal for the PCMCIA cards. 110 /CARDIORD O This pin is the /IORD signal for the PCMCIA IO cards. 111 /CARDIOWR O This pin is the /IOWR signal for the PCMCIA IO cards. 115 /CARDDIR O This pin is used to provide the direction control for bi–directional data buffers used for the PCMCIA slot(s). This signal will assert whenever /CARD2CSH or /CARD2CSL or /CARD1CSH or /CARD1CSL is asserted and a read transaction is taking place. 105 /CARD2WAIT I This pin is the card wait signal from PCMCIA card slot 2. 113 /CARD1WAIT I This pin is the card wait signal from PCMCIA card slot 1. Bus Arbitration Pins 167 /DREQ I This pin is used to request external arbitration. If the TESTSIU signal is high and the TESTSIU function has been enabled, then once /DGRNT is asserted, external logic can initiate reads or writes to PR31100 processor registers by driving the appropriate input signals. If the TESTSIU signal is low or the TESTSIU function has not been enabled, then PR31100 memory transactions are halted and certain memory signals will be tri–stated when /DGRNT is asserted in order to allow an external master to access memory. 166 /DGRNT O This pin is asserted in response to /DREQ to inform the external test logic or bus master that it can now begin to drive signals. 128 SYSCLKIN I This pin should be connected along with SYSCLKOUT to an external crystal which is the main PR31100 clock source. 129 SYSCLKOUT O This pin should be connected along with SYSCLKIN to an external crystal which is the main PR31100 clock source. 79 C32KIN I This pin along with C32KOUT should be connected to a 32.768 KHz crystal. 80 C32KOUT O This pin along with C32KIN should be connected to a 32.768 KHz crystal. 77 BC32K O This pin is a buffered output of the 32.768 KHz clock. 50 CHIFS I/O This pin is the CHI frame synchronization signal. This pin is available for use in one of two modes. As an output, this pin allows PR31100 to be the master CHI sync source. As an input, this pin allows an external peripheral to be the master CHI sync source and the PR31100 CHI module will slave to this external sync. 49 CHICLK I/O This pin is the CHI clock signal. This pin is available for use in one of two modes. As an output, this pin allows PR31100 to be the master CHI clock source. As an input, this pin allows an external peripheral to be the master CHI clock source and the PR31100 CHI module will slave to this external clock. 52 CHIDOUT O This pin is the CHI serial data output signal. 51 CHIDIN I This pin is the CHI serial data input signal. 46, 107, 47, 108, 56, 64, 64 IO(6:0) I/O These pins are general purpose input/output ports. Each port can be independently programmed as an input or output port. Each port can generate a separate positive and negative edge interrupt. Each port can also be independently programmed to use a 16 to 24 msec debouncer. 30, 45 MFIO(1:0) I/O These pins are multi–function input/output ports. Each port can be independently programmed as an input or output port, or can be programmed for multi–function use to support vendor–dependent test signals (for debugging purposes only). Each port can generate a separate positive and negative edge interrupt. Note that 30 other multi–function pins are available for usage as multi–function input/output ports. These pins are named after their respective standard/normal function and are not listed here. Clock Pins CHI Pins IO Pins Magicbus Pins 34 MBUSCLK I/O This pin is the bi–directional Magicbus clock signal. MBUSCLK is an input signal whenever PR31100 is in the slave mode and is an output signal whenever PR31100 is in the master mode. 32 MBUSDATA I/O This pin is the bi–directional Magicbus data signal. MBUSDATA is an input signal whenever PR31100 is in the slave mode and is an output signal whenever PR31100 is in the master mode. 1996 Aug 07 9 Philips Semiconductors Preliminary specification MIPS PR31100 Highly integrated embedded processor PIN # 31 NAME TYPE NAME AND FUNCTION MBUSINT I This pin is the Magicbus interrupt signal. This signal is used to interrupt PR31100 whenever a peripheral has been attached to or detached from the bus, or whenever a peripheral has initiated an interrupt event. 88 /CPURES I This pin is used to reset the CPU core. This pin should be connected to a switch for initiating a reset in the event that a software problem might hang the CPU core. The pin should also be pulled up to VSTANDBY through an external pull–up resistor. 87 /PON I This pin serves as the Power On Reset signal for PR31100. This signal must remain low when VSTANDBY is asserted until VSTANDBY is stable. Once VSTANDBY is asserted, this signal should never go low unless all power is lost in the system. Reset Pins Power Supply Pins 86 ONBUTN I This pin is used as the On Button for the system. Asserting this signal will cause PWRCS to set to indicate to the System Power Supply to turn power on to the system. PWRCS will not assert if the PWROK signal is low. 82 PWRCS O This pin is used as the chip select for the System Power Supply. When the system is off, the assertion of this signal will cause the System Power Supply to turn VCCDRAM and VCC3 on to power up the system. The Power Supply will latch SPI commands on the falling edge of PWRCS. Power Supply Pins (continued) 84 PWROK I This pin provides a status from the System Power Supply that there is a good source of power in the system. This signal typically will be asserted if there is a Battery Charger supplying current or if the Main Battery is good and the Battery Door is closed. If PWROK is low when the system is powered off, PWRCS will not assert as a result of the user pressing the ONBUTN or an interrupt attempting to wake up the system. If the device is on when the PWROK signal goes low, the software will immediately shut down the system since power is about to be lost. When PWROK goes low, there must be ample warning so that the software can shut down the system before power is actually lost. 83 PWRINT I This pin is used by the System Power Supply to alert the software that some status has changed in the System Power Supply and the software should read the status from the System Power Supply to find out what has changed. These will be low priority events, unlike the PWROK status, which is a high priority emergency case. 76 VCC3 I This pin provides the status of the power supply for the ROM, UCB1100, system buffers, and other transient components in the system. This signal will be asserted by the System Power Supply when PWRCS is asserted, and will always be turned off when the system is powered down. 41 SIBDIN I This pin contains the input data shifted from UCB1100 and/or external codec device. 42 SIBDOUT O This pin contains the output data shifted to UCB1100 and/or external codec device. 39 SIBSCLK O This pin is the serial clock sent to UCB1100 and/or external codec device. The programmable SIBSCLK rate is derived by dividing down from SIBMCLK. 40 SIBSYNC O This pin is the frame synchronization signal sent to UCB1100 and/or external codec device. This frame sync is asserted for one clock cycle immediately before each frame starts and all devices connected to the SIB monitor SIBSYNC to determine when they should transmit or receive data. 44 SIBIRQ I This pin is a general purpose input port used for the SIB interrupt source from UCB1100. This interrupt source can be configured to generate an interrupt on either a positive and/or negative edge. 37 SIBMCLK I/O This pin is the master clock source for the SIB logic. This pin is available for use in one of two modes. First, SIBMCLK can be configured as a high–rate output master clock source required by certain external codec devices. In this mode all SIB clocks are synchronously slaved to the main PR31100 system clock CLK2X. Conversely, SIBMCLK can be configured as an input slave clock source. In this mode, all SIB clocks are derived from an external SIBMCLK oscillator source, which is asynchronous with respect to CLK2X. Also, for this mode, SIBMCLK can still be optionally used as a high–rate master clock source required by certain external codec devices. 67 SPICLK O This pin is used to clock data in and out of the SPI slave device. 69 SPIOUT O This pin contains the data that is shifted into the SPI slave device. 68 SPIIN I This pin contains the data that is shifted out of the SPI slave device. SIB Pins SPI Pins 1996 Aug 07 10 Philips Semiconductors Preliminary specification MIPS PR31100 Highly integrated embedded processor PIN # NAME TYPE NAME AND FUNCTION UART and IR Pins 55 TXD O This pin is the UART transmit signal from the UARTA module. 54 RXD I This pin is the UART receive signal to the UARTA module. 59 IROUT O This pin is the UART transmit signal from the UARTB module or the Consumer IR output signal if Consumer IR mode is enabled. 58 IRIN I This pin is the UART receive signal to the UARTB module. RXPWR O This pin is the receiver power output control signal to the external communication IR analog circuitry. CARDET I This pin is the carrier detect input signal from the external communication IR analog circuitry. 91 FRAME O This pin is the frame synchronization pulse signal between the Video Module and the LCD, and is used by the LCD to return it’s pointers to the top of the display. The Video Module asserts FRAME after all the lines of the LCD have been shifted and transferred, producing a full frame of display. 93 DF O This pin is the AC signal for the LCD. Since LCD plasma tends to deteriorate whenever subjected to a DC voltage, the DF signal is used by the LCD to alternate the polarity of the row and column voltages used to turn the pixels on and off. The DF signal can be configured to toggle on every frame or can be configured to toggle every programmable number of LOAD signals. 94 LOAD O This pin is the line synchronization pulse signal between the Video Module and the LCD, and is used by the LCD to transfer the contents of it’s horizontal line shift register to the LCD panel for display. The Video Module asserts LOAD after an entire horizontal line of data has been shifted into the LCD. 95 CP O This pin is the clock signal for the LCD. Data is pushed by the Video Module on the rising edge of CP and sampled by the LCD on the falling edge of CP. 101, 100, 99, 98 VDAT(3:0) O These pins are the data for the LCD. These signals are directly connected to the LCD for 4–bit non–split displays. For 4–bit split and 8–bit non–split displays, an external register is required to demultiplex the 4–bit data into the desired 8 parallel data lines needed for the LCD. 90 DISPON O This pin is the display–on enable signal for the LCD. 74 TESTSIU I This pin allows external logic to initiate read or write transactions to PR31100 registers. The TESTSIU mode is enabled by toggling this signal after the device has powered up. Once the function is enabled, if the TESTSIU pin is high when the bus is arbitrated (using /DREQ and /DGRNT), then external logic can initiate read and write transactions to PR31100 registers. This pin is used for debugging purposes only. 71 TESTCPU I This pin allows numerous internal CPU core signals to be brought to external PR31100 pins, in place of the normal signals assigned to these pins. The CPU core signals assigned to their respective pins during TESTCPU mode are vendor–dependent. The TESTCPU mode is enabled by asserting this TESTCPU signal, and this function is provided for generating test vectors for the CPU core. This pin is used for debugging purposes only. 72 TESTIN I This pin is reserved for vendor–dependent use. This pin is used for debugging purposes only. 73 TESTOUT O This pin is reserved for vendor–dependent use. This pin is used for debugging purposes only. 62 Video Pins Test Pins Spare Pins NC4–1 No Connect These pins are reserved for future use and should be left unconnected. Power Supply Pins 1996 Aug 07 VDD (34 each) +3.3V These pins are the power pins for PR31100 and should be connected to the digital +3.3V power supply VSTANDBY. VSS (34 each) GND These pins are the ground pins for PR31100 and should be connected to digital ground. NOTE: For some vendor–dependent implementations of PR31100, pin 131 may be used for a filter capacitor for the SYSCLK oscillator (capacitor connected between pin 131 and digital ground). 11 Philips Semiconductors Preliminary specification MIPS PR31100 Highly integrated embedded processor ELECTRICAL CHARACTERISTICS ABSOLUTE MAXIMUM RATINGS VSS = 0V PARAMETER SYMBOL VDD Power supply voltage VIN Input voltage Tstg Storage temperature range Pd Maximum dissipation (Tamb = 70°C) LIMITS UNIT VSS – 0.5 to 4.5 V VSS – 0.5 to VDD + 0.5 V –55 to +125 °C 1 W RECOMMENDED OPERATING CONDITION VSS = 0V LIMITS SYMBOL PARAMETER MIN TYP MAX UNIT VDD Power supply voltage 3.0 3.3 3.6 V VIN Input voltage VSS – VDD V Topr Operating temperature range 0 – 70 °C DC ELECTRICAL CHARACTERISTICS Tamb = 0 to +70°C, VDD = 3.3 ± 0.3V. LIMITS SYMBOL PARAMETER CONDITIONS MIN TYP MAX UNIT IDD Operating current VIN = VDD or VSS; VDD = MAX IOH = IOL = 0 – 110 TBD mA IDDS Static current VIN = VDD or VSS; VDD = MAX IOH = IOL = 0 – 50 100 µA Input leakage current VDD = MAX; VIH = VDD VIL = VSS –10 – 10 µA VIH1 High level input voltage1 VDD = 3.6V VDD × 0.8 – VDD + 0.3 V VIL1 Low level input voltage1 VDD = 3.0V –0.3 – VDD × 0.2 V VIH2 High level input voltage2 VDD = 3.6V 2.4 – VDD + 0.3 V VIL2 Low level input voltage2 VDD = 3.0V –0.3 – 0.6 V VDD – 0.6 – – V – – VSS + 0.4 V VDD – 0.6 – – V – – VSS + 0.4 V VDD – 0.6 – – V – – VSS + 0.4 V VDD – 0.6 – – V – – VSS + 0.4 V TBD – TBD µA IL voltage3 VOH1 High level output VOL1 Low level output voltage3 VDD = 3.0; IOH = –4mA VOH2 High level output voltage4 VOL2 Low level output voltage4 VOH3 High level output voltage5 VOL3 Low level output voltage5 VOH4 High level output voltage6 VOL4 Low level output voltage6 VDD = 3.0; IOL = 24mA IOZ Off-state leakage current VDD = MAX; VOL = VSS VDD = 3.0; IOL = 4mA VDD = 3.0; IOH = –8mA VDD = 3.0; IOL = 8mA VDD = 3.0; IOH = –16mA VDD = 3.0; IOL = 16mA VDD = 3.0; IOH = –24mA VOH = VDD; NOTES: 1. SYSVLKIN 2. Other inputs 3. D[31:0], /RAS0, /RAS1, /DCS0, /DCKE, DQMH, DQML, /DREQ, /DGRNT, BC32K, VDAT[3:0], CP, LOAD, DF, FRAME, DISPON, VIDDONE, PWRCS, TXD, RXD, /CS0∼3, /MCS0∼3, CHIFS, CHICLK, CHIDOUT, CHIDIN, IO[6:0], SPICLK, SPIOUT, SPIIN, SIBSYNC, SIBOUT, SIBMCLK, SIBCLK, RXPWR, IROUT, /CRAD1WAIT, /CARD2WAIT, MIOX[2:0] 4. A[12:], ALE, /RD, /WE /SAS0∼3, /CARDREG, /IOWR, /CARD1CSL, /CARD1CSH, /CARD2CSL, /CARD2CSH 5. DCLKOUT 6. MBUSCLK, MBUSDATA 1996 Aug 07 12 Philips Semiconductors Preliminary specification MIPS PR31100 Highly integrated embedded processor AC ELECTRICAL CHARACTERISTICS PR31100 TIMING – DEFINITION OF AC SPECIFICATION 2.0V 0.8V DELAY 2.2V OUTPUTS 0.8V SETUP 0.8VCC INPUTS 0.2VCC 1996 Aug 07 HOLD 2.2V 2.2V 0.8V 0.8V 13 Philips Semiconductors Preliminary specification MIPS PR31100 Highly integrated embedded processor MEMORY INTERFACE Tamb = 0 to +70°C, VDD = 3.3 ± 0.3V, External Capacitance = 40pF LIMITS ITEM PARAMETER RISING/FALLING MIN MAX UNIT 1 DCLKOUT high time – 5 – ns 2 DCLKOUT low time – 5 – ns 3 DCLKOUT period – 12.5 – ns Rising – 4 ns 4 Delay DCLKOUT to ALE Falling – 3 ns 4 Delay DCLKOUT to A[12:0] – – 8 ns 4 Delay DCLKOUT to D[31:16] – – 8 ns 4 Delay DCLKOUT to D[15:0] – 1.5 8 ns 4 Delay DCLKOUT to /CS3–0 4 Delay DCLKOUT to /RD 4 Delay DCLKOUT to /WE 4 Delay DCLKOUT to /SAS3–0 4 4 Delay DCLKOUT to /CARDxCSx Delay DCLKOUT to /CARDDIR 4 Delay DCLKOUT to /CARDREG 4 Delay DCLKOUT to /IORD 4 Delay DCLKOUT to /IOWR 4 Delay DCLKOUT to /RAS0 4 Delay DCLKOUT to /RAS1 4 Delay DCLKOUT to DQMH/L 4 Delay DCLKOUT to /DCS0 4 Delay DCLKOUT to DCKE 4 Delay DCLKOUT to /MCS3–0 5 Rising – 10 ns Falling – 10 ns Risng – 8 ns Falling – 7 ns Rising – 5 ns Falling – 4 ns Rising – 1.5 ns Falling – 1.5 ns Rising – 9 ns Falling – 8 ns Rising – 12 ns Falling – 11 ns Rising – 9 ns Falling – 10 ns Rising – 10 ns Falling – 9 ns Rising – 9 ns Falling – 9 ns Rising – 6 ns Falling – 6 ns Rising 1.5 8 ns Falling 1.5 9 ns Rising 1.5 8 ns Falling 1.5 9 ns Rising 1.5 7 ns Falling 1.5 6 ns Rising 1.5 8 ns Falling 1.5 8 ns Rising – 10 ns Falling – 10 ns D[31:16] to DCLKIN Setup time – 2 – ns 6 D[31:16] to DCLKIN Hold time – 1 – ns 5 D[15:0] to DCLKIN Setup time – 1 – ns 6 D[15:0] to DCLKIN Hold time – 1.5 – ns 7 DCLKOUT to DCLKIN Board Delay time – 0 3 ns 1996 Aug 07 14 Philips Semiconductors Preliminary specification MIPS PR31100 Highly integrated embedded processor MEMORY INTERFACE TIMING DIAGRAMS 1 2 DCLKOUT MEMORY OUTPUTS 3 4 Figure 1. Memory Output and Clock Timing DCLKIN MEMORY INPUTS 5 Figure 2. Memory Input Timing DCLKOUT 7 DCLKIN Figure 3. DCLKOUT to DCLKIN 1996 Aug 07 15 6 Philips Semiconductors Preliminary specification MIPS PR31100 Highly integrated embedded processor CHI Tamb = 0 to +70°C, VDD = 3.3 ± 0.3V, External Capacitance = 40pF LIMITS ITEM PARAMETER RISING/FALLING MIN MAX UNIT 1 CHICLK high time – 100 – ns 2 CHICLK low time – 100 – ns 3 CHICLK period 4 Delay CHICLK Rising to CHIDOUT (Master) 7 Delay CHICLK Falling to CHIDOUT (Master) 4 Delay CHICLK Rising to CHIFS (Master) 7 Delay CHICLK Falling to CHIFS (Master) 4 Delay CHICLK Rising to CHIDOUT (Slave) 7 Delay CHICLK Falling to CHIDOUT (Slave) 4 Delay CHICLK Rising to CHIFS (Slave) – 225 – ns Rising – 5 ns Falling – 5 ns Rising – 5 ns Falling – 5 ns Rising – 5 ns Falling – 5 ns Rising – 5 ns Falling – 5 ns Rising – 10 ns Falling – 10 ns Rising – 10 ns Falling – 10 ns Rising – 10 ns Falling – 10 ns Rising – 10 ns 7 Delay CHICLK Falling to CHIFS (Slave) Falling – 10 ns 5 CHIDIN to CHICLK Rising Setup time (Master) – 20 – ns 6 CHIDIN to CHICLK Rising Hold time (Master) – 20 – ns 8 CHIDIN to CHICLK Falling Setup time (Master) – 20 – ns 9 CHIDIN to CHICLK Falling Hold time (Master) – 20 – ns 5 CHIFS to CHICLK Rising Setup time (Slave) – 20 – ns 6 CHIFS to CHICLK Rising Hold time (Slave) – 20 – ns 8 CHIFS to CHICLK Falling Setup time (Slave) – 20 – ns 9 CHIFS to CHICLK Falling Hold time (Slave) – 20 – ns 5 CHIDIN to CHICLK Rising Setup time (Slave) – 20 – ns 6 CHIDIN to CHICLK Rising Hold time (Slave) – 20 – ns 8 CHIDIN to CHICLK Falling Setup time (Slave) – 20 – ns 9 CHIDIN to CHICLK Falling Hold time (Slave) – 20 – ns 1996 Aug 07 16 Philips Semiconductors Preliminary specification MIPS PR31100 Highly integrated embedded processor CHI TIMING DIAGRAMS 1 2 CHICLK CHI OUTPUTS 3 4 Figure 4. CHI Output and Clock Timing (CHITXEDGE = 1) CHICLK CHI INPUTS 5 6 Figure 5. CHI Input Timing (CHIRXEDGE = 1) CHICLK CHI OUTPUTS 7 Figure 6. CHI Output and Clock Timing (CHITXEDGE = 0) CHICLK CHI INPUTS 8 9 Figure 7. CHI Input Timing (CHIRXEDGE = 0) 1996 Aug 07 17 Philips Semiconductors Preliminary specification MIPS PR31100 Highly integrated embedded processor MAGIC BUS Tamb = 0 to +70°C, VDD = 3.3 ± 0.3V, External Capacitance = 40pF LIMITS ITEM PARAMETER RISING/FALLING MIN MAX UNIT 1 MBUSCLK high time – 10 – ns 2 MBUSCLK low time – 10 – ns 3 MBUSCLK period 4 Delay MSBUSCLK Rising to MBUSDATA (Master) – 25 – ns Rising – 2 ns Falling – 2 ns Rising – 2 ns Falling – 2 ns 7 Delay MSBUSCLK Falling to MBUSDATA (Master) 5 MBUSDATA to MBUSCLK Rising Setup time (Slave) – 4 – ns 6 MBUSDATA to MBUSCLK Rising Hold time (Slave) – 5 – ns 8 MBUSDATA to MBUSCLK Falling Setup time (Slave) – 4 – ns 9 MBUSDATA to MBUSCLK Falling Hold time (Slave) – 5 – ns 1996 Aug 07 18 Philips Semiconductors Preliminary specification MIPS PR31100 Highly integrated embedded processor MAGIC BUS TIMING DIAGRAMS 1 2 MBUSCLK MBUSDATA 3 4 Figure 8. Magic Bus Output and Clock Timing (Master, PHAPOL = 1) MBUSCLK MBUSDATA 5 6 Figure 9. Magic Bus Input Timing (Slave, RCVPHAPOL = 0) MBUSCLK MBUSDATA 7 Figure 10. Magic Bus Output and Clock Timing (Master, PHAPOL = 0) MBUSCLK MBUSDATA 8 9 Figure 11. Magic Bus Input Timing (Slave, RCVPHAPOL = 1) 1996 Aug 07 19 Philips Semiconductors Preliminary specification MIPS PR31100 Highly integrated embedded processor SIB Tamb = 0 to +70°C, VDD = 3.3 ± 0.3V, External Capacitance = 40pF LIMITS ITEM PARAMETER RISING/FALLING MIN MAX UNIT 1 SIBMCLK high time – 20 – ns 2 SIBMCLK low time – 20 – ns 3 SIBMCLK period – 50 – ns 4 Delay SIBMCLK to SIBSCLK Rising – 5 ns 5 Delay SIBMCLK to SIBSCLK Falling – 5 ns Rising – 2 ns Falling – 2 ns Rising – 2 ns Falling – 2 ns 6 Delay SIBSCLK Rising to SIBSYNC 6 Delay SIBSCLK Rising to SIBDOUT 7 SIBDIN to SIBSCLK Rising Setup time – 20 – ns 8 SIBDIN to SIBSCLK Rising Hold time – 0 – ns SIB TIMING DIAGRAMS 1 2 SIBMCLK 3 5 4 SIBSCLK Figure 12. SIB CLK Timing SIBSCLK SIB OUTPUTS 6 SIBDIN 7 Figure 13. SIB Timing 1996 Aug 07 20 8 Philips Semiconductors Preliminary specification MIPS PR31100 Highly integrated embedded processor SPI LIMITS ITEM PARAMETER RISING/FALLING MIN MAX UNIT 1 SPIMCLK high time – 120 – ns 2 SPICLK low time – 120 – ns 3 SPICLK period – 250 – ns 4 Delay SPICLK Rising to SPIOUT Rising – ns 4 Delay SPICLK Rising to SPIOUT Falling – ns 7 Delay SPICLK Falling to SPIOUT Rising – ns 7 Delay SPICLK Falling to SPIOUT Falling – ns 8 SPIIN to SPICLK Rising Setup time – 15 – ns 9 SPIIN to SPICLK Rising Hold time – 15 – ns 5 SPIIN to SPICLK Falling Setup time – 15 – ns 6 SPIIN to SPICLK Falling Hold time – 15 – ns SPI TIMING DIAGRAMS 1 2 SPICLK SPIOUT 3 4 SPIIN 5 6 Figure 14. SPI Timing (PHAPOL = 1) SPICLK SPIOUT 7 SPIIN 8 9 Figure 15. SPI Timing (PHAPOL = 0) 1996 Aug 07 21 Philips Semiconductors Preliminary specification MIPS PR31100 Highly integrated embedded processor VIDEO Tamb = 0 to +70°C, VDD = 3.3 ± 0.3V, External Capacitance = 40pF LIMITS ITEM PARAMETER RISING/FALLING MIN MAX UNIT 1 LOAD Pulse width – 100 1600 ns 2 Delay LOAD Falling to FRAME – 100 3200 ns 3 Delay LOAD Falling to DF – 100 3200 ns 4 Delay LOAD Falling to CP – 100 3200 ns 5 Delay CP Rising to VDAT[3:0] – – 3 ns 6 VDAT to CP Rising Setup – 15 25 ns 7 VDAT to CP Rising Hold – 15 25 ns NOTE: Values shown assume a 40MHz clock for the CPU, MIN and MAX values are programmable using Video Control Registers. VIDEO TIMING DIAGRAMS 2 FRAME 3 DF LOAD 1 4 CP VDAT[3:0] 5 Figure 16. Video Timing, 4 Bit Non-Split LCD CP VDAT[3:0] 6 7 Figure 17. Video Data Timing, 4 Bit Split LCD and 8 Bit Non-Split LCD 1996 Aug 07 22 Philips Semiconductors Preliminary specification MIPS PR31100 Highly integrated embedded processor POWER Tamb = 0 to +70°C, VDD = 3.3 ± 0.3V, External Capacitance = 40pF LIMITS ITEM PARAMETER RISING/FALLING MIN MAX UNIT 1 VSTANDBY to /PON Rising – 50 – ns 2 VSTANDBY to ONBUTN delay time – 2 – s POWER TIMING DIAGRAM VSTANDBY 1 /PON 2 ONBUTN Figure 18. CPU RESET Tamb = 0 to +70°C, VDD = 3.3 ± 0.3V, External Capacitance = 40pF LIMITS ITEM 1 PARAMETER RISING/FALLING /CPURES low time – 1 /CPURES Figure 19. 1996 Aug 07 23 MIN MAX 10 – UNIT ns Philips Semiconductors Preliminary specification MIPS PR31100 Highly integrated embedded processor LQFP208: 208-PIN PLASTIC LOW PROFILE QUAD FLAT PACKAGE 30.00 156 105 28.00 104 0.50 157 0.20 EJECTOR MARK 208 53 C 1.0 52 INDEX MARK (1.40) 0.625 1 0.625 0.15 (28.80) R0.2 R 0.2 0.15 0.10 0.50 (29.00) UNIT = mm (Drawing not to scale) 1996 Aug 07 24 Philips Semiconductors Preliminary specification Highly integrated embedded processor NOTES 1996 Aug 07 25 MIPS PR31100 Philips Semiconductors Preliminary specification MIPS PR31100 Highly integrated embedded processor DEFINITIONS Data Sheet Identification Product Status Definition Objective Specification Formative or in Design This data sheet contains the design target or goal specifications for product development. Specifications may change in any manner without notice. Preliminary Specification Preproduction Product This data sheet contains preliminary data, and supplementary data will be published at a later date. Philips Semiconductors reserves the right to make changes at any time without notice in order to improve design and supply the best possible product. Product Specification Full Production This data sheet contains Final Specifications. Philips Semiconductors reserves the right to make changes at any time without notice, in order to improve design and supply the best possible product. Philips Semiconductors and Philips Electronics North America Corporation reserve the right to make changes, without notice, in the products, including circuits, standard cells, and/or software, described or contained herein in order to improve design and/or performance. Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no license or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified. Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. LIFE SUPPORT APPLICATIONS Philips Semiconductors and Philips Electronics North America Corporation Products are not designed for use in life support appliances, devices, or systems where malfunction of a Philips Semiconductors and Philips Electronics North America Corporation Product can reasonably be expected to result in a personal injury. Philips Semiconductors and Philips Electronics North America Corporation customers using or selling Philips Semiconductors and Philips Electronics North America Corporation Products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors and Philips Electronics North America Corporation for any damages resulting from such improper use or sale. Philips Semiconductors 811 East Arques Avenue P.O. Box 3409 Sunnyvale, California 94088–3409 Telephone 800-234-7381 Philips Semiconductors and Philips Electronics North America Corporation register eligible circuits under the Semiconductor Chip Protection Act. Copyright Philips Electronics North America Corporation 1996 All rights reserved. Printed in U.S.A.