CY2304:3.3 V Zero Delay Buffer Datasheet.pdf

CY2304
3.3 V Zero Delay Buffer
3.3 V Zero Delay Buffer
Features
■
Zero input-output propagation delay, adjustable by capacitive
load on FBK input
required to be driven into the FBK pin, and can be obtained from
one of the outputs. The input-to-output skew is guaranteed to be
less than 250 ps, and output-to-output skew is guaranteed to be
less than 200 ps.
■
Multiple configurations
The CY2304 has two banks of two outputs each.
■
Multiple low-skew outputs
■
10 MHz to 133 MHz operating range
■
90 ps typical peak cycle-to-cycle jitter at 15 pF, 66 MHz
■
Space-saving 8-pin 150-mil small outline integrated circuit
(SOIC) package
■
3.3 V operation
■
Industrial temperature available
The CY2304 PLL enters a power down state when there are no
rising edges on the REF input. In this mode, all outputs are
three-stated and the PLL is turned off, resulting in less than
25 A of current draw.
Multiple CY2304 devices can accept the same input clock and
distribute it in a system. In this case, the skew between the
outputs of two devices is guaranteed to be less than 500 ps.
The CY2304 is available in two different configurations, as
shown in Available Configurations. The CY2304-1 is the base
part, where the output frequencies equal the reference if there is
no counter in the feedback path.
Functional Description
The CY2304 is a 3.3 V zero delay buffer designed to distribute
high-speed clocks in PC, workstation, datacom, telecom, and
other high performance applications.
The part has an on-chip phase-locked loop (PLL) that locks to an
input clock presented on the REF pin. The PLL feedback is
The CY2304-2 allows the user to obtain Ref and 1/2x or 2x
frequencies on each output bank. The exact configuration and
output frequencies depends on which output drives the feedback
pin.
For a complete list of related documentation, click here.
Logic Block Diagram
FBK
CLKA1
PLL
REF
CLKA2
/2
Extra Divider (-2)
CLKB1
CLKB2
Available Configurations
Device
FBK from
CY2304-1
Bank A or B
Reference
Reference
CY2304-2
Bank A
Reference
Reference/2
CY2304-2
Bank B
2 × Reference
Reference
Cypress Semiconductor Corporation
Document Number: 38-07247 Rev. *N
•
198 Champion Court
Bank A Frequency
•
Bank B Frequency
San Jose, CA 95134-1709
•
408-943-2600
Revised May 13, 2016
CY2304
Contents
Pin Configurations ........................................................... 3
Pin Definitions .................................................................. 3
Zero Delay and Skew Control .......................................... 4
Maximum Ratings ............................................................. 5
Operating Conditions ....................................................... 5
Electrical Characteristics ................................................. 5
Switching Characteristics ................................................ 6
Operating Conditions ....................................................... 7
Electrical Characteristics ................................................. 7
Switching Characteristics ................................................ 8
Switching Waveforms ...................................................... 9
Ordering Information ...................................................... 11
Ordering Code Definitions ......................................... 11
Package Diagram ............................................................ 12
Acronyms ........................................................................ 13
Document Number: 38-07247 Rev. *N
Document Conventions ................................................. 13
Units of Measure ....................................................... 13
Appendix: Silicon Errata for
the Zero Delay Clock Buffers, CY2304 ......................... 14
Part Numbers Affected .............................................. 14
CY2304 Errata Summary .......................................... 14
CY2303 Qualification Status of fixed silicon .............. 14
Document History Page ................................................. 16
Sales, Solutions, and Legal Information ...................... 17
Worldwide Sales and Design Support ....................... 17
Products .................................................................... 17
PSoC® Solutions ...................................................... 17
Cypress Developer Community ................................. 17
Technical Support ..................................................... 17
Page 2 of 17
CY2304
Pin Configurations
Figure 1. 8-pin SOIC pinout
REF
CLKA1
CLKA2
GND
1
2
3
4
8
7
6
5
FBK
VDD
CLKB2
CLKB1
Pin Definitions
8-pin SOIC
Pin
1
Signal
REF
[1]
Description
Input reference frequency, 5 V tolerant input
2
CLKA1 [2] Clock output, Bank A
3
CLKA2 [2] Clock output, Bank A
4
GND
Ground
5
CLKB1 [2] Clock output, Bank B
6
CLKB2 [2] Clock output, Bank B
7
VDD
3.3 V supply
8
FBK
PLL feedback input
Notes
1. Weak pull-down.
2. Weak pull-down on all outputs.
Document Number: 38-07247 Rev. *N
Page 3 of 17
CY2304
Zero Delay and Skew Control
Figure 2. REF. Input to CLKA/CLKB Delay vs. Difference in Loading Between FBK Pin and CLKA/CLKB Pins
To close the feedback loop of the CY2304, the FBK pin can be driven from any of the four available output pins. The output driving
the FBK pin is driving a total load of 7 pF, with any additional load that it drives. The relative loading of this output (with respect to the
remaining outputs) can adjust the input-output delay. This is shown in Figure 2.
For applications requiring zero input-output delay, all outputs including the one providing feedback must be equally loaded. If
input-output delay adjustments are required, use the graph shown in Figure 2 to calculate loading differences between the feedback
output and remaining outputs.
For zero output-output skew, be sure to load outputs equally. For further information on using CY2304, refer to the application note
AN1234 - Understanding Cypress’s Zero Delay Buffers.
Document Number: 38-07247 Rev. *N
Page 4 of 17
CY2304
Maximum Ratings
Storage temperature ............................... –65 °C to +150 °C
Supply voltage to ground potential ............. –0.5 V to +7.0 V
DC input voltage (except Ref) ........... –0.5 V to VDD + 0.5 V
Junction temperature ................................................ 150 °C
Static discharge voltage
(per MIL-STD-883, Method 3015) ......................... > 2000 V
DC input voltage REF ...................................... –0.5 V to 7 V
Operating Conditions
For CY2304SXC Commercial Temperature Devices
Parameter
Description
Min
Max
Unit
VDD
Supply voltage
3.0
3.6
V
TA
Operating temperature (ambient temperature)
0
70
°C
CL
Load capacitance (below 100 MHz)
–
30
pF
Load capacitance (from 100 MHz to 133 MHz)
–
15
pF
–
7
pF
0.05
50
ms
Min
Max
Unit
CIN
Input capacitance
tPU
Power-up time for all VDDs to reach minimum specified voltage (power ramps must
be monotonic)
[3]
Electrical Characteristics
For CY2304SXC Commercial Temperature Devices
Parameter
Description
Test Conditions
VIL
Input LOW voltage
–
0.8
V
VIH
Input HIGH voltage
2.0
–
V
IIL
Input LOW current
VIN = 0 V
–
50.0
A
IIH
Input HIGH current
VIN = VDD
–
100.0
A
Output LOW voltage
[4]
IOL = 8 mA (-1, -2)
–
0.4
V
Output HIGH voltage
[4]
IOH = –8 mA (-1, -2)
2.4
–
V
VOL
VOH
IDD (PD mode) Power-down supply current
REF = 0 MHz
–
12.0
A
IDD
Unloaded outputs, 100 MHz REF, Select inputs
at VDD or GND
–
45.0
mA
Unloaded outputs, 66 MHz REF (-1, -2)
–
32.0
mA
Unloaded outputs, 33 MHz REF (-1, -2)
–
18.0
mA
Supply current
Notes
3. Applies to both REF clock and FBK.
4. Parameter is guaranteed by design and characterization. Not 100% tested in production.
Document Number: 38-07247 Rev. *N
Page 5 of 17
CY2304
Switching Characteristics
For CY2304SXC Commercial Temperature Devices
Parameter [5]
Name
Test Conditions
Min
Typ
Max
Unit
t1
Output frequency
30 pF load, all devices
10
–
100
MHz
t1
Output frequency
15 pF load, -1, -2 devices
10
–
133.3
MHz
Measured at 1.4 V,
FOUT = 66.66 MHz, 30-pF load
40.0
50.0
60.0
%
tDC
Duty cycle
tDC
Duty cycle [6] = t2 t1 (-2)
Measured at 1.4 V,
FOUT = 83.0 MHz, 15-pF load
40.0
50.0
60.0
%
tDC
Duty cycle [6] = t2 t1 (-1, -2)
Measured at 1.4 V,
FOUT < 50 MHz, 15-pF load
45.0
50.0
55.0
%
t3
Rise time[6] (-1, -2)
Measured between 0.8 V and 2.0 V,
30-pF load
–
–
2.20
ns
t3
Rise time [6] (-1, -2)
Measured between 0.8 V and 2.0 V,
15-pF load
–
–
1.50
ns
t4
Fall time [6] (-1, -2)
Measured between 0.8 V and 2.0 V,
30-pF load
–
–
2.20
ns
t4
Fall time [6] (-1, -2)
Measured between 0.8 V and 2.0 V,
15 pF load
–
–
1.50
ns
t5
Output-to-output skew on same
Bank (-1, -2) [6]
All outputs equally loaded
–
–
200
ps
Output bank A to output bank B
skew (-1)
All outputs equally loaded
–
–
200
ps
Output bank A to output bank B
skew (-2)
All outputs equally loaded
–
–
400
ps
t6
Skew, REF rising edge to FBK
rising edge [6]
Measured at VDD/2
–
0
250
ps
t7
Device-to-device skew [6]
Measured at VDD/2 on the FBK pins
of devices
–
0
500
ps
tJ
Cycle-to-cycle jitter [6] (-1)
Measured at 66.67 MHz, loaded
outputs, 15-pF load
–
90
175
ps
Measured at 66.67 MHz, loaded
outputs, 30-pF load
–
–
200
ps
Measured at 133.3 MHz, loaded
outputs, 15-pF load
–
–
100
ps
Measured at 66.67 MHz, loaded
outputs 30-pF load
–
–
400
ps
Measured at 66.67 MHz, loaded
outputs 15-pF load
–
–
375
ps
Stable power supply, valid clocks
presented on REF and FBK pins
–
–
1.0
ms
tJ
tLOCK
[6]
= t2 t1 (-1, -2)
Cycle-to-cycle jitter [6] (-2)
PLL lock time [6]
Notes
5. All parameters are specified with loaded output.
6. Parameter is guaranteed by design and characterization. Not 100% tested in production.
Document Number: 38-07247 Rev. *N
Page 6 of 17
CY2304
Operating Conditions
For CY2304SXI Industrial Temperature Devices
Min
Max
Unit
VDD
Parameter
Supply voltage
3.0
3.6
V
TA
Operating temperature (ambient temperature)
–40
85
°C
CL
Load capacitance (below 100 MHz)
–
30
pF
Load capacitance (from 100 MHz to 133 MHz)
–
15
pF
Input capacitance
–
7
pF
Min
Max
Unit
–
0.8
V
CIN
Description
Electrical Characteristics
For CY2304SXI Industrial Temperature Devices
Parameter
Description
VIL
Input LOW voltage
VIH
Input HIGH voltage
IIL
Input LOW current
IIH
VOL
VOH
[7]
Test Conditions
2.0
–
V
VIN = 0 V
–
50.0
A
Input HIGH current
VIN = VDD
–
100.0
A
Output LOW voltage [7]
IOL = 8 mA (-1, -2)
–
0.4
V
2.4
–
V
Output HIGH voltage
IOH = –8 mA (-1, -2)
IDD (PD mode) Power-down supply current
REF = 0 MHz
–
25.0
A
IDD
Unloaded outputs, 100 MHz, Select inputs at VDD
or GND
–
45.0
mA
Unloaded outputs, 66 MHz REF (-1, -2)
–
35.0
mA
Unloaded outputs, 33 MHz REF (-1, -2)
–
20.0
mA
Supply current
Thermal Resistance
Parameter [8]
Description
θJA
Thermal resistance
(junction to ambient)
θJC
Thermal resistance
(junction to case)
Test Conditions
8-pin SOIC
Unit
Test conditions follow standard test methods and
procedures for measuring thermal impedance, in
accordance with EIA/JESD51.
140
°C/W
54
°C/W
Notes
7. Parameter is guaranteed by design and characterization. Not 100% tested in production.
8. These parameters are guaranteed by design and are not tested.
Document Number: 38-07247 Rev. *N
Page 7 of 17
CY2304
Switching Characteristics
for CY2304SXI Industrial Temperature Devices
Parameter [9]
Name
Test Conditions
t1
Output frequency
30-pF load, All devices
t1
Output frequency
15-pF load, All devices
Min
Typ
Max
Unit
10
–
100
MHz
10
–
133.3
MHz
Measured at 1.4 V, FOUT = 66.66
MHz,
30-pF load
40.0
50.0
60.0
%
Duty cycle [10] = t2 t1 (-2)
Measured at 1.4 V,
FOUT = 83.0 MHz, 15-pF load
40.0
50.0
60.0
%
tDC
Duty cycle [10] = t2 t1 (-1, -2)
Measured at 1.4 V,
FOUT < 50 MHz, 15-pF load
45.0
50.0
55.0
%
t3
Rise time [10] (-1, -2)
Measured between 0.8 V and 2.0 V,
30-pF load
–
–
2.50
ns
t3
Rise time [10] (-1, -2)
Measured between 0.8 V and 2.0 V,
15-pF load
–
–
1.50
ns
t4
Fall time [10] (-1, -2)
Measured between 0.8 V and 2.0 V,
30-pF load
–
–
2.50
ns
t4
Fall time [10] (-1, -2)
Measured between 0.8 V and 2.0 V,
15-pF load
–
–
1.50
ns
t5
Output-to-output skew on same
bank (-1, -2) [10]
All outputs equally loaded
–
–
200
ps
Output bank A to output bank B
skew (-1)
All outputs equally loaded
–
–
200
ps
Output bank A to output bank B
skew (-2)
All outputs equally loaded
–
–
400
ps
t6
Skew, REF rising edge to FBK
rising edge [10]
Measured at VDD/2
–
0
250
ps
t7
Device-to-device skew [10]
Measured at VDD/2 on the FBK pins
of devices
–
0
500
ps
tJ
Cycle-to-cycle jitter [10] (-1)
Measured at 66.67 MHz,
loaded outputs, 15-pF load
–
–
180
ps
Measured at 66.67 MHz,
loaded outputs, 30-pF load
–
–
200
ps
Measured at 133.3 MHz,
loaded outputs, 15-pF load
–
–
100
ps
Measured at 66.67 MHz,
loaded outputs, 30-pF load
–
–
400
ps
Measured at 66.67 MHz,
loaded outputs, 15-pF load
–
–
380
ps
Stable power supply, valid clocks
presented on REF and FBK pins
–
–
1.0
ms
tDC
Duty cycle
tDC
tJ
tLOCK
[10]
= t2 t1 (-1, -2)
Cycle-to-cycle jitter [10] (-2)
PLL lock time [10]
Notes
9. All parameters are specified with loaded output.
10. Parameter is guaranteed by design and characterization. Not 100% tested in production.
Document Number: 38-07247 Rev. *N
Page 8 of 17
CY2304
Switching Waveforms
Figure 3. Duty Cycle Timing
t1
t2
1.4 V
1.4 V
1.4 V
Figure 4. All Outputs Rise/Fall Time
OUTPUT
2.0 V
0.8 V
2.0 V
0.8 V
t3
3.3 V
0V
t4
Figure 5. Output-Output Skew
OUTPUT
1.4 V
1.4 V
OUTPUT
t5
Figure 6. Input-Output Skew
INPUT
VDD/2
VDD/2
FBK
t6
Figure 7. Device-Device Skew
VDD/2
FBK, Device 1
VDD/2
FBK, Device 2
t7
Document Number: 38-07247 Rev. *N
Page 9 of 17
CY2304
Figure 8. Test Circuit # 1
VDD
0.1 F
OUTPUTS
CLK OUT
C LOAD
V DD
0.1 F
GND
GND
Test circuit for all parameters
Document Number: 38-07247 Rev. *N
Page 10 of 17
CY2304
Ordering Information
Ordering Code
Package Type
Operating Range
Pb-free
CY2304SXC-1
8-pin SOIC (150 Mils)
Commercial
CY2304SXC-1T
8-pin SOIC (150 Mils) – Tape and Reel
Commercial
CY2304SXI-1
8-pin SOIC (150 Mils)
Industrial
CY2304SXI-1T
8-pin SOIC (150 Mils) – Tape and Reel
Industrial
CY2304SXC-2
8-pin SOIC (150 Mils)
Commercial
CY2304SXC-2T
8-pin SOIC (150 Mils) – Tape and Reel
Commercial
CY2304SXI-2
8-pin SOIC (150 Mils)
Industrial
CY2304SXI-2T
8-pin SOIC (150 Mils) – Tape and Reel
Industrial
Ordering Code Definitions
CY 2304 S
X
X - X
T
X = blank or T
blank = Tube; T = Tape and Reel
X = 1 or 2
Temperature Range: X = C or I
C = Commercial; I = Industrial
X = Pb-free
Package Type: S = 8-pin SOIC
Base Device Part Number
Company ID: CY = Cypress
Document Number: 38-07247 Rev. *N
Page 11 of 17
CY2304
Package Diagram
Figure 9. 8-pin SOIC (150 Mils) Package Outline, 51-85066
51-85066 *H
Document Number: 38-07247 Rev. *N
Page 12 of 17
CY2304
Acronyms
Acronym
Document Conventions
Description
PLL
Phase Locked Loop
SOIC
Small Outline Integrated Circuit
Document Number: 38-07247 Rev. *N
Units of Measure
Symbol
Unit of Measure
C
degree Celsius
MHz
megahertz
µA
microampere
mA
milliampere
ms
millisecond
ns
nanosecond
pF
picofarad
ps
picosecond
V
volt
Page 13 of 17
CY2304
Appendix: Silicon Errata for the Zero Delay Clock Buffers, CY2304
This section describes the errors, workaround solution and silicon design fixes for Cypress zero delay clock buffers belonging to the
families CY2304. Details include errata trigger conditions, scope of impact, available workarounds, and silicon revision applicability.
Contact your local Cypress Sales Representative if you have questions.
Part Numbers Affected
Table 1. Part Numbers Affected
Part Number
Device Variants
CY2304SXC-1
All Variants
CY2304SXC-1T
All Variants
CY2304SXC-2
All Variants
CY2304SXC-2T
All Variants
CY2304SXI-1
All Variants
CY2304SXI-1T
All Variants
CY2304SXI-2
All Variants
CY2304SXI-2T
All Variants
CY2304 Errata Summary
Items
Part Number
Fix Status
Start up lock time issue [CY2304]
All
Silicon fixed. New silicon available from WW 10
of 2013
CY2303 Qualification Status of fixed silicon
Product Status: In production
Qualification report last updated on 11/27/2012
http://www.cypress.com/?rID=72595
1. Start up lock time issue
■
Problem Definition
Output of CY2304 fails to locks within 1 ms upon power up (as per datasheet spec)
■
Parameters Affected
PLL lock time
■
Trigger Condition(s)
Start up
■
Scope of Impact
It can impact the performance of system and its throughput
■
Workaround
Apply reference input (RefClk) before power up (VDD). If RefClk is applied after power up, noise gets coupled on the output and
propagates back to the PLL causing it to take higher time to acquire lock. If reference input is present during power up, noise will
not propagate to the PLL and device will start up normally without problems.
■
Fix Status
This issue is due to design marginality. Two minor design modifications have been made to address this problem.
a. Addition of VCO bias detector block as shown in the following figure keeps comparator power down till VCO bias is present and
thereby eliminating the propagation of noise to feedback.
b. Bias generator enhancement for successful initialization.
Document Number: 38-07247 Rev. *N
Page 14 of 17
CY2304
Document Number: 38-07247 Rev. *N
Page 15 of 17
CY2304
Document History Page
Document Title: CY2304, 3.3 V Zero Delay Buffer
Document Number: 38-07247
Rev.
ECN
Orig. of
Change
Submission
Date
**
110512
SZV
12/11/01
Description of Change
Change from Spec number: 38-01010 to 38-07247
*A
112294
CKN
03/04/02
On Pin Configuration Diagram (p.1), swapped CLKA2 and CLKA1
*B
113934
CKN
05/01/02
Added Operating Conditions for CY2304SI-X Industrial Temperature Devices,
p. 4
*C
121851
RBI
12/14/02
Power up requirements added to Operating Conditions Information
*D
308436
RGL
01/26/05
Added Lead-free Devices
*E
2542331
AESA
09/18/08
Updated template. Added Note “Not recommended for new designs.”
Removed part number CY2304SI-2 and CY2304SI-2T.
Changed Lead-Free to Pb-Free.
Changed IDD (PD mode) from 12.0 to 25.0 A.
Deleted Duty Cycle parameters for FOUT < 50.0 MHz for commercial and
industrial devices.
*F
2673353
KVM /
PYRS
03/13/09
Reverted IDD (PD mode) and Duty Cycle parameters back to the values in
revision *D:
Changed IDD (PD mode) from 25 to 12 A for commercial devices.
Added Duty Cycle parameters for FOUT < 50.0 MHz for commercial and
industrial devices.
*G
2906571
KVM
04/07/10
Removed parts CY2304SC-1, CY2304SC-1T, CY2304SC-2, CY2304SC-2T,
CY2304SI-1, CY2304SI-1T from the ordering information table.
Updated Package Diagram.
*H
3072674
BASH
10/27/2010
Corrected part number in all table titles (pages 3 to 5) from CY2304SC-X and
CY2304SI-X to CY2304SXC and CY2304SXI.
Removed “except t8” from Figure 7
*I
3162681
BASH
02/04/2011
Updated to new template.
*J
3204827
CXQ
03/24/2011
Added duty cycle spec for 83.0 MHz output condition.
*K
4018186
CINM
06/10/2013
Updated Package Diagram:
spec 51-85066 – Changed revision from *D to *F.
Added Appendix: Silicon Errata for the Zero Delay Clock Buffers, CY2304.
*L
4291190
CINM
02/25/2014
Updated to new template.
Completing Sunset Review.
*M
4578443
AJU
11/25/2014
Updated Functional Description:
Added “For a complete list of related documentation, click here.” at the end.
*N
5270465
PSR
05/13/2016
Added Thermal Resistance.
Updated Package Diagram:
spec 51-85066 – Changed revision from *F to *H.
Updated to new template.
Document Number: 38-07247 Rev. *N
Page 16 of 17
CY2304
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OR ACCOMPANYING HARDWARE, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE. To the extent
permitted by applicable law, Cypress reserves the right to make changes to this document without further notice. Cypress does not assume any liability arising out of the application or use of any
product or circuit described in this document. Any information provided in this document, including any sample design information or programming code, is provided only for reference purposes. It is
the responsibility of the user of this document to properly design, program, and test the functionality and safety of any application made of this information and any resulting product. Cypress products
are not designed, intended, or authorized for use as critical components in systems designed or intended for the operation of weapons, weapons systems, nuclear installations, life-support devices or
systems, other medical devices or systems (including resuscitation equipment and surgical implants), pollution control or hazardous substances management, or other uses where the failure of the
device or system could cause personal injury, death, or property damage ("Unintended Uses"). A critical component is any component of a device or system whose failure to perform can be reasonably
expected to cause the failure of the device or system, or to affect its safety or effectiveness. Cypress is not liable, in whole or in part, and you shall and hereby do release Cypress from any claim,
damage, or other liability arising from or related to all Unintended Uses of Cypress products. You shall indemnify and hold Cypress harmless from and against all claims, costs, damages, and other
liabilities, including claims for personal injury or death, arising from or related to any Unintended Uses of Cypress products.
Cypress, the Cypress logo, Spansion, the Spansion logo, and combinations thereof, PSoC, CapSense, EZ-USB, F-RAM, and Traveo are trademarks or registered trademarks of Cypress in the United
States and other countries. For a more complete list of Cypress trademarks, visit cypress.com. Other names and brands may be claimed as property of their respective owners.
Document Number: 38-07247 Rev. *N
Revised May 13, 2016
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