Freescale Semiconductor Inc PART INFORMATION Mfg Item Number Mfg Item Name MCF5272VF66 MABGA-FW 196 15SQ0.8P1.0 SUPPLIER Company Name Company Unique ID Response Date Response Document ID Contact Name Contact Title Contact Phone Contact Email Authorized Representative Representative Title Representative Phone Representative Email URL for Additional Information Freescale Semiconductor Inc 14-141-7928 2012-07-28 5220K00119D049A1.25 Freescale Semiconductor Inc Product Technical Support 1-800-521-6274 [email protected] Daniel Binyon EPP Customer Response 512-895-3406 [email protected] www.freescale.com DECLARATION EU RoHS Pb Free HalogenFree Plating Indicator EU RoHS Exemption(s) MANUFACTURING Mfg Item Number Mfg Item Name Version Weight UoM Unit Volume J-STD-020 MSL Rating Peak Processing Temperature Max Time at Peak Temperature Number of Processing Cycles No No Yes e0 MCF5272VF66 MABGA-FW 196 15SQ0.8P1.0 ALL 0.547250 g EACH 3 220 C 30 seconds 3 RoHS RoHS Directive RoHS Definition RoHS Legal Definition RoHS Declaration Supplier Acceptance Signature Exemption List Version List of Freescale Accepted Exemptions 2011/65/EU RoHS Definition: Quantity limit of 0.1% by mass (1000 PPM) of homogeneous material for: Lead (Pb), Mercury, Hexavalent Chromium, Polybrominated Biphenyls (PBB), Polybrominated Diphenyl Ethers (PBDE) and quantity limit of 0.01% by mass (100 PPM) of homogeneous material of Cadmium Please indicate whether any homogeneous material (as defined by the RoHS Directive, EU 2011/65/EU and implemented by the laws of the European Union member states) of the part(s) identified on this form contains lead, mercury, cadmium, hexavalent chromium, polybrominated biphenyls and/or polybrominated diphenyl ethers (each a RoHS restricted substance) in excess of the applicable quantity limit identified below. If a homogeneous material within the part(s) contains a RoHS restricted substance in excess of an applicable quantity limit, please indicate below which, if any, RoHS exemption you believe may apply. If the part is an assembly with lower level components, the declaration shall encompass all such components. Supplier certifies that it gathered the information it provides in this form using appropriate methods to ensure its accuracy and that such information is true and correct to the best of its knowledge and belief, as of the date that Supplier completes this form. Supplier acknowledges that Company will rely on this certification in determining the compliance of its products with European Union member state laws that implement the RoHS Directive. Company acknowledges that Supplier may have relied on information provided by others in completing this form, and that Supplier may not have independently verified such information. However, in situations where Supplier has not independently verified information provided by others, Supplier agrees that, at a minimum, its suppliers have provided certifications regarding their contributions to the part(s), and those certifications are at least as comprehensive as the certification in this paragraph. If the Company and the Supplier enter into a written agreement with respect to the identified part(s),the terms and conditions of that agreement, including any warranty rights and/or remedies provided as part of that agreement, will be the sole and exclusive source of the Suppliers liability and the Companys remedies for issues that arise regarding information the Supplier provides in this form. In the absence of such written agreement, the warranty rights and/or remedies of Suppliers Standard Terms and Conditions of Sale applicable to such part(s) shall apply. 3 - Item(s) does not contain RoHS restricted substances per the definition above except for lead in solders and selected exemptions, if any Accepted Daniel Binyon 2012/51/EU 6(a) : Lead as an alloying element in steel for machining purposes and in galvanized steel containing up to 0.35% lead by weight 6(b) : Lead as an alloying element in aluminium containing up to 0.4% lead by weight 6(c) : Copper alloy containing up to 4% lead by weight 7(a) : Lead in high melting temperature type solders (i.e. lead-based alloys containing 85% by weight or more lead) 7(b) : Lead in solders for servers, storage and storage array systems, network infrastructure equipment for switching, signaling, transmission, and network management for telecommunications 7(c)-I : Electrical and electronic components containing lead in a glass or ceramic other than dielectric ceramic in capacitors, e.g. piezoelectronic devices, or in a glass or ceramic matrix compound 7(c)-II : Lead in dielectric ceramic in capacitors for a rated voltage of 125 V AC or 250 V DC or higher 7(c)-III : Lead in dielectric ceramic in capacitors for a rated voltage of less than 125 V AC or 250 V DC 7(c)-IV : Lead in PZT based dielectric ceramic materials for capacitors being part of integrated circuits or discrete semiconductors 15 : Lead in solders to complete a viable electrical connection between semiconductor die and carrier within integrated circuit flip chip packages MATERIAL COMPOSITION Homogeneous Material Weight SubstanceClass Substance CAS Die Encapsulant 0.2687 SubPart% ARTICLEPPM ARTICLE% Die Encapsulant Metals Aluminum, metal 7429-90-5 0.00830176 g Die Encapsulant Arsenic/Arsenic Compounds Arsenic 7440-38-2 0.00000027 g 30896 3.0896 15169 1.5169 1 0.0001 0 Die Encapsulant Cadmium/Cadmium Compounds Cadmium 7440-43-9 0.00000027 0 g 1 0.0001 0 Die Encapsulant Plastics/polymers Proprietary Material-Other Epoxy resins - 0 0.00830176 g 30896 3.0896 15169 Die Encapsulant Solvents, additives, and other materials Carbon Black 1.5169 1333-86-4 0.00083028 g 3090 0.309 1517 Die Encapsulant Lead/Lead Compounds 0.1517 Lead 7439-92-1 0.00000027 g 1 0.0001 0 Die Encapsulant 0 Solvents, additives, and other materials Other organic phosphorous compounds - 0.00083028 g 3090 0.309 1517 0.1517 Die Encapsulant Plastics/polymers Proprietary Material-Other phenolic resins - 0.01521971 g 56642 5.6642 27811 2.7811 Die Encapsulant Glass Silica, vitreous 60676-86-0 0.2352154 g 875383 87.5383 429826 42.9826 Organic Substrate, Halogen-fre Exemption SubstanceWeight UoM SubPart PPM g 0.15785 g Organic Substrate, Halogen-fre Metals Barium sulfate 7727-43-7 0.00876825 g 55548 5.5548 16022 1.6022 Organic Substrate, Halogen-fre Metals Copper, metal 7440-50-8 0.0555741 g 352069 35.2069 101551 10.1551 Organic Substrate, Halogen-fre Plastics/polymers Epikote 862 28064-14-4 0.01186274 g 75152 7.5152 21677 2.1677 Organic Substrate, Halogen-fre Metals Gold, metal 7440-57-5 0.00223831 g 14180 1.418 4090 0.409 Organic Substrate, Halogen-fre Nickel (external applications only) Nickel 7440-02-0 0.01697977 g 107569 10.7569 31027 3.1027 Organic Substrate, Halogen-fre Solvents, additives, and other materials Diphenyl tolyl phosphate 26444-49-5 0.01983559 g 125661 12.5661 36245 3.6245 Organic Substrate, Halogen-fre Solvents, additives, and other materials Other miscellaneous substances (less than 5%). - 0.00031317 g 1984 0.1984 572 0.0572 Organic Substrate, Halogen-fre Solvents, additives, and other materials Other Aromatic carbonyl compounds - 0.00121339 g 7687 0.7687 2217 0.2217 Organic Substrate, Halogen-fre Glass Silica, crystalline - tridymite 15468-32-3 0.04106468 g 260150 26.015 75038 7.5038 Solder Balls - Low Lead 0.1013 g Solder Balls - Low Lead Lead/Lead Compounds Lead 7439-92-1 0.036468 g 360000 36 66638 6.6638 Solder Balls - Low Lead Metals Silver, metal 7440-22-4 0.002026 g 20000 2 3702 0.3702 Solder Balls - Low Lead Metals Tin, metal 7440-31-5 0.062806 g 620000 62 114766 11.4766 Non-Conductive Epoxy/Adhesive 0.009 g Non-Conductive Epoxy/Adhesive Plastics/polymers Proprietary Material-Other Epoxy resins - 0.000675 g 75000 7.5 1233 0.1233 Non-Conductive Epoxy/Adhesive Plastics/polymers Crosslinked acrylate polymer 25767-43-5 0.0018 g 200000 20 3289 0.3289 Non-Conductive Epoxy/Adhesive Plastics/polymers Other polymers - 0.000675 g 75000 7.5 1233 0.1233 Non-Conductive Epoxy/Adhesive Plastics/polymers Proprietary Material-Other polymers - 0.0018 g 200000 20 3289 0.3289 Non-Conductive Epoxy/Adhesive Glass Silica, vitreous 60676-86-0 0.00405 g 450000 45 7400 0.74 1000000 100 3106 0.3106 Bonding Wire 0.0017 Bonding Wire Silicon Semiconductor Die g Metals Gold, metal 7440-57-5 0.0017 0.0087 g g Silicon Semiconductor Die Solvents, additives, and other materials Other miscellaneous substances (less than 5%). - 0.000174 g 20000 2 317 0.0317 Silicon Semiconductor Die Glass Silicon, doped - 0.008526 g 980000 98 15579 1.5579 LINKS MCD LINK NXP website GENERAL ENVIRONMENTAL COMPLIANCE LINKS RoHS signed letter China RoHS REACH signed letter ELV signed letter Conflict Minerals statement NXP ENVIRONMENTAL INFORMATION Environmental Compliance website FAQ Technical Service Request LINKS TO BLANK IPC1752 FORMS Blank IPC1752 v1.1 Form http://www.nxp.com http://www.nxp.com/files/corporate/doc/support_info/NXP-ROHS-DECLARATION.pdf http://www.nxp.com/about/corporate-responsibility/environmental-compliance-organization/china-rohs:ENV_CHINA_ROHS_STRATEGY http://www.nxp.com/files/corporate/doc/support_info/NXP-REACH-STATEMENT.pdf http://www.nxp.com/files/corporate/doc/support_info/NXP-ELV-STATEMENT.pdf http://www.nxp.com/files/corporate/doc/support_info/NXP-STATEMENT-CONFLICT-MINERALS.pdf http://www.nxp.com/about/corporate-responsibility/environmental-compliance-organization:ABUENVPRFPRDX http://www.nxp.com/about/corporate-responsibility/environmental-compliance-organization/eco-product-faqs:ENVIRON_FAQ http://www.nxp.com/support/sales-and-support:SUPPORTHOME http://www.NXP.com/files/abstract/corporate/ehs_epp/IPC-1752-2_v1.1_MCD_Template.pdf IPC1752 XML LINKS http://www.freescale.com/mcds/MCF5272VF66_IPC1752_v11.xml http://www.freescale.com/mcds/MCF5272VF66_IPC1752A.xml