Freescale Semiconductor Inc PART INFORMATION Mfg Item Number Mfg Item Name MCF5275LCVM133 MABGA-FW 196 15SQ0.8P1.0 SUPPLIER Company Name Company Unique ID Response Date Response Document ID Contact Name Contact Title Contact Phone Contact Email Authorized Representative Representative Title Representative Phone Representative Email URL for Additional Information Freescale Semiconductor Inc 14-141-7928 2015-06-22 5220K00119D033A1.40 Freescale Semiconductor Inc Product Technical Support 1-800-521-6274 [email protected] Daniel Binyon EPP Customer Response 512-895-3406 [email protected] www.freescale.com DECLARATION EU RoHS Pb Free HalogenFree Plating Indicator EU RoHS Exemption(s) MANUFACTURING Mfg Item Number Mfg Item Name Version Weight UoM Unit Volume J-STD-020 MSL Rating Peak Processing Temperature Max Time at Peak Temperature Number of Processing Cycles Yes Yes Yes e1 MCF5275LCVM133 MABGA-FW 196 15SQ0.8P1.0 ALL 0.491550 g EACH 3 260 C 40 seconds 3 RoHS RoHS Directive RoHS Definition RoHS Legal Definition RoHS Declaration Supplier Acceptance Signature Exemption List Version List of Freescale Accepted Exemptions 2011/65/EU RoHS Definition: Quantity limit of 0.1% by mass (1000 PPM) of homogeneous material for: Lead (Pb), Mercury, Hexavalent Chromium, Polybrominated Biphenyls (PBB), Polybrominated Diphenyl Ethers (PBDE) and quantity limit of 0.01% by mass (100 PPM) of homogeneous material of Cadmium Please indicate whether any homogeneous material (as defined by the RoHS Directive, EU 2011/65/EU and implemented by the laws of the European Union member states) of the part(s) identified on this form contains lead, mercury, cadmium, hexavalent chromium, polybrominated biphenyls and/or polybrominated diphenyl ethers (each a RoHS restricted substance) in excess of the applicable quantity limit identified below. If a homogeneous material within the part(s) contains a RoHS restricted substance in excess of an applicable quantity limit, please indicate below which, if any, RoHS exemption you believe may apply. If the part is an assembly with lower level components, the declaration shall encompass all such components. Supplier certifies that it gathered the information it provides in this form using appropriate methods to ensure its accuracy and that such information is true and correct to the best of its knowledge and belief, as of the date that Supplier completes this form. Supplier acknowledges that Company will rely on this certification in determining the compliance of its products with European Union member state laws that implement the RoHS Directive. Company acknowledges that Supplier may have relied on information provided by others in completing this form, and that Supplier may not have independently verified such information. However, in situations where Supplier has not independently verified information provided by others, Supplier agrees that, at a minimum, its suppliers have provided certifications regarding their contributions to the part(s), and those certifications are at least as comprehensive as the certification in this paragraph. If the Company and the Supplier enter into a written agreement with respect to the identified part(s),the terms and conditions of that agreement, including any warranty rights and/or remedies provided as part of that agreement, will be the sole and exclusive source of the Suppliers liability and the Companys remedies for issues that arise regarding information the Supplier provides in this form. In the absence of such written agreement, the warranty rights and/or remedies of Suppliers Standard Terms and Conditions of Sale applicable to such part(s) shall apply. 1 - Item(s) do not contain RoHS restricted substances per the definition above Accepted Daniel Binyon 2012/51/EU 6(a) : Lead as an alloying element in steel for machining purposes and in galvanized steel containing up to 0.35% lead by weight 6(b) : Lead as an alloying element in aluminium containing up to 0.4% lead by weight 6(c) : Copper alloy containing up to 4% lead by weight 7(a) : Lead in high melting temperature type solders (i.e. lead-based alloys containing 85% by weight or more lead) 7(b) : Lead in solders for servers, storage and storage array systems, network infrastructure equipment for switching, signaling, transmission, and network management for telecommunications 7(c)-I : Electrical and electronic components containing lead in a glass or ceramic other than dielectric ceramic in capacitors, e.g. piezoelectronic devices, or in a glass or ceramic matrix compound 7(c)-II : Lead in dielectric ceramic in capacitors for a rated voltage of 125 V AC or 250 V DC or higher 7(c)-III : Lead in dielectric ceramic in capacitors for a rated voltage of less than 125 V AC or 250 V DC 7(c)-IV : Lead in PZT based dielectric ceramic materials for capacitors being part of integrated circuits or discrete semiconductors 15 : Lead in solders to complete a viable electrical connection between semiconductor die and carrier within integrated circuit flip chip packages MATERIAL COMPOSITION Homogeneous Material Weight SubstanceClass Substance CAS Die Encapsulant 0.2687 Die Encapsulant Metals Aluminum, metal 7429-90-5 0.00830176 g Die Encapsulant Plastics/polymers Proprietary Material-Other Epoxy resins - 0.00830176 g Die Encapsulant Solvents, additives, and other materials Carbon Black 1333-86-4 0.00083028 Die Encapsulant Solvents, additives, and other materials Other organic phosphorous compounds - Die Encapsulant Plastics/polymers Proprietary Material-Other phenolic resins Die Encapsulant Glass Silica, vitreous Solder Balls - Lead Free Exemption SubstanceWeight UoM SubPart PPM SubPart% ARTICLEPPM ARTICLE% 30896 3.0896 16888 1.6888 30896 3.0896 16888 1.6888 g 3090 0.309 1689 0.1689 0.00083028 g 3090 0.309 1689 0.1689 - 0.01521971 g 56642 5.6642 30962 3.0962 60676-86-0 0.23521621 g 875386 87.5386 478542 47.8542 g 0.0366 g Solder Balls - Lead Free Metals Aluminum, metal 7429-90-5 0.00000113 g 31 0.0031 2 0.0002 Solder Balls - Lead Free Antimony/Antimony Compounds Antimony (metallic) 7440-36-0 0.00000458 g 125 0.0125 9 0.0009 Solder Balls - Lead Free Arsenic/Arsenic Compounds Arsenic 7440-38-2 0.00000271 g 74 0.0074 5 0.0005 Solder Balls - Lead Free Bismuth/Bismuth Compounds Bismuth 7440-69-9 0.00000684 g 187 0.0187 13 0.0013 Solder Balls - Lead Free Cadmium/Cadmium Compounds Cadmium 7440-43-9 0.00000044 g 12 0.0012 0 0 Solder Balls - Lead Free Metals Copper, metal 7440-50-8 0.00018278 g 4994 0.4994 371 0.0371 Solder Balls - Lead Free Metals Gold, metal 7440-57-5 0.00000227 g 62 0.0062 4 0.0004 Solder Balls - Lead Free Metals Indium, metal 7440-74-6 0.00000227 g 62 0.0062 4 0.0004 Solder Balls - Lead Free Solvents, additives, and other materials Sulfur 7704-34-9 0.00000022 g 6 0.0006 0 0 Solder Balls - Lead Free Solvents, additives, and other materials Phosphorus, elemental (not containing red allotrope) 7723-14-0 0.00000227 g 62 0.0062 4 0.0004 Solder Balls - Lead Free Metals Iron, metal 7439-89-6 0.00000458 g 125 0.0125 9 0.0009 Solder Balls - Lead Free Lead/Lead Compounds Lead 7439-92-1 0.00001373 g 375 0.0375 27 0.0027 Solder Balls - Lead Free Nickel (external applications only) Nickel 7440-02-0 0.00000113 g 31 0.0031 2 0.0002 Solder Balls - Lead Free Metals Silver, metal 7440-22-4 0.00146228 g 39953 3.9953 2974 0.2974 Solder Balls - Lead Free Metals Tin, metal 7440-31-5 0.03491207 g 953882 95.3882 71024 7.1024 Solder Balls - Lead Free Metals Zinc, metal 7440-66-6 0.0000007 g 19 0.0019 1 0.0001 Non-Conductive Epoxy/Adhesive 0.009 g Non-Conductive Epoxy/Adhesive Plastics/polymers Proprietary Material-Other Epoxy resins - 0.000675 g 75000 7.5 1373 0.1373 Non-Conductive Epoxy/Adhesive Plastics/polymers Crosslinked acrylate polymer 25767-43-5 0.0018 g 200000 20 3661 0.3661 Non-Conductive Epoxy/Adhesive Plastics/polymers Other polymers - 0.000675 g 75000 7.5 1373 0.1373 Non-Conductive Epoxy/Adhesive Plastics/polymers Proprietary Material-Other polymers - 0.0018 g 200000 20 3661 0.3661 Non-Conductive Epoxy/Adhesive Glass Silica, vitreous 60676-86-0 0.00405 g 450000 45 8239 0.8239 Non-Conductive Epoxy/Adhesive 0.009 g Non-Conductive Epoxy/Adhesive Plastics/polymers Proprietary Material-Other Epoxy resins - 0.000675 g 75000 7.5 1373 0.1373 Non-Conductive Epoxy/Adhesive Plastics/polymers Crosslinked acrylate polymer 25767-43-5 0.0018 g 200000 20 3661 0.3661 Non-Conductive Epoxy/Adhesive Plastics/polymers Other polymers - 0.000675 g 75000 7.5 1373 0.1373 Non-Conductive Epoxy/Adhesive Plastics/polymers Proprietary Material-Other polymers - 0.0018 g 200000 20 3661 0.3661 Non-Conductive Epoxy/Adhesive Glass Silica, vitreous 60676-86-0 0.00405 g 450000 45 8239 0.8239 1000000 100 3458 0.3458 Bonding Wire 0.0017 Bonding Wire Organic Substrate, Halogen-fre g Metals Gold, metal 7440-57-5 0.0017 0.15785 g g Organic Substrate, Halogen-fre Solvents, additives, and other materials Other Aromatic hydrocarbon compounds - 0.00121939 g 7725 0.7725 2480 0.248 Organic Substrate, Halogen-fre Metals Barium sulfate 7727-43-7 0.00877804 g 55610 5.561 17857 1.7857 Organic Substrate, Halogen-fre Metals Copper, metal 7440-50-8 0.05566864 g 352668 35.2668 113251 11.3251 Organic Substrate, Halogen-fre Metals Gold, metal 7440-57-5 0.00222553 g 14099 1.4099 4527 0.4527 Organic Substrate, Halogen-fre Metals Other nickel compounds - 0.01699492 g 107665 10.7665 34574 3.4574 Organic Substrate, Halogen-fre Solvents, additives, and other materials Other organic phosphorous compounds - 0.01984948 g 125749 12.5749 40381 4.0381 Organic Substrate, Halogen-fre Plastics/polymers Other polymers - 0.01192383 g 75539 7.5539 24257 2.4257 Organic Substrate, Halogen-fre Glass Other silica compounds - 0.04119017 g 260945 26.0945 83796 8.3796 Silicon Semiconductor Die 0.0087 g Silicon Semiconductor Die Solvents, additives, and other materials Other miscellaneous substances (less than 5%). - 0.000174 g 20000 2 353 0.0353 Silicon Semiconductor Die Glass Silicon, doped - 0.008526 g 980000 98 17345 1.7345 LINKS MCD LINK Freescale website GENERAL ENVIRONMENTAL COMPLIANCE LINKS RoHS signed letter China RoHS REACH signed letter ELV signed letter Conflict Minerals statement FREESCALE ENVIRONMENTAL INFORMATION EPP website FAQ Technical Service Request LINKS TO BLANK IPC1752 FORMS Blank IPC1752 v1.1 Form http://www.freescale.com http://www.freescale.com/files/abstract/corporate/ehs_epp/ENV_ROHS_Freescale_Response.pdf http://www.freescale.com/chinarohs http://www.freescale.com/files/abstract/corporate/ehs_epp/ENV_REACH_Freescale_Response.pdf http://www.freescale.com/files/abstract/corporate/ehs_epp/ENV_ELV_Freescale_Reponse.pdf http://www.freescale.com/files/abstract/corporate/ehs_epp/ENV_CONFLICT_METAL_Freescale_Response.pdf http://www.freescale.com/epp http://www.freescale.com/webapp/sps/site/overview.jsp?code=ENVIRON_FAQ https://www.freescale.com/webapp/servicerequest.create_SR.framework?defaultCategory=Hardware Product Support&defaultTopic=Environmentally Preferred Prod http://www.freescale.com/files/abstract/corporate/ehs_epp/IPC-1752-2_v1.1_MCD_Template.pdf IPC1752 XML LINKS http://www.freescale.com/mcds/MCF5275LCVM133_IPC1752_v11.xml http://www.freescale.com/mcds/MCF5275LCVM133_IPC1752A.xml