DSPB56720AG.pdf

Freescale Semiconductor Inc
PART INFORMATION
Mfg Item Number
Mfg Item Name
DSPB56720AG
LQFP 144 20SQ1.4P0.5 C90
SUPPLIER
Company Name
Company Unique ID
Response Date
Response Document ID
Contact Name
Contact Title
Contact Phone
Contact Email
Authorized Representative
Representative Title
Representative Phone
Representative Email
URL for Additional Information
Freescale Semiconductor Inc
14-141-7928
2016-02-22
8286K00023D188A1.17
Freescale Semiconductor Inc
Product Technical Support
1-800-521-6274
support@freescale.com
Daniel Binyon
EPP Customer Response
512-895-3406
eppanlst@freescale.com
www.freescale.com
DECLARATION
EU RoHS
Pb Free
HalogenFree
Plating Indicator
EU RoHS Exemption(s)
MANUFACTURING
Mfg Item Number
Mfg Item Name
Version
Weight
UoM
Unit Volume
J-STD-020 MSL Rating
Peak Processing Temperature
Max Time at Peak Temperature
Number of Processing Cycles
Yes
Yes
Yes
e3
DSPB56720AG
LQFP 144 20SQ1.4P0.5 C90
ALL
1.319100
g
EACH
3
260 C
40 seconds
3
RoHS
RoHS Directive
RoHS Definition
RoHS Legal Definition
RoHS Declaration
Supplier Acceptance
Signature
Exemption List Version
List of Freescale Accepted
Exemptions
2011/65/EU
RoHS Definition: Quantity limit of 0.1% by mass (1000 PPM) of homogeneous material for: Lead (Pb), Mercury, Hexavalent Chromium, Polybrominated Biphenyls (PBB),
Polybrominated Diphenyl Ethers (PBDE) and quantity limit of 0.01% by mass (100 PPM) of homogeneous material of Cadmium
Please indicate whether any homogeneous material (as defined by the RoHS Directive, EU 2011/65/EU and implemented by the laws of the European Union member states)
of the part(s) identified on this form contains lead, mercury, cadmium, hexavalent chromium, polybrominated biphenyls and/or polybrominated diphenyl ethers (each a RoHS
restricted substance) in excess of the applicable quantity limit identified below. If a homogeneous material within the part(s) contains a RoHS restricted substance in excess
of an applicable quantity limit, please indicate below which, if any, RoHS exemption you believe may apply. If the part is an assembly with lower level components, the
declaration shall encompass all such components. Supplier certifies that it gathered the information it provides in this form using appropriate methods to ensure its accuracy
and that such information is true and correct to the best of its knowledge and belief, as of the date that Supplier completes this form. Supplier acknowledges that Company
will rely on this certification in determining the compliance of its products with European Union member state laws that implement the RoHS Directive. Company
acknowledges that Supplier may have relied on information provided by others in completing this form, and that Supplier may not have independently verified such
information. However, in situations where Supplier has not independently verified information provided by others, Supplier agrees that, at a minimum, its suppliers have
provided certifications regarding their contributions to the part(s), and those certifications are at least as comprehensive as the certification in this paragraph. If the Company
and the Supplier enter into a written agreement with respect to the identified part(s),the terms and conditions of that agreement, including any warranty rights and/or
remedies provided as part of that agreement, will be the sole and exclusive source of the Suppliers liability and the Companys remedies for issues that arise regarding
information the Supplier provides in this form. In the absence of such written agreement, the warranty rights and/or remedies of Suppliers Standard Terms and Conditions of
Sale applicable to such part(s) shall apply.
1 - Item(s) do not contain RoHS restricted substances per the definition above
Accepted
Daniel Binyon
2012/51/EU
6(a) : Lead as an alloying element in steel for machining purposes and in galvanized steel containing up to 0.35% lead by weight
6(b) : Lead as an alloying element in aluminium containing up to 0.4% lead by weight
6(c) : Copper alloy containing up to 4% lead by weight
7(a) : Lead in high melting temperature type solders (i.e. lead-based alloys containing 85% by weight or more lead)
7(b) : Lead in solders for servers, storage and storage array systems, network infrastructure equipment for switching, signaling, transmission, and network management for
telecommunications
7(c)-I : Electrical and electronic components containing lead in a glass or ceramic other than dielectric ceramic in capacitors, e.g. piezoelectronic devices, or in a glass or
ceramic matrix compound
7(c)-II : Lead in dielectric ceramic in capacitors for a rated voltage of 125 V AC or 250 V DC or higher
7(c)-III : Lead in dielectric ceramic in capacitors for a rated voltage of less than 125 V AC or 250 V DC
7(c)-IV : Lead in PZT based dielectric ceramic materials for capacitors being part of integrated circuits or discrete semiconductors
15 : Lead in solders to complete a viable electrical connection between semiconductor die and carrier within integrated circuit flip chip packages
MATERIAL COMPOSITION
Homogeneous Material
Weight
SubstanceClass
Substance
CAS
Lead Frame Plating
0.0132
Lead Frame Plating
Lead/Lead Compounds
Lead
7439-92-1
0.00000264
g
Lead Frame Plating
Metals
Tin, metal
7440-31-5
0.01319736
g
Silicon Semiconductor Die
Exemption
SubstanceWeight
UoM SubPart
PPM
SubPart%
ARTICLEPPM
ARTICLE%
200
0.02
2
0.0002
999800
99.98
10004
1.0004
g
0.1287
g
Silicon Semiconductor Die
Solvents, additives, and other materials
Other miscellaneous substances (less than 5%).
-
0.002574
g
20000
2
1951
0.1951
Silicon Semiconductor Die
Glass
Silicon, doped
-
0.126126
g
980000
98
95615
9.5615
Epoxy Die Attach
0.0126
g
Epoxy Die Attach
Plastics/polymers
2,2'-[methylenebis(phenyleneoxymethylene)]bisoxirane
39817-09-9
0.00378
g
300000
30
2865
0.2865
Epoxy Die Attach
Metals
Silver, metal
7440-22-4
0.00756
g
600000
60
5731
0.5731
Epoxy Die Attach
Solvents, additives, and other materials
Dodecenyl succinic anhydride
25377-73-5
0.00126
g
100000
10
955
0.0955
Copper Lead Frame
0.1858
g
Copper Lead Frame
Metals
Copper, metal
7440-50-8
0.17910283
g
963955
96.3955
135776
13.5776
Copper Lead Frame
Solvents, additives, and other materials
Phosphorus, elemental (not containing red allotrope)
7723-14-0
0.00015329
g
825
0.0825
116
0.0116
Copper Lead Frame
Metals
Iron, metal
7439-89-6
0.0043663
g
23500
2.35
3310
0.331
Copper Lead Frame
Lead/Lead Compounds
Lead
7439-92-1
0.00003159
g
170
0.017
23
0.0023
Copper Lead Frame
Metals
Silver, metal
7440-22-4
0.001858
g
10000
1
1408
0.1408
Copper Lead Frame
Metals
Tin, metal
7440-31-5
0.00005574
g
300
0.03
42
0.0042
Copper Lead Frame
Metals
Zinc, metal
7440-66-6
0.00023225
g
1250
0.125
176
0.0176
Bonding Wire, PdCu
0.0032
g
Bonding Wire, PdCu
Metals
Copper, metal
7440-50-8
0.0031392
g
981000
98.1
2379
0.2379
Bonding Wire, PdCu
Metals
Gold, metal
7440-57-5
0.0000032
g
1000
0.1
2
0.0002
Bonding Wire, PdCu
Metals
Palladium, metal
7440-05-3
0.0000576
g
18000
1.8
43
0.0043
Die Encapsulant, Halogen-free
0.9756
g
Die Encapsulant, Halogen-free
Solvents, additives, and other materials
Acrylonitrile/Butadiene copolymer, carboxyl terminated
(26/74)
68891-46-3
0.0009756
g
1000
0.1
739
0.0739
Die Encapsulant, Halogen-free
Plastics/polymers
Proprietary Material-Other Epoxy resins
-
0.0595116
g
61000
6.1
45115
4.5115
Die Encapsulant, Halogen-free
Solvents, additives, and other materials
Carbon Black
1333-86-4
0.0039024
g
4000
0.4
2958
0.2958
Die Encapsulant, Halogen-free
Plastics/polymers
Proprietary Material-Other phenolic resins
-
0.0380484
g
39000
3.9
28844
2.8844
Die Encapsulant, Halogen-free
Glass
Silicon dioxide
7631-86-9
0.068292
g
70000
7
51771
5.1771
Die Encapsulant, Halogen-free
Glass
Silica, vitreous
60676-86-0
0.80487
g
825000
82.5
610175
61.0175
LINKS
MCD LINK
NXP website
GENERAL ENVIRONMENTAL
COMPLIANCE LINKS
RoHS signed letter
China RoHS
REACH signed letter
ELV signed letter
Conflict Minerals statement
NXP ENVIRONMENTAL
INFORMATION
Environmental Compliance
website
FAQ
Technical Service Request
LINKS TO BLANK IPC1752
FORMS
Blank IPC1752 v1.1 Form
http://www.nxp.com
http://www.nxp.com/files/corporate/doc/support_info/NXP-ROHS-DECLARATION.pdf
http://www.nxp.com/about/corporate-responsibility/environmental-compliance-organization/china-rohs:ENV_CHINA_ROHS_STRATEGY
http://www.nxp.com/files/corporate/doc/support_info/NXP-REACH-STATEMENT.pdf
http://www.nxp.com/files/corporate/doc/support_info/NXP-ELV-STATEMENT.pdf
http://www.nxp.com/files/corporate/doc/support_info/NXP-STATEMENT-CONFLICT-MINERALS.pdf
http://www.nxp.com/about/corporate-responsibility/environmental-compliance-organization:ABUENVPRFPRDX
http://www.nxp.com/about/corporate-responsibility/environmental-compliance-organization/eco-product-faqs:ENVIRON_FAQ
http://www.nxp.com/support/sales-and-support:SUPPORTHOME
http://www.NXP.com/files/abstract/corporate/ehs_epp/IPC-1752-2_v1.1_MCD_Template.pdf
IPC1752 XML LINKS
http://www.freescale.com/mcds/DSPB56720AG_IPC1752_v11.xml
http://www.freescale.com/mcds/DSPB56720AG_IPC1752A.xml