16L - SOIC 150 MILS PB-FREE Package Material Declaration Datasheet.pdf

16L – SOIC 150mils
Pb-Free Package
PACKAGE MATERIAL DECLARATION DATASHEET
Cypress Package Code
Package Weight – Site 1
Package Weight – Site 3
SZ
B1: 150.0201 mg
B2: 150.1999 mg
B3: 149.5250 mg
B4: 148.3400 mg
B5: 149.9999 mg
B1: 166.0797 mg
B2: 161.2638 mg
Body Size (mil/mm)
Package Weight – Site 2
150 mils
B1: 158.9900 mg
B2: 152.8306 mg
Package Weight – Site 4
B1: 135.9018 mg
SUMMARY
The 16L-SOIC package is qualified at three assembly sites. Packages from different assembly sites are
likely to have different materials composition. However, Cypress guarantees that as long as products are
being ordered with a Cypress Part Number containing an “X” (e.g. CY7C1328G-133AXI, CY2308SXC1HT) they meet the requirement of RoHS.
ASSEMBLY Site 1: Cypress Manufacturing Limited (CML)
Package Qualification Report # 023407, 121408, 140805, 143003 (Note 1)
I. DECLARATION OF PACKAGED UNITS
A. BANNED SUBSTANCES
Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU
RoHS. Listed in the table below are materials that are neither contained nor intentionally added to this
product.
Substances / Compounds
Cadmium and Cadmium Compounds
Hexavalent Chromium and its Compounds
Lead and Lead Compounds
Mercury and Mercury Compounds
Polybrominated Biphenyls (PBB)
Polybrominated Diphenylethers (PBDE)
Asbestos
Azo colorants
Ozone Depleting Substances
Polychlorinated Biphenyls (PCBs)
Polychlorinated Napthalenes
Radioactive Substances
Shortchain Chlorinated Paraffins
Tributyl Tin (TBT) and Triphenyl Tin (TPT)
Tributyl Tin Oxide (TBTO)
Formaldehyde
Weight by
mg
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
PPM
Analysis Report
Link/s
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
0
0
0
0
0
0
0
0
0
0
CoA-SZ16CML
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to
report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material
information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-04308 Rev. *R
Page 1 of 20
16L – SOIC 150mils
Pb-Free Package
B. MATERIAL COMPOSITION (Note 3)
B1. NiPdAu with Standard Molding Compound
Material
Lead frame
Lead Finish
Die Attach
Die
Wire
Purpose of
Use
Base Material
External
Plating
Adhesive
Circuit
Interconnect
Mold Compound
Encapsulation
Substance
Composition
Cu
Fe
P
Zn
Ni
Pd
Au
Ag
Bismaleimide
Polymer
Methacrylate
Acylate ester
Organic
Peroxide
Si
Au
Fused Silica
Solid Epoxy
Resin
Phenol Resin
Antimony
Trioxide
Crystalline
Silica
Carbon Black
77.3836
1.9066
0.0557
0.0952
0.1875
0.0095
0.0030
0.3193
0.0450
0.0246
0.0083
0.0083
% weight of
substance
per
Homogenou
s material
97.4100%
2.4000%
0.0701%
0.1199%
93.7734%
4.7262%
1.5004%
77.9773%
10.9930%
6.0095%
2.0154%
2.0154%
515,822
12,709
371
635
1,250
63
20
2,128
300
164
55
55
51.5822%
1.2709%
0.0371%
0.0635%
0.1250%
0.0063%
0.0020%
0.2128%
0.0300%
0.0164%
0.0055%
0.0055%
0.0041
0.9894%
27
0.0027%
5.7300
0.7237
46.9382
100.0000%
100.0000%
73.9001%
38,195
4,824
312,879
3.8195%
0.4824%
31.2879%
6.3516
10.0000%
42,338
4.2338%
6.9867
11.0000%
46,572
4.6572%
0.8257
1.3000%
5,504
0.5504%
14808-60-7
1.9054
2.9999%
12,701
1.2701%
1333-86-4
0.5081
0.8000%
3,387
0.3387%
% Total:
100.0000%
CAS Number
7440-50-8
7439-89-6
7723-14-0
7440-66-6
7440-02-0
7440-05-3
7440-57-5
7440-22-4
Trade Secret
Trade Secret
Trade Secret
Trade Secret
Trade Secret
7440-21-3
7440-57-5
60676-86-0
Trade Secret
Trade Secret
1309-64-4
Package Weight (mg):
Weight by
mg
150.0201
% weight of
substance
per package
PPM
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to
report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material
information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-04308 Rev. *R
Page 2 of 20
16L – SOIC 150mils
Pb-Free Package
B2. NiPdAu using Green Molding Compound
Material
Purpose of
Use
Lead frame
Base Material
Lead Finish
External
Plating
Die Attach
Adhesive
Substance
Composition
Cu
Fe
P
Zn
Ni
Pd
Au
Ag
Proprietary
bismaleimide
Proprietary
polymer
Methacrylate
Acrylate ester
Organic
peroxide
CAS Number
7440-50-8
7439-89-6
7723-14-0
7440-66-6
7440-02-0
7440-05-3
7440-57-5
7440-22-4
Trade Secret
Trade Secret
Trade Secret
Trade Secret
Trade Secret
Die
Circuit
Si
7440-21-3
Wire
Interconnect
Au
7440-57-5
Mold
Compound
Encapsulation
SiO2
Phenol Resin
Epoxy Resin
60676-86-0
Trade Secret
Trade Secret
Package Weight (mg):
59.0846
1.4557
0.0425
0.0728
0.9115
0.0164
0.0165
0.1595
% Weight of
Substance
per
Homogeneo
us
Material
97.4100
2.4000
0.0700
0.1200
96.5204
1.7370
1.7427
80.0000
393,373
9,692
283
485
6,069
109
110
1,062
39.3373
0.9692
0.0283
0.0485
0.6069
0.0109
0.0110
0.1062
0.0179
9.0000
119
0.0119
0.0100
0.0040
0.0040
5.0000
2.0000
2.0000
66
27
27
0.0066
0.0027
0.0027
0.0040
2.0000
27
18,579
0.0027
1.8579
8,420
0.8420
499,782
28,078
33,693
49.9782
2.8078
3.3693
%Total:
100.0000%
Weight by
mg
2.7905
1.2647
75.0673
4.2173
5.0607
150.1999
100.00
100.00
89.0000
5.0000
6.0000
PPM
% Weight of
Substance
per package
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to
report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material
information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-04308 Rev. *R
Page 3 of 20
16L – SOIC 150mils
Pb-Free Package
B3. NiPdAu using Green Molding Compound and Copper Wire
Material
Purpose of
Use
Lead frame
Base Material
Lead Finish
External
Plating
Die Attach
Adhesive
Die
Wire
Circuit
Interconnect
Mold
Compound
Encapsulation
Substance
Composition
Cu
Fe
P
Zn
Ni
Pd
Au
Ag
Proprietary
bismaleimide
Proprietary
polymer
Methacrylate
Acrylate ester
Organic
peroxide
Si
Cu
SiO2
Phenol Resin
Epoxy Resin
59.0846
1.4557
0.0425
0.0728
0.9115
0.0164
0.0165
0.1595
% Weight of
Substance
per
Homogeneou
s
Material
97.4100%
2.4000%
0.0700%
0.1200%
96.5163%
1.7366%
1.7471%
80.0000%
395,149
9,735
284
487
6,096
110
110
1,067
39.5149%
0.9735%
0.0284%
0.0487%
0.6096%
0.0110%
0.0110%
0.1067%
Trade Secret
0.0179
9.0000%
120
0.0120%
Trade Secret
0.0100
5.0000%
67
0.0067%
Trade Secret
Trade Secret
0.0040
0.0040
2.0000%
2.0000%
27
27
0.0027%
0.0027%
Trade Secret
0.0040
2.0000%
27
0.0027%
7440-21-3
7440-50-8
60676-86-0
Trade Secret
Trade Secret
2.7905
0.5898
75.0673
4.2173
5.0607
100.0000%
100.0000%
89.0000%
5.0000%
6.0000%
18,662
3,944
502,038
28,205
33,845
1.8662%
0.3944%
50.2038%
2.8205%
3.3845%
%Total:
100.0000%
CAS Number
7440-50-8
7439-89-6
7723-14-0
7440-66-6
7440-02-0
7440-05-3
7440-57-5
7440-22-4
Package Weight (mg):
Weight by
mg
149.5250
PPM
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to
report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material
information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-04308 Rev. *R
Page 4 of 20
% Weight of
Substance
per package
16L – SOIC 150mils
Pb-Free Package
B4. NiPdAu, Green Molding Compound, Copper-Palladium (Cu-Pd)
Material
Purpose of
Use
Lead frame
Base Material
Lead Finish
External
Plating
Die Attach
Adhesive
Die
Circuit
Wire
Interconnect
Mold
Compound
Encapsulation
Substance
Composition
Cu
Ni
Si
Mg
Nickel
Palladium
Gold
Silver
Carbocyclic
acrylate
Bismaleimide
Resin
Acrylate
Additive
Silicon
Copper
Palladium
Silica - SiO2
Epoxy Resin
Phenol Resin
CAS Number
7440-50-8
7440-02-0
7440-21-3
7439-95-4
7440-02-0
7440-05-3
7440-57-5
7440-22-4
Weight by
mg
48.4026
1.8127
0.1454
0.0301
0.7522
0.0005
0.0003
0.3527
Trade Secret
0.0533
Trade Secret
Trade Secret
Trade Secret
7440-21-3
7440-50-8
7440-05-3
60676-86-0
Trade Secret
Trade Secret
0.0206
0.0135
0.0025
1.8530
0.8533
0.0001
85.0090
5.1282
3.9100
Package Weight (mg):
148.3400
% Weight of
Substance
per
Homogeneou
s
Material
96.0544%
3.5973%
0.2885%
0.0597%
99.8938%
0.0664%
0.0398%
79.6882%
326,295
12,220
980
203
5,071
3
2
2,378
32.6295%
1.2220%
0.0980%
0.0203%
0.5071%
0.0003%
0.0002%
0.2378%
12.0425%
359
0.0359%
4.6543%
139
0.0139%
3.0502%
0.5648%
100.0000%
99.9883%
0.0117%
90.3897%
5.4528%
4.1575%
91
17
12,492
5,752
1
573,069
34,571
26,358
0.0091%
0.0017%
1.2492%
0.5752%
0.0001%
57.3069%
3.4571%
2.6358%
%Total:
100.0000%
PPM
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to
report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material
information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-04308 Rev. *R
Page 5 of 20
% Weight of
Substance
per package
16L – SOIC 150mils
Pb-Free Package
B5. NiPdAu-Ag using Au Wire
Material
Purpose of
Use
Lead frame
Base Material
Lead Finish
External
Plating
Die Attach
Adhesive
Die
Wire
Circuit
Interconnect
Mold
Compound
Encapsulation
Cu
Fe
P
Zn
Ni
7440-50-8
7439-89-6
7723-14-0
7440-66-6
7440-02-0
48.1067
1.1853
0.0346
0.0593
0.5928
% Weight of
Substance
per
Homogeneou
s
Material
97.4100%
2.4000%
0.0700%
0.1200%
96.5204%
Pd
7440-05-3
Au
Ag
7440-57-5
7440-22-4
7440-22-4
0.0107
0.0080
0.0027
0.0885
1.7370%
1.3070%
0.4357%
80.0000%
71
53
18
590
0.0071%
0.0054%
0.0018%
0.0590%
0.0100
9.0000%
67
0.0066%
0.0055
0.0022
0.0022
5.0000%
2.0000%
2.0000%
37
15
15
0.0037%
0.0015%
0.0015%
0.0022
1.5490
1.5268
86.1639
4.8407
5.8088
2.0000%
100.0000%
100.0000%
89.0000%
5.0000%
6.0000%
15
10,327
10,179
574,426
32,271
38,725
0.0015%
1.0327%
1.0179%
57.4426%
3.2271%
3.8725%
%Total:
100.0000%
Substance
Composition
Ag
Proprietary
bismaleimide
Proprietary
polymer
Methacrylate
Acrylate ester
Organic
peroxide
Si
Au
SiO2
Phenol Resin
Epoxy Resin
CAS Number
Trade Secret
Trade Secret
Trade Secret
Trade Secret
Trade Secret
7440-21-3
7440-57-5
60676-86-0
Trade Secret
Trade Secret
Package Weight (mg):
Weight by
mg
149.9999
PPM
% Weight of
Substance
per package
320,712
7,902
231
395
3,952
32.0711%
0.7902%
0.0230%
0.0395%
0.3952%
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to
report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material
information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-04308 Rev. *R
Page 6 of 20
16L – SOIC 150mils
Pb-Free Package
II. DECLARATION OF PACKAGING / INDIRECT MATERIALS
Type
Tape & Reel
Tube
Others
Material
Cover tape
Carrier tape
Plastic Reel
Plastic Tube
End Plug
Shielding bag
Moisture Barrier bag
Protective Band
Shipping and Inner
Box
Dessicant
Bubble Pack
Lead
PPM
< 2.0
< 2.0
< 2.0
< 5.0
< 5.0
< 2.0
< 2.0
< 2.0
< 10.0
Cadmium
PPM
< 2.0
< 2.0
< 2.0
< 5.0
< 5.0
< 2.0
< 2.0
< 2.0
< 4.0
Cr VI
PPM
< 2.0
< 2.0
< 2.0
< 5.0
< 5.0
< 2.0
< 2.0
< 2.0
< 4.0
Mercury
PPM
< 2.0
< 2.0
< 2.0
< 5.0
< 5.0
< 2.0
< 2.0
< 2.0
< 5.0
PBB
PPM
<5.0
<5.0
<5.0
< 1.0
< 1.0
<5.0
<5.0
<5.0
---------
PBDE
PPM
<5.0
<5.0
<5.0
< 1.0
< 1.0
<5.0
<5.0
<5.0
-----------
< 10.0
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
< 1.0
< 2.0
< 3.0
< 100.0
< 3.0
< 90.0
Analysis Report
(Note2)
CoA-COVT-R
CoA-CART-R
CoA-PLRL-R
CoA-PLTB-R
CoA-EPLG-R
CoA-SBAG –R
CoA-MBBG-R
CoA-PROB-R
CoA-ABOX-R
CoA-DESS-R
CoA-BUBP-R
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to
report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material
information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-04308 Rev. *R
Page 7 of 20
16L – SOIC 150mils
Pb-Free Package
ASSEMBLY Site 2: Amkor Technology Philippines (P1/P2)
Package Qualification Report # 033203 / 124706 (Note1)
A. BANNED SUBSTANCES
Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU
RoHS. Listed in the table below are materials that are neither contained nor intentionally added to this
product.
Substances / Compounds
Cadmium and Cadmium Compounds
Hexavalent Chromium and its Compounds
Lead and Lead Compounds
Mercury and Mercury Compounds
Polybrominated Biphenyls (PBB)
Polybrominated Diphenylethers (PBDE)
Asbestos
Azo colorants
Ozone Depleting Substances
Polychlorinated Biphenyls (PCBs)
Polychlorinated Napthalenes
Radioactive Substances
Shortchain Chlorinated Paraffins
Tributyl Tin (TBT) and Triphenyl Tin (TPT)
Tributyl Tin Oxide (TBTO)
Formaldehyde
Weight by
mg
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
PPM
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
0
0
0
0
0
0
0
0
0
0
Analysis
Report Link/s
CoA-SZ16Amkor
Philippines
(P1/P2)
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to
report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material
information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-04308 Rev. *R
Page 8 of 20
16L – SOIC 150mils
Pb-Free Package
B1: MATERIAL COMPOSITION (Note 3)
USING Au WIRE
Material
Purpose of
Use
Lead frame
Base Material
Lead finish
External Plating
Die Attach
Adhesive
Die
Wire
Mold
Compound
Circuit
Interconnect
Encapsulation
7440-50-8
7439-89-6
7723-14-0
7440-66-6
7440-22-4
7440-31-5
Trade Secret
7440-22-4
Trade Secret
Trade Secret
Trade Secret
55.2800
1.3400
0.0200
0.0600
0.5900
2.7300
0.2200
0.7500
0.0300
0.0300
0.0300
% weight of
substance per
Homogenous
material
96.5000
2.3500
0.0500
0.1000
1.0000
100.0000
21.0000
70.0000
3.0000
3.0000
3.0000
7440-21-3
7440-57-5
Trade Secret
60676-86-0
Trade Secret
1309-64-4
3.0400
0.3000
6.6100
82.3000
2.8300
2.8300
100.0000
100.0000
7.0000
87.0000
3.0000
3.0000
Package Weight (mg):
158.9900
Substance
Composition
Cu
Fe
P
Zn
Ag
Pure Sn
Resin
Ag
Metal Oxide
Amine
Gamma
Butyrolactone
Si
Au
Epoxy Resin
SiO2
Phenol Resin
Antimony
Trioxide
CAS Number
Weight by
mg
PPM
34,7700
8,400
100
400
3,700
17,200
1,400
4,700
200
200
200
34.7700%
0.8400%
0.0100%
0.0400%
0.3700%
1.7200%
0.1400%
0.4700%
0.0200%
0.0200%
0.0200%
19,100
1,900
41,600
517,600
17,800
17,800
1.9100%
0.1900%
4.1600%
51.7600%
1.7800%
1.7800%
% Total:
100.0000%
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to
report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material
information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-04308 Rev. *R
% weight of
substance
per package
Page 9 of 20
16L – SOIC 150mils
Pb-Free Package
B2: MATERIAL COMPOSITION (Note 3)
USING Cu WIRE
Material
Lead frame
Lead Finish
Die Attach
Die
Wire
Purpose of
Use
Base Material
External
Plating
Adhesive
Circuit
Interconnect
Mold
Compound
Encapsulation
Copper (Cu)
Iron (Fe)
Zinc (Z)
Phosphorus (P)
Silver (Ag)
7440-50-8
7439-89-6
7440-66-6
7723-14-0
7440-22-4
48.3259
1.1902
0.0595
0.0149
0.1340
% weight of
substance
per
Homogenou
s
material
97.1874
2.3935
0.1197
0.0299
0.2695
Tin (Sn)
7440-31-5
2.7290
100.0000
17,856
1.7856
Trade Secret
Trade Secret
7440-22-4
Trade Secret
0.0593
0.0339
0.6518
0.0339
7.0000
4.0000
77.0000
4.0000
388
222
4,265
222
0.0388
0.0222
0.4265
0.0222
Trade Secret
0.0339
4.0000
222
0.0222
Trade Secret
0.0339
4.0000
222
0.0222
7440-21-3
7440-50-8
3.3630
0.0915
100.0000
100.0000
22,004
599
2.2004
0.0599
Trade Secret
7.2057
7.5000
47,148
4.7148
60676-86-0
1333-86-4
82.6253
0.4804
86.0000
0.5000
540,633
3,143
54.0633
0.3143
Trade Secret
1.9215
2.0000
12,573
1.2573
Trade Secret
3.8430
4.0000
25,146
2.5146
Package Weight (mg):
152.8306
% Total:
100.0000%
Substance
Composition
Epoxy Resin A
Epoxy Resin B
Silver (Ag)
Lactone
Polyoxypropylenedi
amine
2,6-Diglycidyl
phenyl allyl ether
oligomer
Silicon
Copper (Cu)
Multi-aromatic
Resin
SiO2 Filler
Carbon Black
Epoxy Cresol
Novolac
Phenol Resin
CAS Number
Weight by mg
PPM
% weight of
substance
per package
316,206
7,788
389
97
877
31.6206
0.7788
0.0389
0.0097
0.0877
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to
report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material
information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-04308 Rev. *R
Page 10 of 20
16L – SOIC 150mils
Pb-Free Package
II. DECLARATION OF PACKAGING / INDIRECT MATERIALS
Type
Tape & Reel
Tube
Others
Material
Cover tape
Carrier tape
Plastic Reel
Plastic Tube
End Plug
Shielding bag
Moisture Barrier bag
Protective Band
Shipping and Inner
Box
Dessicant
Bubble Pack
Lead
PPM
< 2.0
< 2.0
< 2.0
< 5.0
< 5.0
< 2.0
< 2.0
< 2.0
< 10.0
Cadmium
PPM
< 2.0
< 2.0
< 2.0
< 5.0
< 5.0
< 2.0
< 2.0
< 2.0
< 4.0
Cr VI
PPM
< 2.0
< 2.0
< 2.0
< 5.0
< 5.0
< 2.0
< 2.0
< 2.0
< 4.0
Mercury
PPM
< 2.0
< 2.0
< 2.0
< 5.0
< 5.0
< 2.0
< 2.0
< 2.0
< 5.0
PBB
PPM
<5.0
<5.0
<5.0
< 1.0
< 1.0
<5.0
<5.0
<5.0
---------
PBDE
PPM
<5.0
<5.0
<5.0
< 1.0
< 1.0
<5.0
<5.0
<5.0
-----------
< 10.0
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
< 1.0
< 2.0
< 3.0
< 100.0
< 3.0
< 90.0
Analysis Report
(Note2)
CoA-COVT-R
CoA-CART-R
CoA-PLRL-R
CoA-PLTB-R
CoA-EPLG-R
CoA-SBAG –R
CoA-MBBG-R
CoA-PROB-R
CoA-ABOX-R
CoA-DESS-R
CoA-BUBP-R
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to
report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material
information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-04308 Rev. *R
Page 11 of 20
16L – SOIC 150mils
Pb-Free Package
ASSEMBLY Site 3: Orient Semiconductor Electronics Taiwan (OSET)
Package Qualification Report # 050701 / 120409 (Note1)
A. BANNED SUBSTANCES
Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU
RoHS. Listed in the table below are materials that are neither contained nor intentionally added to this
product.
Substances / Compounds
Cadmium and Cadmium Compounds
Hexavalent Chromium and its Compounds
Lead and Lead Compounds
Mercury and Mercury Compounds
Polybrominated Biphenyls (PBB)
Polybrominated Diphenylethers (PBDE)
Asbestos
Azo colorants
Ozone Depleting Substances
Polychlorinated Biphenyls (PCBs)
Polychlorinated Napthalenes
Radioactive Substances
Shortchain Chlorinated Paraffins
Tributyl Tin (TBT) and Triphenyl Tin (TPT)
Tributyl Tin Oxide (TBTO)
Formaldehyde
Weight by
mg
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
PPM
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
0
0
0
0
0
0
0
0
0
0
Analysis
Report Link/s
CoA-SZ16OSET
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to
report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material
information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-04308 Rev. *R
Page 12 of 20
16L – SOIC 150mils
Pb-Free Package
B. MATERIAL COMPOSITION (Note 3)
B1. USING GOLD WIRE
Material
Purpose of
Use
Lead frame
Base Material
Lead finish
External Plating
Die Attach
Die
Wire
Mold
Compound
Adhesive
Circuit
Interconnect
Encapsulation
Substance
Composition
Cu
Fe
P
Zn
Pb
Polyimide
NBR
Bismaleimide
Phenol resin
Ni
Pd
Au
Acrylic resin
Polybutadiene
derivative
Butadiene
copolymer
Epoxy Resin
Acrylate
Peroxide
Additive
Silver (Metal
powder)
Si
Au
Epoxy resin 1
Epoxy resin 2
Phenol resin
Aromatic
Phosphate
Carbon black
Silica
7440-50-8
7439-89-6
7723-14-0
7440-66-6
7439-92-1
Trade Secret
9003-18-3
79922-55-7
28453-20-5
7440-02-0
7440-05-3
7440-57-5
Trade Secret
Trade Secret
48.2567
1.1773
0.0414
0.0626
0.0012
0.0468
0.0078
0.0078
0.0066
0.4745
0.0086
0.0086
0.0196
0.0126
% weight of
substance per
Homogenous
material
97.2755
2.3733
0.0834
0.1262
0.0023
0.0944
0.0157
0.0157
0.0134
96.5200
1.7400
1.7400
8.5199
5.4874
Trade Secret
0.0023
1.0108
14
0.0014
Trade Secret
Trade Secret
Trade Secret
7440-22-4
0.0047
0.0091
0.0012
0.0035
0.1770
2.0217
3.9711
0.5054
1.5162
76.9675
28
55
7
21
1,066
0.0028
0.0055
0.0007
0.0021
0.1066
7440-21-3
7440-57-5
158117-90-9
85954-11-6
26834-02-6
139189-30-3
6.1900
0.3599
3.8220
2.1840
3.8220
1.6380
100.0000
100.0000
3.5000
2.0000
3.5000
1.5000
37,271
2,167
23,013
13,150
23,013
9,863
3.7271
0.2167
2.3013
1.3150
2.3013
0.9863
1333-86-4
60676-86-0
0.2184
97.5155
0.2000
89.3000
1,315
587,161
0.1315
58.7161
% Total:
100.0000%
CAS Number
Package Weight (mg):
Weight by
mg
166.0797
% weight of
substance
per package
PPM
290,564
7,089
249
377
7
282
47
47
40
2,857
52
52
118
76
29.0564
0.7089
0.0249
0.0377
0.0007
0.0282
0.0047
0.0047
0.0040
0.2857
0.0052
0.0052
0.0118
0.0076
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to
report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material
information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-04308 Rev. *R
Page 13 of 20
16L – SOIC 150mils
Pb-Free Package
B2. USING COPPER WIRE
Material
Purpose of
Use
Lead frame
Base Material
Lead finish
External Plating
Die Attach
Adhesive
Die
Wire
Mold
Compound
Circuit
Interconnect
Encapsulation
Substance
Composition
Cu
Fe
P
Zn
Pb
Ni
Pd
Au
Silver
Epoxy resin A
Epoxy resin B
Diluent A
Diluent B
Phenolic
Hardener
Dicyandiamide
Organic
peroxide
Si
Copper
Epoxy resin A
Epoxy,Cresol
Novolac
Phenol resin
Metal Hydroxide
Carbon Black
Silica Fused A
Silica Fused B
Silica,crystalline
7440-50-8
7439-89-6
7723-14-0
7440-66-6
7439-92-1
7440-02-0
7440-05-3
7440-57-5
7440-22-4
9003-36-5
Trade Secret
Trade Secret
Trade Secret
Trade Secret
45.7365
1.1143
0.0391
0.0593
0.0047
0.4201
0.0379
0.0066
0.0441
0.0024
0.0036
0.0024
0.0036
0.0030
% weight of
substance per
Homogenous
material
97.4071
2.3733
0.0833
0.1262
0.0101
90.4082
8.1633
1.4286
74.0000
4.0000
6.0000
4.0000
6.0000
5.0000
461-58-5
Trade Secret
0.0003
0.0003
0.5000
0.5000
2
2
0.0002%
0.0002%
7440-21-3
7440-50-8
Trade Secret
29690-82-2
1.2971
0.1157
5.6186
5.6186
100.0000
100.0000
5.0000
5.0000
8,043
717
34,841
34,841
0.8043%
0.0717%
3.4841%
3.4841%
Trade Secret
Trade Secret
1333-86-4
60676-86-0
7631-86-9
14808-60-7
5.6186
5.6186
0.3371
77.9869
11.2373
0.3371
5.0000
5.0000
0.3000
69.4000
10.0000
0.3000
34,841
34,841
2,090
483,598
69,683
2,090
3.4841%
3.4841%
0.2090%
48.3598%
6.9683%
0.2090%
% Total:
100.0000%
CAS Number
Package Weight (mg):
Weight by
mg
161.2638
% weight of
substance
per package
PPM
283,613
6,910
242
368
29
2,605
235
41
273
15
22
15
22
19
28.3613%
0.6910%
0.0242%
0.0368%
0.0029%
0.2605%
0.0235%
0.0041%
0.0273%
0.0015%
0.0022%
0.0015%
0.0022%
0.0019%
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to
report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material
information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-04308 Rev. *R
Page 14 of 20
16L – SOIC 150mils
Pb-Free Package
II. DECLARATION OF PACKAGING / INDIRECT MATERIALS
Type
Tape & Reel
Tube
Others
Material
Cover tape
Carrier tape
Plastic Reel
Plastic Tube
End Plug
Shielding bag
Moisture Barrier bag
Protective Band
Shipping and Inner
Box
Dessicant
Bubble Pack
Lead
PPM
< 2.0
< 2.0
< 2.0
< 5.0
< 5.0
< 2.0
< 2.0
< 2.0
< 10.0
Cadmium
PPM
< 2.0
< 2.0
< 2.0
< 5.0
< 5.0
< 2.0
< 2.0
< 2.0
< 4.0
Cr VI
PPM
< 2.0
< 2.0
< 2.0
< 5.0
< 5.0
< 2.0
< 2.0
< 2.0
< 4.0
Mercury
PPM
< 2.0
< 2.0
< 2.0
< 5.0
< 5.0
< 2.0
< 2.0
< 2.0
< 5.0
PBB
PPM
<5.0
<5.0
<5.0
< 1.0
< 1.0
<5.0
<5.0
<5.0
---------
PBDE
PPM
<5.0
<5.0
<5.0
< 1.0
< 1.0
<5.0
<5.0
<5.0
-----------
< 10.0
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
< 1.0
< 2.0
< 3.0
< 100.0
< 3.0
< 90.0
Analysis Report
(Note2)
CoA-COVT-R
CoA-CART-R
CoA-PLRL-R
CoA-PLTB-R
CoA-EPLG-R
CoA-SBAG –R
CoA-MBBG-R
CoA-PROB-R
CoA-ABOX-R
CoA-DESS-R
CoA-BUBP-R
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to
report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material
information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-04308 Rev. *R
Page 15 of 20
16L – SOIC 150mils
Pb-Free Package
ASSEMBLY Site 4: UTAC Limited Thailand (UTL)
Package Qualification Report # 134506 (Note1)
A. BANNED SUBSTANCES
Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU
RoHS. Listed in the table below are materials that are neither contained nor intentionally added to this
product.
Substances / Compounds
Cadmium and Cadmium Compounds
Hexavalent Chromium and its Compounds
Lead and Lead Compounds
Mercury and Mercury Compounds
Polybrominated Biphenyls (PBB)
Polybrominated Diphenylethers (PBDE)
Asbestos
Azo colorants
Ozone Depleting Substances
Polychlorinated Biphenyls (PCBs)
Polychlorinated Napthalenes
Radioactive Substances
Shortchain Chlorinated Paraffins
Tributyl Tin (TBT) and Triphenyl Tin (TPT)
Tributyl Tin Oxide (TBTO)
Formaldehyde
Weight by
mg
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
PPM
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
0
0
0
0
0
0
0
0
0
0
Analysis
Report Link/s
CoA-SZ16UTAC
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to
report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material
information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-04308 Rev. *R
Page 16 of 20
16L – SOIC 150mils
Pb-Free Package
B1. MATERIAL COMPOSITION (Note 3)
USING COPPER PALLADIUM WIRE
Material
Purpose of
Use
Leadframe
Base Material
Lead Finish
External
Plating
Die Attach
Adhesive
Die
Wire
Circuit
Interconnect
Mold
Compound
Encapsulation
Substance
Composition
Cu
Fe
Zn
P
Ni
Pd
Au
Ag
Silver
Trimethylbicyclo
metharcrylate
Bis-1H-pyrrole
dione
Acrylic acid
Silicon
Copper
Palladium
Silica fused
Epoxy resin
Phenol resin A
Phenol resin B
Carbon black
CAS Number
7440-50-8
7439-89-6
7440-66-6
7723-14-0
7440-02-0
7440-05-3
7440-57-5
7440-22-4
7440-22-4
7534-94-3
3006-93-7
1017237-78-3
7440-21-3
7440-50-8
7440-05-3
60676-86-0
Trade secret
Trade secret
Trade secret
1333-86-4
Package Weight (mg):
49.5513
0.1170
0.0365
0.0330
0.2450
0.0146
0.0176
0.0068
0.2504
0.0686
% Weight of
Substance per
Homogeneous
Material
99.6270%
0.2340%
0.0730%
0.0660%
86.2600%
5.1400%
6.2100%
2.3900%
73.0000
20.0000%
364,611
861
269
243
1,803
107
130
50
1,842
505
% Weight of
Substance
per
Package
36.4611%
0.0861%
0.0269%
0.0243%
0.1803%
0.0107%
0.0130%
0.0050%
0.1842%
0.0505%
0.0223
6.5000%
164
0.0164%
0.0017
2.3350
0.0992
0.0018
70.6359
7.0636
2.6592
2.6592
0.0831
0.5000%
100.0000%
98.2500%
1.7500%
85.0000%
8.5000%
3.2000%
3.2000%
0.1000%
13
17,182
730
13
519,765
51,976
19,567
19,567
611
0.0013%
1.7182%
0.0730%
0.0013%
51.9756%
5.1976%
1.9567%
1.9567%
0.0611%
% Total:
100.0000%
Weight by
mg
135.9018
PPM
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to
report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material
information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-04308 Rev. *R
Page 17 of 20
16L – SOIC 150mils
Pb-Free Package
II. DECLARATION OF PACKAGING / INDIRECT MATERIALS
Type
Tape & Reel
Tube
Others
Material
Cover tape
Carrier tape
Plastic Reel
Plastic Tube
End Plug
Shielding bag
Moisture Barrier bag
Protective Band
Shipping and Inner
Box
Dessicant
Bubble Pack
Lead
PPM
< 2.0
< 2.0
< 2.0
< 5.0
< 5.0
< 2.0
< 2.0
< 2.0
< 10.0
Cadmium
PPM
< 2.0
< 2.0
< 2.0
< 5.0
< 5.0
< 2.0
< 2.0
< 2.0
< 4.0
Cr VI
PPM
< 2.0
< 2.0
< 2.0
< 5.0
< 5.0
< 2.0
< 2.0
< 2.0
< 4.0
Mercury
PPM
< 2.0
< 2.0
< 2.0
< 5.0
< 5.0
< 2.0
< 2.0
< 2.0
< 5.0
PBB
PPM
<5.0
<5.0
<5.0
< 1.0
< 1.0
<5.0
<5.0
<5.0
---------
PBDE
PPM
<5.0
<5.0
<5.0
< 1.0
< 1.0
<5.0
<5.0
<5.0
-----------
< 10.0
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
< 1.0
< 2.0
< 3.0
< 100.0
< 3.0
< 90.0
Analysis Report
(Note2)
CoA-COVT-R
CoA-CART-R
CoA-PLRL-R
CoA-PLTB-R
CoA-EPLG-R
CoA-SBAG –R
CoA-MBBG-R
CoA-PROB-R
CoA-ABOX-R
CoA-DESS-R
CoA-BUBP-R
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to
report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material
information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-04308 Rev. *R
Page 18 of 20
16L – SOIC 150mils
Pb-Free Package
Document History Page
Document Title:
Document Number:
Rev.
16L - SOIC 150 MILS PB-FREE PACKAGE MATERIAL DECLARATION DATASHEET
001-04308
**
*A
ECN No. Orig. of
Change
390185
GFJ
399136
GFJ
*B
2521701 HLR
*C
2679529 MAHA
*D
Dcon
2792057 MAHA
*E
3006383 HLR
*F
3274916 HLR
*G
3388242 MAHA
*H
3604210 COPI
Description of Change
New document
Additional Assembly Site with different materials used. Additional
packaging indirect materials for Assy Site 2
Updated Cypress Logo
Added % weight of substance per Homogenous Material and %
weight of substance per package on the Material Composition for
Assy Site 1, 2 and 3.
Added CAS Number for Antimony Trioxide and SiO2 on Assy Site 1
and 2.
Completed the RoHS Substances namely; Lead Cadmium, Mercury,
Chromium VI, PBB and PBDE on Declaration of Packaging Indirect
Materials table for Assy Site 1,2 and 3.
Corrected the CAS numbers for Nickel, Palladium, and Gold for the
lead finish of assembly site 3. Added CAS numbers for NBR,
Bismaleimide, and Phenol resin for the lead frame of assembly site 3.
Added CAS numbers for Epoxy Resin 1, Epoxy Resin 2, Phenol resin,
and Aromatic phosphate for the mold compound of assembly site 3.
Changed E-CML to WEB in distribution list.
Corrected the reference QTP for assembly site 2 from 044301 to
033203.
Changed the substance Dicyclopentadi to Epoxy resin on Mold
Compound for Assembly Site 2.
Added material composition using Green Mold Compound on
Assembly Site 1. Reference QTP No. 103302.
Expressed the Weight by mg, % weight of substance per
Homogenous material, and % weight of substance per package of
assembly site 1 table B1,assembly site 2, and assembly site 3 in four
decimal places. Recalculated the % weight of substance per
Homogenous material of assembly site 1 table B1. Recalculated the
PPM values, % weight of substance per package and % weight of
substance per Homogenous material of assembly site 3.
Added PMDD for Assembly Site 3-B2 – OSE Taiwan Copper
Qualification under QTP # 120409.
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100%
material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material
Analysis Reports and Cypress Assembly sites information
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-04308 Rev. *R
Page 19 of 20
16L – SOIC 150mils
Pb-Free Package
Document History Page
Document Title:
Document Number:
Rev.
16L - SOIC 150 MILS PB-FREE PACKAGE MATERIAL DECLARATION DATASHEET
001-04308
*I
ECN No. Orig. of
Change
3645620 COPI
*J
3767019 HLR
*K
3925886 VFR
*L
4032205 YUM
*M
4109518 YUM
*N
4185000 HLR
*O
*P
4285027 JSO
4450719 AWP
*Q
4636391 HLR
*R
4993643 HLR
DCON
Description of Change
Added PMDD B3 for Assembly site 1 – CML RA Copper Qualification
under QTP # 121408.
Added CAS number of Crystalline Silica and Carbon Black on
Assembly Sites 1 and 3.
Added B.2 for Site 2: Amkor-M Copper wire qualification, reference
QTP # 124706
Added assembly site name in the Assembly heading in site 1, 2 and
3.
Changed the assembly code to assembly site name in site 1, 2 and 3.
Corrected total package weight in site 1:B1 from “150.0198” to
“150.0201”
Corrected the CAS Number of Epoxy Resin 1 of Mold Compound for
Assembly Site 3.
Added assembly site 4
Added Material Composition (B4) (Cu-Pd) wire on Assembly Site1Cypress Manufacturing Limited reference-QTP#140805.
Added B5 Material Composition for Assembly Site 1 in reference to
QTP No. 143003.
Changed the substances with “-------------“to “Trade Secret”.
Removed distribution and posting in the document history page.
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100%
material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material
Analysis Reports and Cypress Assembly sites information
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-04308 Rev. *R
Page 20 of 20