16L – SOIC 150mils Pb-Free Package PACKAGE MATERIAL DECLARATION DATASHEET Cypress Package Code Package Weight – Site 1 Package Weight – Site 3 SZ B1: 150.0201 mg B2: 150.1999 mg B3: 149.5250 mg B4: 148.3400 mg B5: 149.9999 mg B1: 166.0797 mg B2: 161.2638 mg Body Size (mil/mm) Package Weight – Site 2 150 mils B1: 158.9900 mg B2: 152.8306 mg Package Weight – Site 4 B1: 135.9018 mg SUMMARY The 16L-SOIC package is qualified at three assembly sites. Packages from different assembly sites are likely to have different materials composition. However, Cypress guarantees that as long as products are being ordered with a Cypress Part Number containing an “X” (e.g. CY7C1328G-133AXI, CY2308SXC1HT) they meet the requirement of RoHS. ASSEMBLY Site 1: Cypress Manufacturing Limited (CML) Package Qualification Report # 023407, 121408, 140805, 143003 (Note 1) I. DECLARATION OF PACKAGED UNITS A. BANNED SUBSTANCES Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU RoHS. Listed in the table below are materials that are neither contained nor intentionally added to this product. Substances / Compounds Cadmium and Cadmium Compounds Hexavalent Chromium and its Compounds Lead and Lead Compounds Mercury and Mercury Compounds Polybrominated Biphenyls (PBB) Polybrominated Diphenylethers (PBDE) Asbestos Azo colorants Ozone Depleting Substances Polychlorinated Biphenyls (PCBs) Polychlorinated Napthalenes Radioactive Substances Shortchain Chlorinated Paraffins Tributyl Tin (TBT) and Triphenyl Tin (TPT) Tributyl Tin Oxide (TBTO) Formaldehyde Weight by mg 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 PPM Analysis Report Link/s < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 0 0 0 0 0 0 0 0 0 0 CoA-SZ16CML As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-04308 Rev. *R Page 1 of 20 16L – SOIC 150mils Pb-Free Package B. MATERIAL COMPOSITION (Note 3) B1. NiPdAu with Standard Molding Compound Material Lead frame Lead Finish Die Attach Die Wire Purpose of Use Base Material External Plating Adhesive Circuit Interconnect Mold Compound Encapsulation Substance Composition Cu Fe P Zn Ni Pd Au Ag Bismaleimide Polymer Methacrylate Acylate ester Organic Peroxide Si Au Fused Silica Solid Epoxy Resin Phenol Resin Antimony Trioxide Crystalline Silica Carbon Black 77.3836 1.9066 0.0557 0.0952 0.1875 0.0095 0.0030 0.3193 0.0450 0.0246 0.0083 0.0083 % weight of substance per Homogenou s material 97.4100% 2.4000% 0.0701% 0.1199% 93.7734% 4.7262% 1.5004% 77.9773% 10.9930% 6.0095% 2.0154% 2.0154% 515,822 12,709 371 635 1,250 63 20 2,128 300 164 55 55 51.5822% 1.2709% 0.0371% 0.0635% 0.1250% 0.0063% 0.0020% 0.2128% 0.0300% 0.0164% 0.0055% 0.0055% 0.0041 0.9894% 27 0.0027% 5.7300 0.7237 46.9382 100.0000% 100.0000% 73.9001% 38,195 4,824 312,879 3.8195% 0.4824% 31.2879% 6.3516 10.0000% 42,338 4.2338% 6.9867 11.0000% 46,572 4.6572% 0.8257 1.3000% 5,504 0.5504% 14808-60-7 1.9054 2.9999% 12,701 1.2701% 1333-86-4 0.5081 0.8000% 3,387 0.3387% % Total: 100.0000% CAS Number 7440-50-8 7439-89-6 7723-14-0 7440-66-6 7440-02-0 7440-05-3 7440-57-5 7440-22-4 Trade Secret Trade Secret Trade Secret Trade Secret Trade Secret 7440-21-3 7440-57-5 60676-86-0 Trade Secret Trade Secret 1309-64-4 Package Weight (mg): Weight by mg 150.0201 % weight of substance per package PPM Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-04308 Rev. *R Page 2 of 20 16L – SOIC 150mils Pb-Free Package B2. NiPdAu using Green Molding Compound Material Purpose of Use Lead frame Base Material Lead Finish External Plating Die Attach Adhesive Substance Composition Cu Fe P Zn Ni Pd Au Ag Proprietary bismaleimide Proprietary polymer Methacrylate Acrylate ester Organic peroxide CAS Number 7440-50-8 7439-89-6 7723-14-0 7440-66-6 7440-02-0 7440-05-3 7440-57-5 7440-22-4 Trade Secret Trade Secret Trade Secret Trade Secret Trade Secret Die Circuit Si 7440-21-3 Wire Interconnect Au 7440-57-5 Mold Compound Encapsulation SiO2 Phenol Resin Epoxy Resin 60676-86-0 Trade Secret Trade Secret Package Weight (mg): 59.0846 1.4557 0.0425 0.0728 0.9115 0.0164 0.0165 0.1595 % Weight of Substance per Homogeneo us Material 97.4100 2.4000 0.0700 0.1200 96.5204 1.7370 1.7427 80.0000 393,373 9,692 283 485 6,069 109 110 1,062 39.3373 0.9692 0.0283 0.0485 0.6069 0.0109 0.0110 0.1062 0.0179 9.0000 119 0.0119 0.0100 0.0040 0.0040 5.0000 2.0000 2.0000 66 27 27 0.0066 0.0027 0.0027 0.0040 2.0000 27 18,579 0.0027 1.8579 8,420 0.8420 499,782 28,078 33,693 49.9782 2.8078 3.3693 %Total: 100.0000% Weight by mg 2.7905 1.2647 75.0673 4.2173 5.0607 150.1999 100.00 100.00 89.0000 5.0000 6.0000 PPM % Weight of Substance per package Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-04308 Rev. *R Page 3 of 20 16L – SOIC 150mils Pb-Free Package B3. NiPdAu using Green Molding Compound and Copper Wire Material Purpose of Use Lead frame Base Material Lead Finish External Plating Die Attach Adhesive Die Wire Circuit Interconnect Mold Compound Encapsulation Substance Composition Cu Fe P Zn Ni Pd Au Ag Proprietary bismaleimide Proprietary polymer Methacrylate Acrylate ester Organic peroxide Si Cu SiO2 Phenol Resin Epoxy Resin 59.0846 1.4557 0.0425 0.0728 0.9115 0.0164 0.0165 0.1595 % Weight of Substance per Homogeneou s Material 97.4100% 2.4000% 0.0700% 0.1200% 96.5163% 1.7366% 1.7471% 80.0000% 395,149 9,735 284 487 6,096 110 110 1,067 39.5149% 0.9735% 0.0284% 0.0487% 0.6096% 0.0110% 0.0110% 0.1067% Trade Secret 0.0179 9.0000% 120 0.0120% Trade Secret 0.0100 5.0000% 67 0.0067% Trade Secret Trade Secret 0.0040 0.0040 2.0000% 2.0000% 27 27 0.0027% 0.0027% Trade Secret 0.0040 2.0000% 27 0.0027% 7440-21-3 7440-50-8 60676-86-0 Trade Secret Trade Secret 2.7905 0.5898 75.0673 4.2173 5.0607 100.0000% 100.0000% 89.0000% 5.0000% 6.0000% 18,662 3,944 502,038 28,205 33,845 1.8662% 0.3944% 50.2038% 2.8205% 3.3845% %Total: 100.0000% CAS Number 7440-50-8 7439-89-6 7723-14-0 7440-66-6 7440-02-0 7440-05-3 7440-57-5 7440-22-4 Package Weight (mg): Weight by mg 149.5250 PPM Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-04308 Rev. *R Page 4 of 20 % Weight of Substance per package 16L – SOIC 150mils Pb-Free Package B4. NiPdAu, Green Molding Compound, Copper-Palladium (Cu-Pd) Material Purpose of Use Lead frame Base Material Lead Finish External Plating Die Attach Adhesive Die Circuit Wire Interconnect Mold Compound Encapsulation Substance Composition Cu Ni Si Mg Nickel Palladium Gold Silver Carbocyclic acrylate Bismaleimide Resin Acrylate Additive Silicon Copper Palladium Silica - SiO2 Epoxy Resin Phenol Resin CAS Number 7440-50-8 7440-02-0 7440-21-3 7439-95-4 7440-02-0 7440-05-3 7440-57-5 7440-22-4 Weight by mg 48.4026 1.8127 0.1454 0.0301 0.7522 0.0005 0.0003 0.3527 Trade Secret 0.0533 Trade Secret Trade Secret Trade Secret 7440-21-3 7440-50-8 7440-05-3 60676-86-0 Trade Secret Trade Secret 0.0206 0.0135 0.0025 1.8530 0.8533 0.0001 85.0090 5.1282 3.9100 Package Weight (mg): 148.3400 % Weight of Substance per Homogeneou s Material 96.0544% 3.5973% 0.2885% 0.0597% 99.8938% 0.0664% 0.0398% 79.6882% 326,295 12,220 980 203 5,071 3 2 2,378 32.6295% 1.2220% 0.0980% 0.0203% 0.5071% 0.0003% 0.0002% 0.2378% 12.0425% 359 0.0359% 4.6543% 139 0.0139% 3.0502% 0.5648% 100.0000% 99.9883% 0.0117% 90.3897% 5.4528% 4.1575% 91 17 12,492 5,752 1 573,069 34,571 26,358 0.0091% 0.0017% 1.2492% 0.5752% 0.0001% 57.3069% 3.4571% 2.6358% %Total: 100.0000% PPM Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-04308 Rev. *R Page 5 of 20 % Weight of Substance per package 16L – SOIC 150mils Pb-Free Package B5. NiPdAu-Ag using Au Wire Material Purpose of Use Lead frame Base Material Lead Finish External Plating Die Attach Adhesive Die Wire Circuit Interconnect Mold Compound Encapsulation Cu Fe P Zn Ni 7440-50-8 7439-89-6 7723-14-0 7440-66-6 7440-02-0 48.1067 1.1853 0.0346 0.0593 0.5928 % Weight of Substance per Homogeneou s Material 97.4100% 2.4000% 0.0700% 0.1200% 96.5204% Pd 7440-05-3 Au Ag 7440-57-5 7440-22-4 7440-22-4 0.0107 0.0080 0.0027 0.0885 1.7370% 1.3070% 0.4357% 80.0000% 71 53 18 590 0.0071% 0.0054% 0.0018% 0.0590% 0.0100 9.0000% 67 0.0066% 0.0055 0.0022 0.0022 5.0000% 2.0000% 2.0000% 37 15 15 0.0037% 0.0015% 0.0015% 0.0022 1.5490 1.5268 86.1639 4.8407 5.8088 2.0000% 100.0000% 100.0000% 89.0000% 5.0000% 6.0000% 15 10,327 10,179 574,426 32,271 38,725 0.0015% 1.0327% 1.0179% 57.4426% 3.2271% 3.8725% %Total: 100.0000% Substance Composition Ag Proprietary bismaleimide Proprietary polymer Methacrylate Acrylate ester Organic peroxide Si Au SiO2 Phenol Resin Epoxy Resin CAS Number Trade Secret Trade Secret Trade Secret Trade Secret Trade Secret 7440-21-3 7440-57-5 60676-86-0 Trade Secret Trade Secret Package Weight (mg): Weight by mg 149.9999 PPM % Weight of Substance per package 320,712 7,902 231 395 3,952 32.0711% 0.7902% 0.0230% 0.0395% 0.3952% Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-04308 Rev. *R Page 6 of 20 16L – SOIC 150mils Pb-Free Package II. DECLARATION OF PACKAGING / INDIRECT MATERIALS Type Tape & Reel Tube Others Material Cover tape Carrier tape Plastic Reel Plastic Tube End Plug Shielding bag Moisture Barrier bag Protective Band Shipping and Inner Box Dessicant Bubble Pack Lead PPM < 2.0 < 2.0 < 2.0 < 5.0 < 5.0 < 2.0 < 2.0 < 2.0 < 10.0 Cadmium PPM < 2.0 < 2.0 < 2.0 < 5.0 < 5.0 < 2.0 < 2.0 < 2.0 < 4.0 Cr VI PPM < 2.0 < 2.0 < 2.0 < 5.0 < 5.0 < 2.0 < 2.0 < 2.0 < 4.0 Mercury PPM < 2.0 < 2.0 < 2.0 < 5.0 < 5.0 < 2.0 < 2.0 < 2.0 < 5.0 PBB PPM <5.0 <5.0 <5.0 < 1.0 < 1.0 <5.0 <5.0 <5.0 --------- PBDE PPM <5.0 <5.0 <5.0 < 1.0 < 1.0 <5.0 <5.0 <5.0 ----------- < 10.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 1.0 < 2.0 < 3.0 < 100.0 < 3.0 < 90.0 Analysis Report (Note2) CoA-COVT-R CoA-CART-R CoA-PLRL-R CoA-PLTB-R CoA-EPLG-R CoA-SBAG –R CoA-MBBG-R CoA-PROB-R CoA-ABOX-R CoA-DESS-R CoA-BUBP-R Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-04308 Rev. *R Page 7 of 20 16L – SOIC 150mils Pb-Free Package ASSEMBLY Site 2: Amkor Technology Philippines (P1/P2) Package Qualification Report # 033203 / 124706 (Note1) A. BANNED SUBSTANCES Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU RoHS. Listed in the table below are materials that are neither contained nor intentionally added to this product. Substances / Compounds Cadmium and Cadmium Compounds Hexavalent Chromium and its Compounds Lead and Lead Compounds Mercury and Mercury Compounds Polybrominated Biphenyls (PBB) Polybrominated Diphenylethers (PBDE) Asbestos Azo colorants Ozone Depleting Substances Polychlorinated Biphenyls (PCBs) Polychlorinated Napthalenes Radioactive Substances Shortchain Chlorinated Paraffins Tributyl Tin (TBT) and Triphenyl Tin (TPT) Tributyl Tin Oxide (TBTO) Formaldehyde Weight by mg 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 PPM < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 0 0 0 0 0 0 0 0 0 0 Analysis Report Link/s CoA-SZ16Amkor Philippines (P1/P2) As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-04308 Rev. *R Page 8 of 20 16L – SOIC 150mils Pb-Free Package B1: MATERIAL COMPOSITION (Note 3) USING Au WIRE Material Purpose of Use Lead frame Base Material Lead finish External Plating Die Attach Adhesive Die Wire Mold Compound Circuit Interconnect Encapsulation 7440-50-8 7439-89-6 7723-14-0 7440-66-6 7440-22-4 7440-31-5 Trade Secret 7440-22-4 Trade Secret Trade Secret Trade Secret 55.2800 1.3400 0.0200 0.0600 0.5900 2.7300 0.2200 0.7500 0.0300 0.0300 0.0300 % weight of substance per Homogenous material 96.5000 2.3500 0.0500 0.1000 1.0000 100.0000 21.0000 70.0000 3.0000 3.0000 3.0000 7440-21-3 7440-57-5 Trade Secret 60676-86-0 Trade Secret 1309-64-4 3.0400 0.3000 6.6100 82.3000 2.8300 2.8300 100.0000 100.0000 7.0000 87.0000 3.0000 3.0000 Package Weight (mg): 158.9900 Substance Composition Cu Fe P Zn Ag Pure Sn Resin Ag Metal Oxide Amine Gamma Butyrolactone Si Au Epoxy Resin SiO2 Phenol Resin Antimony Trioxide CAS Number Weight by mg PPM 34,7700 8,400 100 400 3,700 17,200 1,400 4,700 200 200 200 34.7700% 0.8400% 0.0100% 0.0400% 0.3700% 1.7200% 0.1400% 0.4700% 0.0200% 0.0200% 0.0200% 19,100 1,900 41,600 517,600 17,800 17,800 1.9100% 0.1900% 4.1600% 51.7600% 1.7800% 1.7800% % Total: 100.0000% Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-04308 Rev. *R % weight of substance per package Page 9 of 20 16L – SOIC 150mils Pb-Free Package B2: MATERIAL COMPOSITION (Note 3) USING Cu WIRE Material Lead frame Lead Finish Die Attach Die Wire Purpose of Use Base Material External Plating Adhesive Circuit Interconnect Mold Compound Encapsulation Copper (Cu) Iron (Fe) Zinc (Z) Phosphorus (P) Silver (Ag) 7440-50-8 7439-89-6 7440-66-6 7723-14-0 7440-22-4 48.3259 1.1902 0.0595 0.0149 0.1340 % weight of substance per Homogenou s material 97.1874 2.3935 0.1197 0.0299 0.2695 Tin (Sn) 7440-31-5 2.7290 100.0000 17,856 1.7856 Trade Secret Trade Secret 7440-22-4 Trade Secret 0.0593 0.0339 0.6518 0.0339 7.0000 4.0000 77.0000 4.0000 388 222 4,265 222 0.0388 0.0222 0.4265 0.0222 Trade Secret 0.0339 4.0000 222 0.0222 Trade Secret 0.0339 4.0000 222 0.0222 7440-21-3 7440-50-8 3.3630 0.0915 100.0000 100.0000 22,004 599 2.2004 0.0599 Trade Secret 7.2057 7.5000 47,148 4.7148 60676-86-0 1333-86-4 82.6253 0.4804 86.0000 0.5000 540,633 3,143 54.0633 0.3143 Trade Secret 1.9215 2.0000 12,573 1.2573 Trade Secret 3.8430 4.0000 25,146 2.5146 Package Weight (mg): 152.8306 % Total: 100.0000% Substance Composition Epoxy Resin A Epoxy Resin B Silver (Ag) Lactone Polyoxypropylenedi amine 2,6-Diglycidyl phenyl allyl ether oligomer Silicon Copper (Cu) Multi-aromatic Resin SiO2 Filler Carbon Black Epoxy Cresol Novolac Phenol Resin CAS Number Weight by mg PPM % weight of substance per package 316,206 7,788 389 97 877 31.6206 0.7788 0.0389 0.0097 0.0877 Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-04308 Rev. *R Page 10 of 20 16L – SOIC 150mils Pb-Free Package II. DECLARATION OF PACKAGING / INDIRECT MATERIALS Type Tape & Reel Tube Others Material Cover tape Carrier tape Plastic Reel Plastic Tube End Plug Shielding bag Moisture Barrier bag Protective Band Shipping and Inner Box Dessicant Bubble Pack Lead PPM < 2.0 < 2.0 < 2.0 < 5.0 < 5.0 < 2.0 < 2.0 < 2.0 < 10.0 Cadmium PPM < 2.0 < 2.0 < 2.0 < 5.0 < 5.0 < 2.0 < 2.0 < 2.0 < 4.0 Cr VI PPM < 2.0 < 2.0 < 2.0 < 5.0 < 5.0 < 2.0 < 2.0 < 2.0 < 4.0 Mercury PPM < 2.0 < 2.0 < 2.0 < 5.0 < 5.0 < 2.0 < 2.0 < 2.0 < 5.0 PBB PPM <5.0 <5.0 <5.0 < 1.0 < 1.0 <5.0 <5.0 <5.0 --------- PBDE PPM <5.0 <5.0 <5.0 < 1.0 < 1.0 <5.0 <5.0 <5.0 ----------- < 10.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 1.0 < 2.0 < 3.0 < 100.0 < 3.0 < 90.0 Analysis Report (Note2) CoA-COVT-R CoA-CART-R CoA-PLRL-R CoA-PLTB-R CoA-EPLG-R CoA-SBAG –R CoA-MBBG-R CoA-PROB-R CoA-ABOX-R CoA-DESS-R CoA-BUBP-R Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-04308 Rev. *R Page 11 of 20 16L – SOIC 150mils Pb-Free Package ASSEMBLY Site 3: Orient Semiconductor Electronics Taiwan (OSET) Package Qualification Report # 050701 / 120409 (Note1) A. BANNED SUBSTANCES Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU RoHS. Listed in the table below are materials that are neither contained nor intentionally added to this product. Substances / Compounds Cadmium and Cadmium Compounds Hexavalent Chromium and its Compounds Lead and Lead Compounds Mercury and Mercury Compounds Polybrominated Biphenyls (PBB) Polybrominated Diphenylethers (PBDE) Asbestos Azo colorants Ozone Depleting Substances Polychlorinated Biphenyls (PCBs) Polychlorinated Napthalenes Radioactive Substances Shortchain Chlorinated Paraffins Tributyl Tin (TBT) and Triphenyl Tin (TPT) Tributyl Tin Oxide (TBTO) Formaldehyde Weight by mg 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 PPM < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 0 0 0 0 0 0 0 0 0 0 Analysis Report Link/s CoA-SZ16OSET As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-04308 Rev. *R Page 12 of 20 16L – SOIC 150mils Pb-Free Package B. MATERIAL COMPOSITION (Note 3) B1. USING GOLD WIRE Material Purpose of Use Lead frame Base Material Lead finish External Plating Die Attach Die Wire Mold Compound Adhesive Circuit Interconnect Encapsulation Substance Composition Cu Fe P Zn Pb Polyimide NBR Bismaleimide Phenol resin Ni Pd Au Acrylic resin Polybutadiene derivative Butadiene copolymer Epoxy Resin Acrylate Peroxide Additive Silver (Metal powder) Si Au Epoxy resin 1 Epoxy resin 2 Phenol resin Aromatic Phosphate Carbon black Silica 7440-50-8 7439-89-6 7723-14-0 7440-66-6 7439-92-1 Trade Secret 9003-18-3 79922-55-7 28453-20-5 7440-02-0 7440-05-3 7440-57-5 Trade Secret Trade Secret 48.2567 1.1773 0.0414 0.0626 0.0012 0.0468 0.0078 0.0078 0.0066 0.4745 0.0086 0.0086 0.0196 0.0126 % weight of substance per Homogenous material 97.2755 2.3733 0.0834 0.1262 0.0023 0.0944 0.0157 0.0157 0.0134 96.5200 1.7400 1.7400 8.5199 5.4874 Trade Secret 0.0023 1.0108 14 0.0014 Trade Secret Trade Secret Trade Secret 7440-22-4 0.0047 0.0091 0.0012 0.0035 0.1770 2.0217 3.9711 0.5054 1.5162 76.9675 28 55 7 21 1,066 0.0028 0.0055 0.0007 0.0021 0.1066 7440-21-3 7440-57-5 158117-90-9 85954-11-6 26834-02-6 139189-30-3 6.1900 0.3599 3.8220 2.1840 3.8220 1.6380 100.0000 100.0000 3.5000 2.0000 3.5000 1.5000 37,271 2,167 23,013 13,150 23,013 9,863 3.7271 0.2167 2.3013 1.3150 2.3013 0.9863 1333-86-4 60676-86-0 0.2184 97.5155 0.2000 89.3000 1,315 587,161 0.1315 58.7161 % Total: 100.0000% CAS Number Package Weight (mg): Weight by mg 166.0797 % weight of substance per package PPM 290,564 7,089 249 377 7 282 47 47 40 2,857 52 52 118 76 29.0564 0.7089 0.0249 0.0377 0.0007 0.0282 0.0047 0.0047 0.0040 0.2857 0.0052 0.0052 0.0118 0.0076 Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-04308 Rev. *R Page 13 of 20 16L – SOIC 150mils Pb-Free Package B2. USING COPPER WIRE Material Purpose of Use Lead frame Base Material Lead finish External Plating Die Attach Adhesive Die Wire Mold Compound Circuit Interconnect Encapsulation Substance Composition Cu Fe P Zn Pb Ni Pd Au Silver Epoxy resin A Epoxy resin B Diluent A Diluent B Phenolic Hardener Dicyandiamide Organic peroxide Si Copper Epoxy resin A Epoxy,Cresol Novolac Phenol resin Metal Hydroxide Carbon Black Silica Fused A Silica Fused B Silica,crystalline 7440-50-8 7439-89-6 7723-14-0 7440-66-6 7439-92-1 7440-02-0 7440-05-3 7440-57-5 7440-22-4 9003-36-5 Trade Secret Trade Secret Trade Secret Trade Secret 45.7365 1.1143 0.0391 0.0593 0.0047 0.4201 0.0379 0.0066 0.0441 0.0024 0.0036 0.0024 0.0036 0.0030 % weight of substance per Homogenous material 97.4071 2.3733 0.0833 0.1262 0.0101 90.4082 8.1633 1.4286 74.0000 4.0000 6.0000 4.0000 6.0000 5.0000 461-58-5 Trade Secret 0.0003 0.0003 0.5000 0.5000 2 2 0.0002% 0.0002% 7440-21-3 7440-50-8 Trade Secret 29690-82-2 1.2971 0.1157 5.6186 5.6186 100.0000 100.0000 5.0000 5.0000 8,043 717 34,841 34,841 0.8043% 0.0717% 3.4841% 3.4841% Trade Secret Trade Secret 1333-86-4 60676-86-0 7631-86-9 14808-60-7 5.6186 5.6186 0.3371 77.9869 11.2373 0.3371 5.0000 5.0000 0.3000 69.4000 10.0000 0.3000 34,841 34,841 2,090 483,598 69,683 2,090 3.4841% 3.4841% 0.2090% 48.3598% 6.9683% 0.2090% % Total: 100.0000% CAS Number Package Weight (mg): Weight by mg 161.2638 % weight of substance per package PPM 283,613 6,910 242 368 29 2,605 235 41 273 15 22 15 22 19 28.3613% 0.6910% 0.0242% 0.0368% 0.0029% 0.2605% 0.0235% 0.0041% 0.0273% 0.0015% 0.0022% 0.0015% 0.0022% 0.0019% Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-04308 Rev. *R Page 14 of 20 16L – SOIC 150mils Pb-Free Package II. DECLARATION OF PACKAGING / INDIRECT MATERIALS Type Tape & Reel Tube Others Material Cover tape Carrier tape Plastic Reel Plastic Tube End Plug Shielding bag Moisture Barrier bag Protective Band Shipping and Inner Box Dessicant Bubble Pack Lead PPM < 2.0 < 2.0 < 2.0 < 5.0 < 5.0 < 2.0 < 2.0 < 2.0 < 10.0 Cadmium PPM < 2.0 < 2.0 < 2.0 < 5.0 < 5.0 < 2.0 < 2.0 < 2.0 < 4.0 Cr VI PPM < 2.0 < 2.0 < 2.0 < 5.0 < 5.0 < 2.0 < 2.0 < 2.0 < 4.0 Mercury PPM < 2.0 < 2.0 < 2.0 < 5.0 < 5.0 < 2.0 < 2.0 < 2.0 < 5.0 PBB PPM <5.0 <5.0 <5.0 < 1.0 < 1.0 <5.0 <5.0 <5.0 --------- PBDE PPM <5.0 <5.0 <5.0 < 1.0 < 1.0 <5.0 <5.0 <5.0 ----------- < 10.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 1.0 < 2.0 < 3.0 < 100.0 < 3.0 < 90.0 Analysis Report (Note2) CoA-COVT-R CoA-CART-R CoA-PLRL-R CoA-PLTB-R CoA-EPLG-R CoA-SBAG –R CoA-MBBG-R CoA-PROB-R CoA-ABOX-R CoA-DESS-R CoA-BUBP-R Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-04308 Rev. *R Page 15 of 20 16L – SOIC 150mils Pb-Free Package ASSEMBLY Site 4: UTAC Limited Thailand (UTL) Package Qualification Report # 134506 (Note1) A. BANNED SUBSTANCES Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU RoHS. Listed in the table below are materials that are neither contained nor intentionally added to this product. Substances / Compounds Cadmium and Cadmium Compounds Hexavalent Chromium and its Compounds Lead and Lead Compounds Mercury and Mercury Compounds Polybrominated Biphenyls (PBB) Polybrominated Diphenylethers (PBDE) Asbestos Azo colorants Ozone Depleting Substances Polychlorinated Biphenyls (PCBs) Polychlorinated Napthalenes Radioactive Substances Shortchain Chlorinated Paraffins Tributyl Tin (TBT) and Triphenyl Tin (TPT) Tributyl Tin Oxide (TBTO) Formaldehyde Weight by mg 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 PPM < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 0 0 0 0 0 0 0 0 0 0 Analysis Report Link/s CoA-SZ16UTAC As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-04308 Rev. *R Page 16 of 20 16L – SOIC 150mils Pb-Free Package B1. MATERIAL COMPOSITION (Note 3) USING COPPER PALLADIUM WIRE Material Purpose of Use Leadframe Base Material Lead Finish External Plating Die Attach Adhesive Die Wire Circuit Interconnect Mold Compound Encapsulation Substance Composition Cu Fe Zn P Ni Pd Au Ag Silver Trimethylbicyclo metharcrylate Bis-1H-pyrrole dione Acrylic acid Silicon Copper Palladium Silica fused Epoxy resin Phenol resin A Phenol resin B Carbon black CAS Number 7440-50-8 7439-89-6 7440-66-6 7723-14-0 7440-02-0 7440-05-3 7440-57-5 7440-22-4 7440-22-4 7534-94-3 3006-93-7 1017237-78-3 7440-21-3 7440-50-8 7440-05-3 60676-86-0 Trade secret Trade secret Trade secret 1333-86-4 Package Weight (mg): 49.5513 0.1170 0.0365 0.0330 0.2450 0.0146 0.0176 0.0068 0.2504 0.0686 % Weight of Substance per Homogeneous Material 99.6270% 0.2340% 0.0730% 0.0660% 86.2600% 5.1400% 6.2100% 2.3900% 73.0000 20.0000% 364,611 861 269 243 1,803 107 130 50 1,842 505 % Weight of Substance per Package 36.4611% 0.0861% 0.0269% 0.0243% 0.1803% 0.0107% 0.0130% 0.0050% 0.1842% 0.0505% 0.0223 6.5000% 164 0.0164% 0.0017 2.3350 0.0992 0.0018 70.6359 7.0636 2.6592 2.6592 0.0831 0.5000% 100.0000% 98.2500% 1.7500% 85.0000% 8.5000% 3.2000% 3.2000% 0.1000% 13 17,182 730 13 519,765 51,976 19,567 19,567 611 0.0013% 1.7182% 0.0730% 0.0013% 51.9756% 5.1976% 1.9567% 1.9567% 0.0611% % Total: 100.0000% Weight by mg 135.9018 PPM Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-04308 Rev. *R Page 17 of 20 16L – SOIC 150mils Pb-Free Package II. DECLARATION OF PACKAGING / INDIRECT MATERIALS Type Tape & Reel Tube Others Material Cover tape Carrier tape Plastic Reel Plastic Tube End Plug Shielding bag Moisture Barrier bag Protective Band Shipping and Inner Box Dessicant Bubble Pack Lead PPM < 2.0 < 2.0 < 2.0 < 5.0 < 5.0 < 2.0 < 2.0 < 2.0 < 10.0 Cadmium PPM < 2.0 < 2.0 < 2.0 < 5.0 < 5.0 < 2.0 < 2.0 < 2.0 < 4.0 Cr VI PPM < 2.0 < 2.0 < 2.0 < 5.0 < 5.0 < 2.0 < 2.0 < 2.0 < 4.0 Mercury PPM < 2.0 < 2.0 < 2.0 < 5.0 < 5.0 < 2.0 < 2.0 < 2.0 < 5.0 PBB PPM <5.0 <5.0 <5.0 < 1.0 < 1.0 <5.0 <5.0 <5.0 --------- PBDE PPM <5.0 <5.0 <5.0 < 1.0 < 1.0 <5.0 <5.0 <5.0 ----------- < 10.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 1.0 < 2.0 < 3.0 < 100.0 < 3.0 < 90.0 Analysis Report (Note2) CoA-COVT-R CoA-CART-R CoA-PLRL-R CoA-PLTB-R CoA-EPLG-R CoA-SBAG –R CoA-MBBG-R CoA-PROB-R CoA-ABOX-R CoA-DESS-R CoA-BUBP-R Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-04308 Rev. *R Page 18 of 20 16L – SOIC 150mils Pb-Free Package Document History Page Document Title: Document Number: Rev. 16L - SOIC 150 MILS PB-FREE PACKAGE MATERIAL DECLARATION DATASHEET 001-04308 ** *A ECN No. Orig. of Change 390185 GFJ 399136 GFJ *B 2521701 HLR *C 2679529 MAHA *D Dcon 2792057 MAHA *E 3006383 HLR *F 3274916 HLR *G 3388242 MAHA *H 3604210 COPI Description of Change New document Additional Assembly Site with different materials used. Additional packaging indirect materials for Assy Site 2 Updated Cypress Logo Added % weight of substance per Homogenous Material and % weight of substance per package on the Material Composition for Assy Site 1, 2 and 3. Added CAS Number for Antimony Trioxide and SiO2 on Assy Site 1 and 2. Completed the RoHS Substances namely; Lead Cadmium, Mercury, Chromium VI, PBB and PBDE on Declaration of Packaging Indirect Materials table for Assy Site 1,2 and 3. Corrected the CAS numbers for Nickel, Palladium, and Gold for the lead finish of assembly site 3. Added CAS numbers for NBR, Bismaleimide, and Phenol resin for the lead frame of assembly site 3. Added CAS numbers for Epoxy Resin 1, Epoxy Resin 2, Phenol resin, and Aromatic phosphate for the mold compound of assembly site 3. Changed E-CML to WEB in distribution list. Corrected the reference QTP for assembly site 2 from 044301 to 033203. Changed the substance Dicyclopentadi to Epoxy resin on Mold Compound for Assembly Site 2. Added material composition using Green Mold Compound on Assembly Site 1. Reference QTP No. 103302. Expressed the Weight by mg, % weight of substance per Homogenous material, and % weight of substance per package of assembly site 1 table B1,assembly site 2, and assembly site 3 in four decimal places. Recalculated the % weight of substance per Homogenous material of assembly site 1 table B1. Recalculated the PPM values, % weight of substance per package and % weight of substance per Homogenous material of assembly site 3. Added PMDD for Assembly Site 3-B2 – OSE Taiwan Copper Qualification under QTP # 120409. Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-04308 Rev. *R Page 19 of 20 16L – SOIC 150mils Pb-Free Package Document History Page Document Title: Document Number: Rev. 16L - SOIC 150 MILS PB-FREE PACKAGE MATERIAL DECLARATION DATASHEET 001-04308 *I ECN No. Orig. of Change 3645620 COPI *J 3767019 HLR *K 3925886 VFR *L 4032205 YUM *M 4109518 YUM *N 4185000 HLR *O *P 4285027 JSO 4450719 AWP *Q 4636391 HLR *R 4993643 HLR DCON Description of Change Added PMDD B3 for Assembly site 1 – CML RA Copper Qualification under QTP # 121408. Added CAS number of Crystalline Silica and Carbon Black on Assembly Sites 1 and 3. Added B.2 for Site 2: Amkor-M Copper wire qualification, reference QTP # 124706 Added assembly site name in the Assembly heading in site 1, 2 and 3. Changed the assembly code to assembly site name in site 1, 2 and 3. Corrected total package weight in site 1:B1 from “150.0198” to “150.0201” Corrected the CAS Number of Epoxy Resin 1 of Mold Compound for Assembly Site 3. Added assembly site 4 Added Material Composition (B4) (Cu-Pd) wire on Assembly Site1Cypress Manufacturing Limited reference-QTP#140805. Added B5 Material Composition for Assembly Site 1 in reference to QTP No. 143003. Changed the substances with “-------------“to “Trade Secret”. Removed distribution and posting in the document history page. Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-04308 Rev. *R Page 20 of 20