24L – QFN 4.0 x 4.0 mm (Saw Version) Pb-Free Package PACKAGE MATERIAL DECLARATION DATASHEET Cypress Package Code Package Weight – Site 1 LQ 27.4301 mg Body Size (mil/mm) Package Weight – Site 2 Package Weight – Site 3 Package Weight – Site 5 29.7801 mg B1: 30.0002 mg B2: 31.6054 mg B3: 31.5816 mg Package Weight – Site 4 Package Weight – Site 6 *** 4.0x4.0 mm B1: 30.0000 mg B2: 29.4900 mg B3: 28.2310 mg B4: 30.0002 mg B5: 28.2309 mg 42.0500 mg B1: 25.7582 mg SUMMARY The QFN 24L Pb-Free package is compliant to RoHS. Cypress Ordering Part Numbers containing an “X” (e.g. CY7C1328G-133AXI, CY2308SXC-1HT) meet the Directive 2002/95/EC (RoHS) requirement. ASSEMBLY Site 1: PT UNISEM Batam Package Qualification Report # 071706 (See Note 1) I. DECLARATION OF PACKAGED UNITS A. BANNED SUBSTANCES Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU RoHS. Listed in the table below are materials that are neither contained nor intentionally added to this product. Substances / Compounds Cadmium and Cadmium Compounds Hexavalent Chromium and its Compounds Lead and Lead Compounds Mercury and Mercury Compounds Polybrominated Biphenyls (PBB) Polybrominated Diphenylethers (PBDE) Asbestos Azo colorants Ozone Depleting Substances Polychlorinated Biphenyls (PCBs) Polychlorinated Napthalenes Radioactive Substances Shortchain Chlorinated Paraffins Tributyl Tin (TBT) and Triphenyl Tin (TPT) Tributyl Tin Oxide (TBTO) Formaldehyde Weight by mg PPM 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 0 0 0 0 0 0 0 0 0 0 Analysis Report (Note 2) CoA-LQ24-PT UNISEM As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-15690 Rev. *Q Page 1 of 21 24L – QFN 4.0 x 4.0 mm (Saw Version) Pb-Free Package B. MATERIAL COMPOSITION (Note 3) Material Leadframe Purpose of Use Base Material Lead Finish External Plating Die Attach Adhesive Die Wire Circuit Interconnect Mold Compound Encapsulation Substance Composition Cu Fe P Zn Pb Ni Pd Au Silver (Ag) Epoxy Resin t-Butyl phenyl_glycidyl ether Dicyadiamide Hardener Si Au Silica Fused Epoxy Resin Phenol Resin Carbon Black 7440-50-8 7439-89-6 7723-14-0 7440-66-6 7439-92-1 7440-02-0 7440-05-3 7440-57-5 7440-22-4 9003-36-5 3101-60-8 11.7528 0.3088 0.0194 0.0254 0.0036 0.2239 0.0101 0.0060 0.8433 0.1715 0.0853 97.0500% 2.5500% 0.1600% 0.2100% 0.0300% 93.2800% 4.2000% 2.5200% 73.9700% 15.0400% 7.4800% 428,464 11,258 706 927 132 8162 367 220 30,742 6,251 3,109 % weight of substance per package 42.8464% 1.1258% 0.0706% 0.0927% 0.0132% 0.8162% 0.0367% 0.0220% 3.0742% 0.6251% 0.3109% 461-58-5 Trade Secret 7440-21-3 7440-57-5 60676-86-0 Trade Secret Trade Secret 1333-86-4 0.0060 0.0340 1.7800 0.4000 11.0191 0.3528 0.3528 0.0353 0.5300% 2.9800% 100.0000% 100.0000% 93.7000% 3.0000% 3.0000% 0.3000% 220 1,238 64,892 14,583 401,718 12,862 12,862 1,286 0.0220% 0.1238% 6.4892% 1.4583% 40.1718% 1.2862% 1.2862% 0.1286% CAS Number Package Weight (mg): Weight by mg % weight of substance per Homogeneous material PPM 27.4301 % Total: 100.0000 II. DECLARATION OF PACKAGING / INDIRECT MATERIALS Type Tape & Reel Tray Others Material Cover tape Carrier tape Plastic Reel Tray Shielding bag Lead PPM < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 Cadmium PPM < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 Cr VI PPM < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 Mercury PPM < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 PBB PPM <5.0 <5.0 <0.0005 <5.0 <5.0 PBDE PPM <5.0 <5.0 <0.0005 <5.0 <5.0 Analysis Report (Note2) CoA-COVT-R CoA-CART-R CoA-PLRL-R CoA-TRAY-R CoA-SBAG –R Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-15690 Rev. *Q Page 2 of 21 24L – QFN 4.0 x 4.0 mm (Saw Version) Pb-Free Package ASSEMBLY Site 2: Cypress Manufacturing Limited (CML) Package Qualification Report # 084602, 120207, 134516, 143205, ***124105 (See Note1) I. DECLARATION OF PACKAGED UNITS A. BANNED SUBSTANCES Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU RoHS. Listed in the table below are materials that are neither contained nor intentionally added to this product. Substances / Compounds Cadmium and Cadmium Compounds Hexavalent Chromium and its Compounds Lead and Lead Compounds Mercury and Mercury Compounds Polybrominated Biphenyls (PBB) Polybrominated Diphenylethers (PBDE) Asbestos Azo colorants Ozone Depleting Substances Polychlorinated Biphenyls (PCBs) Polychlorinated Napthalenes Radioactive Substances Shortchain Chlorinated Paraffins Tributyl Tin (TBT) and Triphenyl Tin (TPT) Tributyl Tin Oxide (TBTO) Formaldehyde Weight by mg PPM 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 0 0 0 0 0 0 0 0 0 0 Analysis Report (Note 2) CoA-LQ24CML As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-15690 Rev. *Q Page 3 of 21 24L – QFN 4.0 x 4.0 mm (Saw Version) Pb-Free Package B1. MATERIAL COMPOSITION (Note 3) Using Gold Palladium Wire Material Purpose of Use Lead frame Base Material Lead Finish External Plating Die Attach Adhesive Die Wire Circuit Interconnect Mold Compound Encapsulation Substance Composition Copper Silicon Magnesium Nickel Nickel Palladium Gold Silver Proprietary bismaleimide Proprietary polymer Methacrylate Acrylate ester Organic peroxide Silicon Gold Palladium SiO2 Metal OH Phenol Resin Epoxy Resin Carbon Black Others CAS Number 7440-50-8 7440-21-3 7439-95-4 7440-02-0 7440-02-0 7440-05-3 7440-57-5 7440-22-4 Proprietary Proprietary Proprietary Proprietary Proprietary 7440-21-3 7440-57-5 7440-05-3 60676-86-0 --------Proprietary Proprietary 1333-86-4 --------- Package Weight (mg): Weight by mg % weight of substance per Homogeneous material 16.0200 0.1100 0.0200 0.5000 0.3378 0.0061 0.0061 0.1477 96.2162% 0.6607% 0.1201% 3.0030% 96.5145% 1.7428% 1.7428% 77.7614% 0.0200 0.0100 10.5296% 534,001 3,667 667 16,667 11,261 203 203 4,923 667 % weight of substance per package 53.4001% 0.3667% 0.0667% 1.6667% 1.1261% 0.0203% 0.0203% 0.4923% 0.0667% 333 0.0041 0.0041 5.2648% 2.1480% 2.1480% 0.0041 2.8500 0.9900 0.0100 7.9600 0.3240 0.2200 0.4000 0.0200 0.0360 2.1480% 100.0000% 99.0000% 1.0000% 88.8393% 3.6161% 2.4554% 4.4643% 0.2232% 0.4018% 30.0000 PPM 0.0333% 0.0136% 0.0136% 136 136 136 95,000 33,000 333 265,334 10,800 7,333 13,333 667 1,200 0.0136% 9.5000% 3.3000% 0.0333% 26.5334% 1.0800% 0.7333% 1.3333% 0.0667% 0.1200% % Total: Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-15690 Rev. *Q Page 4 of 21 100.0000 24L – QFN 4.0 x 4.0 mm (Saw Version) Pb-Free Package B2. MATERIAL COMPOSITION (Note 3) Using Copper Wire Material Purpose of Use Lead frame Base Material Lead Finish External Plating Die Attach Adhesive Die Wire Circuit Interconnect Mold Compound Encapsulation Substance Composition Copper Silicon Magnesium Nickel Nickel Palladium Gold Silver Proprietary bismaleimide Proprietary polymer Methacrylate Acrylate ester Organic peroxide Silicon Copper SiO2 Metal OH Phenol Resin Epoxy Resin Carbon Black Others 7440-50-8 7440-21-3 7439-95-4 7440-02-0 7440-02-0 7440-05-3 7440-57-5 7440-22-4 16.0200 0.1100 0.0200 0.5000 0.3300 0.0100 0.0100 0.1600 96.2162% 0.6607% 0.1201% 3.0030% 94.2857% 2.8571% 2.8571% 79.1139% 543,237 3,730 678 16,955 11,190 339 339 5,426 % weight of substance per package 54.3237% 0.3730% 0.0678% 1.6955% 1.1190% 0.0339% 0.0339% 0.5426% Proprietary 0.0200 9.8892% 678 0.0678% 0.0100 4.9446% 339 0.0339% 0.0041 0.0041 2.0174% 2.0174% 138 138 0.0138% 0.0138% 2.0174% 138 0.0138% 100.00% 100.00% 88.6809% 3.7879% 2.4510% 4.4563% 0.2228% 0.4011% 96,643 15,655 269,923 11,529 7,460 13,564 679 1,221 9.6643% 1.5655% 26.9923% 1.1529% 0.7460% 1.3564% 0.0679% 0.1221% CAS Number Proprietary Proprietary Proprietary Proprietary 7440-21-3 7440-50-8 60676-86-0 --------Proprietary Proprietary 1333-86-4 --------- Package Weight (mg): Weight by mg 0.0041 2.8500 0.4617 7.9600 0.3400 0.2200 0.4000 0.0200 0.0360 29.4900 % weight of substance per Homogeneou s material PPM % Total: Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-15690 Rev. *Q Page 5 of 21 100.00% 24L – QFN 4.0 x 4.0 mm (Saw Version) Pb-Free Package B3. MATERIAL COMPOSITION (Note 3) Using Copper Palladium wire Material Purpose of Use Lead frame Base Material Lead Finish External Plating Die Attach Adhesive Die Wire Circuit Interconnect Mold Compound Encapsulation Substance Composition Copper Silicon Magnesium Nickel Nickel Palladium Gold Silver Proprietary bismaleimide Carbocylic acrylate Bismaleimide resin Acrylate Additive Silicon Copper Palladium SiO2 Metal OH Phenol Resin Epoxy Resin Carbon Black Others CAS Number 7440-50-8 7440-21-3 7439-95-4 7440-02-0 7440-02-0 7440-05-3 7440-57-5 7440-22-4 Proprietary 12.5068 0.0321 0.0065 0.3846 0.3115 0.0002 0.0001 0.2116 96.7270% 0.2483% 0.0503% 2.9745% 99.9038% 0.0641% 0.0321% 64.0824% 443,017 1,137 230 13,623 11,034 7 4 7,495 % weight of substance per package 44.3017% 0.1137% 0.0230% 1.3623% 1.1034% 0.0007% 0.0004% 0.7495% 0.0155 4.6941% 549 0.0549% 0.0606 18.3525% 2,147 0.2147% 0.0155 0.0155 0.0115 1.843 0.5745 0.0001 11.0091 0.0125 0.5981 0.5982 0.0175 0.006 4.6941% 4.6941% 3.4827% 100.0000% 99.9826% 0.0174% 89.9333% 0.1021% 4.8859% 4.8867% 0.1430% 0.0490% 549 549 407 65,283 20,350 4 389,965 443 21,186 21,189 620 213 0.0549% 0.0549% 0.0407% 6.5283% 2.0350% 0.0004% 38.9965% 0.0443% 2.1186% 2.1189% 0.0620% 0.0213% Weight by mg % weight of substance per Homogeneou s material PPM Proprietary Proprietary Proprietary Proprietary 7440-21-3 7440-50-8 7440-50-8 60676-86-0 --------Proprietary Proprietary 1333-86-4 --------- Package Weight (mg): 28.2310 % Total: Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-15690 Rev. *Q Page 6 of 21 100.00% 24L – QFN 4.0 x 4.0 mm (Saw Version) Pb-Free Package B4. MATERIAL COMPOSITION (Note 3) Using Gold Palladium Wire and Nitto Mold Compound Material Purpose of Use Lead frame Base Material Lead Finish External Plating Die Attach Die Wire Adhesive Circuit Interconnect Mold Compound Encapsulation Substance Composition CAS Number Copper 7440-50-8 Iron Phosphorous Zinc Nickel Palladium Gold Silver Proprietary bismaleimide Proprietary polymer Methacrylate Acrylate ester Organic peroxide Silicon Gold Palladium SiO2 Fused SiO2 Crystalline Metal Oxide Phenol Resin Epoxy Resin Carbon Black 7439-89-6 7723-14-0 7440-66-6 7440-02-0 7440-05-3 7440-57-5 7440-22-4 Proprietary Weight by mg % weight of substance per Homogeneous material PPM % weight of substance per package 16.2221 0.3997 0.0117 0.0200 0.3346 0.0060 0.0060 0.3312 97.4100% 2.4000% 0.0700% 0.1200% 96.5204% 1.7370% 1.7427% 80.0000% 540,735 13,323 389 666 11,152 201 201 11,041 54.0735% 1.3323% 0.0389% 0.0666% 1.1152% 0.0201% 0.0201% 1.1041% 0.0373 9.0000% 1,242 0.1242% 0.0207 0.0083 0.0083 5.0000% 2.0000% 2.0000% 690 276 276 0.0690% 0.0276% 0.0276% 0.0083 5.7964 1.1910 0.0120 4.7206 2.0000% 100.0000% 99.0000% 1.0000% 88.8393% 3.6161% 276 193,214 39,699 401 157,354 0.0276% 19.3214% 3.9699% 0.0401% 15.7354% 7,449 5,587 7,449 7,449 931 0.7449% 0.5587% 0.7449% 0.7449% 0.0931% Proprietary Proprietary Proprietary Proprietary 7440-21-3 7440-57-5 7440-05-3 60676-86-0 14808-60-7 Proprietary Proprietary Proprietary 1333-86-4 Package Weight (mg): 0.2235 0.1676 0.2235 0.2235 0.0279 30.0002 2.4554% 4.4643% 0.2232% 0.4018% % Total: Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-15690 Rev. *Q Page 7 of 21 100.0000 24L – QFN 4.0 x 4.0 mm (Saw Version) Pb-Free Package *** B5. MATERIAL COMPOSITION (Note 3) Using Copper Wire with Nitto Mold Compound Material Purpose of Use Lead frame Base Material Lead Finish External Plating Die Attach Die Wire Adhesive Circuit Interconnect Mold Compound Encapsulation Substance Composition Copper Silicon Magnesium Nickel Nickel Palladium Gold Silver Proprietary bismaleimide Carbocylic acrylate Bismaleimide resin Acrylate Additive Silicon Copper SiO2 SiO2 Crystalline Metal OH Phenol Resin Epoxy Resin Carbon Black Others 12.5068 0.0321 0.0065 0.3846 0.3115 0.0002 0.0001 0.2116 96.7270% 0.2483% 0.0503% 2.9745% 99.9038% 0.0641% 0.0321% 64.0824% 443,017 1,137 230 13,623 11,034 7 4 7,495 % weight of substance per package 44.3017% 0.1137% 0.0230% 1.3623% 1.1034% 0.0007% 0.0004% 0.7495% 0.0155 4.6941% 549 0.0549% 0.0606 18.3525% 2,147 0.2147% Proprietary Proprietary 7440-21-3 7440-50-8 60676-86-0 0.0155 0.0155 0.0115 1.8430 0.5745 10.7339 4.6941% 4.6941% 3.4827% 100.0000% 100.0000% 87.4333% 549 549 407 65,283 20,353 380,217 0.0549% 0.0549% 0.0407% 6.5283% 2.0353% 38.0217% 14808-60-7 --------Proprietary Proprietary 1333-86-4 --------- 0.2752 0.0125 0.5981 0.5982 0.0175 0.0060 2.5000 0.1021% 4.8859% 4.8867% 0.1430% 0.0490% 9,748 443 21,186 21,189 620 213 0.9748% 0.0443% 2.1186% 2.1189% 0.0620% 0.0213% CAS Number 7440-50-8 7440-21-3 7439-95-4 7440-02-0 7440-02-0 7440-05-3 7440-57-5 7440-22-4 Proprietary Weight by mg % weight of substance per Homogeneou s material PPM Proprietary Proprietary Package Weight (mg): 28.2309 % Total: Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-15690 Rev. *Q Page 8 of 21 100.00% 24L – QFN 4.0 x 4.0 mm (Saw Version) Pb-Free Package II. DECLARATION OF PACKAGING / INDIRECT MATERIALS Type Tape & Reel Tray Others Material Lead PPM Cadmium PPM Cr VI PPM Mercury PPM Cover tape Carrier tape Plastic Reel Tray Shielding bag < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 PBB PPM PBDE PPM <5.0 <5.0 <0.0005 <5.0 <5.0 <5.0 <5.0 <0.0005 <5.0 <5.0 Analysis Report (Note2) CoA-COVT-R CoA-CART-R CoA-PLRL-R CoA-TRAY-R CoA-SBAG –R Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-15690 Rev. *Q Page 9 of 21 24L – QFN 4.0 x 4.0 mm (Saw Version) Pb-Free Package ASSEMBLY Site 3: Amkor Technology Philippines (P3/P4) Package Qualification Report #091203 (See Note 1) I. DECLARATION OF PACKAGED UNITS A. BANNED SUBSTANCES Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU RoHS. Listed in the table below are materials that are neither contained nor intentionally added to this product. Substances / Compounds Cadmium and Cadmium Compounds Hexavalent Chromium and its Compounds Lead and Lead Compounds Mercury and Mercury Compounds Polybrominated Biphenyls (PBB) Polybrominated Diphenylethers (PBDE) Asbestos Azo colorants Ozone Depleting Substances Polychlorinated Biphenyls (PCBs) Polychlorinated Napthalenes Radioactive Substances Shortchain Chlorinated Paraffins Tributyl Tin (TBT) and Triphenyl Tin (TPT) Tributyl Tin Oxide (TBTO) Formaldehyde Weight by mg PPM 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 0 0 0 0 0 0 0 0 0 0 Analysis Report (Note 2) CoA-LQ24Amkor Philippines (P3/P4) As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-15690 Rev. *Q Page 10 of 21 24L – QFN 4.0 x 4.0 mm (Saw Version) Pb-Free Package B. MATERIAL COMPOSITION (Note 3) Material Leadframe Lead Finish Die Attach Purpose of Use Base Material External Plating Adhesive Die Wire Circuit Interconnect Mold Compound Encapsulation Substance Composition Cu Ni Si Mg Ni Pd Au Ag Ag Bismaleimide Methacrylate Ester Polymer Acrylate Silicon Au Phenol Resin Epoxy Resin Carbon Black Silica Fused Crystalline Silica Metal hydro oxide CAS Number Weight by mg %weight of substance per Homogeneous material 7440-50-8 7440-02-0 7440-21-3 7439-95-4 7440-02-0 7440-05-3 7440-57-5 7440-22-4 7440-22-4 Proprietary Proprietary 12.4868 0.3894 0.0844 0.0195 0.3610 0.0080 0.0010 96.2000% 3.0000% 0.6500% 0.1500% Proprietary Proprietary 7440-21-3 7440-57-5 Proprietary Proprietary 1333-86-4 60676-86-0 14808-60-7 proprietary Package Weight (mg): % weight of substance per package PPM 97.5700% 2.1600% 0.2700% 419,300 13,076 2,833 654 12,123 268 34 41.9300% 1.3076% 0.2833% 0.0654% 1.2123% 0.0268% 0.0034% 0.3034 0.0111 0.0111 82.0000% 3.0000% 3.0000% 10,188 373 373 1.0188% 0.0373% 0.0373% 0.0037 0.0407 1.5300 0.1500 1.2942 1.2942 0.0719 9.3470 0.2876 2.0851 1.0000% 11.0000% 124 1,367 51,377 5,037 43,459 43,459 2,414 313,868 9,657 70,017 0.0124% 0.1367% 5.1377% 0.5037% 4.3459% 4.3459% 0.2414% 31.3868% 0.9657% 7.0017% 100.0000% 100.0000% 9.0000% 9.0000% 0.5000% 65.0000% 2.0000% 14.5000% 29.7801 % Total: 100.0000 II. DECLARATION OF PACKAGING / INDIRECT MATERIALS Type Material Tape & Reel Tray Others Cover tape Carrier tape Plastic Reel Tray Shielding bag Lead PPM < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 Cadmium PPM < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 Cr VI PPM < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 Mercury PPM < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 PBB PPM <5.0 <5.0 <0.0005 <5.0 <5.0 PBDE PPM <5.0 <5.0 <0.0005 <5.0 <5.0 Analysis Report (Note2) CoA-COVT-R CoA-CART-R CoA-PLRL-R CoA-TRAY-R CoA-SBAG –R Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-15690 Rev. *Q Page 11 of 21 24L – QFN 4.0 x 4.0 mm (Saw Version) Pb-Free Package ASSEMBLY Site 4: CARSEM Malaysia Package Qualification Report #081801 (See Note 1) I. DECLARATION OF PACKAGED UNITS A. BANNED SUBSTANCES Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU RoHS. Listed in the table below are materials that are neither contained nor intentionally added to this product. Substances / Compounds Cadmium and Cadmium Compounds Hexavalent Chromium and its Compounds Lead and Lead Compounds Mercury and Mercury Compounds Polybrominated Biphenyls (PBB) Polybrominated Diphenylethers (PBDE) Asbestos Azo colorants Ozone Depleting Substances Polychlorinated Biphenyls (PCBs) Polychlorinated Napthalenes Radioactive Substances Shortchain Chlorinated Paraffins Tributyl Tin (TBT) and Triphenyl Tin (TPT) Tributyl Tin Oxide (TBTO) Formaldehyde Weight by mg PPM 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 0 0 0 0 0 0 0 0 0 0 Analysis Report (Note 2) CoA-LQ24CARSEM As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-15690 Rev. *Q Page 12 of 21 24L – QFN 4.0 x 4.0 mm (Saw Version) Pb-Free Package B. MATERIAL COMPOSITION (Note 3) Material Purpose of Use Leadframe Base Material Lead Finish External Plating Die Attach Adhesive Die Wire Circuit Interconnect Mold Compound Encapsulation Substance Composition CAS Number Weight by mg %weight of substance per Homogeneous material Cu Ni Si Mg Ni Pd Au Ag Bismaleimide resin Carbocyclic Acrylate Additive 7440-50-8 7440-02-0 7440-21-3 7439-95-4 7440-02-0 7440-05-3 7440-57-5 7440-22-4 Proprietary 14.2071 0.4746 0.1186 0.0297 0.1727 0.0150 0.0023 0.0994 0.0042 95.8000% 3.2000% 0.8000% 0.2000% Proprietary % weight of substance per package PPM 71.0000% 3.0000% 337,863 11,286 2,821 705 4,107 357 54 2,364 100 33.7863% 1.1286% 0.2821% 0.0705% 0.4107% 0.0357% 0.0054% 0.2364% 0.0100% 0.0280 20.0000% 666 0.0666% Proprietary 0.0042 3.0000% 0.0100% Acrylate ester Proprietary 0.0042 3.0000% Silicon Au Fused Silica Epoxy Resin Phenol Resin Carbon Black 7440-21-3 7440-57-5 60676-86-0 Proprietary proprietary 1333-86-4 1.8700 0.2500 23.2095 0.7431 0.7431 0.0743 100.0000% 100.0000% 93.7000% 3.0000% 3.0000% 0.3000% 99.8810 9 99.8810 9 44,471 5,945 551,950 17,672 17,672 1,767 Package Weight (mg): 90.9000% 7.9000% 1.2000% 42.0500 % Total: 0.0100% 4.4471% 0.5945% 55.1950% 1.7672% 1.7672% 0.1767% 100.0000 II. DECLARATION OF PACKAGING / INDIRECT MATERIALS Type Material Tape & Reel Tray Others Cover tape Carrier tape Plastic Reel Tray Shielding bag Lead PPM < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 Cadmium PPM < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 Cr VI PPM < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 Mercury PPM < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 PBB PPM <5.0 <5.0 <0.0005 <5.0 <5.0 PBDE PPM <5.0 <5.0 <0.0005 <5.0 <5.0 Analysis Report (Note2) CoA-COVT-R CoA-CART-R CoA-PLRL-R CoA-TRAY-R CoA-SBAG –R Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-15690 Rev. *Q Page 13 of 21 24L – QFN 4.0 x 4.0 mm (Saw Version) Pb-Free Package ASSEMBLY Site 5: Advanced Semiconductor Engineering Taiwan (ASET) Package Qualification Report # 112108, 114401 / 120604 / 134505 (See Note 1) I. DECLARATION OF PACKAGED UNITS A. BANNED SUBSTANCES Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU RoHS. Listed in the table below are materials that are neither contained nor intentionally added to this product. Substances / Compounds Cadmium and Cadmium Compounds Hexavalent Chromium and its Compounds Lead and Lead Compounds Mercury and Mercury Compounds Polybrominated Biphenyls (PBB) Polybrominated Diphenylethers (PBDE) Asbestos Azo colorants Ozone Depleting Substances Polychlorinated Biphenyls (PCBs) Polychlorinated Napthalenes Radioactive Substances Shortchain Chlorinated Paraffins Tributyl Tin (TBT) and Triphenyl Tin (TPT) Tributyl Tin Oxide (TBTO) Formaldehyde Weight by mg PPM 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 0 0 0 0 0 0 0 0 0 0 Analysis Report (Note 2) CoA-LQ24ASET As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-15690 Rev. *Q Page 14 of 21 24L – QFN 4.0 x 4.0 mm (Saw Version) Pb-Free Package B1. MATERIAL COMPOSITION (Note 3) Using Gold Wire Material Lead Frame Purpose of Use Base material Lead Finish External Plating Die Attach Adhesive Die Circuit Wire Interconnect Mold Compound Encapsulation Substance Composition Copper Nickel Silicon Magnesium Nickel Palladium Gold Silver Acrylic Resin Polybutadiene derivative Butadiene copolymer Acrylate Peroxide Additive Silicon Gold Ion Impurities Epoxy Resin A Epoxy Resin B Phenol Resin Carbon Black Silica Fused CAS Number Weight by mg 7440-50-8 7440-02-0 7440-21-3 7439-95-4 7440-02-0 7440-05-3 7440-57-5 7440-22-4 ------------------ 14.2376 0.4440 0.0962 0.0222 0.1905 0.0074 0.0021 0.4830 0.0518 % Weight of substance per Homogeneo us material 96.2000% 3.0000% 0.6500% 0.1500% 95.2500% 3.6800% 1.0700% 70.0000% 7.5000% 0.0638 0.0242 0.0518 0.0069 0.0086 1.1000 0.2000 0.0000 0.5855 0.3903 0.8587 0.0651 11.1105 9.2500% 3.5000% 7.5000% 1.0000% 1.2500% 100.0000% 99.9900% 0.0100% 4.5000% 3.0000% 6.6000% 0.5000% 85.4000% -------------------------------------------------------------------------------------7440-21-3 7440-57-5 --------------------------------------------------------------------1333-86-4 60676-86-0 Package Weight (mg): 30.0002 PPM % weight of substance per package 474,587 14,800 3,207 740 6,350 245 71 16,100 1,725 47.4587% 1.4800% 0.3207% 0.0740% 0.6350% 0.0245% 0.0071% 1.6100% 0.1725% 2,128 805 1,725 230 288 36,667 6,666 0.6667 19,515 13,010 28,622 2,168 370,351 0.2128% 0.0805% 0.1725% 0.0230% 0.0288% 3.6667% 0.6666% 0.0001% 1.9515% 1.3010% 2.8622% 0.2168% 37.0351% % Total: 100.0000 Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-15690 Rev. *Q Page 15 of 21 24L – QFN 4.0 x 4.0 mm (Saw Version) Pb-Free Package B2. MATERIAL COMPOSITION (Note 3) Using Copper Palladium Wire Material Lead Frame Purpose of Use Base material Lead Finish External Plating Die Attach Adhesive Die Circuit Wire Interconnect Mold Compound Encapsulation 7440-50-8 7440-02-0 7440-21-3 7439-95-4 12.3136 0.3840 0.0832 0.0192 % Weight of substance per Homogeneo us material 96.2000 3.0000 0.6500 0.1500 7440-31-5 2.8000 100.0000 79,629 7.9629 Phenol Resin Novolak Epoxy Resin Amorphous Silica ---------------------------------------------------- 0.0760 0.0760 0.0380 2,160 2,160 1,080 0.2160 0.2160 0.1080 Acrylic Copolymer Silicon Copper Palladium Epoxy Resin Phenol Resin Carbon Black Silica Fused ------------------ 12.0000 12.0000 6.0000 70.0000 7440-21-3 7440-50-8 7440-05-3 ----------------------------------1333-86-4 60676-86-0 0.4431 1.7100 0.7199 0.0001 1.3200 0.9900 0.0495 14.1405 12,601 48,631 20,472 4 37,539 28,155 1,408 402,141 1.2601 4.8631 2.0472 0.0004 3.7539 2.8155 0.1408 40.2141 Package Weight (mg): 35.1631 Substance Composition Copper Nickel Silicon Magnesium Pure tin CAS Number Weight by mg 100.0000 99.9800 0.0200 8.0000 6.0000 0.3000 85.7000 PPM % weight of substance per package 350,186 10,921 2,366 546 35.0186 1.0921 0.2366 0.0546 % Total: 100.0000 Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-15690 Rev. *Q Page 16 of 21 24L – QFN 4.0 x 4.0 mm (Saw Version) Pb-Free Package B3. MATERIAL COMPOSITION (Note 3) Using Copper Wire Material Lead Frame Purpose of Use Base material Lead Finish External Plating Die Attach Adhesive Die Wire Circuit Interconnect Mold Compound Encapsulation CAS Number Weight by mg 7440-50-8 7440-02-0 7440-21-3 7439-95-4 7440-02-0 7440-05-3 7440-57-5 7440-22-4 ------------------ 14.2352 0.4439 0.0926 0.0222 0.1929 0.0075 0.0022 0.2310 0.0248 % Weight of substance per Homogeneo us material 96.2000 3.0000 0.6500 0.1500 95.2500 3.6800 1.0700 70.0000 7.5000 ------------------ 0.0305 9.2500 970 0.0970 --------------------------------------------------------------------7440-21-3 7440-50-8 ---------------------------------------------------1333-86-4 60676-86-0 0.0116 0.0248 0.0033 0.0041 1.2050 0.0500 0.6750 0.4500 0.9900 0.0750 12.8100 3.5000 7.5000 1.0000 1.2500 100.0000 100.0000 4.5000 3.0000 6.6000 0.5000 85.4000 367 786 105 131 34,943 1,588 21,442 14,295 31,449 2,382 406,925 0.0367 0.0786 0.0105 0.0131 3.4943 0.1588 2.1442 1.4295 3.1449 0.2382 40.6925 Package Weight (mg): 31.5816 Substance Composition Copper Nickel Silicon Magnesium Nickel Palladium Gold Silver Acrylic Resin Polybutadiene derivative Butadiene copolymer Acrylate Peroxide Additive Silicon Copper Epoxy Resin A Epoxy Resin B Phenol Resin Carbon Black Silica Fused % weight of substance per package PPM 452,198 14,102 3,055 705 6,127 237 69 7,338 786 45.2198 1.4102 0.3055 0.0705 0.6127 0.0237 0.0069 0.7338 0.0786 % Total: 100.0000 II. DECLARATION OF PACKAGING / INDIRECT MATERIALS Type Material Tape & Reel Tray Others Cover tape Carrier tape Plastic Reel Tray Shielding bag Lead PPM < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 Cadmium PPM < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 Cr VI PPM < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 Mercury PPM < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 PBB PPM <5.0 <5.0 <0.0005 <5.0 <5.0 PBDE PPM <5.0 <5.0 <0.0005 <5.0 <5.0 Analysis Report (Note2) CoA-COVT-R CoA-CART-R CoA-PLRL-R CoA-TRAY-R CoA-SBAG –R Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-15690 Rev. *Q Page 17 of 21 24L – QFN 4.0 x 4.0 mm (Saw Version) Pb-Free Package ASSEMBLY Site 6: UTAC Thailand (UT) Package Qualification Report # 141704 (See Note 1) I. DECLARATION OF PACKAGED UNITS A. BANNED SUBSTANCES Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU RoHS. Listed in the table below are materials that are neither contained nor intentionally added to this product. Substances / Compounds Cadmium and Cadmium Compounds Hexavalent Chromium and its Compounds Lead and Lead Compounds Mercury and Mercury Compounds Polybrominated Biphenyls (PBB) Polybrominated Diphenylethers (PBDE) Asbestos Azo colorants Ozone Depleting Substances Polychlorinated Biphenyls (PCBs) Polychlorinated Napthalenes Radioactive Substances Shortchain Chlorinated Paraffins Tributyl Tin (TBT) and Triphenyl Tin (TPT) Tributyl Tin Oxide (TBTO) Formaldehyde Weight by mg PPM 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 0 0 0 0 0 0 0 0 0 0 Analysis Report (Note 2) CoA-LQ24UTAC As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-15690 Rev. *Q Page 18 of 21 24L – QFN 4.0 x 4.0 mm (Saw Version) Pb-Free Package B1. MATERIAL COMPOSITION (Note 3) Using Copper Palladium Wire Material Lead Frame Purpose of Use Base material Lead Finish Die Attach External Plating Adhesive Die Circuit Wire Interconnect Mold Compound Encapsulation Substance Composition Copper Silicon Magnesium Nickel Gold Silver Palladium Silver exo-1,7,7trimethylbicyclo[2.2.1]he pt-2yl methacrylate 1,1'-(1,3-phenylene)bis1H-pyrrole-2,5dione Acrylic acid, 2[methyl[(1,1,2,2,3,3,4,4, 4nonafluorobutyl)sulfonyl ]amino]ethyl ester, telomer with 3mercapto-1,2propanediol, 2-me Silicon Copper Palladium Silica fused Epoxy resin Phenol resin Carbon black 7440-50-8 7440-21-3 7439-95-4 7440-02-0 7440-57-5 7440-22-4 7440-05-3 7440-22-4 12.0176 0.0905 0.0219 0.5633 0.0065 0.0027 0.0062 0.2584 % Weight of substance per Homogeneo us material 99.0735 0.7463 0.1802 97.7930 0.6511 0.4744 1.0815 73.0000 7534-94-3 0.0190 20.0000 CAS Number 3006-93-7 Weight by mg 0.0190 466,555 3,514 849 21,868 253 106 242 10,030 46.6555 0.3514 0.0849 2.1868 0.0253 0.0106 0.0242 1.0030 738 0.0738 738 0.0738 738 21,936 11,252 201 417,187 21,666 21,666 461 0.0738 2.1936 1.1252 0.0201 41.7187 2.1666 2.1666 0.0461 6.5000 1017237-78-3 0.0190 0.0500 7440-21-3 7440-50-8 7440-05-3 60676-86-0 Trade secret Trade secret 1333-86-4 0.5650 0.2898 0.0052 10.7460 0.5581 0.5581 0.0119 100.0000 98.2500 1.7500 90.5000 4.7000 4.7000 0.1000 Package Weight (mg): % weight of substance per package PPM 25.7582 % Total: 100.0000 II. DECLARATION OF PACKAGING / INDIRECT MATERIALS Type Material Tape & Reel Tray Others Cover tape Carrier tape Plastic Reel Tray Shielding bag Lead PPM < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 Cadmium PPM < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 Cr VI PPM < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 Mercury PPM < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 PBB PPM <5.0 <5.0 <0.0005 <5.0 <5.0 PBDE PPM <5.0 <5.0 <0.0005 <5.0 <5.0 Analysis Report (Note2) CoA-COVT-R CoA-CART-R CoA-PLRL-R CoA-TRAY-R CoA-SBAG –R Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-15690 Rev. *Q Page 19 of 21 24L – QFN 4.0 x 4.0 mm (Saw Version) Pb-Free Package Document History Page Document Title: Document Number: Rev. 24L - QFN 4.0 X 4.0 MM (SAW VERSION) PB- FREE PACKAGE MATERIAL DECLARATION DATASHEET 001-15690 *A ECN No. Orig. of Change 1126686 JSO/ HLR 2553825 MAHA *B 2558354 RZY *C *D 2647572 MAHA 2695138 DPT *E 2709113 DPT *F 2751654 MAHA *G 2934854 MAHA *H 3264886 VFR *I 3298119 HLR *J 3453554 VFR *K 3602037 COPI ** VFR Description of Change Initial spec release. Changed reference QTP for Assembly Site 1 to 071706. Changed distribution from CML to WEB Refreshed field in the header on document history page. Correct spec number was entered but field failed to update. Removed extra “Rev.” and inserted required fields in the footers. Added data for assembly site 2. Added Amkor Phil (P3) for additional site of 24QFN (LQ24A). Added Carsem Malaysia for additional site of 24QFN (LQ24A). Revised the material composition table for assembly site 1. Corrected the lead frame composition for assembly site 2. Added PMDD for Assembly Site 5. Reference QTP # 112108. Removed tube material on Declaration of Packaging for Indirect Material. Added PMDD for Assembly Site 6. Reference QTP # 114401 – ASEK Copper wire qualification. Added PMDD for Assembly site 7. Reference QTP # 120207 – CML RA Copper Wire Qualification. Align PMDD of Assembly site 2 (CML-RA) to current MSDS report. Added Table B2 for Site 6 PMDD with reference QTP # 120604 – ASEK Pure Cu Wire qualification. Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-15690 Rev. *Q Page 20 of 21 24L – QFN 4.0 x 4.0 mm (Saw Version) Pb-Free Package Document History Page Document Title: Document Number: Rev. 24L - QFN 4.0 X 4.0 MM (SAW VERSION) PB- FREE PACKAGE MATERIAL DECLARATION DATASHEET 001-15690 *L ECN No. Orig. of Change 4055135 YUM *M 4106912 YUM *N 4197918 JSO *O 4390705 VFR *P 4640921 HLR *Q 4734613 MLA Description of Change Added assembly site name in the assembly heading in site 1, 2, 3, 4, 5 and 6. Changed Assembly code to assembly site name in site 1, 2, 3, 4, 5 and 6. Update material composition in site 1, site 2:B2, site 3, site 4 and site 5:B1 to reflect 4 decimal values. Consolidate material composition in one assembly site: 1. CML 2. ASET Corrected total package weight in site 1 from “27.4300” to “27.4301”. Corrected total package weight in site site 3 from “29.7800” to “29.7801”. Corrected assembly code in site 3 from “P1/P2” to “P3/P4”. Added QTP 134516 and table for copper palladium wire material composition in Assembly site2 (CML) Added QTP 134505 and updated copper palladium wire material composition (changed lead finish to Pure Sn from NiPdAu) in Assembly site 5 (ASE) Added on Assembly Site 6 – UTAC Thailand - B1 as identification on Copper Palladium wire - QTP # 141704 for CuPd wire qual Added B4 Material Composition for Assembly Site 2 in reference to QTP No. 143205. Add QTP # 124105 reference to site 2. Add table B5 to site 2. Add package weight from site 2, B5 to page 1. Distribution: WEB Posting: None Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-15690 Rev. *Q Page 21 of 21