8L - PDIP
Pb-Free Package
PACKAGE MATERIAL DECLARATION DATASHEET
Cypress Package Code
Package Weight – Site 1
*** Package Weight – Site 3
PZ
502.7695 mg
496.3100 mg
Body Size (mil/mm)
Package Weight – Site 2
300 mils
526.5864 mg
SUMMARY
The 8L-PDIP Pb-Free package is compliant to RoHS. Cypress Ordering Part Number containing an “X”
(e.g. CY7C1328G-133AXI, CY2308SXC-1HT) meet the of Directive 2002/95/EC (RoHS) requirement.
ASSEMBLY Site 1: Millennium Microtech Thailand (MMT)
Package Qualification Report # 051206 (Note 1)
I. DECLARATION OF PACKAGED UNITS
A. BANNED SUBSTANCES
Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU
RoHS. listed in the table below are materials that are neither contained nor intentionally added to this
product.
Substances / Compounds
Cadmium and Cadmium Compounds
Hexavalent Chromium and its Compounds
Lead and Lead Compounds
Mercury and Mercury Compounds
Polybrominated Biphenyls (PBB)
Polybrominated Diphenylethers (PBDE)
Asbestos
Azo colorants
Ozone Depleting Substances
Polychlorinated Biphenyls (PCBs)
Polychlorinated Napthalenes
Radioactive Substances
Shortchain Chlorinated Paraffins
Tributyl Tin (TBT) and Triphenyl Tin (TPT)
Tributyl Tin Oxide (TBTO)
Formaldehyde
Weight by
mg
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
PPM
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
0
0
0
0
0
0
0
0
0
0
Analysis Report
(Note 2)
CoA-PZ08MMT
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural
impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress
Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-03202 Rev. *G
Page 1 of 8
8L - PDIP
Pb-Free Package
B. MATERIAL COMPOSITION (Note 3)
Material
Lead frame
Purpose of Use
Base Material
Lead Finish
External Plating
Die Attach
Adhesive
Die
Wire
Circuit
Interconnect
Mold
Compound
Encapsulation
CAS
Number
Weight by
mg
% weight of
substance per
Homogenous
material
Copper
Iron
Phosphorus
7440-50-8
7439-89-6
7723-14-0
198.9332
5.5466
0.7354
96.6914%
2.6959%
0.3574%
395,675
11,032
1,045
39.5675%
1.1032%
0.1463%
Zinc
Nickel (Ni)
Palladium (Pd)
Gold (Au)
Epoxy Resin
Silver
Aromatic Amine
Si
Au
Silica Fused
Epoxy Resin
Epoxy, Cresol
Novolac
Phenol Resin
Carbon Black
7440-66-6
7440-02-0
7440-05-3
7440-57-5
----------------7440-22-4
----------------7440-21-3
7440-57-5
60676-86-0
-----------------
0.5253
3.9919
0.1681
0.1891
0.1700
1.4450
0.0850
5.0000
0.9799
256.5000
11.4000
0.2553%
91.7875%
3.8647%
4.3478%
10.0000%
85.0000%
5.0000%
100.0000%
100.0000%
90.0000%
4.0000%
1,463
7,940
376
334
338
2,874
169
9,945
1,949
510,174
22,674
0.1045%
0.7940%
0.0334%
0.0376%
0.0338%
0.2874%
0.0169%
0.9945%
0.1949%
51.0174%
2.2674%
29690-82-2
2.8500
1.0000%
5,669
0.5669%
----------------1333-86-4
12.8250
1.4250
4.5000%
0.5000%
25,509
2,834
2.5509%
0.2834%
Package Weight (mg):
502.7695
% Total:
100.0000%
Substance
Composition
% weight of
substance
per package
PPM
II. DECLARATION OF PACKAGING INDIRECT MATERIALS
Type
Tube
Others
Material
Plastic Tube
End Pin
End Plug
Shielding Bag
Lead
PPM
<2.0
<2.0
<2.0
<2.0
Cadmium
PPM
<2.0
<2.0
<2.0
< 2.0
Cr VI
PPM
<2.0
<2.0
<2.0
< 2.0
Mercury
PPM
<2.0
<2.0
<2.0
< 2.0
PBB
PPM
<0.0005
<0.0005
<0.0005
< 5.0
PBDE
PPM
<0.0005
<0.0005
<0.0005
< 5.0
Analysis Report
(Note2)
CoA-PLTB-R
CoA-ENDP-R
CoA-EPLG-R
CoA-SBAG-R
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural
impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress
Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-03202 Rev. *G
Page 2 of 8
8L - PDIP
Pb-Free Package
ASSEMBLY Site 2: Amkor Technology Philippines (P1/P2)
Package Qualification Report # 122903 (Note 1)
I. DECLARATION OF PACKAGED UNITS
A. BANNED SUBSTANCES
Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU
RoHS. listed in the table below are materials that are neither contained nor intentionally added to this
product.
Substances / Compounds
Cadmium and Cadmium Compounds
Hexavalent Chromium and its Compounds
Lead and Lead Compounds
Mercury and Mercury Compounds
Polybrominated Biphenyls (PBB)
Polybrominated Diphenylethers (PBDE)
Asbestos
Azo colorants
Ozone Depleting Substances
Polychlorinated Biphenyls (PCBs)
Polychlorinated Napthalenes
Radioactive Substances
Shortchain Chlorinated Paraffins
Tributyl Tin (TBT) and Triphenyl Tin (TPT)
Tributyl Tin Oxide (TBTO)
Formaldehyde
Weight by
mg
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
PPM
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
0
0
0
0
0
0
0
0
0
0
Analysis Report
(Note 2)
CoA-PZ08Amkor Philippines
(P1/P2)
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural
impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress
Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-03202 Rev. *G
Page 3 of 8
8L - PDIP
Pb-Free Package
B. MATERIAL COMPOSITION (Note 3)
Material
Purpose of Use
Lead frame
Base Material
Lead Finish
External Plating
Die Attach
Adhesive
Die
Wire
Mold
Compound
Circuit
Interconnect
Encapsulation
Substance
Composition
CAS
Number
Weight by
mg
% weight of
substance per
Homogenous
material
PPM
% weight of
substance
per package
Copper
Iron
7440-50-8
7439-89-6
170.0929
4.2105
96.9752%
2.3888%
324,082
7,983
32.4082%
0.7983%
Zinc
Phosphorus
Silver
Tin
Resin
Ag
Mixed aryl allyl
glycidyl compounds
Amine
Gamma
Butyrolactone
Diglycidylether of
bisphenol-F
Si
Cu
Multi-aromatic
Resin
SiO2
Carbon Black
Epoxy Cresol
Novolac
Phenol Resin
7440-66-6
7723-14-0
7440-22-4
7440-31-5
Proprietary
Proprietary
0.2347
0.0702
0.8161
9.1643
0.1569
1.5694
0.1332%
0.0398%
0.4630%
100.0000%
7.0000%
70.0000%
445
133
1,547
17,376
298
2976
0.0445%
0.0133%
0.1547%
1.7376%
0.0298%
0.2976%
Proprietary
Proprietary
0.0673
0.1121
3.0000%
5.0000%
128
213
0.0128%
0.0213%
Proprietary
0.1121
5.0000%
213
0.0213%
Proprietary
7440-21-3
7440-50-8
0.2242
4.7880
0.0855
10.0000%
100.00%
100.00%
425
9,078
162
0.0425%
0.9078%
0.0162%
Proprietary
60676-86-0
Proprietary
25.1162
287.9987
1.6744
7.5000%
86.0000%
0.5000%
47,621
546,048
3,175
4.7621%
54.6048%
0.3175%
1333-86-4
Proprietary
6.6976
13.3953
2.0000%
4.0000%
12,699
25,398
1.2699%
2.5398%
Package Weight (mg):
526.5864
% Total:
100.0000%
II. DECLARATION OF PACKAGING INDIRECT MATERIALS
Type
Tube
Others
Material
Plastic Tube
End Pin
End Plug
Shielding Bag
Lead
PPM
<2.0
<2.0
<2.0
<2.0
Cadmium
PPM
<2.0
<2.0
<2.0
< 2.0
Cr VI
PPM
<2.0
<2.0
<2.0
< 2.0
Mercury
PPM
<2.0
<2.0
<2.0
< 2.0
PBB
PPM
<0.0005
<0.0005
<0.0005
< 5.0
PBDE
PPM
<0.0005
<0.0005
<0.0005
< 5.0
Analysis Report
(Note2)
CoA-PLTB-R
CoA-ENDP-R
CoA-EPLG-R
CoA-SBAG-R
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural
impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress
Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-03202 Rev. *G
Page 4 of 8
8L - PDIP
Pb-Free Package
***ASSEMBLY Site 3: UTAC Thailand (UTL)
Package Qualification Report # 140501(Note 1)
I. DECLARATION OF PACKAGED UNITS
A. BANNED SUBSTANCES
Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU
RoHS. listed in the table below are materials that are neither contained nor intentionally added to this
product.
Substances / Compounds
Cadmium and Cadmium Compounds
Hexavalent Chromium and its Compounds
Lead and Lead Compounds
Mercury and Mercury Compounds
Polybrominated Biphenyls (PBB)
Polybrominated Diphenylethers (PBDE)
Asbestos
Azo colorants
Ozone Depleting Substances
Polychlorinated Biphenyls (PCBs)
Polychlorinated Napthalenes
Radioactive Substances
Shortchain Chlorinated Paraffins
Tributyl Tin (TBT) and Triphenyl Tin (TPT)
Tributyl Tin Oxide (TBTO)
Formaldehyde
Weight by
mg
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
PPM
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
0
0
0
0
0
0
0
0
0
0
Analysis Report
(Note 2)
CoA-PZ08UTL
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural
impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress
Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-03202 Rev. *G
Page 5 of 8
8L - PDIP
Pb-Free Package
B. MATERIAL COMPOSITION (Note 3)
Purpose of Use
Lead frame
Base Material
Lead Finish
External Plating
Die Attach
Adhesive
Die
Wire
Circuit
Interconnect
Mold
Compound
Encapsulation
Substance
Composition
CAS
Number
Weight by
mg
% weight of
substance per
Homogenous
material
PPM
% weight of
substance
per package
Copper
Fe
7440-50-8
7439-89-6
126.6600
3.0600
97.3600%
2.3500%
255203
6165
25.5200%
0.6200%
Pb
P
Zn
Ag
Sn
Ag
Exo-1.7.7trimethybicyclo[2.2.
1] hept-2ylmethacrylate
1.1-{1,3phenylene)bis1Hpyrrole-2.5-dione
Acrylic acid 2methyl
Si
Cu
Pd
Silica fused
Epoxy Resin
Cresol Novolac
Phenol Novolac
Carbon Black
7440-66-6
7723-14-0
7440-66-6
7440-22-4
7440-22-4
7440-22-4
0.0100
0.1100
0.1600
0.1000
37.0000
.7300
0.0100%
0.0800%
0.1300%
0.0800%
100.0000%
73.0000%
20
221
322
201
74550
1471
0.0005%
0.0200%
0.0300%
0.0200%
7.4600%
0.1500%
7534-94-3
0.2000
20.0000%
3006-93-7
1017237-783
7440-21-3
7440-57-5
7440-05-3
60676086-0
Trade secret
29690-82-2
Trade Secret
133.86-5
0.0700
6.5000%
141
0.0100%
0.0100
2.8800
0.2800
0.0100
282.7700
19.5000
6.5000
15.9300
0.3300
.5000%
100.00%
98.2500%
1.7500%
87.0000%
6.0000%
2.0000%
4.9000%
0.1000%
20
5802
574
20
569,744
39,292
13097
32089
665
0.0001%
0.5793%
0.0600%
0.0001%
56.9700%
3.9300%
1.3100%
3.2100%
0.0700%
Package Weight (mg):
496.3100
403
% Total:
0.0400%
100.0000%
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural
impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress
Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-03202 Rev. *G
Page 6 of 8
8L - PDIP
Pb-Free Package
II. DECLARATION OF PACKAGING INDIRECT MATERIALS
Type
Tube
Others
Material
Plastic Tube
End Pin
End Plug
Shielding Bag
Lead
PPM
<2.0
<2.0
<2.0
<2.0
Cadmium
PPM
<2.0
<2.0
<2.0
< 2.0
Cr VI
PPM
<2.0
<2.0
<2.0
< 2.0
Mercury
PPM
<2.0
<2.0
<2.0
< 2.0
PBB
PPM
<0.0005
<0.0005
<0.0005
< 5.0
PBDE
PPM
<0.0005
<0.0005
<0.0005
< 5.0
Analysis Report
(Note2)
CoA-PLTB-R
CoA-ENDP-R
CoA-EPLG-R
CoA-SBAG-R
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural
impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress
Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-03202 Rev. *G
Page 7 of 8
8L - PDIP
Pb-Free Package
Document History Page
Document Title:
Document Number:
Rev.
**
*A
*B
8L-PDIP PB-FREE PACKAGE MATERIAL DECLARATION DATASHEET
001-03202
ECN No. Orig. of
Change
385878
EML
639358
XRN/MR
B
*C
3119253 MAHA
DCon
3476493 MAHA
*D
3889747 JARG
*E
4032288 YUM
*F
4090366 UDR
*G
4365867 MLA
Description of Change
New document
1. Updated Cypress Logo
2. Added on the material composition the percent weight
per homogeneous material and weight of substance
3. Updated and added Lead, Cr+VI, PBB and PBDE on
the Declaration of Packaging/Indirect Materials.
Added note 4: the package were based on
Engineering calculation and performed on a package
family basis
Added data for assembly site 2.
Replaced CML with WEB in distribution list.
Deleted Assembly Site 1 – Omedata. Expressed the
weight by mg, package weight, % weight of substance
per Homogeneous material, and % weight of substance
per package in four decimal places.
Changed Document Title from 8L-PDIP Pb-Free
Package PMDD to 8L-PDIP PB-FREE PACKAGE
MATERIAL DECLARATION DATASHEET
Corrected material composition table to meet 100%
weight of substance per Homogenous material
Added Assembly site name in the Assembly heading.
Changed Assembly Code to Assembly Site Name.
Added Declaration of Packaged Units and Declaration of
Packaging Indirect Materials under assembly site 2.
Added site 3, UTAC, Thailand.
Distribution: WEB
Posting:
None
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural
impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress
Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-03202 Rev. *G
Page 8 of 8