ATMEL T0781

Features
•
•
•
•
•
•
•
Active Mixer with Conversion Gain
No External LO Driver Necessary
Low LO Drive Level Required
RF and LO Ports May Be Driven Single-ended
Single 5-V Supply Voltage
High LO-RF Isolation
Broadband Resistive 50-W Impedances on All Three Ports
Applications
• Infrastructure Digital Communication Systems
• 1700 MHz to 2300 MHz Receivers for CDMA/PCS/DCS/UMTS Base Stations
Electrostatic sensitive device.
Observe precautions for handling.
1700 - 2300 MHz
High Linearity
SiGe Active
Receiver Mixer
T0781
Description
The T0781 is a high linearity active mixer which is manufactured using Atmel’s
advanced Silicon-Germanium technology. This mixer features a frequency range of
1700 MHz to 2300 MHz. It operates from a single 5-V supply and provides 12 dB of
conversion gain while requiring only 0 dBm input to the integrated LO driver. An IF
amplifier is also included.
Preliminary
The T0781 incorporates internal matching on each RF, IF and LO ports to enhance
ease of use and to reduce the external components required. The RF and LO inputs
can be driven differentially or single-ended.
Figure 1. Block Diagram
RFP
RFN
4
5
1
16
13
IFP
IFN
LOP
12
LON
Rev. 4534B–SIGE–01/03
1
Pin Configuration
Figure 2. Pinning SSOP16
IFP
VCC
GND
RFP
RFN
GND
VCC
L1
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
IFN
VCC
GND
LOP
LON
GND
VCC
L2
Pin Description
2
Pin
Symbol
Function
1
IFP
IF positive output
2
VCC
5-V power supply
3
GND
Ground
4
RFP
RF positive input
5
RFN
RF negative input
6
GND
Ground
7
VCC
5-V power supply
8
L1
External inductor terminal
9
L2
External inductor terminal
10
VCC
5-V power supply
11
GND
Ground
12
LON
Local oscillator, negative input
13
LOP
Local oscillator, positive input
14
GND
Ground
15
VCC
5-V power supply
16
IFN
IF negative output
T0781
4534B–SIGE–01/03
T0781
Absolute Maximum Ratings (1)
All voltages are referred to GND.
Parameters
Symbol
Value
Unit
VCC
5.5
V
LO input
LOP, LON
10
dBm
IF input
RFP, RFN
15
V
Operating temperature
TOP
-40 to +85
°C
Storage temperature
Tstg
-65 to +150
°C
Supply voltage
Notes:
1. The device may not survive all maximum values applied simultaneously.
Thermal Resistance
Parameters
Symbol
Value
Unit
Junction ambient
RthJA
TBD
K/W
Junction case
RthJC
46
°C/W
Electrical Characteristics
Test Conditions: VCC = 5 V, Tamb = 25°C, RF input: -40 dB at 1880 MHz, LO input: 0 dBm at 1680 MHz
No.
1
Parameters
Test
Conditions
1700 to 2000 MHz
Operation
Pin
Symbol
Min.
4, 5
fRF
Typ.
2000 to 2300 MHz
Operation
Max.
Min.
1700
2000
fLO
1400
1,
16
FIF
30
200
4, 5
IIP3
12
Typ.
Max.
Unit
Type*
2000
2300
MHz
B, C
2000
1700
2300
MHz
B, C
300
30
200
300
MHz
B, C
15
12
15
dBm
D
AC Performance
1.1
RF frequency
range
For RF = 2000
to 2300 MHz
operation,
single-ended
RF + LO drive is
recommended
1.11
LO frequency
range
1.2
IF frequency
range
1.3
Input IP3
1.4
Input P1dB
4, 5
P1dB
1
2
3
5
dBm
D
1.5
Conversion gain
1,
16
G
9
12
6
9
dB
A
RF1 = RF2 =
-15 dBm/tone,
1 MHz spacing
*) Type means: A = 100% tested, B = 100% correlation tested, C = Characterized on samples, D = Design parameter
Note:
1. The return losses shown were measured with the T0781 mounted on Atmel’s FR4 evaluation boards using standard
matching practices as indicated on the respective application schematic (see Figure 23 and Figure 24). Users following
the RF, LO and IF matching guidelines will achieve similar performance.
3
4534B–SIGE–01/03
Electrical Characteristics (Continued)
Test Conditions: VCC = 5 V, Tamb = 25°C, RF input: -40 dB at 1880 MHz, LO input: 0 dBm at 1680 MHz
No.
Parameters
1.6
SSB noise figure
1.7
RF return loss
1.8
Test
Conditions
1700 to 2000 MHz
Operation
Pin
Symbol
Typ.
Max.
1,
16
NFSSB
14
15
Matched to
50 W (1)
4, 5
RLRF
20
LO return loss
Matched to
50 W (1)
12,
13
RLLO
1.9
IF return loss
Matched to
50 W (1)
1,
16
RLIF
1.10
LO drive
Matched to
50 W
12,
13
PLO
2
Min.
-3
2000 to 2300 MHz
Operation
Typ.
Max.
Unit
Type*
16
19
dB
D
20
dB
D
20
20
dB
D
20
20
dB
D
0
+3
Min.
-3
0
+3
dBm
D
Isolation Performance
2.1
Leakage (LO-RF)
12,
13
ALO-RF
-60
-40
-30
-20
dBm
D
2.2
Leakage (LO-IF)
12,
13
ALO-IF
-30
-20
-30
-20
dBm
D
2.3
Leakage (RF-IF)
-53
-40
-35
-25
dBm
D
3
Miscellaneous
3.1
Supply voltage
2,
7,
10,
15
VCC
5.0
5.25
5.0
5.25
V
A
3.2
Supply current
2,
7,
10,
15
ICC
160
180
160
180
mA
A
4.75
4.75
*) Type means: A = 100% tested, B = 100% correlation tested, C = Characterized on samples, D = Design parameter
Note:
1. The return losses shown were measured with the T0781 mounted on Atmel’s FR4 evaluation boards using standard
matching practices as indicated on the respective application schematic (see Figure 23 and Figure 24). Users following
the RF, LO and IF matching guidelines will achieve similar performance.
4
T0781
4534B–SIGE–01/03
T0781
1700 MHz to 2000 MHz: Typical Device Performance
Figure 3. Conversion Gain Versus Temperature, PLO = 0 dBm
Conversion Gain (dB)
20.0
Conversion Gain vs Tem perature
Plo = 0dBm
16.0
12.0
8.0
4.0
0.0
1400
-40ºC
+25ºC
+85ºC
1600
1800
2000
Frequency (MHz)
2200
Figure 4. Conversion Gain Versus LO Drive, Tamb = 25°C
Conversion Gain vs LO Drive
T=+25ºC
Conversion Gain (dB)
20.0
16.0
12.0
8.0
4.0
0.0
1400
-3 dBm
0 dBm
+3 dBm
1600
1800
2000
Frequency (MHz)
2200
Figure 5. Leakages, PLO = 0 dBm at Pins, PRF = -20 dBm at Pins, Tamb = 25°C
Leakages
Plo=0 dBm at pins, Prf=-20 dBm at pins,
T=+25ºC
Leakage (dBm)
0
LO-RF
RF-IF
LO-IF
-20
-40
-60
-80
1400
1600
1800
2000
Frequency (MHz)
2200
5
4534B–SIGE–01/03
Figure 6. Input IP3 Versus Temperature PLO = 0 dBm
Input IP3 vs Tem perature
Plo = 0dBm
Input IP3 (dBm)
20.0
-40ºC
+25º C
+85º C
18.0
16.0
14.0
12.0
10.0
1700
1750
1800
1850
1900
1950
2000
Frequency (MHz)
Figure 7. Input IP3 Versus LO Drive, Tamb = 25°C
Input IP3 vs LO Drive
T=+25ºC
Input IP3 (dBm)
20.0
-3 dBm
0 dBm
+3dBm
18.0
16.0
14.0
12.0
10.0
1700
1750
1800 1850 1900
Frequency (MHz)
1950
2000
Figure 8. Noise Figure Versus Temperature, PLO = 0 dBm
Noise Figure vs Tem perature
Plo=0dBm
Noise Figure (dB)
20
-40ºC
+25ºC
+85ºC
18
16
14
12
10
1700
1750
1800
1850
1900
1950
2000
Frequency (MHz)
6
T0781
4534B–SIGE–01/03
T0781
Figure 9. RF & LO Return Loss, Tamb = 25°C
RF & LO Return Loss (Note 1)
T=+25ºC
0
RF RL
Return Loss (dB)
-5
LO RL
-10
-15
-20
-25
-30
1400
1600
1800
2000
Frequency (MHz)
2200
Figure 10. IF Return Loss, Tamb = 25°C
IF Return Loss (Note 1)
T=+25ºC
0
Reutrn Loss (dB)
-5
-10
-15
-20
-25
-30
30
60
90
120 150 180 210 240 270 300
Frequency (MHz)
Figure 11. Input P1dB Versus Temperature, PLO = 0 dBm
Input P1dB vs Tem perature
Plo=0 dBm
Input P1dB (dBm)
5.0
3.0
1.0
-1.0
-40ºC
+25º C
+85º C
-3.0
-5.0
1700
1750
1800
1850
1900
1950
2000
Frequency (MHz)
7
4534B–SIGE–01/03
Figure 12. Input P1dB Versus LO Drive, Tamb = 25°C
Input P1dB vs LO Drive
T=+25ºC
Input P1dB (dBm)
5.0
3.0
1.0
-1.0
-3 dBm
0 dBm
+3dBm
-3.0
-5.0
1700
1750
1800
1850
1900
1950
2000
Frequency (MHz)
8
T0781
4534B–SIGE–01/03
T0781
2200 MHz to 2300 MHz: Typical Device Performance, Single-ended Drive
Figure 13. Conversion Gain Versus Temperature, PLO = 0 dBm
Conversion Gain vs Tem perature
Plo=0 dBm
Conversion Gain (dB)
20
-40ºC
+25ºC
+85ºC
16
12
8
4
0
2000
2100
2200
2300
2400
2500
Frequency (MHz)
Figure 14. Conversion Gain Versus LO Drive, Tamb = 25°C
Conversion Gain vs LO Drive
T=+25ºC
Conversion Gain (dB)
20
-3 dBm
0 dBm
+3 dBm
16
12
8
4
0
2000
2100
2200
2300
2400
2500
Frequency (MHz)
Figure 15. Leakages, PLO = 0 dBm at Pins, PRF = -20 dBm at Pins, Tamb = 25°C
Leakage (dBm)
-20
Leakages
Plo=0 dBm at pins, Prf=-20 dBm at pins,
T=+25ºC
LO-RF
RF-IF
LO-IF
-25
-30
-35
-40
-45
1800
1900 2000 2100
2200
2300 2400 2500
Frequency (MHz)
9
4534B–SIGE–01/03
Figure 16. Input IP3 Versus Temperature PLO = 0 dBm
Input IP3 vs Tem perature
Plo=0dBm
Input IP3 (dBm)
20.0
-40ºC
+25ºC
+85ºC
18.0
16.0
14.0
12.0
10.0
2000
2050
2100 2150 2200
Frequency (MHz)
2250
2300
Figure 17. Input IP3 Versus LO Drive, Tamb = 25°C
Input IP3 vs LO Drive
T=+25ºC
Input IP3 (dBm)
20.0
-3 dBm
0 dBm
+3 dBm
18.0
16.0
14.0
12.0
10.0
2000
2050
2100 2150 2200
Frequency (MHz)
2250
2300
Figure 18. Input P1dB Versus Temperature, Tamb = 25°C
Input P1dB vs Tem perature
Plo=0dBm
Input P1dB (dBm)
10.0
-40ºC
+25ºC
+85ºC
8.0
6.0
4.0
2.0
0.0
2000
2050
2100
2150
2200
2250
2300
Frequency (MHz)
10
T0781
4534B–SIGE–01/03
T0781
Figure 19. RF & LO Return Loss, VCC = 5 V, Tamb = 25°C
RF & LO Return Loss (Note 1)
Vcc=5V, T=+25ºC
Return Loss (dB)
0
-5
RF RL
-10
LO RL
-15
-20
-25
-30
-35
1800
1900
2000
2100
2200
2300
2400
255
300
Frequency (MHz)
Figure 20. IF Return Loss, Tamb = 25°C
IF Return Loss (Note 1)
T=25C
Reutrn Loss (dB)
0
-5
-10
-15
-20
-25
-30
30
75
120
165
210
Frequency (MHz)
Figure 21. Input P1dB Versus Temperature, PLO = 0 dBm
Input P1dB vs Tem perature
Plo=0dBm
Input P1dB (dBm)
10.0
8.0
6.0
-40ºC
+25ºC
+85ºC
4.0
2.0
0.0
2000
2050
2100
2150
2200
2250
2300
Frequency (MHz)
11
4534B–SIGE–01/03
Figure 22. Input P1dB Versus LO Drive, Tamb = 25°C
Input P1dB vs LO Drive
T=25C
10.0
-3 dBm
0 dBm
+3 dBm
Input P1dB (dBm)
8.0
6.0
4.0
2.0
0.0
2000
2050
2100
2150
2200
2250
2300
Frequency (MHz)
Figure 23. 1700 MHz to 2000 MHz Application Schematic (Differential Drive)
5V
IFout
J5
Lfil
C3
1
2
3
4
5
6
7
8
Vcc
T9
RFin
J3
T2
IC1
C7
C4
L3
C5
Vcc
C20
L1
Vcc
C9
16
15
14
13
12
11
10
9
C1
Vcc
L4
C11
C12
T11
LOin
J4
Vcc
C21
L2
Vcc
C6
12
T0781
Vcc
C10
T0781
4534B–SIGE–01/03
T0781
Bill of Materials (for 1700 MHz to 2000 MHz Evaluation Board)
Component
Designator
Value
Vendor
Part Number
Description
IC1
Atmel
T0781
J3, J4, J5
Johnson
Components
142-0701-851
SMA connector, end launch with tab, for 0.062 inch
board
Panansonic
EHF-FD1619
RF transformer
IF transformer
T9, T11
1:1
T2
1:1
Mini-Circuits
TC1-1
Lfil
1 µH
Würth Elektronik
74476401
L1, L2
see Table 1
TOKO
LL1608-FSR10J
L3
nc
SiGe receiver mixer
Inductor, 1210 footprint, minimum 200 mA rating
Inductor, 0603 footprint, high Q series
L4
nc
C1, C3, C20, C21
6.8 pF
Capacitor, 0603 footprint
C6, C10
100 pF
Capacitor, 0603 footprint
C7, C9
120 pF
Capacitor, 0603 footprint
C4, C5
2.2 pF
Capacitor, 0603 footprint
C11, C12
3.3 pF
Capacitor, 0603 footprint
The T0781 utilizes an IF tank circuit to maximize performance across the entire IF bandwidth. the off-chip inductors L1 and L2 resonate with an on-chip capacitor (4 pF) to provide IF tunability. therefore, L1 and L2 must be selected such that the resonance occurs
at the desired IF.
The following table provides the inductor values required on the evaluation board for
some common intermediate frequencies. By default, all evaluation board are shipped
with L1 = L2 = 100 nH, resulting in a 200 MHz resonant IF.
Table 1. IF Tank Circuit
IF (MHz) Typical
L1, L2 (nH)
TOKO Part Number
70
680
LL2012-FHR68J
150
150
LL1608-FSR15J
200
100
LL1608-FSR10J
300
39
LL1608-FS39NJ
13
4534B–SIGE–01/03
Figure 24. Demo Test Board (Fully Asembled PCB)
J5
47 mm
T2
C4
L3
J3
C9
C1
IC1
T0781
T9
C7
C3
C11
T11
L4
C5
C20
C12
C21
L1
C6
J4
L2
C10
Lfil
CON
2
1
47 mm
14
T0781
4534B–SIGE–01/03
T0781
Figure 25. 2000 MHz to 2300 MHz Application Schematic (Single-ended Drive)
5V
IFout
J5
Lfil
C7
C3
C2
RFin
Vcc
C4
J3
L3
C5
Vcc
C20
IC
1
1
2
3
4
5
6
7
8
L1
T2
C9
T0781
Vcc
16
15
14
13
12
11
10
9
C1
Vcc C11
LOin
R2
J4
L4
Vcc C12
C21
L2
Vcc
Vcc
C6
C10
Bill of Materials for (2000 MHz to 2300 MHz Evaluation Board)
Component
Designator
Value
Vendor
Part Number
IC1
Atmel
T0781
J3, J4, J5
Johnson
Components
142-0701-851
Description
SiGe receiver mixer
SMA connector, end launch with tab, for 0.062 inch
board
T2
1:1
Mini-Circuits
TC1-1
IF transformer
Lfil
1 µH
Würth Elektronik
74476401
L1, L2
see Table 1
TOKO
LL1608-FSR10J
L3
2.2 nH
L4
3.3 nH
TOKO
LL1608-FSR8NJ Inductor, 0603 footprint, high Q series
C1, C3, C20, C21
6.8 pF
C2
2.7 pF
C4
18 pF
C6, C10
100 pF
Capacitor, 0603 footprint
C7, C9
120 pF
Capacitor, 0603 footprint
Inductor, 1210 footprint, minimum 200 mA rating
Inductor, 0603 footprint, high Q series
Capacitor, 0603 footprint
C5
2.2 pF
Capacitor, 0603 footprint
C11
3.3 pF
Capacitor, 0603 footprint
C12
2.7 pF
Capacitor, 0603 footprint
R1, R2
0µ
Resistor, 0603 footprint
15
4534B–SIGE–01/03
Figure 26. Demo Test Board (Fully Asembled PCB)
J5
47 mm
T2
C7
C3
C5 R2
C20
J3
C9
IC1
C1
R3
C11
R4
C21
C12
T0781
T0780
C4 R1
L1
C6
J4
L2
C10
Lfil
CON
2
1
47 mm
Figure 27. Recommended Package Footprint
In order to avoid soldering problems, plugging of the ground vias under the heat slug is recommended!
31.75
3.0
6.35
0.74
0.4
0.74
3.0
f0.33 via
0.7
0.9
6.9
all units are in mm
- Indicates metalization
- vias connect pad to underlying ground plane
Remark: Heatslug must be soldered to GND.
16
T0781
4534B–SIGE–01/03
T0781
Ordering Information
Extended Type Number
Package
Remarks
T0781-6C
TSSOP16
–
Package Information
17
4534B–SIGE–01/03
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Printed on recycled paper.
4534B–SIGE–01/03
xM