Freescale Semiconductor Inc PART INFORMATION Mfg Item Number Mfg Item Name MK21FN1M0AVMC12R MAPBGA 121 8*8*1.5 P0.65 SUPPLIER Company Name Company Unique ID Response Date Response Document ID Contact Name Contact Title Contact Phone Contact Email Authorized Representative Representative Title Representative Phone Representative Email URL for Additional Information Freescale Semiconductor Inc 14-141-7928 2016-05-19 00ADK00229D022A1.6 Freescale Semiconductor Inc Product Technical Support 1-800-521-6274 [email protected] Daniel Binyon EPP Customer Response 512-895-3406 [email protected] www.freescale.com DECLARATION EU RoHS Pb Free HalogenFree Plating Indicator EU RoHS Exemption(s) MANUFACTURING Mfg Item Number Mfg Item Name Version Weight UoM Unit Volume J-STD-020 MSL Rating Peak Processing Temperature Max Time at Peak Temperature Number of Processing Cycles Yes Yes Yes e1 MK21FN1M0AVMC12R MAPBGA 121 8*8*1.5 P0.65 ALL 0.167700 g EACH 3 260 C 40 seconds 3 RoHS RoHS Directive RoHS Definition RoHS Legal Definition RoHS Declaration Supplier Acceptance Signature Exemption List Version List of Freescale Accepted Exemptions 2011/65/EU RoHS Definition: Quantity limit of 0.1% by mass (1000 PPM) of homogeneous material for: Lead (Pb), Mercury, Hexavalent Chromium, Polybrominated Biphenyls (PBB), Polybrominated Diphenyl Ethers (PBDE) and quantity limit of 0.01% by mass (100 PPM) of homogeneous material of Cadmium Please indicate whether any homogeneous material (as defined by the RoHS Directive, EU 2011/65/EU and implemented by the laws of the European Union member states) of the part(s) identified on this form contains lead, mercury, cadmium, hexavalent chromium, polybrominated biphenyls and/or polybrominated diphenyl ethers (each a RoHS restricted substance) in excess of the applicable quantity limit identified below. If a homogeneous material within the part(s) contains a RoHS restricted substance in excess of an applicable quantity limit, please indicate below which, if any, RoHS exemption you believe may apply. If the part is an assembly with lower level components, the declaration shall encompass all such components. Supplier certifies that it gathered the information it provides in this form using appropriate methods to ensure its accuracy and that such information is true and correct to the best of its knowledge and belief, as of the date that Supplier completes this form. Supplier acknowledges that Company will rely on this certification in determining the compliance of its products with European Union member state laws that implement the RoHS Directive. Company acknowledges that Supplier may have relied on information provided by others in completing this form, and that Supplier may not have independently verified such information. However, in situations where Supplier has not independently verified information provided by others, Supplier agrees that, at a minimum, its suppliers have provided certifications regarding their contributions to the part(s), and those certifications are at least as comprehensive as the certification in this paragraph. If the Company and the Supplier enter into a written agreement with respect to the identified part(s),the terms and conditions of that agreement, including any warranty rights and/or remedies provided as part of that agreement, will be the sole and exclusive source of the Suppliers liability and the Companys remedies for issues that arise regarding information the Supplier provides in this form. In the absence of such written agreement, the warranty rights and/or remedies of Suppliers Standard Terms and Conditions of Sale applicable to such part(s) shall apply. 1 - Item(s) do not contain RoHS restricted substances per the definition above Accepted Daniel Binyon 2012/51/EU 6(a) : Lead as an alloying element in steel for machining purposes and in galvanized steel containing up to 0.35% lead by weight 6(b) : Lead as an alloying element in aluminium containing up to 0.4% lead by weight 6(c) : Copper alloy containing up to 4% lead by weight 7(a) : Lead in high melting temperature type solders (i.e. lead-based alloys containing 85% by weight or more lead) 7(b) : Lead in solders for servers, storage and storage array systems, network infrastructure equipment for switching, signaling, transmission, and network management for telecommunications 7(c)-I : Electrical and electronic components containing lead in a glass or ceramic other than dielectric ceramic in capacitors, e.g. piezoelectronic devices, or in a glass or ceramic matrix compound 7(c)-II : Lead in dielectric ceramic in capacitors for a rated voltage of 125 V AC or 250 V DC or higher 7(c)-III : Lead in dielectric ceramic in capacitors for a rated voltage of less than 125 V AC or 250 V DC 7(c)-IV : Lead in PZT based dielectric ceramic materials for capacitors being part of integrated circuits or discrete semiconductors 15 : Lead in solders to complete a viable electrical connection between semiconductor die and carrier within integrated circuit flip chip packages MATERIAL COMPOSITION Homogeneous Material Weight SubstanceClass Substance CAS Silicon Semiconductor Die 0.0085 Silicon Semiconductor Die Solvents, additives, and other materials Other miscellaneous substances (less than 5%). - 0.00017 g Silicon Semiconductor Die Glass Silicon, doped - 0.00833 g Bonding Wire, PdCu Exemption SubstanceWeight UoM SubPart PPM SubPart% ARTICLEPPM ARTICLE% 20000 2 1013 0.1013 980000 98 49672 4.9672 g 0.013 g Bonding Wire, PdCu Metals Copper, metal 7440-50-8 0.01261 g 970000 97 75193 7.5193 Bonding Wire, PdCu Metals Palladium, metal 7440-05-3 0.00039 g 30000 3 2325 0.2325 Solder Balls - Lead Free 0.013 g Solder Balls - Lead Free Metals Copper, metal 7440-50-8 0.000065 g 5000 0.5 387 0.0387 Solder Balls - Lead Free Metals Silver, metal 7440-22-4 0.00039 g 30000 3 2325 0.2325 Solder Balls - Lead Free Metals Tin, metal 7440-31-5 0.012545 g 965000 96.5 74806 7.4806 Epoxy Die Attach 0.0028 g Epoxy Die Attach Plastics/polymers Phenolic Polymer Resin, Epikote 155 9003-36-5 0.00032458 g 115920 11.592 1935 0.1935 Epoxy Die Attach Plastics/polymers Other Epoxy resins - 0.00017744 g 63370 6.337 1058 0.1058 Epoxy Die Attach Solvents, additives, and other materials 1-cyanoguanidine 461-58-5 0.00000865 g 3091 0.3091 51 0.0051 Epoxy Die Attach Metals Silver, metal 7440-22-4 0.00228933 g 817619 81.7619 13651 1.3651 Die Encapsulant, Halogen-free 0.0704 g Die Encapsulant, Halogen-free Plastics/polymers Other Epoxy resins - 0.00352 g 50000 5 20989 2.0989 Die Encapsulant, Halogen-free Solvents, additives, and other materials Carbon Black 1333-86-4 0.0002112 g 3000 0.3 1259 0.1259 Die Encapsulant, Halogen-free Plastics/polymers Phenol, polymer with formaldehyde 9003-35-4 0.002112 g 30000 3 12593 1.2593 Die Encapsulant, Halogen-free Glass Silica, vitreous 60676-86-0 0.0645568 g 917000 91.7 384967 38.4967 Organic Substrate, Halogen-fre 0.06 g Organic Substrate, Halogen-fre Metals Barium sulfate 7727-43-7 0.00144714 g 24119 2.4119 8629 0.8629 Organic Substrate, Halogen-fre Metals Copper, metal 7440-50-8 0.04296438 g 716073 71.6073 256197 25.6197 Organic Substrate, Halogen-fre Plastics/polymers 4,4'-dihydroxy-3,3',5,5'-tetramethylbiphenyl digycidyl ether 85954-11-6 0.00033744 g 5624 0.5624 2012 0.2012 Organic Substrate, Halogen-fre Metals Gold, metal 7440-57-5 0.00012954 g 2159 0.2159 772 0.0772 Organic Substrate, Halogen-fre Metals Talc 14807-96-6 0.0001509 g 2515 0.2515 899 0.0899 Organic Substrate, Halogen-fre Nickel (external applications only) Nickel 7440-02-0 0.00099324 g 16554 1.6554 5922 0.5922 Organic Substrate, Halogen-fre Glass Fibrous-glass-wool 65997-17-3 0.01256934 g 209489 20.9489 74951 7.4951 Organic Substrate, Halogen-fre Glass Silicon dioxide 7631-86-9 0.00050382 g 8397 0.8397 3004 0.3004 Organic Substrate, Halogen-fre Metals Copper phthalocyanine 147-14-8 0.00000954 g 159 0.0159 56 0.0056 Organic Substrate, Halogen-fre Solvents, additives, and other materials 3-methoxy-3-methyl-1-butyl acetate 103429-90-9 0.00089466 g 14911 1.4911 5334 0.5334 LINKS MCD LINK NXP website GENERAL ENVIRONMENTAL COMPLIANCE LINKS RoHS signed letter China RoHS REACH signed letter ELV signed letter Conflict Minerals statement NXP ENVIRONMENTAL INFORMATION Environmental Compliance website FAQ Technical Service Request LINKS TO BLANK IPC1752 FORMS Blank IPC1752 v1.1 Form http://www.nxp.com http://www.nxp.com/files/corporate/doc/support_info/NXP-ROHS-DECLARATION.pdf http://www.nxp.com/about/corporate-responsibility/environmental-compliance-organization/china-rohs:ENV_CHINA_ROHS_STRATEGY http://www.nxp.com/files/corporate/doc/support_info/NXP-REACH-STATEMENT.pdf http://www.nxp.com/files/corporate/doc/support_info/NXP-ELV-STATEMENT.pdf http://www.nxp.com/files/corporate/doc/support_info/NXP-STATEMENT-CONFLICT-MINERALS.pdf http://www.nxp.com/about/corporate-responsibility/environmental-compliance-organization:ABUENVPRFPRDX http://www.nxp.com/about/corporate-responsibility/environmental-compliance-organization/eco-product-faqs:ENVIRON_FAQ http://www.nxp.com/support/sales-and-support:SUPPORTHOME http://www.NXP.com/files/abstract/corporate/ehs_epp/IPC-1752-2_v1.1_MCD_Template.pdf IPC1752 XML LINKS http://www.freescale.com/mcds/MK21FN1M0AVMC12R_IPC1752_v11.xml http://www.freescale.com/mcds/MK21FN1M0AVMC12R_IPC1752A.xml