Freescale Semiconductor Inc PART INFORMATION Mfg Item Number Mfg Item Name MKL17Z64VDA4R MAPBGA 36 3.5*3.5*.5 P.5 SUPPLIER Company Name Company Unique ID Response Date Response Document ID Contact Name Contact Title Contact Phone Contact Email Authorized Representative Representative Title Representative Phone Representative Email URL for Additional Information Freescale Semiconductor Inc 14-141-7928 2015-11-21 00JCK10949D382A1.0 Freescale Semiconductor Inc Product Technical Support 1-800-521-6274 [email protected] Daniel Binyon EPP Customer Response 512-895-3406 [email protected] www.freescale.com DECLARATION EU RoHS Pb Free HalogenFree Plating Indicator EU RoHS Exemption(s) MANUFACTURING Mfg Item Number Mfg Item Name Version Weight UoM Unit Volume J-STD-020 MSL Rating Peak Processing Temperature Max Time at Peak Temperature Number of Processing Cycles Yes Yes Yes e1 MKL17Z64VDA4R MAPBGA 36 3.5*3.5*.5 P.5 ALL 0.010900 g EACH 3 260 C 40 seconds 3 RoHS RoHS Directive RoHS Definition RoHS Legal Definition RoHS Declaration Supplier Acceptance Signature Exemption List Version List of Freescale Accepted Exemptions 2011/65/EU RoHS Definition: Quantity limit of 0.1% by mass (1000 PPM) of homogeneous material for: Lead (Pb), Mercury, Hexavalent Chromium, Polybrominated Biphenyls (PBB), Polybrominated Diphenyl Ethers (PBDE) and quantity limit of 0.01% by mass (100 PPM) of homogeneous material of Cadmium Please indicate whether any homogeneous material (as defined by the RoHS Directive, EU 2011/65/EU and implemented by the laws of the European Union member states) of the part(s) identified on this form contains lead, mercury, cadmium, hexavalent chromium, polybrominated biphenyls and/or polybrominated diphenyl ethers (each a RoHS restricted substance) in excess of the applicable quantity limit identified below. If a homogeneous material within the part(s) contains a RoHS restricted substance in excess of an applicable quantity limit, please indicate below which, if any, RoHS exemption you believe may apply. If the part is an assembly with lower level components, the declaration shall encompass all such components. Supplier certifies that it gathered the information it provides in this form using appropriate methods to ensure its accuracy and that such information is true and correct to the best of its knowledge and belief, as of the date that Supplier completes this form. Supplier acknowledges that Company will rely on this certification in determining the compliance of its products with European Union member state laws that implement the RoHS Directive. Company acknowledges that Supplier may have relied on information provided by others in completing this form, and that Supplier may not have independently verified such information. However, in situations where Supplier has not independently verified information provided by others, Supplier agrees that, at a minimum, its suppliers have provided certifications regarding their contributions to the part(s), and those certifications are at least as comprehensive as the certification in this paragraph. If the Company and the Supplier enter into a written agreement with respect to the identified part(s),the terms and conditions of that agreement, including any warranty rights and/or remedies provided as part of that agreement, will be the sole and exclusive source of the Suppliers liability and the Companys remedies for issues that arise regarding information the Supplier provides in this form. In the absence of such written agreement, the warranty rights and/or remedies of Suppliers Standard Terms and Conditions of Sale applicable to such part(s) shall apply. 1 - Item(s) do not contain RoHS restricted substances per the definition above Accepted Daniel Binyon 2012/51/EU 6(a) : Lead as an alloying element in steel for machining purposes and in galvanized steel containing up to 0.35% lead by weight 6(b) : Lead as an alloying element in aluminium containing up to 0.4% lead by weight 6(c) : Copper alloy containing up to 4% lead by weight 7(a) : Lead in high melting temperature type solders (i.e. lead-based alloys containing 85% by weight or more lead) 7(b) : Lead in solders for servers, storage and storage array systems, network infrastructure equipment for switching, signaling, transmission, and network management for telecommunications 7(c)-I : Electrical and electronic components containing lead in a glass or ceramic other than dielectric ceramic in capacitors, e.g. piezoelectronic devices, or in a glass or ceramic matrix compound 7(c)-II : Lead in dielectric ceramic in capacitors for a rated voltage of 125 V AC or 250 V DC or higher 7(c)-III : Lead in dielectric ceramic in capacitors for a rated voltage of less than 125 V AC or 250 V DC 7(c)-IV : Lead in PZT based dielectric ceramic materials for capacitors being part of integrated circuits or discrete semiconductors 15 : Lead in solders to complete a viable electrical connection between semiconductor die and carrier within integrated circuit flip chip packages MATERIAL COMPOSITION Homogeneous Material Weight SubstanceClass Substance CAS Bonding Wire, PdCu 0 Bonding Wire, PdCu Metals Copper, metal 7440-50-8 0 g Bonding Wire, PdCu Metals Gold, metal 7440-57-5 0 g Bonding Wire, PdCu Metals Palladium, metal 7440-05-3 0 g Non-Conductive Epoxy/Adhesive Exemption SubstanceWeight UoM SubPart PPM SubPart% ARTICLEPPM ARTICLE% 980994 98.0994 0 0 1000 0.1 0 0 18006 1.8006 0 0 g 0.0002 g Non-Conductive Epoxy/Adhesive Plastics/polymers Poly[(o-cresyl glycidyl ether)-co-formaldehyde] 29690-82-2 0.00002 g 100000 10 1834 0.1834 Non-Conductive Epoxy/Adhesive Plastics/polymers 4,4'-Isopropylidenediphenol-1-chloro-2,3-epoxypropane concentrate 25068-38-6 0.00005 g 250000 25 4587 0.4587 Non-Conductive Epoxy/Adhesive Plastics/polymers Phenol p-xylylene dimethyl ether copolymer 26834-02-6 0.00006 g 300000 30 5504 0.5504 Non-Conductive Epoxy/Adhesive Glass Silicon dioxide 7631-86-9 0.00005 g 250000 25 4587 0.4587 Non-Conductive Epoxy/Adhesive Plastics/polymers Acrylic acid ester copolymer 78506-70-4 0.00002 g 100000 10 1834 0.1834 Solder Balls - Lead Free 0.0012 g Solder Balls - Lead Free Metals Copper, metal 7440-50-8 0.00000601 g 5012 0.5012 551 0.0551 Solder Balls - Lead Free Metals Silver, metal 7440-22-4 0.00001203 g 10024 1.0024 1103 0.1103 Solder Balls - Lead Free Metals Tin, metal 7440-31-5 0.00118196 g 984964 98.4964 108436 10.8436 Die Encapsulant, Halogen-free 0.0061 g Die Encapsulant, Halogen-free Metals Other aluminum compounds - 0.000122 g 20000 2 11192 1.1192 Die Encapsulant, Halogen-free Plastics/polymers Other Epoxy resins - 0.000305 g 50000 5 27981 2.7981 Die Encapsulant, Halogen-free Solvents, additives, and other materials Carbon Black 1333-86-4 0.000061 g 10000 1 5596 0.5596 Die Encapsulant, Halogen-free Solvents, additives, and other materials Other organic phosphorous compounds - 0.000061 g 10000 1 5596 0.5596 Die Encapsulant, Halogen-free Plastics/polymers Phenol, polymer with formaldehyde 9003-35-4 0.000183 g 30000 3 16788 1.6788 Die Encapsulant, Halogen-free Plastics/polymers Other phenolic resins - 0.000183 g 30000 3 16788 1.6788 Die Encapsulant, Halogen-free Glass Silica, vitreous 60676-86-0 0.005185 g 850000 85 475704 47.5704 Organic Substrate 0.0024 g Organic Substrate Metals Aluminum, metal 7429-90-5 0.00000619 g 2580 0.258 567 0.0567 Organic Substrate Arsenic/Arsenic Compounds Arsenic 7440-38-2 0.00000029 g 119 0.0119 26 0.0026 Organic Substrate Metals Barium sulfate 7727-43-7 0.00006488 g 27032 2.7032 5952 0.5952 Organic Substrate Metals Copper, metal 7440-50-8 0.00088214 g 367558 36.7558 80930 8.093 Organic Substrate Metals Gold, metal 7440-57-5 0.00013558 g 56492 5.6492 12438 1.2438 Organic Substrate Solvents, additives, and other materials Other inorganic phosphorous compounds - 0.0000002 g 85 0.0085 18 0.0018 Organic Substrate Metals Magnesium, metal 7439-95-4 0.00002188 g 9118 0.9118 2007 0.2007 Organic Substrate Nickel (external applications only) Nickel 7440-02-0 0.00088266 g 367774 36.7774 80977 8.0977 Organic Substrate Solvents, additives, and other materials Other organic Silicon Compounds - 0.00000234 g 973 0.0973 214 0.0214 Organic Substrate Glass Fibrous-glass-wool 65997-17-3 0.000128 g 53335 5.3335 11743 1.1743 Organic Substrate Metals Zinc, metal 7440-66-6 0.00000311 g 1296 0.1296 285 0.0285 Organic Substrate Metals Aluminum Hydroxide 21645-51-2 0.0000614 g 25584 2.5584 5633 0.5633 Organic Substrate Solvents, additives, and other materials 3-methoxy-3-methyl-1-butyl acetate 103429-90-9 0.0000519 g 21625 2.1625 4761 0.4761 Organic Substrate Plastics/polymers Methacrylic acid, polymer with 2,2-bis(p-(2,3epoxypropoxy)phenyl)propane 26875-67-2 0.00015943 g 66429 6.6429 14626 1.4626 Silicon Semiconductor Die 0.001 g Silicon Semiconductor Die Solvents, additives, and other materials Other miscellaneous substances (less than 5%). - 0.00002 g 20000 2 1834 0.1834 Silicon Semiconductor Die Glass Silicon, doped - 0.00098 g 980000 98 89908 8.9908 LINKS MCD LINK Freescale website GENERAL ENVIRONMENTAL COMPLIANCE LINKS RoHS signed letter China RoHS REACH signed letter ELV signed letter Conflict Minerals statement FREESCALE ENVIRONMENTAL INFORMATION EPP website FAQ Technical Service Request LINKS TO BLANK IPC1752 FORMS Blank IPC1752 v1.1 Form http://www.freescale.com http://www.freescale.com/files/abstract/corporate/ehs_epp/ENV_ROHS_Freescale_Response.pdf http://www.freescale.com/chinarohs http://www.freescale.com/files/abstract/corporate/ehs_epp/ENV_REACH_Freescale_Response.pdf http://www.freescale.com/files/abstract/corporate/ehs_epp/ENV_ELV_Freescale_Reponse.pdf http://www.freescale.com/files/abstract/corporate/ehs_epp/ENV_CONFLICT_METAL_Freescale_Response.pdf http://www.freescale.com/epp http://www.freescale.com/webapp/sps/site/overview.jsp?code=ENVIRON_FAQ https://www.freescale.com/webapp/servicerequest.create_SR.framework?defaultCategory=Hardware Product Support&defaultTopic=Environmentally Preferred Prod http://www.freescale.com/files/abstract/corporate/ehs_epp/IPC-1752-2_v1.1_MCD_Template.pdf IPC1752 XML LINKS http://www.freescale.com/mcds/MKL17Z64VDA4R_IPC1752_v11.xml http://www.freescale.com/mcds/MKL17Z64VDA4R_IPC1752A.xml