56L QFN PB-FREE PACKAGE MATERIAL DECLARATION DATASHEET.pdf

56L - QFN
Pb-Free Package
PACKAGE MATERIAL DECLARATION DATASHEET
Cypress Package Code
Package Weight – Site 1
LY / LT
188.0104 mg
Body Size (mil/mm)
Package Weight – Site 2
Package Weight – Site 3
185.0003 mg
Package Weight – Site 4
Package Weight – Site 5
190.1801 mg
B1 : 176.5002 mg
B2 : 180.0262 mg
B3 : 169.9999 mg
B4 : 170.2700 mg
Package Weight – Site 6
8x8 mm
125.1303 mg
B1: 165.2401 mg
B2: 162.6570 mg
194.8298 mg
Package Weight – Site 8
N/A
Package Weight – Site 7
SUMMARY
The 56L-QFN Pb-Free package is compliant to RoHS. Cypress Ordering Part Numbers containing an “X”
(e.g. CY7C1328G-133AXI, CY2308SXC-1HT) meet the Directive 2002/95/EC (RoHS) requirement.
ASSEMBLY Site 1: Amkor Technology Seoul Korea
Package Qualification Report # 031803, 092103 (Note 1)
I.DECLARATION OF PACKAGED UNITS
A. BANNED SUBSTANCES
Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU
RoHS. Listed in the table below are materials that are neither contained nor intentionally added to this
product.
Substances / Compounds
Cadmium and Cadmium Compounds
Hexavalent Chromium and its Compounds
Lead and Lead Compounds
Mercury and Mercury Compounds
Polybrominated Biphenyls (PBB)
Polybrominated Diphenylethers (PBDE)
Asbestos
Azo colorants
Ozone Depleting Substances
Polychlorinated Biphenyls (PCBs)
Polychlorinated Napthalenes
Radioactive Substances
Shortchain Chlorinated Paraffins
Tributyl Tin (TBT) and Triphenyl Tin (TPT)
Tributyl Tin Oxide (TBTO)
Formaldehyde
Weight by mg
PPM
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
0
0
0
0
0
0
0
0
0
0
Analysis Report
(Note 2)
CoA-LY56Amkor Seoul
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to
report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material
information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-04327 Rev. *V
Page 1 of 20
56L - QFN
Pb-Free Package
B. MATERIAL COMPOSITION (Note 3)
Material
Purpose of Use
Leadframe
Base Material
Lead Finish
External Plating
Die Attach
Adhesive
Die
Wire
Circuit
Interconnect
Mold
Compound
Encapsulation
Substance
Composition
Cu
Fe
P
Zn
Ag
Sn
Resin
Ag
Metal oxide
Amine
Gamma
Butyrolactone
Si
Au
Phenol Resin
Epoxy Resin
Carbon Black
Silica Fused
7440-50-8
7439-89-6
7723-14-0
7440-66-6
7440-22-4
7440-31-5
Trade Secret
7440-22-4
Trade Secret
Trade Secret
96-48-0
100.7125
2.4302
0.0313
0.1147
1.0117
3.9500
0.5000
1.6700
0.0700
0.0700
0.0700
%weight of
substance
per
Homogene
ous
material
96.5600%
2.3300%
0.0300%
0.1100%
0.9700%
100.0000%
21.0100%
70.1700%
2.9400%
2.9400%
2.9400%
7440-21-3
7440-57-5
Trade secret
Trade secret
1333-86-4
60676-86-0
14.7800
1.3400
4.0432
5.5134
0.2450
51.4584
100.0000%
100.0000%
6.6000%
9.0000%
0.4000%
84.0000%
CAS Number
Package Weight (mg):
Weight by
mg
188.0104
% weight of
substance
per
package
PPM
535,675
12,926
166
610
5,381
21,009
2,660
8,883
372
372
372
53.5675%
1.2926%
0.0166%
0.0610%
0.5381%
2.1009%
0.2660%
0.8883%
0.0372%
0.0372%
0.0372%
78,613
7,127
21,505
29,325
1,303
273,700
7.8613%
0.7127%
2.1505%
2.9325%
0.1303%
27.3700%
% Total:
100.0000
II. DECLARATION OF PACKAGING INDIRECT MATERIALS
Type
Tape & Reel
Tray
Others
Material
Lead
PPM
Cr VI
PPM
Mercury
PPM
PBB
PPM
<20.0
<5.0
< 5.0
< 5.0
Cadmiu
m
PPM
<20.0
<5.0
< 5.0
< 5.0
Cover tape
Carrier tape
Plastic Reel
Tray
<20.0
<5.0
< 5.0
< 5.0
<20.0
<10.0
< 10.0
< 10.0
<20.0
<50.0
<50.0
<50.0
<20.0
<45.0
<45.0
<45.0
Shielding bag
<2.0
<2.0
<2.0
<2.0
<5.0
<5.0
PBDE
PPM
Analysis Report
(Note2)
CoA-COVT-R
CoA-CART-R
CoA-PLRL-R
CoA-TRAY-R
CoA-TRAY-M
CoA-SBAG –R
CoA-SBAG –M
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to
report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material
information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-04327 Rev. *V
Page 2 of 20
56L - QFN
Pb-Free Package
ASSEMBLY Site 2: PT UNISEM Batam Indonesia
Package Qualification Report # 073701 (Note 1)
I, DECLARATION OF PACKAGED UNITS
A. BANNED SUBSTANCES
Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU RoHS.
Listed in the table below are materials that are neither contained nor intentionally added to this product.
Substances / Compounds
Cadmium and Cadmium Compounds
Hexavalent Chromium and its Compounds
Lead and Lead Compounds
Mercury and Mercury Compounds
Polybrominated Biphenyls (PBB)
Polybrominated Diphenylethers (PBDE)
Asbestos
Azo colorants
Ozone Depleting Substances
Polychlorinated Biphenyls (PCBs)
Polychlorinated Napthalenes
Radioactive Substances
Shortchain Chlorinated Paraffins
Tributyl Tin (TBT) and Triphenyl Tin (TPT)
Tributyl Tin Oxide (TBTO)
Formaldehyde
Weight by mg
PPM
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
0
0
0
0
0
0
0
0
0
0
Analysis Report
(Note 2)
CoA-LT56-PT
UNISEM
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report
exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are
calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-04327 Rev. *V
Page 3 of 20
56L - QFN
Pb-Free Package
B. MATERIAL COMPOSITION (Note 3)
Purpose of
Use
Material
Base Material
Substance
Composition
Cu
Fe
P
Leadframe
Lead finish
Zn
Ni
Pd
External
Plating
Au
Silver (Ag)
Epoxy Resin
Die Attach
Die
Wire
t-Butyl phenyl
glycidyl ether
Dicyadiamide
Hardener
Silicon
Au
Adhesive
Circuit
Interconnect
Silica Fused
Epoxy Resin
Mold
Compound
Phenol Resin
Encapsulation
Carbon Black
PPM
238431
6136
368
% weight
of
substanc
e per
package
23.8431%
0.6136%
0.0368%
0.2000%
491
0.0491%
92.0000%
6.9000%
10367
778
1.0367%
0.0778%
1.1000%
124
0.0124%
70.0000%
15.0000%
11524
2469
1.1524%
0.2469%
10.0000%
1646
0.1646%
0.0082
0.0948
12.0200
0.8100
70.3080
0.4000%
4.6000%
100.0000%
100.0000%
90.0000%
66
757
96060
6473
561879
0.0066%
0.0757%
9.6060%
0.6473%
56.1879%
3.9060
5.0000%
31215
3.1215%
3.5154
4.5000%
28094
2.8094%
0.3906
0.5000%
3122
0.3122%
CAS
Number
7440-50-8
7439-89-6
7723-14-0
Weight by
mg
29.8350
0.7678
0.0461
7440-66-6
0.0614
7440-02-0
7440-03-5
1.2972
0.0973
7440-57-5
0.0155
7440-22-4
9003-36-5
1.4420
0.3090
3101-60-8
0.2060
461-58-5
620-92-8
7440-21-3
7440-57-5
60676-86-0
Trade
Secret
Trade
Secret
1333-86-4
Package Weight (mg):
%weight of
substance
per
Homogeneo
us material
97.1500%
2.5000%
0.1500%
125.1303
% Total:
100.0000
II. DECLARATION OF PACKAGING INDIRECT MATERIALS
Type
Tape & Reel
Tray
Others
Material
Lead
PPM
Cr VI
PPM
Mercury
PPM
PBB
PPM
<20.0
<5.0
< 5.0
< 5.0
Cadmiu
m
PPM
<20.0
<5.0
< 5.0
< 5.0
Cover tape
Carrier tape
Plastic Reel
Tray
<20.0
<5.0
< 5.0
< 5.0
<20.0
<10.0
< 10.0
< 10.0
<20.0
<50.0
<50.0
<50.0
<20.0
<45.0
<45.0
<45.0
Shielding bag
<2.0
<2.0
<2.0
<2.0
<5.0
<5.0
PBDE
PPM
Analysis Report
(Note2)
CoA-COVT-R
CoA-CART-R
CoA-PLRL-R
CoA-TRAY-R
CoA-TRAY-M
CoA-SBAG –R
CoA-SBAG –M
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report
exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are
calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-04327 Rev. *V
Page 4 of 20
56L - QFN
Pb-Free Package
ASSEMBLY Site 3: Advanced Semiconductor Engineering Shanghai (ASE)
Package Qualification Report # 084005 (Note 1)
I.DECLARATION OF PACKAGED UNITS
A. BANNED SUBSTANCES
Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU RoHS.
Listed in the table below are materials that are neither contained nor intentionally added to this product.
Substances / Compounds
Cadmium and Cadmium Compounds
Hexavalent Chromium and its Compounds
Lead and Lead Compounds
Mercury and Mercury Compounds
Polybrominated Biphenyls (PBB)
Polybrominated Diphenylethers (PBDE)
Asbestos
Azo colorants
Ozone Depleting Substances
Polychlorinated Biphenyls (PCBs)
Polychlorinated Napthalenes
Radioactive Substances
Shortchain Chlorinated Paraffins
Tributyl Tin (TBT) and Triphenyl Tin (TPT)
Tributyl Tin Oxide (TBTO)
Formaldehyde
Weight by mg
PPM
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
0
0
0
0
0
0
0
0
0
0
Analysis Report
(Note 2)
CoA-LT56ASE Shanghai
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report
exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are
calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-04327 Rev. *V
Page 5 of 20
56L - QFN
Pb-Free Package
B. MATERIAL COMPOSITION (Note 3)
Material
Purpose of Use
Base Material
Leadframe
External Plating
Die Attach
Adhesive
Die
Circuit
Wire
Interconnect
Mold
Compound
Encapsulation
68.5774
1.6392
0.0211
0.1126
0.8600
0.0400
0.0200
0.0100
1.6478
0.0535
0.1712
0.1070
%weight of
substance per
Homogeneous
material
97.4800%
2.3300%
0.0300%
0.1600%
92.4700%
4.3000%
2.1500%
1.0800%
77.0000%
2.5000%
8.0000%
5.0000%
370688
8860
114
608
4648
216
108
54
8907
289
925
578
% weight of
substance
per
package
37.0688%
0.8860%
0.0114%
0.0608%
0.4648%
0.0216%
0.0108%
0.0054%
0.8907%
0.0289%
0.0925%
0.0578%
Trade Secret
0.0214
1.0000%
116
0.0116%
Trade Secret
Trade Secret
Trade Secret
7440-21-3
7440-57-5
7440-05-3
60676-86-0
Trade Secret
Trade Secret
1333-86-4
0.1070
0.0107
0.0214
16.6300
0.8613
0.0087
81.3792
7.5264
4.7040
0.4704
5.0000%
0.5000%
1.0000%
100.0000%
99.0000%
1.0000%
86.5000%
8.0000%
5.0000%
0.5000%
578
58
116
89892
4656
47
439887
40683
25427
2543
0.0578%
0.0058%
0.0116%
8.9892%
0.4656%
0.0047%
43.9887%
4.0683%
2.5427%
0.2543%
Substance
Composition
CAS
Number
Cu
Fe
P
Zn
Ni
Pd
Au
Ag
Silver (Ag)
Epoxy Resin
Acrylic resin
Polybutadiene
derivative
Butadiene
copolymer
Acrylate
Peroxide
Additive
Silicon
Au
Pd
Silica Fused
Epoxy Resin
Phenol Resin
Carbon Black
7440-50-8
7439-89-6
7723-14-0
7440-66-6
7440-02-0
7440-05-3
7440-57-5
7440-22-4
7440-22-4
9003-36-5
Trade Secret
Trade Secre
Package Weight (mg):
Weight by
mg
185.0003
PPM
% Total:
100.0000
II. DECLARATION OF PACKAGING INDIRECT MATERIALS
Type
Tape & Reel
Tray
Others
Material
Lead
PPM
Cr VI
PPM
Mercury
PPM
PBB
PPM
<20.0
<5.0
< 5.0
< 5.0
Cadmiu
m
PPM
<20.0
<5.0
< 5.0
< 5.0
Cover tape
Carrier tape
Plastic Reel
Tray
<20.0
<5.0
< 5.0
< 5.0
<20.0
<10.0
< 10.0
< 10.0
<20.0
<50.0
<50.0
<50.0
<20.0
<45.0
<45.0
<45.0
Shielding bag
<2.0
<2.0
<2.0
<2.0
<5.0
<5.0
PBDE
PPM
Analysis Report
(Note2)
CoA-COVT-R
CoA-CART-R
CoA-PLRL-R
CoA-TRAY-R
CoA-TRAY-M
CoA-SBAG –R
CoA-SBAG –M
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report
exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are
calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-04327 Rev. *V
Page 6 of 20
56L - QFN
Pb-Free Package
ASSEMBLY Site 4: Cypress Manufacturing Limited (CML)
Package Qualification Report # 092006, 095003, 120206 (Note 1)
I.DECLARATION OF PACKAGED UNITS
A. BANNED SUBSTANCES
Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU RoHS.
Listed in the table below are materials that are neither contained nor intentionally added to this product.
Substances / Compounds
Cadmium and Cadmium Compounds
Hexavalent Chromium and its Compounds
Lead and Lead Compounds
Mercury and Mercury Compounds
Polybrominated Biphenyls (PBB)
Polybrominated Diphenylethers (PBDE)
Asbestos
Azo colorants
Ozone Depleting Substances
Polychlorinated Biphenyls (PCBs)
Polychlorinated Napthalenes
Radioactive Substances
Shortchain Chlorinated Paraffins
Tributyl Tin (TBT) and Triphenyl Tin (TPT)
Tributyl Tin Oxide (TBTO)
Formaldehyde
Weight by mg
PPM
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
0
0
0
0
0
0
0
0
0
0
Analysis Report
(Note 2)
CoA-LT56- CML
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report
exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are
calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-04327 Rev. *V
Page 7 of 20
56L - QFN
Pb-Free Package
B1. MATERIAL COMPOSITION (Note 3)
Using Gold wire material
Material
Lead
Frame
Purpose of
Use
Base material
Lead Finish
External
Plating
Die Attach
Adhesive
Die
Circuit
Wire
Interconnect
Mold
Compound
Encapsulation
Substance
Composition
Copper
Iron
Phosphorous
Zinc
Nickel
Palladium
Gold
Ag
Carbocyclic
Acrylate
CAS Number
7440-50-8
7439-89-6
7723-14-0
7440-66-6
7440-02-0
7440-05-3
7440-57-5
7440-22-4
Trade Secret
Weight by
mg
55.0659
1.3567
0.0396
0.0678
0.8590
0.0155
0.0155
0.3256
0.0880
Trade Secret
Trade Secret
Trade Secret
7440-21-3
7440-57-5
7440-05-3
60676-86-0
Trade Secret
Trade Secret
Trade Secret
1333-86-4
14808-60-7
0.0088
0.0088
0.0088
5.9700
4.7916
0.0484
80.6360
2.8971
3.8628
3.8628
0.4829
4.8285
Package Weight (mg):
165.2401
Bismaleimide Resin
Additive
Acrylate ester
Silicon
Gold
Palladium
SiO2
Metal OH
Phenol Resin
Epoxy Resin
Carbon Black
Crystalline Silica
% weight of
substance per
Homogeneous
material
97.4100%
2.4000%
0.0700%
0.1200%
96.5200%
1.7400%
1.7400%
74.0000%
20.0000%
2.0000%
2.0000%
2.0000%
100.0000%
99.0000%
1.0000%
83.5000%
3.0000%
4.0000%
4.0000%
0.5000%
5.0000%
PPM
% weight of
substance per
package
333248
8211
239
411
5199
94
94
1970
33.3248%
0.8211%
0.0239%
0.0411%
0.5199%
0.0094%
0.0094%
0.1970%
533
0.0533%
53
53
53
36129
28998
293
487993
17533
23377
23377
2922
29221
0.0053%
0.0053%
0.0053%
3.6129%
2.8998%
0.0293%
48.7993%
1.7533%
2.3377%
2.3377%
0.2922%
2.9221%
% Total:
100.0000
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report
exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are
calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-04327 Rev. *V
Page 8 of 20
56L - QFN
Pb-Free Package
B2. MATERIAL COMPOSITION (Note 3)
Using Copper wire material
Material
Lead
Frame
Purpose of
Use
Base material
Lead Finish
External
Plating
Die Attach
Adhesive
Die
Wire
Circuit
Interconnect
Mold
Compound
Encapsulation
Copper
Iron
Phosphorous
Zinc
Nickel
Palladium
Gold
Ag
Carbocyclic
Acrylate
7440-50-8
7439-89-6
7723-14-0
7440-66-6
7440-02-0
7440-05-3
7440-57-5
7440-22-4
Trade Secret
55.0600
1.3600
0.0400
0.0700
0.8500
0.0200
0.0200
0.3200
0.0900
% weight of
substance per
Homogeneous
material
97.4100
2.4000
0.0700
0.1200
96.5200
1.7400
1.7400
74.0000
20.0000
Bismaleimide Resin
Additive
Acrylate ester
Silicon
Copper
SiO2
Metal OH
Phenol Resin
Epoxy Resin
Carbon Black
Crystalline Silica
Trade Secret
0.0100
2.0000
61
0.0061%
Trade Secret
Trade Secret
7440-21-3
7440-50-8
60676-86-0
Trade Secret
Trade Secret
Trade Secret
1333-86-4
14808-60-7
0.0100
0.0100
5.9700
2.2570
80.6400
2.9000
3.8600
3.8600
0.4800
4.8300
2.0000
2.0000
100.0000
100.0000
83.5000
3.0000
4.0000
4.0000
0.5000
5.0000
61
61
36,703
13,876
495,768
17,829
23,731
23,731
2,951
29,694
0.0061%
0.0061%
3.6703%
1.3876%
49.5768%
1.7829%
2.3731%
2.3731%
0.2951%
2.9694%
Package Weight (mg):
162.6570
Substance
Composition
CAS Number
Weight by
mg
% weight of
substance per
package
PPM
338,505
8,361
246
430
5,226
123
123
1,967
553
33.8505%
0.8361%
0.0246%
0.0430%
0.5226%
0.0123%
0.0123%
0.1967%
0.0553%
% Total:
100.0000
II. DECLARATION OF PACKAGING INDIRECT MATERIALS
Type
Tape &
Reel
Tray
Others
Material
Lead
PPM
Cr VI
PPM
Mercury
PPM
PBB
PPM
<20.0
<5.0
< 5.0
< 5.0
Cadmiu
m
PPM
<20.0
<5.0
< 5.0
< 5.0
Cover tape
Carrier tape
Plastic Reel
Tray
<20.0
<5.0
< 5.0
< 5.0
<20.0
<10.0
< 10.0
< 10.0
<20.0
<50.0
<50.0
<50.0
<20.0
<45.0
<45.0
<45.0
Shielding bag
<2.0
<2.0
<2.0
<2.0
<5.0
<5.0
PBDE
PPM
Analysis Report
(Note2)
CoA-COVT-R
CoA-CART-R
CoA-PLRL-R
CoA-TRAY-R
CoA-TRAY-M
CoA-SBAG –R
CoA-SBAG –M
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report
exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are
calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-04327 Rev. *V
Page 9 of 20
56L - QFN
Pb-Free Package
ASSEMBLY Site 5: Amkor Technology Philippines (P3/P4)
Package Qualification Report #094101 (Note 1)
I. DECLARATION OF PACKAGED UNITS
A. BANNED SUBSTANCES
Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU RoHS.
Listed in the table below are materials that are neither contained nor intentionally added to this product.
Substances / Compounds
Cadmium and Cadmium Compounds
Hexavalent Chromium and its Compounds
Lead and Lead Compounds
Mercury and Mercury Compounds
Polybrominated Biphenyls (PBB)
Polybrominated Diphenylethers (PBDE)
Asbestos
Azo colorants
Ozone Depleting Substances
Polychlorinated Biphenyls (PCBs)
Polychlorinated Napthalenes
Radioactive Substances
Shortchain Chlorinated Paraffins
Tributyl Tin (TBT) and Triphenyl Tin (TPT)
Tributyl Tin Oxide (TBTO)
Formaldehyde
Weight by mg
PPM
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
0
0
0
0
0
0
0
0
0
0
Analysis Report
(Note 2)
CoA-LT56-Amkor
Philippines
(P3/P4)
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report
exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are
calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-04327 Rev. *V
Page 10 of 20
56L - QFN
Pb-Free Package
B. MATERIAL COMPOSITION (Note 3)
Material
Purpose of Use
Base Material
Leadframe
External Plating
Die Attach
Adhesive
Die
Wire
Circuit
Interconnect
Mold
Compound
Encapsulation
Substance
Composition
Cu
Fe
P
Zn
Ni
Pd
Au
Ag
Silver (Ag)
Acrylate
Bismaleimide
Methacrylate
Ester
Polymer
Silicon
Au
Silica Fused
Epoxy Resin
Phenol Resin
Carbon Black
Crystallin silica
Metal hydro
oxide
7440-50-8
7439-89-6
7723-14-0
7440-66-6
7440-02-0
7440-05-3
7440-57-5
7440-22-4
7440-22-4
Trade Secret
Trade Secret
Trade Secret
107.6985
2.5958
0.0331
0.1326
1.4529
0.0311
0.0060
%weight of
substance per
Homogeneous
material
97.5000%
2.3500%
0.0300%
0.1200%
97.5100%
2.0900%
0.4000%
1.9434
0.2607
0.0711
0.0711
82.0000%
11.0000%
3.0000%
3.0000%
10,219
1,371
374
374
1.0219%
0.1371%
0.0374%
0.0374%
Trade Secret
7440-21-3
7440-57-5
60676-86-0
Trade Secret
Trade Secret
1333-86-4
14808-60-7
Trade Secret
0.0237
14.7900
0.8600
39.1365
5.4189
5.4189
0.3011
1.2042
8.7305
1.0000%
100.0000%
100.0000%
65.0000%
9.0000%
9.0000%
0.5000%
2.0000%
14.5000%
125
77,768
4,522
205,787
28,494
28,494
1,583
6,332
45,906
0.0125%
7.7768%
0.4522%
20.5787%
2.8494%
2.8494%
0.1583%
0.6332%
4.5906%
CAS Number
Package Weight (mg):
Weight by
mg
190.1801
566,298
13,649
174
697
7,640
164
31
% weight of
substance
per
package
56.6298%
1.3649%
0.0174%
0.0697%
0.7640%
0.0164%
0.0031%
PPM
% Total:
100.0000
II. DECLARATION OF PACKAGING INDIRECT MATERIALS
Type
Tape & Reel
Tray
Others
Material
Lead
PPM
Cr VI
PPM
Mercury
PPM
PBB
PPM
<20.0
<5.0
< 5.0
< 5.0
Cadmiu
m
PPM
<20.0
<5.0
< 5.0
< 5.0
Cover tape
Carrier tape
Plastic Reel
Tray
<20.0
<5.0
< 5.0
< 5.0
<20.0
<10.0
< 10.0
< 10.0
<20.0
<50.0
<50.0
<50.0
<20.0
<45.0
<45.0
<45.0
Shielding bag
<2.0
<2.0
<2.0
<2.0
<5.0
<5.0
PBDE
PPM
Analysis Report
(Note2)
CoA-COVT-R
CoA-CART-R
CoA-PLRL-R
CoA-TRAY-R
CoA-TRAY-M
CoA-SBAG –R
CoA-SBAG –M
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report
exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are
calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-04327 Rev. *V
Page 11 of 20
56L - QFN
Pb-Free Package
ASSEMBLY Site 6: CARSEM Malaysia
Package Qualification Report # 083804
(Note 1)
I.DECLARATION OF PACKAGED UNITS
A. BANNED SUBSTANCES
Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU RoHS.
Listed in the table below are materials that are neither contained nor intentionally added to this product.
Substances / Compounds
Cadmium and Cadmium Compounds
Hexavalent Chromium and its Compounds
Lead and Lead Compounds
Mercury and Mercury Compounds
Polybrominated Biphenyls (PBB)
Polybrominated Diphenylethers (PBDE)
Asbestos
Azo colorants
Ozone Depleting Substances
Polychlorinated Biphenyls (PCBs)
Polychlorinated Napthalenes
Radioactive Substances
Shortchain Chlorinated Paraffins
Tributyl Tin (TBT) and Triphenyl Tin (TPT)
Tributyl Tin Oxide (TBTO)
Formaldehyde
Weight by mg
PPM
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
0
0
0
0
0
0
0
0
0
0
Analysis Report
(Note 2)
CoA-LT56CARSEM
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report
exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are
calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-04327 Rev. *V
Page 12 of 20
56L - QFN
Pb-Free Package
B. MATERIAL COMPOSITION (Note 3)
Material
Purpose of
Use
Base Material
Leadframe
External
Plating
Die Attach
Adhesive
Die
Wire
Circuit
Interconnect
Mold
Compound
Encapsulation
Substance
Composition
Cu
Fe
P
Zn
Ni
Pd
Au
Silver (Ag)
Carbocycllic
Acrylate
Bismaleimide
resin
Acrylate
Additive
Silicon
Au
Silica Fused
Epoxy Resin
Phenol Resin
Carbon Black
7440-50-8
7439-89-6
7723-14-0
7440-66-6
7440-02-0
7440-05-3
7440-57-5
7440-22-4
Trade Secret
98.7210
2.3071
0.0202
0.1315
1.1818
0.1028
0.0155
0.3670
0.1034
%weight of
substance per
Homogeneous
material
97.5600%
2.2800%
0.0200%
0.1300%
90.9100%
7.9100%
1.1900%
69.2500%
19.5100%
Trade Secret
0.0155
2.9300%
80
0.0080%
Trade Secret
Trade Secret
7440-21-3
7440-57-5
60676-86-0
Trade Secret
Trade Secret
1333-86-4
0.0220
0.0220
5.2100
1.3000
79.9355
2.5593
2.5593
0.2559
4.1600%
4.1600%
100.0000%
100.0000%
93.7000%
3.0000%
3.0000%
0.3000%
113
113
26741
6672
410283
13136
13136
1314
0.0113%
0.0113%
2.6741%
0.6672%
41.0283%
1.3136%
1.3136%
0.1314%
CAS Number
Package Weight (mg):
Weight by
mg
194.8298
% weight of
substance
per package
PPM
506703
11842
104
675
6066
528
79
1884
531
50.6703%
1.1842%
0.0104%
0.0675%
0.6066%
0.0528%
0.0079%
0.1884%
0.0531%
% Total:
100.0000
II. DECLARATION OF PACKAGING INDIRECT MATERIALS
Type
Tape & Reel
Tray
Others
Material
Lead
PPM
Cr VI
PPM
Mercury
PPM
PBB
PPM
<20.0
<5.0
< 5.0
< 5.0
Cadmiu
m
PPM
<20.0
<5.0
< 5.0
< 5.0
Cover tape
Carrier tape
Plastic Reel
Tray
<20.0
<5.0
< 5.0
< 5.0
<20.0
<10.0
< 10.0
< 10.0
<20.0
<50.0
<50.0
<50.0
<20.0
<45.0
<45.0
<45.0
Shielding bag
<2.0
<2.0
<2.0
<2.0
<5.0
<5.0
PBDE
PPM
Analysis Report
(Note2)
CoA-COVT-R
CoA-CART-R
CoA-PLRL-R
CoA-TRAY-R
CoA-TRAY-M
CoA-SBAG –R
CoA-SBAG –M
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report
exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are
calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-04327 Rev. *V
Page 13 of 20
56L - QFN
Pb-Free Package
ASSEMBLY Site 7: Advanced Semiconductor Engineering Taiwan (ASET)
Package Qualification Report # 111816, 114906, 151312, 151313 (Note 1)
I. DECLARATION OF PACKAGED UNITS
A. BANNED SUBSTANCES
Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU RoHS.
Listed in the table below are materials that are neither contained nor intentionally added to this product.
Substances / Compounds
Cadmium and Cadmium Compounds
Hexavalent Chromium and its Compounds
Lead and Lead Compounds
Mercury and Mercury Compounds
Polybrominated Biphenyls (PBB)
Polybrominated Diphenylethers (PBDE)
Asbestos
Azo colorants
Ozone Depleting Substances
Polychlorinated Biphenyls (PCBs)
Polychlorinated Napthalenes
Radioactive Substances
Shortchain Chlorinated Paraffins
Tributyl Tin (TBT) and Triphenyl Tin (TPT)
Tributyl Tin Oxide (TBTO)
Formaldehyde
Weight by mg
PPM
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
0
0
0
0
0
0
0
0
0
0
Analysis Report
(Note 2)
CoA-LT56- ASET
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report
exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are
calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-04327 Rev. *V
Page 14 of 20
56L - QFN
Pb-Free Package
B1. MATERIAL COMPOSITION (Note 3)
Using Gold wire material
Material
Lead
Frame
Purpose of
Use
Base material
Lead Finish
External
Plating
Die Attach
Adhesive
Die
Circuit
Wire
Interconnect
Mold
Compound
Encapsulation
Substance
Composition
Copper
Iron
Phosphorous
Zinc
Nickel
Palladium
Gold
Silver
Acrylic Resin
Polybutadiene
derivative
Butadiene
copolymer
Acrylate
Peroxide
Additive
Silicon
Gold
Ion Impurities
Epoxy Resin A
Epoxy Resin B
Phenol Resin
Carbon Black
Silica Fused
CAS Number
7440-50-8
7439-89-6
7723-14-0
7440-66-6
7440-02-0
7440-05-3
7440-57-5
7440-22-4
Trade Secret
Trade Secret
76.8583
1.8938
0.0395
0.1184
1.0194
0.0476
0.0130
3.0800
0.3300
% weight of
substance per
Homogeneous
material
97.4000%
2.4000%
0.0500%
0.1500%
94.3900%
4.4100%
1.2000%
70.0000%
7.5000%
435,458
10,730
224
671
5,776
270
73
17,450
1,870
43.5458%
1.0730%
0.0224%
0.0671%
0.5776%
0.0270%
0.0073%
1.7450%
0.1870%
0.4070
9.2500%
2,306
0.2306%
0.1540
0.3300
0.0440
0.0550
15.8000
0.7999
0.0001
3.3980
2.2653
4.9837
0.3776
64.4856
3.5000%
7.5000%
1.0000%
1.2500%
100.0000%
99.9900%
0.0100%
4.5000%
3.0000%
6.6000%
0.5000%
85.4000%
873
1,870
249
312
89,518
4,532
0
19,252
12,835
28,236
2,139
365,357
0.0873%
0.1870%
0.0249%
0.0312%
8.9518%
0.4532%
0.0000%
1.9252%
1.2835%
2.8236%
0.2139%
36.5357%
Weight by
mg
PPM
% weight of
substance per
package
Trade Secret
Trade Secret
Trade Secret
Trade Secret
7440-21-3
7440-57-5
Trade Secret
Trade Secret
Trade Secret
Trade Secret
1333-86-4
60676-86-0
Package Weight (mg): 176.5002
% Total:
100.0000
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report
exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are
calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-04327 Rev. *V
Page 15 of 20
56L - QFN
Pb-Free Package
B2. MATERIAL COMPOSITION (Note 3)
Using Copper wire material
Material
Lead
Frame
Purpose of
Use
Base material
Lead Finish
External
Plating
Die Attach
Adhesive
Die
Wire
Circuit
Interconnect
Mold
Compound
Encapsulation
Substance
Composition
Copper
Iron
Phosphorous
Zinc
Nickel
Palladium
Gold
Silver
Acrylic Resin
Polybutadiene
derivative
Butadiene
copolymer
Acrylate
Peroxide
Additive
Silicon
Copper
Epoxy Resin A
Epoxy Resin B
Phenol Resin
Carbon Black
Silica Fused
CAS Number
7440-50-8
7439-89-6
7723-14-0
7440-66-6
7440-02-0
7440-05-3
7440-57-5
7440-22-4
Trade Secret
Trade Secret
93.0869
2.3439
0.0861
0.1531
1.2346
0.0577
0.0157
1.3230
0.1418
% weight of
substance
per
Homogeneo
us material
97.3000
2.4500
0.0900
0.1600
94.3880
4.4120
1.2000
70.0000
7.5000
517,075
13,020
478
850
6,858
321
87
7,349
787
51.7075%
1.3020%
0.0478%
0.0850%
0.6858%
0.0321%
0.0087%
0.7349%
0.0787%
0.1748
9.2500
971
0.0971%
0.0662
0.1418
0.0189
0.0236
16.1580
0.3700
2.9084
1.9389
4.2656
0.3232
55.1940
3.5000
7.5000
1.0000
1.2500
100.0000
100.0000
4.5000
3.0000
6.6000
0.5000
85.4000
367
787
105
131
89,754
2,057
16,155
10,770
23,694
1,795
306,589
0.0367%
0.0787%
0.0105%
0.0131%
8.9754%
0.2057%
1.6155%
1.0770%
2.3694%
0.1795%
30.6589%
Weight by
mg
PPM
% weight of
substance per
package
Trade Secret
Trade Secret
Trade Secret
Trade Secret
7440-21-3
7440-50-8
Trade Secret
Trade Secret
Trade Secret
1333-86-4
60676-86-0
Package Weight (mg):
180.0262
% Total:
100.0000
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report
exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are
calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-04327 Rev. *V
Page 16 of 20
56L - QFN
Pb-Free Package
B3. MATERIAL COMPOSITION (Note 3)
HX2LP Automotive Part Using Gold wire material
Material
Lead
Frame
Purpose of
Use
Base material
Lead Finish
Die Attach
External
Plating
Adhesive
Die
Wire
Circuit
Interconnect
Mold
Compound
Encapsulation
Substance
Composition
Copper
Iron
Phosphorus
Zinc
Silver
Tin
Impurities
Acrylic Resin
Polybutadiene
derivative
Butadiene
copolymer
Acrylate
Peroxide
Additive
Silver
Silicon
Gold
Epoxy Resin
Phenol Resin
Silica(Amorphous) A
Silica(Amorphous) B
Carbon Black
7440-50-8
7439-89-6
7723-14-0
7440-66-6
7440-22-4
7440-31-5
Trade Secret
Trade Secret
84.5100
2.0700
0.0900
0.1800
3.1500
1.4999
0.0002
0.1200
% weight of
substance per
Homogeneous
material
93.9000%
2.3000%
0.1000%
0.2000%
3.5000%
99.9900%
0.0100%
7.5000%
Trade Secret
0.1600
10.0000%
941
0.0941%
Trade Secret
0.0080
0.5000%
47
0.0047%
Trade Secret
Trade Secret
Trade Secret
7440-22-4
7440-21-3
7440-57-5
Trade Secret
Trade Secret
60676-86-0
76361-86-9
1333-86-4
0.1200
0.0080
0.0240
1.1600
5.8000
2.0998
5.5200
2.7600
54.7860
5.5200
0.4140
7.5000%
0.5000%
1.5000%
72.5000%
100.0000%
100.0000%
8.0000%
4.0000%
79.4000%
8.0000%
0.6000%
706
47
141
6,824
34,118
12,352
32,471
16,235
322,271
32,471
2,435
0.0706%
0.0047%
0.0141%
0.6824%
3.4118%
1.2352%
3.2471%
1.6235%
32.2271%
3.2471%
0.2435%
CAS Number
Weight by
mg
Package Weight (mg): 169.9999
PPM
% weight of
substance per
package
497,118
12,176
529
1,059
18,529
8,823
1
706
49.7118%
1.2176%
0.0529%
0.1059%
1.8529%
0.8823%
0.0001%
0.0706%
% Total:
100.0000
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report
exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are
calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-04327 Rev. *V
Page 17 of 20
56L - QFN
Pb-Free Package
B4. MATERIAL COMPOSITION (Note 3)
RADON Automotive Part Using Gold wire material
Material
Lead
Frame
Purpose of
Use
Base material
Lead Finish
Die Attach
External
Plating
Adhesive
Die
Wire
Circuit
Interconnect
Mold
Compound
Encapsulation
Substance
Composition
7440-50-8
7439-89-6
7723-14-0
7440-66-6
7440-22-4
7440-31-5
Trade Secret
Trade Secret
84.5100
2.0700
0.0900
0.1800
3.1500
1.4999
0.0002
0.1500
% weight of
substance per
Homogeneous
material
93.9000%
2.3000%
0.1000%
0.2000%
3.5000%
99.9900%
0.0100%
7.5000%
Trade Secret
0.2000
10.0000%
1,176
0.1176%
Trade Secret
0.0100
0.5000%
59
0.0059%
Trade Secret
Trade Secret
Trade Secret
7440-22-4
7440-21-3
7440-57-5
Trade Secret
Trade Secret
60676-86-0
76361-86-9
1333-86-4
0.1500
0.0100
0.3000
1.4500
7.5000
1.4999
5.4000
2.7000
53.5950
5.4000
0.4050
7.5000%
0.5000%
1.5000%
72.5000%
100.0000%
100.0000%
8.0000%
4.0000%
79.4000%
8.0000%
0.6000%
882
59
176
8,529
44,118
8,824
31,765
15,882
315,265
31,765
2,383
0.0882%
0.0059%
0.0176%
0.8529%
4.4118%
0.8824%
3.1765%
1.5882%
31.5265%
3.1765%
0.2383%
CAS Number
Copper
Iron
Phosphorus
Zinc
Silver
Tin
Impurities
Acrylic Resin
Polybutadiene
derivative
Butadiene
copolymer
Acrylate
Peroxide
Additive
Silver
Silicon
Gold
Epoxy Resin
Phenol Resin
Silica(Amorphous) A
Silica(Amorphous) B
Carbon Black
Weight by
mg
Package Weight (mg): 170.2700
% weight of
substance per
package
PPM
497,118
12,176
529
1,059
18,529
8,823
1
882
49.7118%
1.2176%
0.0529%
0.1059%
1.8529%
0.8823%
0.0001%
0.0882%
% Total:
100.0000
II. DECLARATION OF PACKAGING INDIRECT MATERIALS
Type
Tape & Reel
Tray
Others
Material
Lead
PPM
Cr VI
PPM
Mercury
PPM
PBB
PPM
<20.0
<5.0
< 5.0
< 5.0
Cadmiu
m
PPM
<20.0
<5.0
< 5.0
< 5.0
Cover tape
Carrier tape
Plastic Reel
Tray
<20.0
<5.0
< 5.0
< 5.0
<20.0
<10.0
< 10.0
< 10.0
<20.0
<50.0
<50.0
<50.0
<20.0
<45.0
<45.0
<45.0
Shielding bag
<2.0
<2.0
<2.0
<2.0
<5.0
<5.0
PBDE
PPM
Analysis Report
(Note2)
CoA-COVT-R
CoA-CART-R
CoA-PLRL-R
CoA-TRAY-R
CoA-TRAY-M
CoA-SBAG –R
CoA-SBAG –M
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report
exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are
calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-04327 Rev. *V
Page 18 of 20
56L - QFN
Pb-Free Package
Document History Page
Document Title:
Document Number:
56L - QFN PB-FREE PACKAGE MATERIAL DECLARATION DATASHEET
001-04327
Rev. ECN No. Orig. of
Change
**
390888
YXP
*A
596678
YRB
*B
2126426 DPT
*C
2134167 DPT
*D
2558465 MAHA
*E
*F
*G
2599497 DPT
2652755 HLR
2712536 HLR
*H
*I
*J
DPT
2746946 EBZ
2865097 HLR
*K
*L
3074449 NKZ
3210380 HLR
*M
3261110 VFR
*N
3465311 VFR
Description of Change
New Specification
Added column for %weight of substance per
homogeneous material in material composition.
Added column for Lead, Cr VI, PBB, PBDE in declaration
of packaging indirect materials.
Removed the following indirect materials such as
moisture barrier bag, protective band, shipping and
inner/pizza box.
Updated Cypress Logo.
Change assembly location from M to L on analysis report
column under Banned Substances.
Added LT on Cypress package code and Assembly Site 2
– Package Qualification Report # 073701.
Changed the assembly code of Assembly Site 2 from
COA-LT56-CA to COA-LT56-AT. Remove Ag substance
on Leadframe. Add CAS Number for Pd.
Corrected PPM values for Table B: Material Composition
of Assembly Site 1.
Added Assembly site 3 – QTP#084005.
Added Assembly Site 4 – QTP No. 084613
Deleted Reference QTP on Assembly Site 4 and added
QTP No. 092006.
Added Assembly site 5 – QTP#094101.
Added Assembly Site 6 – QTP No. 083804
Added Referenced QTP No. 095003 and revised material
composition table for Assembly Site 4.
Changed the package weight of assembly site 4.
Added automotive reference QTP # 092103.
Deleted Tube information on Declaration of Packaging
Materials for all Assembly Sites.
Added Note 4 on footer section.
Added Assembly Site 7 – ASE Taiwan (G). Reference
QTP # 111816.
Added Assembly Site 8 – ASE Taiwan (G) Copper wire
qualification. Reference QTP # 114906.
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report
exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are
calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-04327 Rev. *V
Page 19 of 20
56L - QFN
Pb-Free Package
Document History Page
Document Title:
Document Number:
56L - QFN PB-FREE PACKAGE MATERIAL DECLARATION DATASHEET
001-04327
Rev. ECN No. Orig. of
Change
*O
3588822 HLR
*P
3602305 UDR
*Q
4033441 YUM
*R
*S
4087009 YUM
4108454 YUM
*T
*U
4735039 HLR
4889607 VFR
DCON
*V
5244606 HLR
DCON
Description of Change
Updated Assembly Sites 1 to 7 to reflect 4 decimal places
on values of the material composition table.
Removed Assembly Site 8 to Combine ASET’s material
composition for Gold and Copper wire to one Assembly
Location only (Assembly Site 7 – B1 and B2).
Added B2 on Site 4 – Autoline (RA) Copper Wire
Qualification. Reference QTP # 120206.
Added assembly site name in the Assembly heading.
Changed Assembly Code to Assembly Site Name.
Added “P3/P4” in the assembly heading in site 5.
Corrected total package weight in site 2 from “125.1300” to
“125.1303”.
Corrected total package weight in site 3 from “185.0000” to
“185.0003.”
Corrected total package weight in site 4: B1 from
“165.2400” to “165.2401”
Corrected total package weight in site 7:B1 from
“176.5000” to “176.5002”.
Sunset Due – No Change
Added B3 and B4 for Site 7 Automotive device
qualifications under QTP # 151312 and 151313.
Removed Distribution and Posting in the document history
page.
Changed the substances with “------------- “ Proprietary to
“Trade Secret
Replaced CY logo with the new tagline
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report
exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are
calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-04327 Rev. *V
Page 20 of 20