56L - QFN Pb-Free Package PACKAGE MATERIAL DECLARATION DATASHEET Cypress Package Code Package Weight – Site 1 LY / LT 188.0104 mg Body Size (mil/mm) Package Weight – Site 2 Package Weight – Site 3 185.0003 mg Package Weight – Site 4 Package Weight – Site 5 190.1801 mg B1 : 176.5002 mg B2 : 180.0262 mg B3 : 169.9999 mg B4 : 170.2700 mg Package Weight – Site 6 8x8 mm 125.1303 mg B1: 165.2401 mg B2: 162.6570 mg 194.8298 mg Package Weight – Site 8 N/A Package Weight – Site 7 SUMMARY The 56L-QFN Pb-Free package is compliant to RoHS. Cypress Ordering Part Numbers containing an “X” (e.g. CY7C1328G-133AXI, CY2308SXC-1HT) meet the Directive 2002/95/EC (RoHS) requirement. ASSEMBLY Site 1: Amkor Technology Seoul Korea Package Qualification Report # 031803, 092103 (Note 1) I.DECLARATION OF PACKAGED UNITS A. BANNED SUBSTANCES Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU RoHS. Listed in the table below are materials that are neither contained nor intentionally added to this product. Substances / Compounds Cadmium and Cadmium Compounds Hexavalent Chromium and its Compounds Lead and Lead Compounds Mercury and Mercury Compounds Polybrominated Biphenyls (PBB) Polybrominated Diphenylethers (PBDE) Asbestos Azo colorants Ozone Depleting Substances Polychlorinated Biphenyls (PCBs) Polychlorinated Napthalenes Radioactive Substances Shortchain Chlorinated Paraffins Tributyl Tin (TBT) and Triphenyl Tin (TPT) Tributyl Tin Oxide (TBTO) Formaldehyde Weight by mg PPM 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 0 0 0 0 0 0 0 0 0 0 Analysis Report (Note 2) CoA-LY56Amkor Seoul As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-04327 Rev. *V Page 1 of 20 56L - QFN Pb-Free Package B. MATERIAL COMPOSITION (Note 3) Material Purpose of Use Leadframe Base Material Lead Finish External Plating Die Attach Adhesive Die Wire Circuit Interconnect Mold Compound Encapsulation Substance Composition Cu Fe P Zn Ag Sn Resin Ag Metal oxide Amine Gamma Butyrolactone Si Au Phenol Resin Epoxy Resin Carbon Black Silica Fused 7440-50-8 7439-89-6 7723-14-0 7440-66-6 7440-22-4 7440-31-5 Trade Secret 7440-22-4 Trade Secret Trade Secret 96-48-0 100.7125 2.4302 0.0313 0.1147 1.0117 3.9500 0.5000 1.6700 0.0700 0.0700 0.0700 %weight of substance per Homogene ous material 96.5600% 2.3300% 0.0300% 0.1100% 0.9700% 100.0000% 21.0100% 70.1700% 2.9400% 2.9400% 2.9400% 7440-21-3 7440-57-5 Trade secret Trade secret 1333-86-4 60676-86-0 14.7800 1.3400 4.0432 5.5134 0.2450 51.4584 100.0000% 100.0000% 6.6000% 9.0000% 0.4000% 84.0000% CAS Number Package Weight (mg): Weight by mg 188.0104 % weight of substance per package PPM 535,675 12,926 166 610 5,381 21,009 2,660 8,883 372 372 372 53.5675% 1.2926% 0.0166% 0.0610% 0.5381% 2.1009% 0.2660% 0.8883% 0.0372% 0.0372% 0.0372% 78,613 7,127 21,505 29,325 1,303 273,700 7.8613% 0.7127% 2.1505% 2.9325% 0.1303% 27.3700% % Total: 100.0000 II. DECLARATION OF PACKAGING INDIRECT MATERIALS Type Tape & Reel Tray Others Material Lead PPM Cr VI PPM Mercury PPM PBB PPM <20.0 <5.0 < 5.0 < 5.0 Cadmiu m PPM <20.0 <5.0 < 5.0 < 5.0 Cover tape Carrier tape Plastic Reel Tray <20.0 <5.0 < 5.0 < 5.0 <20.0 <10.0 < 10.0 < 10.0 <20.0 <50.0 <50.0 <50.0 <20.0 <45.0 <45.0 <45.0 Shielding bag <2.0 <2.0 <2.0 <2.0 <5.0 <5.0 PBDE PPM Analysis Report (Note2) CoA-COVT-R CoA-CART-R CoA-PLRL-R CoA-TRAY-R CoA-TRAY-M CoA-SBAG –R CoA-SBAG –M Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-04327 Rev. *V Page 2 of 20 56L - QFN Pb-Free Package ASSEMBLY Site 2: PT UNISEM Batam Indonesia Package Qualification Report # 073701 (Note 1) I, DECLARATION OF PACKAGED UNITS A. BANNED SUBSTANCES Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU RoHS. Listed in the table below are materials that are neither contained nor intentionally added to this product. Substances / Compounds Cadmium and Cadmium Compounds Hexavalent Chromium and its Compounds Lead and Lead Compounds Mercury and Mercury Compounds Polybrominated Biphenyls (PBB) Polybrominated Diphenylethers (PBDE) Asbestos Azo colorants Ozone Depleting Substances Polychlorinated Biphenyls (PCBs) Polychlorinated Napthalenes Radioactive Substances Shortchain Chlorinated Paraffins Tributyl Tin (TBT) and Triphenyl Tin (TPT) Tributyl Tin Oxide (TBTO) Formaldehyde Weight by mg PPM 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 0 0 0 0 0 0 0 0 0 0 Analysis Report (Note 2) CoA-LT56-PT UNISEM As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-04327 Rev. *V Page 3 of 20 56L - QFN Pb-Free Package B. MATERIAL COMPOSITION (Note 3) Purpose of Use Material Base Material Substance Composition Cu Fe P Leadframe Lead finish Zn Ni Pd External Plating Au Silver (Ag) Epoxy Resin Die Attach Die Wire t-Butyl phenyl glycidyl ether Dicyadiamide Hardener Silicon Au Adhesive Circuit Interconnect Silica Fused Epoxy Resin Mold Compound Phenol Resin Encapsulation Carbon Black PPM 238431 6136 368 % weight of substanc e per package 23.8431% 0.6136% 0.0368% 0.2000% 491 0.0491% 92.0000% 6.9000% 10367 778 1.0367% 0.0778% 1.1000% 124 0.0124% 70.0000% 15.0000% 11524 2469 1.1524% 0.2469% 10.0000% 1646 0.1646% 0.0082 0.0948 12.0200 0.8100 70.3080 0.4000% 4.6000% 100.0000% 100.0000% 90.0000% 66 757 96060 6473 561879 0.0066% 0.0757% 9.6060% 0.6473% 56.1879% 3.9060 5.0000% 31215 3.1215% 3.5154 4.5000% 28094 2.8094% 0.3906 0.5000% 3122 0.3122% CAS Number 7440-50-8 7439-89-6 7723-14-0 Weight by mg 29.8350 0.7678 0.0461 7440-66-6 0.0614 7440-02-0 7440-03-5 1.2972 0.0973 7440-57-5 0.0155 7440-22-4 9003-36-5 1.4420 0.3090 3101-60-8 0.2060 461-58-5 620-92-8 7440-21-3 7440-57-5 60676-86-0 Trade Secret Trade Secret 1333-86-4 Package Weight (mg): %weight of substance per Homogeneo us material 97.1500% 2.5000% 0.1500% 125.1303 % Total: 100.0000 II. DECLARATION OF PACKAGING INDIRECT MATERIALS Type Tape & Reel Tray Others Material Lead PPM Cr VI PPM Mercury PPM PBB PPM <20.0 <5.0 < 5.0 < 5.0 Cadmiu m PPM <20.0 <5.0 < 5.0 < 5.0 Cover tape Carrier tape Plastic Reel Tray <20.0 <5.0 < 5.0 < 5.0 <20.0 <10.0 < 10.0 < 10.0 <20.0 <50.0 <50.0 <50.0 <20.0 <45.0 <45.0 <45.0 Shielding bag <2.0 <2.0 <2.0 <2.0 <5.0 <5.0 PBDE PPM Analysis Report (Note2) CoA-COVT-R CoA-CART-R CoA-PLRL-R CoA-TRAY-R CoA-TRAY-M CoA-SBAG –R CoA-SBAG –M Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-04327 Rev. *V Page 4 of 20 56L - QFN Pb-Free Package ASSEMBLY Site 3: Advanced Semiconductor Engineering Shanghai (ASE) Package Qualification Report # 084005 (Note 1) I.DECLARATION OF PACKAGED UNITS A. BANNED SUBSTANCES Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU RoHS. Listed in the table below are materials that are neither contained nor intentionally added to this product. Substances / Compounds Cadmium and Cadmium Compounds Hexavalent Chromium and its Compounds Lead and Lead Compounds Mercury and Mercury Compounds Polybrominated Biphenyls (PBB) Polybrominated Diphenylethers (PBDE) Asbestos Azo colorants Ozone Depleting Substances Polychlorinated Biphenyls (PCBs) Polychlorinated Napthalenes Radioactive Substances Shortchain Chlorinated Paraffins Tributyl Tin (TBT) and Triphenyl Tin (TPT) Tributyl Tin Oxide (TBTO) Formaldehyde Weight by mg PPM 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 0 0 0 0 0 0 0 0 0 0 Analysis Report (Note 2) CoA-LT56ASE Shanghai As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-04327 Rev. *V Page 5 of 20 56L - QFN Pb-Free Package B. MATERIAL COMPOSITION (Note 3) Material Purpose of Use Base Material Leadframe External Plating Die Attach Adhesive Die Circuit Wire Interconnect Mold Compound Encapsulation 68.5774 1.6392 0.0211 0.1126 0.8600 0.0400 0.0200 0.0100 1.6478 0.0535 0.1712 0.1070 %weight of substance per Homogeneous material 97.4800% 2.3300% 0.0300% 0.1600% 92.4700% 4.3000% 2.1500% 1.0800% 77.0000% 2.5000% 8.0000% 5.0000% 370688 8860 114 608 4648 216 108 54 8907 289 925 578 % weight of substance per package 37.0688% 0.8860% 0.0114% 0.0608% 0.4648% 0.0216% 0.0108% 0.0054% 0.8907% 0.0289% 0.0925% 0.0578% Trade Secret 0.0214 1.0000% 116 0.0116% Trade Secret Trade Secret Trade Secret 7440-21-3 7440-57-5 7440-05-3 60676-86-0 Trade Secret Trade Secret 1333-86-4 0.1070 0.0107 0.0214 16.6300 0.8613 0.0087 81.3792 7.5264 4.7040 0.4704 5.0000% 0.5000% 1.0000% 100.0000% 99.0000% 1.0000% 86.5000% 8.0000% 5.0000% 0.5000% 578 58 116 89892 4656 47 439887 40683 25427 2543 0.0578% 0.0058% 0.0116% 8.9892% 0.4656% 0.0047% 43.9887% 4.0683% 2.5427% 0.2543% Substance Composition CAS Number Cu Fe P Zn Ni Pd Au Ag Silver (Ag) Epoxy Resin Acrylic resin Polybutadiene derivative Butadiene copolymer Acrylate Peroxide Additive Silicon Au Pd Silica Fused Epoxy Resin Phenol Resin Carbon Black 7440-50-8 7439-89-6 7723-14-0 7440-66-6 7440-02-0 7440-05-3 7440-57-5 7440-22-4 7440-22-4 9003-36-5 Trade Secret Trade Secre Package Weight (mg): Weight by mg 185.0003 PPM % Total: 100.0000 II. DECLARATION OF PACKAGING INDIRECT MATERIALS Type Tape & Reel Tray Others Material Lead PPM Cr VI PPM Mercury PPM PBB PPM <20.0 <5.0 < 5.0 < 5.0 Cadmiu m PPM <20.0 <5.0 < 5.0 < 5.0 Cover tape Carrier tape Plastic Reel Tray <20.0 <5.0 < 5.0 < 5.0 <20.0 <10.0 < 10.0 < 10.0 <20.0 <50.0 <50.0 <50.0 <20.0 <45.0 <45.0 <45.0 Shielding bag <2.0 <2.0 <2.0 <2.0 <5.0 <5.0 PBDE PPM Analysis Report (Note2) CoA-COVT-R CoA-CART-R CoA-PLRL-R CoA-TRAY-R CoA-TRAY-M CoA-SBAG –R CoA-SBAG –M Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-04327 Rev. *V Page 6 of 20 56L - QFN Pb-Free Package ASSEMBLY Site 4: Cypress Manufacturing Limited (CML) Package Qualification Report # 092006, 095003, 120206 (Note 1) I.DECLARATION OF PACKAGED UNITS A. BANNED SUBSTANCES Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU RoHS. Listed in the table below are materials that are neither contained nor intentionally added to this product. Substances / Compounds Cadmium and Cadmium Compounds Hexavalent Chromium and its Compounds Lead and Lead Compounds Mercury and Mercury Compounds Polybrominated Biphenyls (PBB) Polybrominated Diphenylethers (PBDE) Asbestos Azo colorants Ozone Depleting Substances Polychlorinated Biphenyls (PCBs) Polychlorinated Napthalenes Radioactive Substances Shortchain Chlorinated Paraffins Tributyl Tin (TBT) and Triphenyl Tin (TPT) Tributyl Tin Oxide (TBTO) Formaldehyde Weight by mg PPM 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 0 0 0 0 0 0 0 0 0 0 Analysis Report (Note 2) CoA-LT56- CML As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-04327 Rev. *V Page 7 of 20 56L - QFN Pb-Free Package B1. MATERIAL COMPOSITION (Note 3) Using Gold wire material Material Lead Frame Purpose of Use Base material Lead Finish External Plating Die Attach Adhesive Die Circuit Wire Interconnect Mold Compound Encapsulation Substance Composition Copper Iron Phosphorous Zinc Nickel Palladium Gold Ag Carbocyclic Acrylate CAS Number 7440-50-8 7439-89-6 7723-14-0 7440-66-6 7440-02-0 7440-05-3 7440-57-5 7440-22-4 Trade Secret Weight by mg 55.0659 1.3567 0.0396 0.0678 0.8590 0.0155 0.0155 0.3256 0.0880 Trade Secret Trade Secret Trade Secret 7440-21-3 7440-57-5 7440-05-3 60676-86-0 Trade Secret Trade Secret Trade Secret 1333-86-4 14808-60-7 0.0088 0.0088 0.0088 5.9700 4.7916 0.0484 80.6360 2.8971 3.8628 3.8628 0.4829 4.8285 Package Weight (mg): 165.2401 Bismaleimide Resin Additive Acrylate ester Silicon Gold Palladium SiO2 Metal OH Phenol Resin Epoxy Resin Carbon Black Crystalline Silica % weight of substance per Homogeneous material 97.4100% 2.4000% 0.0700% 0.1200% 96.5200% 1.7400% 1.7400% 74.0000% 20.0000% 2.0000% 2.0000% 2.0000% 100.0000% 99.0000% 1.0000% 83.5000% 3.0000% 4.0000% 4.0000% 0.5000% 5.0000% PPM % weight of substance per package 333248 8211 239 411 5199 94 94 1970 33.3248% 0.8211% 0.0239% 0.0411% 0.5199% 0.0094% 0.0094% 0.1970% 533 0.0533% 53 53 53 36129 28998 293 487993 17533 23377 23377 2922 29221 0.0053% 0.0053% 0.0053% 3.6129% 2.8998% 0.0293% 48.7993% 1.7533% 2.3377% 2.3377% 0.2922% 2.9221% % Total: 100.0000 Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-04327 Rev. *V Page 8 of 20 56L - QFN Pb-Free Package B2. MATERIAL COMPOSITION (Note 3) Using Copper wire material Material Lead Frame Purpose of Use Base material Lead Finish External Plating Die Attach Adhesive Die Wire Circuit Interconnect Mold Compound Encapsulation Copper Iron Phosphorous Zinc Nickel Palladium Gold Ag Carbocyclic Acrylate 7440-50-8 7439-89-6 7723-14-0 7440-66-6 7440-02-0 7440-05-3 7440-57-5 7440-22-4 Trade Secret 55.0600 1.3600 0.0400 0.0700 0.8500 0.0200 0.0200 0.3200 0.0900 % weight of substance per Homogeneous material 97.4100 2.4000 0.0700 0.1200 96.5200 1.7400 1.7400 74.0000 20.0000 Bismaleimide Resin Additive Acrylate ester Silicon Copper SiO2 Metal OH Phenol Resin Epoxy Resin Carbon Black Crystalline Silica Trade Secret 0.0100 2.0000 61 0.0061% Trade Secret Trade Secret 7440-21-3 7440-50-8 60676-86-0 Trade Secret Trade Secret Trade Secret 1333-86-4 14808-60-7 0.0100 0.0100 5.9700 2.2570 80.6400 2.9000 3.8600 3.8600 0.4800 4.8300 2.0000 2.0000 100.0000 100.0000 83.5000 3.0000 4.0000 4.0000 0.5000 5.0000 61 61 36,703 13,876 495,768 17,829 23,731 23,731 2,951 29,694 0.0061% 0.0061% 3.6703% 1.3876% 49.5768% 1.7829% 2.3731% 2.3731% 0.2951% 2.9694% Package Weight (mg): 162.6570 Substance Composition CAS Number Weight by mg % weight of substance per package PPM 338,505 8,361 246 430 5,226 123 123 1,967 553 33.8505% 0.8361% 0.0246% 0.0430% 0.5226% 0.0123% 0.0123% 0.1967% 0.0553% % Total: 100.0000 II. DECLARATION OF PACKAGING INDIRECT MATERIALS Type Tape & Reel Tray Others Material Lead PPM Cr VI PPM Mercury PPM PBB PPM <20.0 <5.0 < 5.0 < 5.0 Cadmiu m PPM <20.0 <5.0 < 5.0 < 5.0 Cover tape Carrier tape Plastic Reel Tray <20.0 <5.0 < 5.0 < 5.0 <20.0 <10.0 < 10.0 < 10.0 <20.0 <50.0 <50.0 <50.0 <20.0 <45.0 <45.0 <45.0 Shielding bag <2.0 <2.0 <2.0 <2.0 <5.0 <5.0 PBDE PPM Analysis Report (Note2) CoA-COVT-R CoA-CART-R CoA-PLRL-R CoA-TRAY-R CoA-TRAY-M CoA-SBAG –R CoA-SBAG –M Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-04327 Rev. *V Page 9 of 20 56L - QFN Pb-Free Package ASSEMBLY Site 5: Amkor Technology Philippines (P3/P4) Package Qualification Report #094101 (Note 1) I. DECLARATION OF PACKAGED UNITS A. BANNED SUBSTANCES Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU RoHS. Listed in the table below are materials that are neither contained nor intentionally added to this product. Substances / Compounds Cadmium and Cadmium Compounds Hexavalent Chromium and its Compounds Lead and Lead Compounds Mercury and Mercury Compounds Polybrominated Biphenyls (PBB) Polybrominated Diphenylethers (PBDE) Asbestos Azo colorants Ozone Depleting Substances Polychlorinated Biphenyls (PCBs) Polychlorinated Napthalenes Radioactive Substances Shortchain Chlorinated Paraffins Tributyl Tin (TBT) and Triphenyl Tin (TPT) Tributyl Tin Oxide (TBTO) Formaldehyde Weight by mg PPM 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 0 0 0 0 0 0 0 0 0 0 Analysis Report (Note 2) CoA-LT56-Amkor Philippines (P3/P4) As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-04327 Rev. *V Page 10 of 20 56L - QFN Pb-Free Package B. MATERIAL COMPOSITION (Note 3) Material Purpose of Use Base Material Leadframe External Plating Die Attach Adhesive Die Wire Circuit Interconnect Mold Compound Encapsulation Substance Composition Cu Fe P Zn Ni Pd Au Ag Silver (Ag) Acrylate Bismaleimide Methacrylate Ester Polymer Silicon Au Silica Fused Epoxy Resin Phenol Resin Carbon Black Crystallin silica Metal hydro oxide 7440-50-8 7439-89-6 7723-14-0 7440-66-6 7440-02-0 7440-05-3 7440-57-5 7440-22-4 7440-22-4 Trade Secret Trade Secret Trade Secret 107.6985 2.5958 0.0331 0.1326 1.4529 0.0311 0.0060 %weight of substance per Homogeneous material 97.5000% 2.3500% 0.0300% 0.1200% 97.5100% 2.0900% 0.4000% 1.9434 0.2607 0.0711 0.0711 82.0000% 11.0000% 3.0000% 3.0000% 10,219 1,371 374 374 1.0219% 0.1371% 0.0374% 0.0374% Trade Secret 7440-21-3 7440-57-5 60676-86-0 Trade Secret Trade Secret 1333-86-4 14808-60-7 Trade Secret 0.0237 14.7900 0.8600 39.1365 5.4189 5.4189 0.3011 1.2042 8.7305 1.0000% 100.0000% 100.0000% 65.0000% 9.0000% 9.0000% 0.5000% 2.0000% 14.5000% 125 77,768 4,522 205,787 28,494 28,494 1,583 6,332 45,906 0.0125% 7.7768% 0.4522% 20.5787% 2.8494% 2.8494% 0.1583% 0.6332% 4.5906% CAS Number Package Weight (mg): Weight by mg 190.1801 566,298 13,649 174 697 7,640 164 31 % weight of substance per package 56.6298% 1.3649% 0.0174% 0.0697% 0.7640% 0.0164% 0.0031% PPM % Total: 100.0000 II. DECLARATION OF PACKAGING INDIRECT MATERIALS Type Tape & Reel Tray Others Material Lead PPM Cr VI PPM Mercury PPM PBB PPM <20.0 <5.0 < 5.0 < 5.0 Cadmiu m PPM <20.0 <5.0 < 5.0 < 5.0 Cover tape Carrier tape Plastic Reel Tray <20.0 <5.0 < 5.0 < 5.0 <20.0 <10.0 < 10.0 < 10.0 <20.0 <50.0 <50.0 <50.0 <20.0 <45.0 <45.0 <45.0 Shielding bag <2.0 <2.0 <2.0 <2.0 <5.0 <5.0 PBDE PPM Analysis Report (Note2) CoA-COVT-R CoA-CART-R CoA-PLRL-R CoA-TRAY-R CoA-TRAY-M CoA-SBAG –R CoA-SBAG –M Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-04327 Rev. *V Page 11 of 20 56L - QFN Pb-Free Package ASSEMBLY Site 6: CARSEM Malaysia Package Qualification Report # 083804 (Note 1) I.DECLARATION OF PACKAGED UNITS A. BANNED SUBSTANCES Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU RoHS. Listed in the table below are materials that are neither contained nor intentionally added to this product. Substances / Compounds Cadmium and Cadmium Compounds Hexavalent Chromium and its Compounds Lead and Lead Compounds Mercury and Mercury Compounds Polybrominated Biphenyls (PBB) Polybrominated Diphenylethers (PBDE) Asbestos Azo colorants Ozone Depleting Substances Polychlorinated Biphenyls (PCBs) Polychlorinated Napthalenes Radioactive Substances Shortchain Chlorinated Paraffins Tributyl Tin (TBT) and Triphenyl Tin (TPT) Tributyl Tin Oxide (TBTO) Formaldehyde Weight by mg PPM 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 0 0 0 0 0 0 0 0 0 0 Analysis Report (Note 2) CoA-LT56CARSEM As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-04327 Rev. *V Page 12 of 20 56L - QFN Pb-Free Package B. MATERIAL COMPOSITION (Note 3) Material Purpose of Use Base Material Leadframe External Plating Die Attach Adhesive Die Wire Circuit Interconnect Mold Compound Encapsulation Substance Composition Cu Fe P Zn Ni Pd Au Silver (Ag) Carbocycllic Acrylate Bismaleimide resin Acrylate Additive Silicon Au Silica Fused Epoxy Resin Phenol Resin Carbon Black 7440-50-8 7439-89-6 7723-14-0 7440-66-6 7440-02-0 7440-05-3 7440-57-5 7440-22-4 Trade Secret 98.7210 2.3071 0.0202 0.1315 1.1818 0.1028 0.0155 0.3670 0.1034 %weight of substance per Homogeneous material 97.5600% 2.2800% 0.0200% 0.1300% 90.9100% 7.9100% 1.1900% 69.2500% 19.5100% Trade Secret 0.0155 2.9300% 80 0.0080% Trade Secret Trade Secret 7440-21-3 7440-57-5 60676-86-0 Trade Secret Trade Secret 1333-86-4 0.0220 0.0220 5.2100 1.3000 79.9355 2.5593 2.5593 0.2559 4.1600% 4.1600% 100.0000% 100.0000% 93.7000% 3.0000% 3.0000% 0.3000% 113 113 26741 6672 410283 13136 13136 1314 0.0113% 0.0113% 2.6741% 0.6672% 41.0283% 1.3136% 1.3136% 0.1314% CAS Number Package Weight (mg): Weight by mg 194.8298 % weight of substance per package PPM 506703 11842 104 675 6066 528 79 1884 531 50.6703% 1.1842% 0.0104% 0.0675% 0.6066% 0.0528% 0.0079% 0.1884% 0.0531% % Total: 100.0000 II. DECLARATION OF PACKAGING INDIRECT MATERIALS Type Tape & Reel Tray Others Material Lead PPM Cr VI PPM Mercury PPM PBB PPM <20.0 <5.0 < 5.0 < 5.0 Cadmiu m PPM <20.0 <5.0 < 5.0 < 5.0 Cover tape Carrier tape Plastic Reel Tray <20.0 <5.0 < 5.0 < 5.0 <20.0 <10.0 < 10.0 < 10.0 <20.0 <50.0 <50.0 <50.0 <20.0 <45.0 <45.0 <45.0 Shielding bag <2.0 <2.0 <2.0 <2.0 <5.0 <5.0 PBDE PPM Analysis Report (Note2) CoA-COVT-R CoA-CART-R CoA-PLRL-R CoA-TRAY-R CoA-TRAY-M CoA-SBAG –R CoA-SBAG –M Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-04327 Rev. *V Page 13 of 20 56L - QFN Pb-Free Package ASSEMBLY Site 7: Advanced Semiconductor Engineering Taiwan (ASET) Package Qualification Report # 111816, 114906, 151312, 151313 (Note 1) I. DECLARATION OF PACKAGED UNITS A. BANNED SUBSTANCES Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU RoHS. Listed in the table below are materials that are neither contained nor intentionally added to this product. Substances / Compounds Cadmium and Cadmium Compounds Hexavalent Chromium and its Compounds Lead and Lead Compounds Mercury and Mercury Compounds Polybrominated Biphenyls (PBB) Polybrominated Diphenylethers (PBDE) Asbestos Azo colorants Ozone Depleting Substances Polychlorinated Biphenyls (PCBs) Polychlorinated Napthalenes Radioactive Substances Shortchain Chlorinated Paraffins Tributyl Tin (TBT) and Triphenyl Tin (TPT) Tributyl Tin Oxide (TBTO) Formaldehyde Weight by mg PPM 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 0 0 0 0 0 0 0 0 0 0 Analysis Report (Note 2) CoA-LT56- ASET As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-04327 Rev. *V Page 14 of 20 56L - QFN Pb-Free Package B1. MATERIAL COMPOSITION (Note 3) Using Gold wire material Material Lead Frame Purpose of Use Base material Lead Finish External Plating Die Attach Adhesive Die Circuit Wire Interconnect Mold Compound Encapsulation Substance Composition Copper Iron Phosphorous Zinc Nickel Palladium Gold Silver Acrylic Resin Polybutadiene derivative Butadiene copolymer Acrylate Peroxide Additive Silicon Gold Ion Impurities Epoxy Resin A Epoxy Resin B Phenol Resin Carbon Black Silica Fused CAS Number 7440-50-8 7439-89-6 7723-14-0 7440-66-6 7440-02-0 7440-05-3 7440-57-5 7440-22-4 Trade Secret Trade Secret 76.8583 1.8938 0.0395 0.1184 1.0194 0.0476 0.0130 3.0800 0.3300 % weight of substance per Homogeneous material 97.4000% 2.4000% 0.0500% 0.1500% 94.3900% 4.4100% 1.2000% 70.0000% 7.5000% 435,458 10,730 224 671 5,776 270 73 17,450 1,870 43.5458% 1.0730% 0.0224% 0.0671% 0.5776% 0.0270% 0.0073% 1.7450% 0.1870% 0.4070 9.2500% 2,306 0.2306% 0.1540 0.3300 0.0440 0.0550 15.8000 0.7999 0.0001 3.3980 2.2653 4.9837 0.3776 64.4856 3.5000% 7.5000% 1.0000% 1.2500% 100.0000% 99.9900% 0.0100% 4.5000% 3.0000% 6.6000% 0.5000% 85.4000% 873 1,870 249 312 89,518 4,532 0 19,252 12,835 28,236 2,139 365,357 0.0873% 0.1870% 0.0249% 0.0312% 8.9518% 0.4532% 0.0000% 1.9252% 1.2835% 2.8236% 0.2139% 36.5357% Weight by mg PPM % weight of substance per package Trade Secret Trade Secret Trade Secret Trade Secret 7440-21-3 7440-57-5 Trade Secret Trade Secret Trade Secret Trade Secret 1333-86-4 60676-86-0 Package Weight (mg): 176.5002 % Total: 100.0000 Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-04327 Rev. *V Page 15 of 20 56L - QFN Pb-Free Package B2. MATERIAL COMPOSITION (Note 3) Using Copper wire material Material Lead Frame Purpose of Use Base material Lead Finish External Plating Die Attach Adhesive Die Wire Circuit Interconnect Mold Compound Encapsulation Substance Composition Copper Iron Phosphorous Zinc Nickel Palladium Gold Silver Acrylic Resin Polybutadiene derivative Butadiene copolymer Acrylate Peroxide Additive Silicon Copper Epoxy Resin A Epoxy Resin B Phenol Resin Carbon Black Silica Fused CAS Number 7440-50-8 7439-89-6 7723-14-0 7440-66-6 7440-02-0 7440-05-3 7440-57-5 7440-22-4 Trade Secret Trade Secret 93.0869 2.3439 0.0861 0.1531 1.2346 0.0577 0.0157 1.3230 0.1418 % weight of substance per Homogeneo us material 97.3000 2.4500 0.0900 0.1600 94.3880 4.4120 1.2000 70.0000 7.5000 517,075 13,020 478 850 6,858 321 87 7,349 787 51.7075% 1.3020% 0.0478% 0.0850% 0.6858% 0.0321% 0.0087% 0.7349% 0.0787% 0.1748 9.2500 971 0.0971% 0.0662 0.1418 0.0189 0.0236 16.1580 0.3700 2.9084 1.9389 4.2656 0.3232 55.1940 3.5000 7.5000 1.0000 1.2500 100.0000 100.0000 4.5000 3.0000 6.6000 0.5000 85.4000 367 787 105 131 89,754 2,057 16,155 10,770 23,694 1,795 306,589 0.0367% 0.0787% 0.0105% 0.0131% 8.9754% 0.2057% 1.6155% 1.0770% 2.3694% 0.1795% 30.6589% Weight by mg PPM % weight of substance per package Trade Secret Trade Secret Trade Secret Trade Secret 7440-21-3 7440-50-8 Trade Secret Trade Secret Trade Secret 1333-86-4 60676-86-0 Package Weight (mg): 180.0262 % Total: 100.0000 Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-04327 Rev. *V Page 16 of 20 56L - QFN Pb-Free Package B3. MATERIAL COMPOSITION (Note 3) HX2LP Automotive Part Using Gold wire material Material Lead Frame Purpose of Use Base material Lead Finish Die Attach External Plating Adhesive Die Wire Circuit Interconnect Mold Compound Encapsulation Substance Composition Copper Iron Phosphorus Zinc Silver Tin Impurities Acrylic Resin Polybutadiene derivative Butadiene copolymer Acrylate Peroxide Additive Silver Silicon Gold Epoxy Resin Phenol Resin Silica(Amorphous) A Silica(Amorphous) B Carbon Black 7440-50-8 7439-89-6 7723-14-0 7440-66-6 7440-22-4 7440-31-5 Trade Secret Trade Secret 84.5100 2.0700 0.0900 0.1800 3.1500 1.4999 0.0002 0.1200 % weight of substance per Homogeneous material 93.9000% 2.3000% 0.1000% 0.2000% 3.5000% 99.9900% 0.0100% 7.5000% Trade Secret 0.1600 10.0000% 941 0.0941% Trade Secret 0.0080 0.5000% 47 0.0047% Trade Secret Trade Secret Trade Secret 7440-22-4 7440-21-3 7440-57-5 Trade Secret Trade Secret 60676-86-0 76361-86-9 1333-86-4 0.1200 0.0080 0.0240 1.1600 5.8000 2.0998 5.5200 2.7600 54.7860 5.5200 0.4140 7.5000% 0.5000% 1.5000% 72.5000% 100.0000% 100.0000% 8.0000% 4.0000% 79.4000% 8.0000% 0.6000% 706 47 141 6,824 34,118 12,352 32,471 16,235 322,271 32,471 2,435 0.0706% 0.0047% 0.0141% 0.6824% 3.4118% 1.2352% 3.2471% 1.6235% 32.2271% 3.2471% 0.2435% CAS Number Weight by mg Package Weight (mg): 169.9999 PPM % weight of substance per package 497,118 12,176 529 1,059 18,529 8,823 1 706 49.7118% 1.2176% 0.0529% 0.1059% 1.8529% 0.8823% 0.0001% 0.0706% % Total: 100.0000 Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-04327 Rev. *V Page 17 of 20 56L - QFN Pb-Free Package B4. MATERIAL COMPOSITION (Note 3) RADON Automotive Part Using Gold wire material Material Lead Frame Purpose of Use Base material Lead Finish Die Attach External Plating Adhesive Die Wire Circuit Interconnect Mold Compound Encapsulation Substance Composition 7440-50-8 7439-89-6 7723-14-0 7440-66-6 7440-22-4 7440-31-5 Trade Secret Trade Secret 84.5100 2.0700 0.0900 0.1800 3.1500 1.4999 0.0002 0.1500 % weight of substance per Homogeneous material 93.9000% 2.3000% 0.1000% 0.2000% 3.5000% 99.9900% 0.0100% 7.5000% Trade Secret 0.2000 10.0000% 1,176 0.1176% Trade Secret 0.0100 0.5000% 59 0.0059% Trade Secret Trade Secret Trade Secret 7440-22-4 7440-21-3 7440-57-5 Trade Secret Trade Secret 60676-86-0 76361-86-9 1333-86-4 0.1500 0.0100 0.3000 1.4500 7.5000 1.4999 5.4000 2.7000 53.5950 5.4000 0.4050 7.5000% 0.5000% 1.5000% 72.5000% 100.0000% 100.0000% 8.0000% 4.0000% 79.4000% 8.0000% 0.6000% 882 59 176 8,529 44,118 8,824 31,765 15,882 315,265 31,765 2,383 0.0882% 0.0059% 0.0176% 0.8529% 4.4118% 0.8824% 3.1765% 1.5882% 31.5265% 3.1765% 0.2383% CAS Number Copper Iron Phosphorus Zinc Silver Tin Impurities Acrylic Resin Polybutadiene derivative Butadiene copolymer Acrylate Peroxide Additive Silver Silicon Gold Epoxy Resin Phenol Resin Silica(Amorphous) A Silica(Amorphous) B Carbon Black Weight by mg Package Weight (mg): 170.2700 % weight of substance per package PPM 497,118 12,176 529 1,059 18,529 8,823 1 882 49.7118% 1.2176% 0.0529% 0.1059% 1.8529% 0.8823% 0.0001% 0.0882% % Total: 100.0000 II. DECLARATION OF PACKAGING INDIRECT MATERIALS Type Tape & Reel Tray Others Material Lead PPM Cr VI PPM Mercury PPM PBB PPM <20.0 <5.0 < 5.0 < 5.0 Cadmiu m PPM <20.0 <5.0 < 5.0 < 5.0 Cover tape Carrier tape Plastic Reel Tray <20.0 <5.0 < 5.0 < 5.0 <20.0 <10.0 < 10.0 < 10.0 <20.0 <50.0 <50.0 <50.0 <20.0 <45.0 <45.0 <45.0 Shielding bag <2.0 <2.0 <2.0 <2.0 <5.0 <5.0 PBDE PPM Analysis Report (Note2) CoA-COVT-R CoA-CART-R CoA-PLRL-R CoA-TRAY-R CoA-TRAY-M CoA-SBAG –R CoA-SBAG –M Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-04327 Rev. *V Page 18 of 20 56L - QFN Pb-Free Package Document History Page Document Title: Document Number: 56L - QFN PB-FREE PACKAGE MATERIAL DECLARATION DATASHEET 001-04327 Rev. ECN No. Orig. of Change ** 390888 YXP *A 596678 YRB *B 2126426 DPT *C 2134167 DPT *D 2558465 MAHA *E *F *G 2599497 DPT 2652755 HLR 2712536 HLR *H *I *J DPT 2746946 EBZ 2865097 HLR *K *L 3074449 NKZ 3210380 HLR *M 3261110 VFR *N 3465311 VFR Description of Change New Specification Added column for %weight of substance per homogeneous material in material composition. Added column for Lead, Cr VI, PBB, PBDE in declaration of packaging indirect materials. Removed the following indirect materials such as moisture barrier bag, protective band, shipping and inner/pizza box. Updated Cypress Logo. Change assembly location from M to L on analysis report column under Banned Substances. Added LT on Cypress package code and Assembly Site 2 – Package Qualification Report # 073701. Changed the assembly code of Assembly Site 2 from COA-LT56-CA to COA-LT56-AT. Remove Ag substance on Leadframe. Add CAS Number for Pd. Corrected PPM values for Table B: Material Composition of Assembly Site 1. Added Assembly site 3 – QTP#084005. Added Assembly Site 4 – QTP No. 084613 Deleted Reference QTP on Assembly Site 4 and added QTP No. 092006. Added Assembly site 5 – QTP#094101. Added Assembly Site 6 – QTP No. 083804 Added Referenced QTP No. 095003 and revised material composition table for Assembly Site 4. Changed the package weight of assembly site 4. Added automotive reference QTP # 092103. Deleted Tube information on Declaration of Packaging Materials for all Assembly Sites. Added Note 4 on footer section. Added Assembly Site 7 – ASE Taiwan (G). Reference QTP # 111816. Added Assembly Site 8 – ASE Taiwan (G) Copper wire qualification. Reference QTP # 114906. Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-04327 Rev. *V Page 19 of 20 56L - QFN Pb-Free Package Document History Page Document Title: Document Number: 56L - QFN PB-FREE PACKAGE MATERIAL DECLARATION DATASHEET 001-04327 Rev. ECN No. Orig. of Change *O 3588822 HLR *P 3602305 UDR *Q 4033441 YUM *R *S 4087009 YUM 4108454 YUM *T *U 4735039 HLR 4889607 VFR DCON *V 5244606 HLR DCON Description of Change Updated Assembly Sites 1 to 7 to reflect 4 decimal places on values of the material composition table. Removed Assembly Site 8 to Combine ASET’s material composition for Gold and Copper wire to one Assembly Location only (Assembly Site 7 – B1 and B2). Added B2 on Site 4 – Autoline (RA) Copper Wire Qualification. Reference QTP # 120206. Added assembly site name in the Assembly heading. Changed Assembly Code to Assembly Site Name. Added “P3/P4” in the assembly heading in site 5. Corrected total package weight in site 2 from “125.1300” to “125.1303”. Corrected total package weight in site 3 from “185.0000” to “185.0003.” Corrected total package weight in site 4: B1 from “165.2400” to “165.2401” Corrected total package weight in site 7:B1 from “176.5000” to “176.5002”. Sunset Due – No Change Added B3 and B4 for Site 7 Automotive device qualifications under QTP # 151312 and 151313. Removed Distribution and Posting in the document history page. Changed the substances with “------------- “ Proprietary to “Trade Secret Replaced CY logo with the new tagline Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-04327 Rev. *V Page 20 of 20