Document No. 001-80331 Rev. *A ECN #4020555 Cypress Semiconductor Automotive Package Qualification Report QTP# 105201 June 2013 Automotive 48L SSOP (300 mils) NiPdAu, MSL3, 260°°C Reflow JCET-China (JT) CYPRESS TECHNICAL CONTACT FOR QUALIFICATION DATA: Mira Ben-Tzur Reliability Director (408) 943-2675 Rene Rodgers Reliability Engineer, MTS (408) 943–2732 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 1 of 8 Document No. 001-80331 Rev. *A ECN #4020555 PRODUCT QUALIFICATION HISTORY QTP Number 105201 Description of Qualification Purpose New Assembly Site (JCET) Qual – Automotive SSOP 48ld – Pb-free (KEG6000, QMI 509, 1.0 mil Wire, NiPdAu) Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 2 of 8 Date Sep 2011 Document No. 001-80331 Rev. *A ECN #4020555 MAJOR PACKAGE INFORMATION USED IN THIS QUALIFICATION Package Designation: SP48 Package Outline, Type, or Name: 48L –Fine Pitch SSOP Mold Compound Name/Manufacturer: KEG6000 / Kyocera Mold Compound Flammability Rating: V-O per UL94 Mold Compound Alpha Emission Rate: 0.002 CPH/cm2 Oxygen Rating Index: >28% N/A Lead Frame Designation: Slotted Full Metal Pad Lead Frame Material: Copper Substrate Material: N/A Lead Finish, Composition / Thickness: NiPdAu Die Backside Preparation Method/Metallization: Backgrind Die Separation Method: Wafersaw Die Attach Supplier: Henkel Die Attach Material: QMI509 Bond Diagram Designation 001-61746, 001-15734, 001-61640 Wire Bond Method: Thermosonic Wire Material/Size: 1.0 mil / Au Thermal Resistance Theta JA °C/W: 69°C/W Package Cross Section Yes/No: Yes Assembly Process Flow: 001-64159 Name/Location of Assembly (prime) facility: JT-JCET China MSL LEVEL 3 REFLOW PROFILE 260C ELECTRICAL TEST / FINISH DESCRIPTION Test Location: CML-R Note: Please contact a Cypress Representative for other package availability. Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 3 of 8 Document No. 001-80331 Rev. *A ECN #4020555 RELIABILITY TESTS PERFORMED PER SPECIFICATION REQUIREMENTS Stress/Test Electrostatic Discharge Human Body Model (ESD-HBM) Electrostatic Discharge Charge Device Model (ESD-CDM) Latch-up Sensitivity High Temperature Operating Life Early Failure Rate Test Condition (Temp/Bias) Result P/F AEC-Q100-002 P AEC-Q100-011 P AEC-Q100-004 AEC-Q100-008 and JESD22-A108 Dynamic Operating Condition, 150 C, Vcc = 5.5V Dynamic Operating Condition, 125 C, Vcc = 2.1V JESD22-A108, 150 C /125C Dynamic Operating Condition, 150 C, Vcc = 5.5V Dynamic Operating Condition, 125 C, Vcc = 2.1V JESD22-A110,130 C, 85%RH, 5.25V Precondition: JESD22-A113 Moisture Sensitivity Level (192 Hrs., 30 C°, 60% RH) JESD22-A103, 150 C P JESD22- A104, -65 C to 150 C Precondition: JESD22-A113 Moisture Sensitivity Level (192 Hrs., 30 C°, 60% RH) Mil-Std 883, Method 2011 P P Wire Bond Shear JESD22-A102, 121 C, 100%RH, 15 PSIG Precondition: JESD22-A113 Moisture Sensitivity Level (192 Hrs., 30 C°, 60% RH) AEC Q100-001 Wire Bond Pull Mil-Std 883, Method 2011 P Solderability JESD22-B102 P Electrical Distributions AEC Q100-009 P Physical Dimensions JESD22B100 and B108 P Lead Integrity JESD22-B105 P High Temperature Operating Life Latent Failure Rate High Accelerated Saturation Test (HAST) High Temperature Storage Life Test Temperature Cycle Post Temperature Cycle Wire Bond Pull Pressure Cooker Test Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 4 of 8 P P P P P P Document No. 001-80331 Rev. *A ECN #4020555 Reliability Test Data QTP #: 105201 Device Fab Lot # Assy Lot # Assy Loc Duration Samp Rej CY8C29666 (8A29666A) 4951258 611109732 JT-CHINA COMP 22 0 CY8C21645 (8A21645A) 4030527 611109733 JT-CHINA COMP 22 0 CY8C20566A (8A205662A) 4931969 611116213 JT-CHINA COMP 22 0 4951258 611109732 JT-CHINA COMP 30 0 4951258 611109732 JT-CHINA COMP 30 0 Failure Mechanism STRESS: ACOUSTIC, MSL3 STRESS: BOND SHEAR CY8C29666 (8A29666A) STRESS: BOND PULL CY8C29666 (8A29666A) STRESS: CONSTRUCTIONAL ANALYIS CY8C29666 (8A29666A) 4951258 611109732 JT-CHINA COMP 5 0 CY8C21645 (8A21645A) 4030527 611109733 JT-CHINA COMP 5 0 CY8C20566A (8A205662A) 4931969 611116213 JT-CHINA COMP 5 0 STRESS: DYE PENETRATION TEST CY8C29666 (8A29666A) 4951258 611109732 JT-CHINA COMP 15 0 CY8C21645 (8A21645A) 4030527 611109733 JT-CHINA COMP 15 0 CY8C20566A (8A205662A) 4931969 611116213 JT-CHINA COMP 15 0 JT-CHINA COMP 3 0 JT-CHINA COMP 3 0 JT-CHINA COMP 3 0 COMP 3 0 COMP 3 0 COMP 3 0 STRESS: ESD-CHARGE DEVICE MODEL, 250V CY8C29666 (8A29666A) 4951258 611109732 STRESS: ESD-CHARGE DEVICE MODEL, 500V CY8C29666 (8A29666A) 4951258 611109732 STRESS: ESD-CHARGE DEVICE MODEL, 750V CY8C29666 (8A29666A) 4951258 611109732 STRESS: ESD-HUMAN BODY CIRCUIT PER JESD22, METHOD A114-E, (500V) CY8C29666 (8A29666A) 4951258 611109732 JT-CHINA STRESS: ESD-HUMAN BODY CIRCUIT PER JESD22, METHOD A114-E, (1000V) CY8C29666 (8A29666A) 4951258 611109732 JT-CHINA STRESS: ESD-HUMAN BODY CIRCUIT PER JESD22, METHOD A114-E, (1500V) CY8C29666 (8A29666A) 4951258 611109732 JT-CHINA Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 5 of 8 Document No. 001-80331 Rev. *A ECN #4020555 Reliability Test Data QTP #: 105201 Device Fab Lot # Assy Lot # Assy Loc Duration Samp Rej Failure Mechanism STRESS: ESD-HUMAN BODY CIRCUIT PER JESD22, METHOD A114-E, (2000V) CY8C29666 (8A29666A) 4951258 611109732 JT-CHINA COMP 3 0 STRESS: HIGH TEMP DYNAMIC OPERATING LIFE-EARLY FAILURE RATE, 125C, 5.5V, Vcc Core CY8C29666 (8A29666A) 4951258 611109732 JT-CHINA 48 800 0 CY8C21645 (8A21645A) 4030527 611109733 JT-CHINA 48 800 0 STRESS: HIGH TEMP DYNAMIC OPERATING LIFE-EARLY FAILURE RATE, 150C, 2.1V, Vcc Core CY8C20566A (8A205662A) 4931969 611116213 JT-CHINA 24 800 0 STRESS: HIGH TEMP DYNAMIC OPERATING LIFE-LATENT FAILURE RATE, 125C, 5.5V, Vcc Core CY8C29666 (8A29666A) 4951258 611109732 JT-CHINA 1000 80 0 CY8C21645 (8A21645A) 4030527 611109733 JT-CHINA 1000 80 0 STRESS: HIGH TEMP DYNAMIC OPERATING LIFE-LATENT FAILURE RATE, 150C, 2.1V, Vcc Core CY8C20566A (8A205662A) 4931969 611116213 JT-CHINA 408 JT-CHINA COMP 80 0 6 0 STRESS: STATIC LATCH-UP TESTING, 125C, +/-140ma CY8C29666 (8A29666A) 4951258 611109732 STRESS: HI-ACCEL SATURATION TEST, 130C, 5.25V, 85%RH, PRE COND 192 HR 30C/60%RH, MSL3 CY8C29666 (8A29666A) 4951258 611109732 JT-CHINA 96 80 0 CY8C21645 (8A21645A) 4030527 611109733 JT-CHINA 96 78 0 CY8C20566A (8A205662A) 4931969 611116213 JT-CHINA 96 80 0 4951258 611109732 JT-CHINA 1000 80 0 CY8C29666 (8A29666A) 4951258 611109732 JT-CHINA COMP 5 0 CY8C21645 (8A21645A) 4030527 611109733 JT-CHINA COMP 5 0 CY8C20566A (8A205662A) 4931969 611116213 JT-CHINA COMP 5 0 4951258 611109732 JT-CHINA COMP 5 0 STRESS: HIGH TEMP STORAGE CY8C29666 (8A29666A) STRESS: INTERNAL VISUAL STRESS: LEAD INTEGRITY CY8C29666 (8A29666A) Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 6 of 8 Document No. 001-80331 Rev. *A ECN #4020555 Reliability Test Data QTP #: 105201 Device Fab Lot # Assy Lot # Assy Loc Duration Samp Rej Failure Mechanism STRESS: PRESSURE COOKER TEST (121C, 100%RH), 15 Psig, PRE COND 192 HR 30C/60%RH (MSL3) CY8C29666 (8A29666A) 4951258 611109732 JT-CHINA 96 79 0 CY8C29666 (8A29666A) 4951258 611109732 JT-CHINA 168 79 0 CY8C21645 (8A21645A) 4030527 611109733 JT-CHINA 96 80 0 CY8C21645 (8A21645A) 4030527 611109733 JT-CHINA 168 80 0 CY8C20566A (8A205662A) 4931969 611116213 JT-CHINA 96 80 0 CY8C20566A (8A205662A) 4931969 611116213 JT-CHINA 168 80 0 STRESS: PHYSICAL DIMENSION CY8C29666 (8A29666A) 4951258 611109732 JT-CHINA COMP 30 0 CY8C21645 (8A21645A) 4030527 611109733 JT-CHINA COMP 30 0 CY8C20566A (8A205662A) 4931969 611116213 JT-CHINA COMP 30 0 CY8C29666 (8A29666A) 4951258 611109732 JT-CHINA COMP 15 0 CY8C21645 (8A21645A) 4030527 611109733 JT-CHINA COMP 15 0 CY8C20566A (8A205662A) 4931969 611116213 JT-CHINA COMP 22 0 STRESS: SOLDERABILITY STRESS: ELECTRICAL DISTRIBUTIONS CY8C29666 (8A29666A) 4951258 611109732 JT-CHINA COMP 30 0 CY8C21645 (8A21645A) 4030527 611109733 JT-CHINA COMP 30 0 CY8C20566A (8A205662A) 4931969 611116213 JT-CHINA COMP 30 0 STRESS: TC COND. C –65C TO 150C, PRE COND 192 HR 30C/60%RH, MSL3 CY8C29666 (8A29666A) 4951258 611109732 JT-CHINA 500 84 0 CY8C29666 (8A29666A) 4951258 611109732 JT-CHINA 1000 80 0 CY8C21645 (8A21645A) 4030527 611109733 JT-CHINA 500 85 0 CY8C21645 (8A21645A) 4030527 611109733 JT-CHINA 1000 85 0 CY8C20566A (8A205662A) 4931969 611116213 JT-CHINA 500 80 0 CY8C20566A (8A205662A) 4931969 611116213 JT-CHINA 1000 80 0 611109732 JT-CHINA COMP 5 0 STRESS: POST TCT BOND PULL CY8C29666 (8A29666A) 4951258 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 7 of 8 Document No. 001-80331 Rev. *A ECN #: 4020555 Document History Page Document Title: CHINA (JT) Document Number: Rev. ECN No. ** 3637182 *A 4020555 QTP 105201: AUTOMOTIVE 48L SSOP (300 MILS) NIPDAU, MSL3, 260C REFLOW JCET001-80331 Orig. of Change NSR NSR Description of Change Initial Spec Release Change ‘Show on Cypress.com’ category from N’ to ‘Y’. Distribution: WEB Posting: None Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 8 of 8