Document No.001-89592 Rev. *A ECN # 4535338 Cypress Semiconductor Package Qualification Report QTP# 092103 VERSION*A October, 2014 Automotive 56-Lead QFN (Quad Flat No-Lead) Pure Sn, MSL3, 260°C Reflow, Amkor-Korea (L) FOR ANY QUESTIONS ON THIS REPORT, PLEASE CONTACT [email protected] or via a CYLINK CRM CASE Prepared By: Josephine Pineda Reliability Engineer Reviewed By: Rene Rodgers Reliability Manager Approved By: Richard Oshiro Reliability Director Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 1 of 8 Document No.001-89592 Rev. *A ECN # 4535338 PACKAGE QUALIFICATION HISTORY QTP Number Description of Qualification Purpose 092103 Qualify 56L QFN package on Automotive application using EME-G700 (Sumitomo Bakelite) Mold Compound, 8290 (Ablestik) Epoxy, Pure Sn at MSL 3,260C Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 2 of 8 Date Jun 09 Document No.001-89592 Rev. *A ECN # 4535338 MAJOR PACKAGE INFORMATION USED IN THIS QUALIFICATION Package Designation: LY56 Package Outline, Type, or Name: 56-Lead QFN Mold Compound Name/Manufacturer: Sumitomo EME-G700 Mold Compound Flammability Rating: V-0 per UL94 Mold Compound Alpha Emission Rate: N/A Oxygen Rating Index: V-0 Lead Frame Material: Copper Lead Finish, Composition / Thickness: Pure Sn Die Backside Preparation Method/Metallization: Backgrind Die Separation Method: Wafer Saw Die Attach Supplier: Ablestik Die Attach Material: 8290 Die Attach Method: Epoxy Bond Diagram Designation: 10-06451 Wire Bond Method: Thermosonic Wire Material/Size: Au, 1.0mil Thermal Resistance Theta JA °C/W: 30°C/W Package Cross Section Yes/No: N/A Assembly Process Flow: 49-10994 Name/Location of Assembly (prime) facility: Amkor-Korea (L) MSL Level 3 Reflow Profile 260C ELECTRICAL TEST/FINISH DESCRIPTION Test Location CML-R Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 3 of 8 Document No.001-89592 Rev. *A ECN # 4535338 RELIABILITY TESTS PERFORMED PER SPECIFICATION REQUIREMENTS Stress/Test Test Condition (Temp/Bias) Result P/F J-STD-020 Acoustic Microscopy Precondition: JESD22 Moisture Sensitivity MSL3 P 192 Hrs, 30°C/60%RH+ Reflow, 260°C+0, -5°C Ball Shear AEC-Q100-010 P Bond Pull Mil-Std 883, Method 2011 P Electrical Distribution AEC Q100-009 P High Temperature Operating Life Early Failure Rate AEC-Q100-008 and JESD22-A108 Dynamic Operating Condition, Vcc Max = 3.8V, 125°C P High Temperature Operating Life Latent Failure Rate Electrostatic Discharge Human Body Model (ESD-HBM) Electrostatic Discharge Charge Device Model (ESD-CDM) JESD22-A108 Dynamic Operating Condition, Vcc Max = 3.8V, 125°C P AEC–Q100–002 P AEC–Q100–011 P High Accelerated Saturation Test (HAST) JESD22-A110, 130°C, 3.63V, 85%RH Precondition: JESD22 Moisture Sensitivity MSL3 192 Hrs 30°C/60%RH+ Reflow, 260°C+0, -5°C High Temp Storage JESD22-A103, 150C Pressure Cooker Test JESD22-A102, 121°C, 100%RH, 15 Psig Precondition: JESD22 Moisture Sensitivity MSL3 192 Hrs 30°C/60%RH+ Reflow, 260°C+0, -5°C P P P Physical Dimension JESD22B100 and B108 P Post Temp Cycle Bond Pull Mil-Std 883, Method 2011 P Static Latch-up AEC-Q100-004 P Solderability JESD22-B102 P Temperature Cycle JESD22-A104, Condition C, -65°C to 150°C Precondition: JESD22 Moisture Sensitivity MSL3 192 Hrs 30°C/60%RH+ Reflow, 260°C+0, -5°C Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 4 of 8 P Document No.001-89592 Rev. *A ECN # 4535338 Reliability Test Data QTP #:092103 Device Fab Lot# Assy Lot # Assy Loc Duration Samp Rej Failure Mechanism STRESS: ACOUSTIC, MSL3 CY7C65630 (7C65630CC) 4642838 610709630 L-KOREA COMP 22 0 CY7C65630 (7C65630CC) 4639823 610712725 L-KOREA COMP 22 0 CY7C65630 (7C65630CC) 4638322 610717719 L-KOREA COMP 22 0 4642838 610709630 L-KOREA COMP 5 0 4642838 610709630 L-KOREA COMP 5 0 STRESS: BALL SHEAR CY7C65630 (7C65630CC) STRESS: BOND PULL CY7C65630 (7C65630CC) STRESS: ELECTRICAL DISTRIBUTION CY7C65630 (7C65630CC) 4642838 610709630 L-KOREA COMP 30 0 CY7C65630 (7C65630CC) 4639823 610712725 L-KOREA COMP 30 0 CY7C65630 (7C65630CC) 4638322 610717719 L-KOREA COMP 30 0 L-KOREA COMP 3 0 L-KOREA COMP 3 0 COMP 3 0 COMP 3 0 COMP 3 0 COMP 3 0 STRESS: ESD-CHARGE DEVICE MODEL, 200V CY7C65630 (7C65630CC) 4642838 610709630 STRESS: ESD-CHARGE DEVICE MODEL, 500V CY7C65630 (7C65630CC) 4642838 610709630 STRESS: ESD-CHARGE DEVICE MODEL, 750V, Corner Pins Only CY7C65630 (7C65630CC) 4642838 610709630 L-KOREA STRESS: ESD-HUMAN BODY CIRCUIT PER JESD22-A114, 500V CY7C65630 (7C65630CC) 4642838 610709630 L-KOREA STRESS: ESD-HUMAN BODY CIRCUIT PER JESD22-A114, 1,000V CY7C65630 (7C65630CC) 4642838 610709630 L-KOREA STRESS: ESD-HUMAN BODY CIRCUIT PER JESD22-A114, 1,500V CY7C65630 (7C65630CC) 4642838 610709630 L-KOREA STRESS: ESD-HUMAN BODY CIRCUIT PER JESD22-A114, 2,000V CY7C65630 (7C65630CC) 4642838 610709630 L-KOREA COMP 3 0 STRESS: HIGH TEMP STORAGE LIFE TEST CY7C65630 (7C65630CC) 4642838 610709630 L-KOREA 500 85 0 CY7C65630 (7C65630CC) 4642838 610709630 L-KOREA 1000 85 0 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 5 of 8 Document No.001-89592 Rev. *A ECN # 4535338 Reliability Test Data QTP #:092103 Device Fab Lot# Assy Lot # Assy Loc Duration Samp Rej Failure Mechanism STRESS: STATIC LATCH-UP TESTING, 125C, 5.2V, +/100mA CY7C65630 (7C65630CC) 4642838 610709630 L-KOREA COMP 6 0 STRESS: PHYSICAL DIMENSIONS CY7C65630 (7C65630CC) 4642838 610709630 L-KOREA COMP 10 0 CY7C65630 (7C65630CC) 4639823 610712728 L-KOREA COMP 10 0 CY7C65630 (7C65630CC) 4638322 610716238 L-KOREA COMP 10 0 L-KOREA COMP 15 0 STRESS: POST TEMP CYCLE WIRE BOND PULL CY7C65630 (7C65630CC) 4638322 610717719 STRESS: PRESSURE COOKER TEST, 121C, 100%RH, 15 Psig, PRE COND 192 HR 30C/60%RH, MSL3 CY7C65630 (7C65630CC) 4642838 610709630 L-KOREA 96 85 0 CY7C65630 (7C65630CC) 4642838 610709630 L-KOREA 168 85 0 CY7C65630 (7C65630CC) 4639823 610712725 L-KOREA 96 84 0 CY7C65630 (7C65630CC) 4639823 610712725 L-KOREA 168 84 0 CY7C65630 (7C65630CC) 4638322 610717719 L-KOREA 96 85 0 CY7C65630 (7C65630CC) 4638322 610717719 L-KOREA 168 85 0 STRESS: HI-ACCEL SATURATION TEST, 130C, 85%RH, 3.63V, PRE COND 192 HR 30C/60%RH, MSL3 CY7C65630 (7C65630CC) 4642838 610709630 L-KOREA 96 76 0 CY7C65630 (7C65630CC) 4639823 610712728 L-KOREA 96 75 0 CY7C65630 (7C65630CC) 4638322 610717719 L-KOREA 96 73 0 CY7C65630 (7C65630CC) 4642838 610709630 L-KOREA COMP 15 0 CY7C65630 (7C65630CC) 4639823 610712725 L-KOREA COMP 15 0 CY7C65630 (7C65630CC) 4638322 610717719 L-KOREA COMP 15 0 STRESS: SOLDERABILITY STRESS: TC COND. C -65C TO 150C, PRE COND 192 HRS 30C/60%RH, MSL3 CY7C65630 (7C65630CC) 4642838 610709630 L-KOREA 500 90 0 CY7C65630 (7C65630CC) 4642838 610709630 L-KOREA 1000 85 0 CY7C65630 (7C65630CC) 4639823 610712725 L-KOREA 500 85 0 CY7C65630 (7C65630CC) 4639823 610712725 L-KOREA 1000 85 0 CY7C65630 (7C65630CC) 4638322 610717719 L-KOREA 500 85 0 CY7C65630 (7C65630CC) 4638322 610717719 L-KOREA 1000 80 0 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 6 of 8 Document No.001-89592 Rev. *A ECN # 4535338 Reliability Test Data QTP #:092103 Device Fab Lot# Assy Lot # Assy Loc Duration Samp Rej Failure Mechanism STRESS: HIGH TEMP DYNAMIC OPERATING LIFE – EARLY FAILURE RATE, 125C, 3.8V Vcc Max CY7C65630 (7C65630CC) 4642838 610709630 L-KOREA 48 85 0 CY7C65630 (7C65630CC) 4642838 610711410P2 L-KOREA 48 290 0 CY7C65630 (7C65630CC) 4642838 610711416P2 L-KOREA 48 867 0 CY7C65630 (7C65630CC) 4642838 610711410P1 L-KOREA 48 839 0 CY7C65630 (7C65630CC) 4642838 610709630P3 L-KOREA 48 875 0 CY7C65630 (7C65630CC) 4642838 610711410P3 L-KOREA 48 30 0 CY7C65630 (7C65630CC) 4642838 610711416P1 L-KOREA 48 278 0 CY7C65630 (7C65630CC) 4642838 610709630P5 L-KOREA 48 190 0 CY7C65630 (7C65630CC) 4642838 610711416P3 L-KOREA 48 40 0 CY7C65630 (7C65630CC) 4639823 610712725P2 L-KOREA 48 127 0 CY7C65630 (7C65630CC) 4639823 610712728P1 L-KOREA 48 955 0 CY7C65630 (7C65630CC) 4639823 610712728P3 L-KOREA 48 194 0 CY7C65630 (7C65630CC) 4639823 610712725P1 L-KOREA 48 153 0 CY7C65630 (7C65630CC) 4639823 610712729P1 L-KOREA 48 280 0 CY7C65630 (7C65630CC) 4639823 610712729P2 L-KOREA 48 870 0 CY7C65630 (7C65630CC) 4639823 610712725P3 L-KOREA 48 869 0 CY7C65630 (7C65630CC) 4639822 610717719P2 L-KOREA 48 862 0 CY7C65630 (7C65630CC) 4639822 610717719P1 L-KOREA 48 84 0 CY7C65630 (7C65630CC) 4639822 610717719P3 L-KOREA 48 37 0 CY7C65630 (7C65630CC) 4639822 610716238P2 L-KOREA 48 375 0 CY7C65630 (7C65630CC) 4639822 610716238P1 L-KOREA 48 870 0 CY7C65630 (7C65630CC) 4639822 610717719P4 L-KOREA 48 161 0 CY7C65630 (7C65630CC) 4639822 610716671P1 L-KOREA 48 870 0 CY7C65630 (7C65630CC) 4639822 610716671P2 L-KOREA 48 105 0 CY7C65630 (7C65630CC) 4639822 610716671P3 L-KOREA 48 161 0 STRESS: HIGH TEMP DYNAMIC OPERATING LIFE – LATENT FAILURE RATE, 125C, 3.8V Vcc Max CY7C65630 (7C65630CC) 4642838 610709630 L-KOREA 1000 84 0 CY7C65630 (7C65630CC) 4639823 610712725 L-KOREA 1000 84 0 CY7C65630 (7C65630CC) 4638322 610717719 L-KOREA 1000 83 0 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 7 of 8 Document No.001-89592 Rev. *A ECN # 4535338 Document History Page Document Title: QTP# 092103: AUTOMOTIVE 56-LEAD QFN (QUAD FLAT NO-LEAD) PURE SN, MSL3, 260C REFLOW, AMKOR-KOREA (L) 001-89592 Document Number: Rev. ECN No. ** 4149293 *A 4535338 Orig. of Change JYF JYF Description of Change Initial Spec Release. Updated QTP title page for template alignment. Distribution: WEB Posting: None Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 8 of 8