20L PDIP Pb-Free Package Material Declaration Datasheet.pdf

20L - PDIP
Pb-Free Package
PACKAGE MATERIAL DECLARATION DATASHEET
Cypress Package Code
Package Weight – Site 1
PZ
2,170.4100 mg
Body Size (mil/mm)
Package Weight – Site 2
300 mils
N/A
SUMMARY
The 20L-PDIP Pb-Free package is compliant to RoHS. Cypress Ordering Part Number containing an “X”
(e.g. CY7C1328G-133AXI, CY2308SXC-1HT) meet the of Directive 2002/95/EC (RoHS) requirement.
ASSEMBLY Site 1: Millennium Microtech Thailand (MMT)
Package Qualification Report # 051206 (Note 1)
I. DECLARATION OF PACKAGED UNITS
A. BANNED SUBSTANCES
Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU
RoHS. listed in the table below are materials that are neither contained nor intentionally added to this
product.
Substances / Compounds
Cadmium and Cadmium Compounds
Hexavalent Chromium and its Compounds
Lead and Lead Compounds
Mercury and Mercury Compounds
Polybrominated Biphenyls (PBB)
Polybrominated Diphenylethers (PBDE)
Asbestos
Azo colorants
Ozone Depleting Substances
Polychlorinated Biphenyls (PCBs)
Polychlorinated Napthalenes
Radioactive Substances
Shortchain Chlorinated Paraffins
Tributyl Tin (TBT) and Triphenyl Tin (TPT)
21qTributyl Tin Oxide (TBTO)
Formaldehyde
Weight by mg
PPM
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
< 5.0
< 5.0
< 5.0
<5.0
< 5.0
< 5.0
0
0
0
0
0
0
0
0
0
0
Analysis Report
(Note 2)
CoA-PZ20- MMT
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural
impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress
Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-03205 Rev.*H
Page 1 of 3
20L - PDIP
Pb-Free Package
B. MATERIAL COMPOSITION (Note 3)
Material
Lead frame
Purpose of
Use
Base Material
Lead Finish
External Plating
Die Attach
Adhesive
Die
Wire
Circuit
Interconnect
Mold
Compound
Encapsulation
Substance
Composition
887.0600
19.1000
0.6500
% weight of
substance per
Homogenous
material
97.7757%
2.1053%
0.0716%
408,706
8,800
299
40.8706%
0.8800%
0.0299%
0.4300
7.3800
0.2200
0.1300
1.0500
5.6000
0.3700
5.5000
0.4200
1063.9200
67.5400
0.0474%
95.4721%
2.8461%
1.6818%
14.9573%
79.7721%
5.2706%
100.0000%
100.0000%
85.6274%
5.4358%
198
3,400
101
60
484
2,580
170
2,534
194
490,194
31,119
0.0198%
0.3400%
0.0101%
0.0060%
0.0484%
0.2580%
0.0170%
0.2534%
0.0194%
49.0194%
3.1119%
29690-82-2
37.2900
3.0012%
17,181
1.7181%
Trade Secret
1333-86-4
67.5400
6.2100
5.4358%
0.4998%
31,119
2,861
3.1119%
0.2861%
% Total:
100.0000
CAS Number
Copper
Iron
Zinc
7440-50-8
7439-89-6
7440-66-6
Phosphorus
Nickel (Ni)
Palladium (Pd)
Gold (Au)
Epoxy Resin
Silver
Aromatic Amine
Silicon
Gold (Au)
Silica Fused
Epoxy Resin
Epoxy, Cresol
Novolac
Phenol Resin
Carbon Black
7723-14-0
7440-02-0
7440-05-3
7440-57-5
Trade Secret
7440-22-4
Trade Secret
7440-21-3
7440-57-5
60676-86-0
Trade Secret
Package Weight (mg):
Weight by mg
2,170.4100
PPM
% weight of
substance
per package
II. DECLARATION OF PACKAGING INDIRECT MATERIALS
Type
Tube
Others
Material
Plastic Tube
End Pin
End Plug
Shielding Bag
Lead
PPM
<2.0
<2.0
<2.0
<2.0
Cadmium
PPM
<2.0
<2.0
<2.0
< 2.0
Cr VI
PPM
<2.0
<2.0
<2.0
< 2.0
Mercury
PPM
<2.0
<2.0
<2.0
< 2.0
PBB
PPM
<0.0005
<0.0005
<0.0005
< 5.0
PBDE
PPM
<0.0005
<0.0005
<0.0005
< 5.0
Analysis Report
(Note2)
CoA-PLTB-R
CoA-ENDP-R
CoA-EPLG-R
CoA-SBAG-R
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural
impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress
Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-03205 Rev.*H
Page 2 of 3
20L - PDIP
Pb-Free Package
Document History Page
Document Title:
Document Number:
Rev.
**
*A
*B
*C
*D
*E
*F
*G
*H
20L-PDIP PB-FREE PACKAGE MATERIAL DECLARATION DATASHEET
001-03205
ECN No. Orig. of
Description of Change
Change
385878
EML
New document
639358
XRN/MRB 1. Updated Cypress Logo
2. Added on the material composition the percent
weight
per homogeneous material and weight of substance
3. Updated and added Lead, Cr+ VI, PBB and PBDE
on the Declaration of Packaging/Indirect Materials.
Added note 4: Engineering Calculations were
applied to derive individual package data.
2778368 MAHA
Added data for assembly site 2. Change CML to WEB in
distribution list.
3147584 MAHA
Deleted the data for Assembly site 1 (Omedata).
3477225 MAHA
Recalculated PPM values of assembly site 1. Expressed
the weight by mg, package weight, % weight of
substance per Homogeneous material, and % weight of
substance per package in four decimal places.
3488170 MAHA
Uploading correct document on the system. No changes
in the document’s content.
3889747 JARG
Corrected material composition table to meet 100%
weight of substance per package
4032288 YUM
Added Assembly site name in the Assembly heading.
Changed the Assembly Code to Assembly Site Name.
5163997 MRB
Changed CAS # from “---------“ to Trade Secret
DCON
Removed Distribution: WEB and Posting: None in the
document history page.
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural
impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress
Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-03205 Rev.*H
Page 3 of 3