20L - PDIP Pb-Free Package PACKAGE MATERIAL DECLARATION DATASHEET Cypress Package Code Package Weight – Site 1 PZ 2,170.4100 mg Body Size (mil/mm) Package Weight – Site 2 300 mils N/A SUMMARY The 20L-PDIP Pb-Free package is compliant to RoHS. Cypress Ordering Part Number containing an “X” (e.g. CY7C1328G-133AXI, CY2308SXC-1HT) meet the of Directive 2002/95/EC (RoHS) requirement. ASSEMBLY Site 1: Millennium Microtech Thailand (MMT) Package Qualification Report # 051206 (Note 1) I. DECLARATION OF PACKAGED UNITS A. BANNED SUBSTANCES Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU RoHS. listed in the table below are materials that are neither contained nor intentionally added to this product. Substances / Compounds Cadmium and Cadmium Compounds Hexavalent Chromium and its Compounds Lead and Lead Compounds Mercury and Mercury Compounds Polybrominated Biphenyls (PBB) Polybrominated Diphenylethers (PBDE) Asbestos Azo colorants Ozone Depleting Substances Polychlorinated Biphenyls (PCBs) Polychlorinated Napthalenes Radioactive Substances Shortchain Chlorinated Paraffins Tributyl Tin (TBT) and Triphenyl Tin (TPT) 21qTributyl Tin Oxide (TBTO) Formaldehyde Weight by mg PPM 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 < 5.0 < 5.0 < 5.0 <5.0 < 5.0 < 5.0 0 0 0 0 0 0 0 0 0 0 Analysis Report (Note 2) CoA-PZ20- MMT As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-03205 Rev.*H Page 1 of 3 20L - PDIP Pb-Free Package B. MATERIAL COMPOSITION (Note 3) Material Lead frame Purpose of Use Base Material Lead Finish External Plating Die Attach Adhesive Die Wire Circuit Interconnect Mold Compound Encapsulation Substance Composition 887.0600 19.1000 0.6500 % weight of substance per Homogenous material 97.7757% 2.1053% 0.0716% 408,706 8,800 299 40.8706% 0.8800% 0.0299% 0.4300 7.3800 0.2200 0.1300 1.0500 5.6000 0.3700 5.5000 0.4200 1063.9200 67.5400 0.0474% 95.4721% 2.8461% 1.6818% 14.9573% 79.7721% 5.2706% 100.0000% 100.0000% 85.6274% 5.4358% 198 3,400 101 60 484 2,580 170 2,534 194 490,194 31,119 0.0198% 0.3400% 0.0101% 0.0060% 0.0484% 0.2580% 0.0170% 0.2534% 0.0194% 49.0194% 3.1119% 29690-82-2 37.2900 3.0012% 17,181 1.7181% Trade Secret 1333-86-4 67.5400 6.2100 5.4358% 0.4998% 31,119 2,861 3.1119% 0.2861% % Total: 100.0000 CAS Number Copper Iron Zinc 7440-50-8 7439-89-6 7440-66-6 Phosphorus Nickel (Ni) Palladium (Pd) Gold (Au) Epoxy Resin Silver Aromatic Amine Silicon Gold (Au) Silica Fused Epoxy Resin Epoxy, Cresol Novolac Phenol Resin Carbon Black 7723-14-0 7440-02-0 7440-05-3 7440-57-5 Trade Secret 7440-22-4 Trade Secret 7440-21-3 7440-57-5 60676-86-0 Trade Secret Package Weight (mg): Weight by mg 2,170.4100 PPM % weight of substance per package II. DECLARATION OF PACKAGING INDIRECT MATERIALS Type Tube Others Material Plastic Tube End Pin End Plug Shielding Bag Lead PPM <2.0 <2.0 <2.0 <2.0 Cadmium PPM <2.0 <2.0 <2.0 < 2.0 Cr VI PPM <2.0 <2.0 <2.0 < 2.0 Mercury PPM <2.0 <2.0 <2.0 < 2.0 PBB PPM <0.0005 <0.0005 <0.0005 < 5.0 PBDE PPM <0.0005 <0.0005 <0.0005 < 5.0 Analysis Report (Note2) CoA-PLTB-R CoA-ENDP-R CoA-EPLG-R CoA-SBAG-R Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-03205 Rev.*H Page 2 of 3 20L - PDIP Pb-Free Package Document History Page Document Title: Document Number: Rev. ** *A *B *C *D *E *F *G *H 20L-PDIP PB-FREE PACKAGE MATERIAL DECLARATION DATASHEET 001-03205 ECN No. Orig. of Description of Change Change 385878 EML New document 639358 XRN/MRB 1. Updated Cypress Logo 2. Added on the material composition the percent weight per homogeneous material and weight of substance 3. Updated and added Lead, Cr+ VI, PBB and PBDE on the Declaration of Packaging/Indirect Materials. Added note 4: Engineering Calculations were applied to derive individual package data. 2778368 MAHA Added data for assembly site 2. Change CML to WEB in distribution list. 3147584 MAHA Deleted the data for Assembly site 1 (Omedata). 3477225 MAHA Recalculated PPM values of assembly site 1. Expressed the weight by mg, package weight, % weight of substance per Homogeneous material, and % weight of substance per package in four decimal places. 3488170 MAHA Uploading correct document on the system. No changes in the document’s content. 3889747 JARG Corrected material composition table to meet 100% weight of substance per package 4032288 YUM Added Assembly site name in the Assembly heading. Changed the Assembly Code to Assembly Site Name. 5163997 MRB Changed CAS # from “---------“ to Trade Secret DCON Removed Distribution: WEB and Posting: None in the document history page. Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-03205 Rev.*H Page 3 of 3