32L QFN 5X5X1.0 MM (SAW VERSION) PB-FREE Package Material Declaration Datasheet.pdf

32L – QFN 5X5X1.0 mm
(Saw Version)
Pb-Free Package
PACKAGE MATERIAL DECLARATION DATASHEET
Cypress Package Code
Package Weight – Site 1
LT
43.8986 mg
Body Size (mil/mm)
Package Weight – Site 2
Package Weight – Site 3
Package Weight – Site 5
67.9928 mg
B1: 68.7901 mg
B2: 64.9671 mg
Package Weight – Site 4
Package Weight – Site 6
5X5X1.0 mm
B1: 69.9000 mg
B2: 68.0100 mg
B3: 66.9064 mg
B4: 69.4639 mg
68.1200 mg
N/A
SUMMARY
The QFN 32L Pb-Free package is compliant to RoHS. Cypress Ordering Part Numbers containing an “X”
(e.g. CY8C21434-24LTXI) meet the Directive 2002/95/EC (RoHS) requirement.
ASSEMBLY Site 1: CARSEM Malaysia
Package Qualification Report # 074701 (See Note 1)
I. DECLARATION OF PACKAGED UNITS
A. BANNED SUBSTANCES
Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU
RoHS. Listed in the table below are materials that are neither contained nor intentionally added to this
product.
Substances / Compounds
Cadmium and Cadmium Compounds
Hexavalent Chromium and its Compounds
Lead and Lead Compounds
Mercury and Mercury Compounds
Polybrominated Biphenyls (PBB)
Polybrominated Diphenylethers (PBDE)
Asbestos
Azo colorants
Ozone Depleting Substances
Polychlorinated Biphenyls (PCBs)
Polychlorinated Napthalenes
Radioactive Substances
Shortchain Chlorinated Paraffins
Tributyl Tin (TBT) and Triphenyl Tin (TPT)
Tributyl Tin Oxide (TBTO)
Formaldehyde
Weight by mg
PPM
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
0
0
0
0
0
0
0
0
0
0
Analysis Report
(Note 2)
CoA-LT32CARSEM
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural
impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress
Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-43056 Rev. *M
Page 1 of 16
32L – QFN 5X5X1.0 mm
(Saw Version)
Pb-Free Package
B. MATERIAL COMPOSITION (Note 3)
Purpose of
Use
Material
Lead
Frame
Base material
Lead Finish
External
Plating
Die Attach
Adhesive
Die
Wire
Circuit
Interconnect
Mold
Compound
Encapsulation
Substance
Composition
CAS Number
Copper
Iron
Phosphorus
Zinc
Nickel
Palladium
Gold
Bismaleimide
Acrylates
Carbolycyclic Acrylate.
Silver
Additives
Si
Au
Fused Silica
Epoxy Resin
Phenol Resin
Carbon Black
7440-50-8
7439-89-6
7723-14-0
7440-66-6
7440-02-0
7440-05-3
7440-57-5
proprietary
proprietary
Proprietary
7440-22-4
proprietary
7440-21-3
7440-57-5
60676-86-0
Proprietary
proprietary
1333-86-4
Package Weight (mg):
Weight by
mg
16.9156
0.4024
0.0052
0.0225
0.2027
0.0176
0.0026
0.0234
0.0234
0.1560
0.5538
0.0234
1.4700
0.5600
22.0382
0.7056
0.7056
0.0706
% weight of
substance per
Homogeneous
material
97.5300%
2.3200%
0.0300%
0.1300%
90.9100%
7.9100%
1.1800%
3.0000%
3.0000%
20.0000%
71.0000%
3.0000%
100.0000%
100.0000%
93.7000%
3.0000%
3.0000%
0.3000%
43.8986
PPM
385332
9166
119
514
4618
402
60
533
533
3554
12615
533
33486
12757
502024
16073
16073
1607
% Total:
% weight of
substance
per
package
38.5332
0.9166
0.0119
0.0514
0.4618
0.0402
0.0060
0.0533
0.0533
0.3554
1.2615
0.0533
3.3486
1.2757
50.2024
1.6073
1.6073
0.1607
100.0000
II. DECLARATION OF PACKAGING / INDIRECT MATERIALS
Type
Material
Tape & Reel
Tray
Others
Cover tape
Carrier tape
Plastic Reel
Tray
Shielding bag
Lead
PPM
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
Cadmium
PPM
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
Cr VI
PPM
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
Mercury
PPM
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
PBB
PPM
<5.0
<5.0
<0.0005
<5.0
<5.0
PBDE
PPM
<5.0
<5.0
<0.0005
<5.0
<5.0
Analysis Report
(Note2)
CoA-COVT-R
CoA-CART-R
CoA-PLRL-R
CoA-TRAY-R
CoA-SBAG –R
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural
impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress
Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-43056 Rev. *M
Page 2 of 16
32L – QFN 5X5X1.0 mm
(Saw Version)
Pb-Free Package
ASSEMBLY Site 2: Cypress Manufacturing Limited (CML)
Package Qualification Report # 082902, 093803, 120204 (See Note 1)
I. DECLARATION OF PACKAGED UNITS
A. BANNED SUBSTANCES
Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU
RoHS. Listed in the table below are materials that are neither contained nor intentionally added to this
product.
Substances / Compounds
Cadmium and Cadmium Compounds
Hexavalent Chromium and its Compounds
Lead and Lead Compounds
Mercury and Mercury Compounds
Polybrominated Biphenyls (PBB)
Polybrominated Diphenylethers (PBDE)
Asbestos
Azo colorants
Ozone Depleting Substances
Polychlorinated Biphenyls (PCBs)
Polychlorinated Napthalenes
Radioactive Substances
Shortchain Chlorinated Paraffins
Tributyl Tin (TBT) and Triphenyl Tin (TPT)
Tributyl Tin Oxide (TBTO)
Formaldehyde
Weight by mg
PPM
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
0
0
0
0
0
0
0
0
0
0
Analysis Report
(Note 2)
CoA-LT32CML
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural
impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress
Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-43056 Rev. *M
Page 3 of 16
32L – QFN 5X5X1.0 mm
(Saw Version)
Pb-Free Package
B1. MATERIAL COMPOSITION (Note 4)
Gold Palladium Wire
Using HITACHI (CEL 9220HF13) MOLD COMPOUND
Material
Purpose of
Use
Lead
Frame
Base material
Lead
Finish
External
Plating
Die Attach
Adhesive
Die
Circuit
Wire
Interconnect
Mold
Compound
Encapsulation
Substance
Composition
CAS Number
Weight by
mg
Copper
Iron
Phosphorus
Zinc
Nickel
Palladium
Gold
Bismaleimide
Polymer
Acrylate Ester
Methacrylate
Silver
Organic Peroxide
Si
Au
Pd
Fused Silica (SiO2)
Metal OH
Epoxy Resin
Phenol Resin
Carbon Black
Others
7440-50-8
7439-89-6
7723-14-0
7440-66-6
7440-02-0
7440-05-3
7440-57-5
proprietary
proprietary
proprietary
proprietary
7440-22-4
proprietary
7440-21-3
7440-57-5
7440-05-3
60676-86-0
Trade Secret
Proprietary
proprietary
1333-86-4
proprietary
28.7554
0.7085
0.0207
0.0354
0.4247
0.0076
0.0077
0.0216
0.0120
0.0048
0.0048
0.1920
0.0048
3.7100
0.8019
0.0081
31.3102
1.1609
1.2313
0.8795
0.0704
0.5277
Package Weight (mg):
69.9000
% weight of
substance per
Homogeneous
material
97.4100%
2.4000%
0.0700%
0.1200%
96.5200%
1.7300%
1.7400%
9.0000%
5.0000%
2.0000%
2.0000%
80.0000%
2.0000%
100.0000%
99.0000%
1.0000%
89.0000%
3.3000%
3.5000%
2.5000%
0.2000%
1.5000%
411,380
10,136
296
507
6,076
109
110
309
172
69
69
2,747
69
53,076
11,472
116
447,929
16,609
17,615
12,582
1,007
7,549
% weight
of
substanc
e per
package
41.1380
1.0136
0.0296
0.0507
0.6076
0.0109
0.0110
0.0309
0.0172
0.0069
0.0069
0.2747
0.0069
5.3076
1.1472
0.0116
44.7929
1.6609
1.7615
1.2582
0.1007
0.7549
% Total:
100.0000
PPM
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural
impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress
Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-43056 Rev. *M
Page 4 of 16
32L – QFN 5X5X1.0 mm
(Saw Version)
Pb-Free Package
B2. MATERIAL COMPOSITION (Note 3)
Gold Palladium Wire
Using NITTO (GE 7470LA) MOLD COMPOUND
Material
Lead
Frame
Purpose of
Use
Base material
Lead Finish
External
Plating
Die Attach
Adhesive
Die
Circuit
Wire
Interconnect
Mold
Compound
Encapsulation
Substance
Composition
Copper
Iron
Phosphorous
Zinc
Nickel
Palladium
Gold
Ag
Carbocyclic Acrylate
Bismaleimide Resin
Additive
Acrylate ester
Silicon
Gold
Palladium
SiO2
Metal OH
Phenol Resin
Epoxy Resin
Carbon Black
Crystalline Silica
CAS Number
7440-50-8
7439-89-6
7723-14-0
7440-66-6
7440-02-0
7440-05-3
7440-57-5
7440-22-4
Trade Secret
Trade Secret
Trade Secret
Trade Secret
7440-21-3
7440-57-5
7440-05-3
60676-86-0
Trade Secret
Trade Secret
Trade Secret
1333-86-4
14808-60-7
Package Weight (mg):
Weight by
mg
28.7749
0.7090
0.0207
0.0354
0.4440
0.0080
0.0080
0.1998
0.0540
0.0054
0.0054
0.0054
3.6700
2.0295
0.0205
26.7367
0.9606
1.2808
1.2808
0.1601
1.6010
68.0100
% weight of
substance
per
Homogeneo
us material
97.4100%
2.4000%
0.0700%
0.1200%
96.5200%
1.7400%
1.7400%
74.0000%
20.0000%
2.0000%
2.0000%
2.0000%
100.0000%
99.0000%
1.0000%
83.5000%
3.0000%
4.0000%
4.0000%
0.5000%
5.0000%
PPM
% weight of
substance
per package
423,098
10,424
304
521
6,528
118
118
2,938
794
79
79
79
53,963
29,841
301
393,129
14,124
18,833
18,833
2,354
23,541
% Total:
42.3098
1.0424
0.0304
0.0521
0.6528
0.0118
0.0118
0.2938
0.0794
0.0079
0.0079
0.0079
5.3963
2.9841
0.0301
39.3129
1.4124
1.8833
1.8833
0.2354
2.3541
100.0000
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural
impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress
Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-43056 Rev. *M
Page 5 of 16
32L – QFN 5X5X1.0 mm
(Saw Version)
Pb-Free Package
B3. MATERIAL COMPOSITION (Note 3)
Copper Wire
Using NITTO (GE 7470LA) MOLD COMPOUND
Material
Lead
Frame
Purpose of
Use
Base material
Lead Finish
External
Plating
Die Attach
Adhesive
Die
Wire
Circuit
Interconnect
Mold
Compound
Encapsulation
Substance
Composition
Copper
Iron
Phosphorous
Zinc
Nickel
Palladium
Gold
Ag
Carbocyclic Acrylate
Bismaleimide Resin
Additive
Acrylate ester
Silicon
Copper
SiO2
Metal OH
Phenol Resin
Epoxy Resin
Carbon Black
Crystalline Silica
CAS Number
7440-50-8
7439-89-6
7723-14-0
7440-66-6
7440-02-0
7440-05-3
7440-57-5
7440-22-4
Trade Secret
Trade Secret
Trade Secret
Trade Secret
7440-21-3
7440-50-8
60676-86-0
Trade Secret
Trade Secret
Trade Secret
1333-86-4
14808-60-7
Package Weight (mg):
Weight by
mg
28.7749
0.7090
0.0207
0.0354
0.4440
0.0080
0.0080
0.1998
0.0540
0.0054
0.0054
0.0054
3.6700
0.9464
26.7367
0.9606
1.2808
1.2808
0.1601
1.6010
66.9064
% weight of
substance
per
Homogeneo
us material
97.4100%
2.4001%
0.0701%
0.1198%
96.5217%
1.7391%
1.7391%
74.0000%
20.0000%
2.0000%
2.0000%
2.0000%
100.0000%
100.0000%
83.5000%
3.0000%
4.0000%
4.0000%
0.5000%
5.0000%
PPM
% weight of
substance
per package
430,077
10,597
309
529
6,636
120
120
2,986
807
81
81
81
54,853
14,145
399,613
14,357
19,143
19,143
2,393
23,929
% Total:
43.0077%
1.0597%
0.0309%
0.0529%
0.6636%
0.0120%
0.0120%
0.2986%
0.0807%
0.0081%
0.0081%
0.0081%
5.4853%
1.4145%
39.9613%
1.4357%
1.9143%
1.9143%
0.2393%
2.3929%
100.0000
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural
impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress
Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-43056 Rev. *M
Page 6 of 16
32L – QFN 5X5X1.0 mm
(Saw Version)
Pb-Free Package
B4. MATERIAL COMPOSITION (Note 3)
Copper Wire
Using HITACHI (CEL 9220HF13) MOLD COMPOUND
Material
Purpose of
Use
Lead
Frame
Base material
Lead
Finish
External
Plating
Die Attach
Adhesive
Die
Wire
Circuit
Interconnect
Mold
Compound
Encapsulation
Substance
Composition
CAS Number
Weight by
mg
Copper
Iron
Phosphorus
Zinc
Nickel
Palladium
Gold
Bismaleimide
Polymer
Acrylate Ester
Methacrylate
Silver
Organic Peroxide
Si
Copper
Fused Silica (SiO2)
Metal OH
Epoxy Resin
Phenol Resin
Carbon Black
Others
7440-50-8
7439-89-6
7723-14-0
7440-66-6
7440-02-0
7440-05-3
7440-57-5
proprietary
proprietary
proprietary
proprietary
7440-22-4
proprietary
7440-21-3
7440-50-8
60676-86-0
Trade Secret
Proprietary
proprietary
1333-86-4
proprietary
28.7554
0.7085
0.0207
0.0354
0.4247
0.0076
0.0077
0.0216
0.012
0.0048
0.0048
0.192
0.0048
3.71
0.3739
31.3102
1.1609
1.2313
0.8795
0.0704
0.5277
Package Weight (mg):
% weight of
substance per
Homogeneous
material
97.4099%
2.4001%
0.0701%
0.1199%
96.5227%
1.7273%
1.7500%
9.0000%
5.0000%
2.0000%
2.0000%
80.0000%
2.0000%
100.0000%
100.0000%
89.0000%
3.2999%
3.5000%
2.5000%
0.2001%
1.5000%
69.4639
PPM
413,962
10,200
298
510
6,114
109
111
311
173
69
69
2,764
69
53,409
5,383
450,741
16,712
17,726
12,661
1,013
7,597
% weight of
substance
per
package
41.3962%
1.0200%
0.0298%
0.0510%
0.6114%
0.0109%
0.0111%
0.0311%
0.0173%
0.0069%
0.0069%
0.2764%
0.0069%
5.3409%
0.5383%
45.0741%
1.6712%
1.7726%
1.2661%
0.1013%
0.7597%
% Total:
100.0000
II. DECLARATION OF PACKAGING / INDIRECT MATERIALS
Type
Material
Tape & Reel
Tray
Others
Cover tape
Carrier tape
Plastic Reel
Tray
Shielding bag
Lead
PPM
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
Cadmium
PPM
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
Cr VI
PPM
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
Mercury
PPM
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
PBB
PPM
<5.0
<5.0
<5.0
<5.0
<5.0
PBDE
PPM
<5.0
<5.0
<5.0
<5.0
<5.0
Analysis Report
(Note2)
CoA-COVT-R
CoA-CART-R
CoA-PLRL-R
CoA-TRAY-R
CoA-SBAG –R
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural
impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress
Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-43056 Rev. *M
Page 7 of 16
32L – QFN 5X5X1.0 mm
(Saw Version)
Pb-Free Package
ASSEMBLY Site 3: Advanced Semiconductor Engineering Shanghai
Package Qualification Report # 084007 (See Note 1)
I. DECLARATION OF PACKAGED UNITS
A. BANNED SUBSTANCES
Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU
RoHS. Listed in the table below are materials that are neither contained nor intentionally added to this
product.
Substances / Compounds
Cadmium and Cadmium Compounds
Hexavalent Chromium and its Compounds
Lead and Lead Compounds
Mercury and Mercury Compounds
Polybrominated Biphenyls (PBB)
Polybrominated Diphenylethers (PBDE)
Asbestos
Azo colorants
Ozone Depleting Substances
Polychlorinated Biphenyls (PCBs)
Polychlorinated Napthalenes
Radioactive Substances
Shortchain Chlorinated Paraffins
Tributyl Tin (TBT) and Triphenyl Tin (TPT)
Tributyl Tin Oxide (TBTO)
Formaldehyde
Weight by mg
PPM
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
0
0
0
0
0
0
0
0
0
0
Analysis Report
(Note 2)
CoA-LT32ASE
Shanghai
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural
impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress
Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-43056 Rev. *M
Page 8 of 16
32L – QFN 5X5X1.0 mm
(Saw Version)
Pb-Free Package
B. MATERIAL COMPOSITION (Note 3)
Material
Purpose of
Use
Lead
Frame
Base material
Lead
Finish
External
Plating
Die Attach
Adhesive
Die
Circuit
Wire
Interconnect
Mold
Compound
Encapsulation
Substance
Composition
Copper
Iron
Phosphorus
Zinc
Nickel
Palladium
Gold
Silver
Acrylic resin
Polybutadiene
derivative
Butadiene
copolymer
Epoxy resin
Silver
Acrylate
Peroxide
Additive
Si
Au
Pd
Silica Fused
Epoxy Resin
Phenol Resin
Carbon Black
7440-50-8
7439-89-6
7723-14-0
7440-66-6
7440-02-0
7440-05-3
7440-57-5
7440-22-4
Proprietary
25.7613
0.6211
0.0106
0.0396
0.3200
0.0100
0.0100
0.0100
0.0360
97.4700%
2.3500%
0.0400%
0.1500%
91.4300%
2.8600%
2.8600%
2.8600%
8.0000%
378,884
9,135
155
583
4,706
147
147
147
529
% weight
of
substance
per
package
37.8884
0.9135
0.0155
0.0583
0.4706
0.0147
0.0147
0.0147
0.0529
proprietary
0.0225
5.0000%
331
0.0331
proprietary
0.0045
1.0000%
66
0.0066
proprietary
7440-22-4
proprietary
proprietary
proprietary
7440-21-3
7440-57-5
7440-05-3
60676-86-0
Proprietary
proprietary
1333-86-4
0.0113
0.3465
0.0225
0.0023
0.0045
3.6600
0.3465
0.0035
31.7888
2.9400
1.8375
0.1838
2.5000%
77.0000%
5.0000%
0.5000%
1.0000%
100.0000%
99.0000%
1.0000%
86.5000%
8.0000%
5.0000%
0.5000%
165
5,096
331
33
66
53,829
5,096
51
467,532
43,240
27,025
2,702
0.0165
0.5096
0.0331
0.0033
0.0066
5.3829
0.5096
0.0051
46.7532
4.3240
2.7025
0.2702
CAS Number
Package Weight (mg):
Weight by
mg
% weight of
substance per
Homogeneous
material
67.9928
PPM
% Total:
100.0000
II. DECLARATION OF PACKAGING / INDIRECT MATERIALS
Type
Tape &
Reel
Tray
Others
Material
Lead
PPM
Cadmium
PPM
Cr VI
PPM
Mercury
PPM
Cover tape
Carrier tape
Plastic Reel
Tray
Shielding bag
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
PBB
PPM
PBDE
PPM
<5.0
<5.0
<0.0005
<5.0
<5.0
<5.0
<5.0
<0.0005
<5.0
<5.0
Analysis
Report
(Note2)
CoA-COVT-R
CoA-CART-R
CoA-PLRL-R
CoA-TRAY-R
CoA-SBAG –R
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural
impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress
Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-43056 Rev. *M
Page 9 of 16
32L – QFN 5X5X1.0 mm
(Saw Version)
Pb-Free Package
ASSEMBLY Site 4: Amkor Technology Philippines (P3/P4)
Package Qualification Report # 083907 (See Note 1)
I. DECLARATION OF PACKAGED UNITS
A. BANNED SUBSTANCES
Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU
RoHS. Listed in the table below are materials that are neither contained nor intentionally added to this
product.
Substances / Compounds
Cadmium and Cadmium Compounds
Hexavalent Chromium and its Compounds
Lead and Lead Compounds
Mercury and Mercury Compounds
Polybrominated Biphenyls (PBB)
Polybrominated Diphenylethers (PBDE)
Asbestos
Azo colorants
Ozone Depleting Substances
Polychlorinated Biphenyls (PCBs)
Polychlorinated Napthalenes
Radioactive Substances
Shortchain Chlorinated Paraffins
Tributyl Tin (TBT) and Triphenyl Tin (TPT)
Tributyl Tin Oxide (TBTO)
Formaldehyde
Weight by mg
PPM
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
0
0
0
0
0
0
0
0
0
0
Analysis Report
(Note 2)
CoA-LT32-Amkor
Philippines
(P3/P4)
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural
impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress
Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-43056 Rev. *M
Page 10 of 16
32L – QFN 5X5X1.0 mm
(Saw Version)
Pb-Free Package
B. MATERIAL COMPOSITION (Note 3)
Material
Lead Frame
Lead Finish
Purpose of
Use
Base material
External
Plating
Die Attach
Adhesive
Die
Wire
Circuit
Interconnect
Mold
Compound
Encapsulation
Substance
Composition
CAS Number
Copper
Nickel
Silicon
Magnesium
Nickel
Palladium
Gold
Silver
Bismaleimide
Methacrylate Ester
Polymer
Silver
Acrylate
Si
Au
Silica Fused
Metal hydro oxide
Epoxy Resin
Phenol Resin
Crystalline Silica
Carbon Black
7440-50-8
7440-02-0
7440-21-3
7439-95-4
7440-02-0
7440-05-3
7440-57-5
7440-22-4
Proprietary
proprietary
proprietary
7440-22-4
proprietary
7440-21-3
7440-57-5
60676-86-0
Proprietary
Proprietary
proprietary
14808-60-7
1333-86-4
Package Weight (mg):
37.1332
1.1580
0.2509
0.0579
0.5660
0.0120
0.0020
96.2000%
3.0000%
0.6500%
0.1500%
97.5800%
2.0700%
0.3500%
545,115
16,999
3,683
850
8,308
176
30
% weight
of
substance
per
package
54.5115
1.6999
0.3683
0.0850
0.8308
0.0176
0.0030
0.0255
0.0255
0.0085
0.6970
0.0935
3.3100
0.5400
15.7560
3.5148
2.1816
2.1816
0.4848
0.1212
3.0000%
3.0000%
1.0000%
82.0000%
11.0000%
100.0000%
100.0000%
65.0000%
14.5000%
9.0000%
9.0000%
2.0000%
0.5000%
374
374
125
10232
1373
48591
7927
231298
51597
32026
32026
7117
1779
0.0374
0.0374
0.0125
1.0232
0.1373
4.8591
0.7927
23.1298
5.1597
3.2026
3.2026
0.7117
0.1779
Weight by
mg
% weight of
substance per
Homogeneous
material
68.1200
PPM
% Total:
100.0000
II. DECLARATION OF PACKAGING / INDIRECT MATERIALS
Type
Tape & Reel
Tray
Others
Material
Lead
PPM
Cadmium
PPM
Cr VI
PPM
Mercury
PPM
Cover tape
Carrier tape
Plastic Reel
Tray
Shielding bag
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
PBB
PPM
PBDE
PPM
<5.0
<5.0
<0.0005
<5.0
<5.0
<5.0
<5.0
<0.0005
<5.0
<5.0
Analysis
Report
(Note2)
CoA-COVT-R
CoA-CART-R
CoA-PLRL-R
CoA-TRAY-R
CoA-SBAG –R
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural
impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress
Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-43056 Rev. *M
Page 11 of 16
32L – QFN 5X5X1.0 mm
(Saw Version)
Pb-Free Package
ASSEMBLY Site 5: Advanced Semiconductor Engineering Taiwan (ASET)
Package Qualification Report # 111812, 114907 (See Note 1)
I. DECLARATION OF PACKAGED UNITS
A. BANNED SUBSTANCES
Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU
RoHS. Listed in the table below are materials that are neither contained nor intentionally added to this
product.
Substances / Compounds
Cadmium and Cadmium Compounds
Hexavalent Chromium and its Compounds
Lead and Lead Compounds
Mercury and Mercury Compounds
Polybrominated Biphenyls (PBB)
Polybrominated Diphenylethers (PBDE)
Asbestos
Azo colorants
Ozone Depleting Substances
Polychlorinated Biphenyls (PCBs)
Polychlorinated Napthalenes
Radioactive Substances
Shortchain Chlorinated Paraffins
Tributyl Tin (TBT) and Triphenyl Tin (TPT)
Tributyl Tin Oxide (TBTO)
Formaldehyde
Weight by mg
PPM
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
0
0
0
0
0
0
0
0
0
0
Analysis Report
(Note 2)
CoA-LT32ASET
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural
impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress
Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-43056 Rev. *M
Page 12 of 16
32L – QFN 5X5X1.0 mm
(Saw Version)
Pb-Free Package
B1. MATERIAL COMPOSITION (Note 3)
Using Gold Wire
Material
Lead
Frame
Purpose of
Use
Base material
Lead Finish
External
Plating
Die Attach
Adhesive
Die
Circuit
Wire
Interconnect
Mold
Compound
Encapsulation
Substance
Composition
Copper
Iron
Phosphorous
Zinc
Nickel
Palladium
Gold
Silver
Acrylic Resin
Polybutadiene
derivative
Butadiene copolymer
Acrylate
Peroxide
Additive
Silicon
Gold
Ion Impurities
Epoxy Resin A
Epoxy Resin B
Phenol Resin
Carbon Black
Silica Fused
CAS Number
Weight by
mg
7440-50-8
7439-89-6
7723-14-0
7440-66-6
7440-02-0
7440-05-3
7440-57-5
7440-22-4
Trade Secret
28.8109
0.7099
0.0148
0.0444
0.3776
0.0176
0.0048
0.7070
0.0758
% weight of
substance
per
Homogeneo
us material
97.4000%
2.4000%
0.0500%
0.1500%
94.3900%
4.4100%
1.2000%
70.0000%
7.5000%
0.0934
0.0354
0.0758
0.0101
0.0126
3.5000
0.3000
0.0000
1.5300
1.0200
2.2440
0.1700
29.0360
9.2500%
3.5000%
7.5000%
1.0000%
1.2500%
100.0000%
99.9900%
0.0100%
4.5000%
3.0000%
6.6000%
0.5000%
85.4000%
Trade Secret
Trade Secret
Trade Secret
Trade Secret
Trade Secret
7440-21-3
7440-57-5
Trade Secret
Trade Secret
Trade Secret
Trade Secret
1333-86-4
60676-86-0
Package Weight (mg):
68.7901
PPM
% weight of
substance
per
package
418,824
10,320
215
645
5,489
256
70
10,278
1,101
41.8824
1.0320
0.0215
0.0645
0.5489
0.0256
0.0070
1.0278
0.1101
1,358
514
1,101
147
184
50,879
4,361
0
22,242
14,828
32,621
2,471
422,096
0.1358
0.0514
0.1101
0.0147
0.0184
5.0879
0.4361
0.0000
2.2242
1.4828
3.2621
0.2471
42.2096
% Total: 100.0000
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to
report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using
MSDS, Material Analysis Reports and Cypress Assembly site information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-43056 Rev. *M
Page 13 of 16
32L – QFN 5X5X1.0 mm
(Saw Version)
Pb-Free Package
B2. MATERIAL COMPOSITION (Note 3)
Using Copper Wire
Material
Lead
Frame
Purpose of
Use
Base material
Lead Finish
External
Plating
Die Attach
Adhesive
Die
Wire
Circuit
Interconnect
Mold
Compound
Encapsulation
Substance
Composition
Copper
Iron
Phosphorous
Zinc
Nickel
Palladium
Gold
Silver
Acrylic Resin
Polybutadiene
derivative
Butadiene copolymer
Acrylate
Peroxide
Additive
Silicon
Copper
Epoxy Resin A
Epoxy Resin B
Phenol Resin
Carbon Black
Silica Fused
CAS Number
Weight by
mg
7440-50-8
7439-89-6
7723-14-0
7440-66-6
7440-02-0
7440-05-3
7440-57-5
7440-22-4
Trade Secret
35.0280
0.8820
0.0324
0.0576
0.4653
0.0218
0.0059
0.2940
0.0315
% weight of
substance
per
Homogeneo
us material
97.3000
2.4500
0.0900
0.1600
94.3880
4.4120
1.2000
70.0000
7.5000
0.0389
0.0147
0.0315
0.0042
0.0053
3.5740
0.1400
1.0953
0.7302
1.6064
0.1217
20.7864
9.2500
3.5000
7.5000
1.0000
1.2500
100.0000
100.0000
4.5000
3.0000
6.6000
0.5000
85.4000
Trade Secret
Trade Secret
Trade Secret
Trade Secret
Trade Secret
7440-21-3
7440-50-8
Trade Secret
Trade Secret
Trade Secret
1333-86-4
60676-86-0
Package Weight (mg):
64.9671
PPM
% weight of
substance
per
package
539,166
13,576
499
887
7,163
335
91
4,525
485
53.9166
1.3576
0.0499
0.0887
0.7163
0.0335
0.0091
0.4525
0.0485
598
226
485
65
81
55,012
2,154
16,859
11,240
24,727
1,873
319,953
0.0598
0.0226
0.0485
0.0065
0.0081
5.5012
0.2154
1.6859
1.1240
2.4727
0.1873
31.9953
% Total: 100.0000
II. DECLARATION OF PACKAGING / INDIRECT MATERIALS
Type
Tape & Reel
Tray
Others
Material
Lead
PPM
Cadmium
PPM
Cr VI
PPM
Mercury
PPM
Cover tape
Carrier tape
Plastic Reel
Tray
Shielding bag
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
PBB
PPM
PBDE
PPM
<5.0
<5.0
<5.0
<5.0
<5.0
<5.0
<5.0
<5.0
<5.0
<5.0
Analysis
Report
(Note2)
CoA-COVT-R
CoA-CART-R
CoA-PLRL-R
CoA-TRAY-R
CoA-SBAG –R
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to
report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using
MSDS, Material Analysis Reports and Cypress Assembly site information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-43056 Rev. *M
Page 14 of 16
32L – QFN 5X5X1.0 mm
(Saw Version)
Pb-Free Package
Document History Page
Document Title:
32L - QFN 5X5X1.0 MM (SAW VERSION) PB-FREE PACKAGE PACKAGE MATERIAL
DECLARATION DATASHEET
Document Number:
001-43056
Rev.
ECN No.
**
*A
1728304
2559346
*B
2599417
Orig. of Description of Change
Change
DPT
Initial spec release.
OKO
Include Autoline CML for additional site of 32LT QFN
Removed Lead Substance on the Leadframe material based on
MSDS,
Removed the Material name for Leadframe and Adhesive.
DPT
Add ASE Shanghai for additional site of 32QFN (LT32B).
Changed body thickness from 5X5X0.93mm to 5X5X1.0mm per
POD#001-30999 in Document title.
*C
*D
*E
2611720
2703729
2826390
Dcon
DPT
HLR
HLR
*F
3261110
VFR
*G
3429897
HLR
*H
3473917
VFR
*I
3533023
COPI
*J
4055149
YUM
Removed inactive distribution CML to WEB
Add Amkor Phil (P3) for additional site of 32QFN (LT32B).
Added Assembly Site 5. QTP No. 085001 – Nitto 7470.
Changed referenced QTP No. 085001 on Assembly site 5 to
QTP No. 093803. Revised the material composition table of
assembly site 5 based on the materials indicated on the
qualification report. Changed Package weight of Assembly Site
5.
Added Assembly Site 6 – ASE Taiwan (G). Reference QTP #
111812.
Updated the material composition table for
Assembly Sites 1 to 6 to reflect 4 decimal places on values.
Added Assembly Site 7 – ASE Taiwan (G) Copper wire
qualification. Reference QTP # 114907.
Added Assembly Site 8 – AUTOLINE RA Copper wire
qualification. Reference QTP # 120204.
Added assembly site name in the Assembly heading in site 1, 2,
3, 4 and 5.
Changed Assembly code to assembly site name in site 1, 2, 3, 4
and 5.
Removed Tube in the Indirect Materials section.
Consolidate material composition in one assembly site.
1. CML
2. ASET
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to
report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using
MSDS, Material Analysis Reports and Cypress Assembly site information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-43056 Rev. *M
Page 15 of 16
32L – QFN 5X5X1.0 mm
(Saw Version)
Pb-Free Package
Document History Page
Document Title:
32L - QFN 5X5X1.0 MM (SAW VERSION) PB-FREE PACKAGE PACKAGE MATERIAL
DECLARATION DATASHEET
Document Number:
001-43056
Rev.
ECN No.
*K
4081278
*L
*M
4572853
5026871
Orig. of Description of Change
Change
YUM
Edited header and corrected the package size (5x5x0.93) to
(5x5x1.0) and added the “Saw Version”.
HLR
Sunset Due – No Change
HLR
Changed the substances with “------------- and Proprietary “to
“Trade Secret”.
MEL
Removed “Distribution: WEB” and “Posting: NONE” from the
document history page.
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to
report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using
MSDS, Material Analysis Reports and Cypress Assembly site information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-43056 Rev. *M
Page 16 of 16
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