100L - TQFP (14 X 14 MM) PB-FREE Package Material Declaration Datasheet.pdf

100L –TQFP (14 x 14 mm)
Pb-Free Package
PACKAGE MATERIAL DECLARATION DATASHEET
Cypress Package Code
Package Weight – Site 1
Package Weight – Site 3
AZ
B1: 569.9900 mg
B2: 660.0100 mg
B3: 644.9998 mg
B4: 657.2885 mg
B5 : 632.8000 mg
B1: 660.0100 mg
B2: 651.0699 mg
Body Size (mil/mm)
Package Weight – Site 2
14 x 14 mm
B1: 661.0004 mg
B2: 658.6038 mg
B3: 668.7599 mg
SUMMARY
The 100L-TQFP package is qualified at three assembly sites. Packages from different assembly sites may
have different material composition. Cypress Ordering Part Numbers containing an “X” (e.g. CY7C1328G133AXI, CY2308SXC-1HT) meet the Directive 2002/95/EC (RoHS) requirement.
ASSEMBLY Site 1 – Cypress Manufacturing Limited (CML)
Package Qualification Report # 040806, 052805, 062603, 112302, 133307, 125105,
134503, ***152607 (See Note 1)
I. DECLARATION OF PACKAGED UNITS
A. BANNED SUBSTANCES
Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU
RoHS. Listed in the table below are materials that are neither contained nor intentionally added to this
product.
Substances / Compounds
Cadmium and Cadmium Compounds
Hexavalent Chromium and its Compounds
Lead and Lead Compounds
Mercury and Mercury Compounds
Polybrominated Biphenyls (PBB)
Polybrominated Diphenylethers (PBDE)
Asbestos
Azo colorants
Ozone Depleting Substances
Polychlorinated Biphenyls (PCBs)
Polychlorinated Napthalenes
Radioactive Substances
Shortchain Chlorinated Paraffins
Tributyl Tin (TBT) and Triphenyl Tin (TPT)
Tributyl Tin Oxide (TBTO)
Formaldehyde
Weight by
mg
PPM
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
0
0
0
0
0
0
0
0
0
0
Analysis
Report
(Note 2)
CoA-AZ100CML
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to
report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material
information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-04270 Rev *S
Page 1 of 17
100L –TQFP (14 x 14 mm)
Pb-Free Package
B. MATERIAL COMPOSITION (Note 3)
B1: NiPdAu with Standard Mold Compound
Material
Leadframe
Purpose of
Use
Base Material
Lead Finish
External Plating
Die Attach
Adhesive
Die
Wire
Circuit
Interconnect
Encapsulation
Mold
Compound
Cu
7440-50-8
39.7595
96.2000%
69,755
%Weight
of
Substance
per
package
6.9755
Mg
7439-95-4
0.2686
0.6500%
471
0.0471
Si
7440-21-3
0.0620
0.1500%
109
0.0109
Ni
Ni
Pd
Au
Ag
Bismaleimide
Polymer
Methacrylate
Acylate ester
Organic Peroxide
Si
Au
SiO2
Epoxy Resin
Phenol Resin
Brominated
Epoxy Resin
Antimony
Trioxide
Others
7440-02-0
7440-02-0
7440-05-3
7440-57-5
7440-22-4
Trade Secret
Trade Secret
Trade Secret
Trade Secret
Trade Secret
7440-21-3
7440-57-5
60676-86-0
Trade Secret
Trade Secret
Trade Secret
1.2399
0.1930
0.0035
0.0035
0.8300
0.1200
0.0600
0.0200
0.0200
0.0100
14.9500
3.3400
448.0168
25.4555
25.4555
4.0729
3.0000%
96.5200%
1.7400%
1.7400%
78.3000%
11.3200%
5.6600%
1.8900%
1.8900%
0.9400%
100.0000%
100.0000%
88.0000%
5.0000%
5.0000%
0.8000%
2,175
339
6
6
1,456
211
105
35
35
17
26,229
5,860
786,008
44,660
44,660
7,146
0.2175
0.0339
0.0006
0.0006
0.1456
0.0211
0.0105
0.0035
0.0035
0.0017
2.6229
0.5860
78.6008
4.4660
4.4660
0.7146
1309-64-4
2.0364
0.4000%
3,573
0.3573
Trade Secret
4.0729
0.8000%
7,146
0.7146
% Total:
100.0000
Substance
Composition
CAS Number
Package Weight (mg):
Weight by
mg
% weight of
substance per
Homogeneous
569.9900
PPM
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to
report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material
information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-04270 Rev *S
Page 2 of 17
100L –TQFP (14 x 14 mm)
Pb-Free Package
B2: NiPdAu with Green Mold Compound
Material
Purpose of
Use
Leadframe
Base Material
Lead Finish
External Plating
Die Attach
Adhesive
Die
Wire
Circuit
Interconnect
Mold
Compound
Encapsulation
Cu
7440-50-8
140.7791
96.2000%
213,298
%Weight
of
Substance
per
package
21.3298
Si
7440-21-3
0.9512
0.6500%
1,441
0.1441
Mg
Ni
Ni
Pd
Au
Ag
Bismaleimide
Polymer
Methacrylate
Acylate ester
Organic Peroxide
Si
Au
SiO2
Phenol Resin
Epoxy Resin
7439-95-4
7440-02-0
7440-02-0
7440-05-3
7440-57-5
7440-22-4
Trade Secret
Trade Secret
Trade Secret
Trade Secret
Trade Secret
7440-21-3
7440-57-5
60676-86-0
Trade Secret
Trade Secret
0.2195
4.3902
3.5326
0.0637
0.0637
2.0320
0.2286
0.1270
0.0508
0.0508
0.0508
35.4700
5.0700
415.5677
23.3465
28.0158
0.1500%
3.0000%
96.5200%
1.7400%
1.7400%
80.0000%
9.0000%
5.0000%
2.0000%
2.0000%
2.0000%
100.0000%
100.0000%
89.0000%
5.0000%
6.0000%
333
6,652
5,352
96
96
3,079
346
192
77
77
77
53,742
7,682
629,638
35,373
42,448
0.0333
0.6652
0.5352
0.0096
0.0096
0.3079
0.0346
0.0192
0.0077
0.0077
0.0077
5.3742
0.7682
62.9638
3.5373
4.2448
% Total:
100.0000
Substance
Composition
CAS Number
Package Weight (mg):
Weight by
mg
% weight of
substance per
Homogeneous
660.0100
PPM
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to
report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material
information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-04270 Rev *S
Page 3 of 17
100L –TQFP (14 x 14 mm)
Pb-Free Package
B3: NiPdAu with Green Mold Compound using CuPd Bonding Wire
Material
Leadframe
Lead Finish
Die Attach
Purpose of
Use
Base Material
External Plating
Adhesive
Die
Circuit
Wire
Interconnect
Mold
Compound
Encapsulation
Weight by
mg
% weight of
substance per
Homogeneous
7440-50-8
187.7022
96.2000
291,011
%Weight of
Substance
per
package
29.1011
Substance
Composition
CAS Number
Cu
PPM
Si
7440-21-3
1.2683
0.6500
1,966
0.1966
Mg
7439-95-4
0.2927
0.1500
454
0.0454
Ni
7440-02-0
5.8535
3.0000
9,075
0.9075
Ni
7440-02-0
4.7134
96.5204
7,308
0.7308
Pd
7440-05-3
0.0848
1.7370
132
0.0132
Au
7440-57-5
0.0851
1.7427
132
0.0132
Ag
7440-22-4
1.1858
80.0000
1,839
0.1839
Trade Secret
0.1334
9.0000
207
0.0207
Trade Secret
0.0741
5.0000
115
0.0115
Trade Secret
0.0296
2.0000
46
0.0046
Acrylate ester
Trade Secret
0.0296
2.0000
46
0.0046
Organic Peroxide
Trade Secret
0.0296
2.0000
46
0.0046
Si
Cu
Pd
SiO2
Phenol Resin
Epoxy Resin
7440-21-3
7440-50-8
7440-05-3
60676-86-0
Trade Secret
Trade Secret
20.7523
6.3822
0.0645
370.5237
20.8159
24.9791
100.0000
99.0000
1.0000
89.0000
5.0000
6.0000
32,174
9,895
100
574,455
32,273
38,727
3.2174
0.9895
0.0100
57.4455
3.2273
3.8727
Package Weight (mg):
644.9998
Proprietary
bismaleimide
Proprietary
polymer
Methacrylate
% Total:
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to
report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material
information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-04270 Rev *S
Page 4 of 17
100.0000
100L –TQFP (14 x 14 mm)
Pb-Free Package
B4: Using Copper wire with NiPdAu and Kyocera Molding
Compound
Material
Purpose of
Use
Leadframe
Based
Material
Lead
Finish
External
Plating
Die Attach
Adhesive
Die
Wire
Circuit
Interconnect
Mold
Compound
Encapsulation
Substance
Composition
Cu
Si
Mg
Ni
Ni
Pd
Au
Ag
Bismaleimide
Polymer
Methacrylate
Acylate ester
Organic Peroxide
Si
Cu
SiO2
Phenol Resin
Epoxy Resin
Carbon Black
CAS Number
7440-50-8
7440-21-3
7439-95-4
7440-02-0
7440-02-0
7440-05-3
7440-57-5
7440-22-4
Trade Secret
Trade Secret
Trade Secret
Trade Secret
Trade Secret
7440-21-3
7440-50-8
60676-86-0
Trade Secret
Trade Secret
1333-86-4
Package Weight (mg):
Weight by
mg
142.5498
3.5122
0.1024
0.1756
3.5326
0.0637
0.0637
2.0320
0.2286
0.1270
0.0508
0.0508
0.0508
35.4700
2.3485
415.5677
23.3465
26.8485
1.1673
657.2885
% Weight of
Substance
per
Homogenous
Material
97.4100%
2.4000%
0.0700%
0.1200%
96.5200%
1.7400%
1.7400%
80.0000%
9.0000%
5.0000%
2.0000%
2.0000%
2.0000%
100.0000%
100.0000%
89.0000%
5.0000%
5.7500%
0.2500%
PPM
% Weight of
Substance
per
Package
216,876
5,343
156
267
5,375
97
97
3,091
348
193
77
77
77
53,964
3,573
632,247
35,519
40,847
1,776
21.6876%
0.5343%
0.0156%
0.0267%
0.5375%
0.0097%
0.0097%
0.3091%
0.0348%
0.0193%
0.0077%
0.0077%
0.0077%
5.3964%
0.3573%
63.2247%
3.5519%
4.0847%
0.1776%
% Total:
100.0000
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to
report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material
information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-04270 Rev *S
Page 5 of 17
100L –TQFP (14 x 14 mm)
Pb-Free Package
B5: NiPdAu-Ag termination finish with Green Mold
Compound
Material
Purpose of
Use
Leadframe
Base Material
Lead Finish
External Plating
Die Attach
Adhesive
Die
Wire
Circuit
Interconnect
Mold
Compound
Encapsulation
Substance
Composition
CAS Number
Cu
7440-50-8
Si
7440-21-3
Mg
Ni
Ni
Pd
Au-Ag
7439-95-4
7440-02-0
7440-02-0
7440-05-3
7440-57-5
7440-22-4
7440-22-4
Trade Secret
Trade Secret
Trade Secret
Trade Secret
Trade Secret
7440-21-3
7440-57-5
60676-86-0
Trade Secret
Trade Secret
Ag
Bismaleimide
Polymer
Methacrylate
Acylate ester
Organic Peroxide
Si
Au
SiO2
Phenol Resin
Epoxy Resin
Package Weight (mg):
Weight by
mg
% weight of
substance per
Homogeneous
187.7022
96.2000%
0.6500%
PPM
296,622
29.6622%
1.2683
0.2927
5.8535
4.7134
0.0848
0.1500%
3.0000%
96.5204%
1.7370%
2,004
463
9,250
7,448
134
0.2004%
0.0463%
0.9250%
0.7448%
0.0134%
0.0851
0.5686
0.0640
0.0355
0.0142
0.0142
0.0142
9.9508
7.4487
369.0739
20.7345
24.8814
1.7427%
80.0000%
9.0000%
5.0000%
2.0000%
2.0000%
2.0000%
100.0000%
100.0000%
89.0000%
5.0000%
6.0000%
134
899
101
56
22
22
22
15,725
11,771
583,239
32,766
39,320
0.0134%
0.0899%
0.0101%
0.0056%
0.0022%
0.0022%
0.0022%
1.5725%
1.1771%
58.3239%
3.2766%
3.9320%
% Total:
100.0000
632.8000
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to
report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material
information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-04270 Rev *S
%Weight
of
Substance
per
package
Page 6 of 17
100L –TQFP (14 x 14 mm)
Pb-Free Package
ASSEMBLY Site 2: Advanced Semiconductor Engineering Taiwan (ASET)
Package Qualification Report # 034101, 120201, 133306 (Note 1)
I. DECLARATION OF PACKAGED UNITS
A.
BANNED SUBSTANCES
Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU
RoHS. Listed in the table below are materials that are neither contained nor intentionally added to this
product.
Substances / Compounds
Cadmium and Cadmium Compounds
Hexavalent Chromium and its Compounds
Lead and Lead Compounds
Mercury and Mercury Compounds
Polybrominated Biphenyls (PBB)
Polybrominated Diphenylethers (PBDE)
Asbestos
Azo colorants
Ozone Depleting Substances
Polychlorinated Biphenyls (PCBs)
Polychlorinated Napthalenes
Radioactive Substances
Shortchain Chlorinated Paraffins
Tributyl Tin (TBT) and Triphenyl Tin (TPT)
Tributyl Tin Oxide (TBTO)
Formaldehyde
Weight by mg
PPM
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
0
0
0
0
0
0
0
0
0
0
Analysis Report
(Note 2)
CoA-AZ100ASET
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to
report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material
information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-04270 Rev *S
Page 7 of 17
100L –TQFP (14 x 14 mm)
Pb-Free Package
B. MATERIAL COMPOSITION (Note 3)
B1: Using Gold Wire
Material
Leadframe
Purpose of
Use
Base Material
Lead Finish
External Plating
Die Attach
Adhesive
Die
Wire
Mold
Compound
Circuit
Interconnect
Encapsulation
Cu
7440-50-8
123.5354
92.8000%
186,892
%Weight
of
Substance
per
package
18.6892%
Ni
7440-02-0
3.8339
2.8800%
5,800
0.5800%
Si
7440-21-3
0.8653
0.6500%
1,309
0.1309%
Mg
Ag
Pure Sn
Ag
Epoxy Resin
Copper
GammaButyrolactone
Aromatichydrocarbons
Si
Au
Epoxy Resin
Phenol Resin
SiO2
Aromatic
Phosphate
Others
7439-95-4
7440-22-4
7440-31-5
7440-22-4
Trade Secret
7440-50-8
96-48-0
0.1997
4.6858
20.9500
2.5802
0.7300
0.0700
0.0700
0.1500%
3.5200%
100.0000%
73.3000%
20.7400%
1.9900%
1.9900%
302
7,089
31,694
3,903
1,104
106
106
0.0302%
0.7089%
3.1694%
0.3903%
0.1104%
0.0106%
0.0106%
Trade Secret
0.0700
1.9900%
106
0.0106%
7440-21-3
7440-57-5
85954-11-6
26834-02-6
60676-86-0
139189-30-3
20.6900
4.4900
23.9115
19.0814
423.2336
7.2213
100.0000%
100.0000%
5.0000%
3.9900%
88.5000%
1.5100%
31,301
6,793
36,175
28,867
640,292
10,925
3.1301%
0.6793%
3.6175%
2.8867%
64.0292%
1.0925%
Trade Secret
4.7823
1.0000%
7,235
0.7235%
% Total:
100.0000
Substance
Composition
CAS Number
Package Weight (mg):
Weight by
mg
661.0004
% weight of
substance per
Homogeneous
PPM
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to
report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material
information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-04270 Rev *S
Page 8 of 17
100L –TQFP (14 x 14 mm)
Pb-Free Package
B2: Using Copper Wire
Material
Purpose of
Use
Leadframe
Base Material
Lead Finish
Die Attach
Die
Wire
Mold
Compound
External
Plating
Adhesive
Circuit
Interconnect
Encapsulation
Cu
7440-50-8
123.5400
92.8000%
187,579
%Weight
of
Substance
per
package
18.7579%
Ni
7440-02-0
3.8300
2.8800%
5,815
0.5815%
Si
7440-21-3
0.8600
0.6500%
1,306
0.1306%
Mg
Ag
7439-95-4
7440-22-4
0.2000
4.6900
0.1500%
3.5200%
304
7,121
0.0304%
0.7121%
Sn
7440-31-5
20.9500
100.0000%
31,810
3.1810%
7440-22-4
9003-36-5
Trade Secret
Trade Secret
Trade Secret
2.6048
0.1408
0.2112
0.1408
0.2112
74.0000%
4.0000%
6.0000%
4.0000%
6.0000%
3,955
214
321
214
321
0.3955%
0.0214%
0.0321%
0.0214%
0.0321%
Trade Secret
0.1760
5.0000%
267
0.0267%
461-58-5
0.0176
0.5000%
27
0.0027%
Trade Secret
0.0176
0.5000%
27
0.0027%
7440-21-3
7440-50-8
Trade Secret
20.6900
2.0938
23.9115
100.0000%
100.0000%
5.0000%
31,415
3,179
36,306
3.1415%
0.3179%
3.6306%
29690-82-2
23.9115
5.0000%
36,306
3.6306%
Trade Secret
Trade Secret
1333-86-4
60676-86-0
7631-86-9
14808-60-7
23.9115
23.9115
1.4347
331.8916
47.8230
1.4347
5.0000%
5.0000%
0.3000%
69.4000%
10.0000%
0.3000%
36,306
36,306
2,178
503,932
72,613
2,178
3.6306%
3.6306%
0.2178%
50.3932%
7.2613%
0.2178%
% Total:
100.0000
Substance
Composition
Ag
Epoxy resin A
Epoxy resin B
Diluent A
Diluent B
Phenolic
Hardener
Dicyandiamide
Organic
peroxide
Si
Copper
Epoxy resin A
Epoxy,Cresol
Novolac
Phenol resin
Metal Hydroxide
Carbon Black
Silica Fused A
Silica Fused B
Silica,crystalline
CAS Number
Package Weight (mg):
Weight by
mg
658.6038
% weight of
substance per
Homogeneous
PPM
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to
report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material
information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-04270 Rev *S
Page 9 of 17
100L –TQFP (14 x 14 mm)
Pb-Free Package
B3: Using Copper Palladium Wire
Material
Purpose of
Use
Leadframe
External
Plating
Copper
Nickel
Silicon
Magnesium
7440-50-8
7440-02-0
7440-21-3
7439-95-4
138.8166
4.3290
0.9379
0.2164
96.2000%
3.0000%
0.6500%
0.1500%
External
Plating
Matte Sn
Tin
7440-31-5
20.8000
100.0000%
Trade Secret
0.1416
12.5000%
Trade Secret
0.1416
12.5000%
68611-44-9
0.0590
5.0000%
Trade Secret
0.8378
70.0000%
7440-21-3
7440-50-8
7440-05-3
Trade secret
Trade secret
Trade secret
1333-86-4
60676-86-0
12.6700
2.2096
0.0004
21.9420
14.6280
32.1816
2.4380
416.4104
100.0000%
99.9800%
0.0200%
3.0000%
3.0000%
5.0000%
0.3000%
88.7000%
Die Attach
Adhesive
Die
Silicon
Wire
Interconnect
Mold
Compound
Encapsulation
Substance
Composition
Novolak Epoxy
Resin
Phenol Resin
Amorphous
Silica
Acrylic
Copolymer
Silicon
Copper
Palladium
Epoxy Resin-A
Epoxy Resin-B
Phenol Resin
Carbon Black
Silica (SiO2)
CAS Number
Package Weight (mg):
Weight by
mg
% weight of
substance per
Homogeneous
668.7599
207,573
6,473
1,402
324
%Weight
of
Substance
per
package
20.7573%
0.6473%
0.1402%
0.0324%
31,102
3.1102%
212
212
0.0212%
0.0212%
88
0.0088%
1,253
18,946
3,304
1
32,810
21,873
48,121
3,646
622,661
0.1253%
1.8946%
0.3304%
0.0001%
3.2810%
2.1873%
4.8121%
0.3646%
62.2661%
% Total:
100.0000
PPM
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to
report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material
information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-04270 Rev *S
Page 10 of 17
100L –TQFP (14 x 14 mm)
Pb-Free Package
II. DECLARATION OF PACKAGING INDIRECT
MATERIALS
Type
Tape & Reel
Tray
Others
Material
Cover tape
Carrier tape
Plastic Reel
Tray
Shielding bag
Moisture Barrier
bag
Protective Band
Shipping and
Inner Box
Dessicant
Bubble Pack
Lead
PPM
Cadmium
PPM
Cr VI
PPM
Mercury
PPM
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
< 10.0
< 2.0
< 4.0
< 10.0
< 2.0
< 2.0
< 2.0
Analysis
Report
(Note2)
CoA-COVT-R
CoA-CART-R
CoA-PLRL-R
PBB
PPM
PBDE
PPM
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
<5.0
<5.0
<5.0
--------<5.0
<5.0
<5.0
<5.0
<5.0
--------<5.0
<5.0
< 2.0
< 4.0
< 2.0
< 5.0
<5.0
---------
<5.0
-----------
CoA-PROB-R
CoA-ABOX-R
< 2.0
< 2.0
< 1.0
< 2.0
< 3.0
< 100.0
< 3.0
< 90.0
CoA-DESS-R
CoA-BUBP-R
CoA-TRAY-R
CoA-SBAG –R
CoA-MBBG-R
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to
report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material
information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-04270 Rev *S
Page 11 of 17
100L –TQFP (14 x 14 mm)
Pb-Free Package
ASSEMBLY Site 3: Jiangsu Changjiang
Electronics Technology (JCET)
Package Qualification Report # 110909, 111817, 141302 , 124804 (See Note 1)
I. DECLARATION OF PACKAGED UNITS
A. BANNED SUBSTANCES
Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU
RoHS. Listed in the table below are materials that are neither contained nor intentionally added to this
product.
Substances / Compounds
Cadmium and Cadmium Compounds
Hexavalent Chromium and its Compounds
Lead and Lead Compounds
Mercury and Mercury Compounds
Polybrominated Biphenyls (PBB)
Polybrominated Diphenylethers (PBDE)
Asbestos
Azo colorants
Ozone Depleting Substances
Polychlorinated Biphenyls (PCBs)
Polychlorinated Napthalenes
Radioactive Substances
Shortchain Chlorinated Paraffins
Tributyl Tin (TBT) and Triphenyl Tin (TPT)
Tributyl Tin Oxide (TBTO)
Formaldehyde
Weight by mg
PPM
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
0
0
0
0
0
0
0
0
0
0
Analysis Report
(Note 2)
CoA-AZ100JCET
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to
report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material
information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-04270 Rev *S
Page 12 of 17
100L –TQFP (14 x 14 mm)
Pb-Free Package
B. MATERIAL COMPOSITION (Note 3)
B1.USING GOLD WIRE
Material
Purpose of
Use
Leadframe
Base Material
Lead Finish
External Plating
Die Attach
Adhesive
Die
Wire
Circuit
Interconnect
Mold
Compound
Encapsulation
Cu
7440-50-8
140.7791
96.2000%
213,298
%Weight
of
Substance
per
package
21.3298
Si
7440-21-3
0.9512
0.6500%
1,441
0.1441
Mg
Ni
Ni
Pd
Au
Ag
Bismaleimide
Polymer
Methacrylate
Acylate ester
Organic Peroxide
Si
Au
SiO2
Phenol Resin
Epoxy Resin
7439-95-4
7440-02-0
7440-02-0
7440-05-3
7440-57-5
7440-22-4
Trade Secret
Trade Secret
Trade Secret
Trade Secret
Trade Secret
7440-21-3
7440-57-5
60676-86-0
Trade Secret
Trade Secret
0.2195
4.3902
3.5326
0.0637
0.0637
2.0320
0.2286
0.1270
0.0508
0.0508
0.0508
35.4700
5.0700
415.5677
23.3465
28.0158
0.1500%
3.0000%
96.5200%
1.7400%
1.7400%
80.0000%
9.0000%
5.0000%
2.0000%
2.0000%
2.0000%
100.0000%
100.0000%
89.0000%
5.0000%
6.0000%
333
6,652
5,352
96
96
3,079
346
192
77
77
77
53,742
7,682
629,638
35,373
42,448
0.0333
0.6652
0.5352
0.0096
0.0096
0.3079
0.0346
0.0192
0.0077
0.0077
0.0077
5.3742
0.7682
62.9638
3.5373
4.2448
% Total:
100.0000
Substance
Composition
CAS Number
Package Weight (mg):
Weight by
mg
% weight of
substance per
Homogeneous
660.0100
PPM
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to
report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material
information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-04270 Rev *S
Page 13 of 17
100L –TQFP (14 x 14 mm)
Pb-Free Package
B2.USING COPPER PALLADIUM WIRE
Material
Purpose of
Use
Leadframe
Base Material
Lead Finish
External Plating
Die Attach
Adhesive
Die
Circuit
Wire
Interconnect
Mold
Compound
Encapsulation
Substance
Composition
Nickel
Silicon
Magnesium
Silver
Copper
Tin
Silver
Proprietary
Bismaleimide
Proprietary Polymer
Methacrylate
Acrylate Ester
Organic Peroxide
Silicon
Copper
Palladium
Epoxy Resin A
Epoxy Resin B
Phenol Resin
Silica(Amorphous)
Carbon Black
CAS Number
7440-02-0
7440-21-3
7439-95-4
7440-22-4
7440-50-8
7440-31-5
7440-22-4
Weight by
mg
2.7060
0.5535
0.1845
2.8290
116.7270
20.8500
2.0320
Trade Secret
0.2286
Trade Secret
Trade Secret
Trade Secret
Trade Secret
7440-21-3
7440-50-8
7440-05-3
Trade Secret
Trade Secret
Trade Secret
0.1270
0.0508
0.0508
0.0508
35.4700
2.1715
0.0384
14.0100
14.0100
23.3500
60676-86-0
1333-86-4
Package Weight (mg):
414.2290
1.4010
651.0699
% weight of
substance
per
Homogeneo
us
2.2000%
0.4500%
0.1500%
2.3000%
94.9000%
100.0000%
80.0000%
9.0000%
5.0000%
2.0000%
2.0000%
2.0000%
100.0000%
98.2600%
1.7400%
3.0000%
3.0000%
5.0000%
88.7000%
0.3000%
4,156
850
283
4,345
179,285
32,024
3,121
%% Weight
of
Substance
per
package
0.4156%
0.0850%
0.0283%
0.4345%
17.9285%
3.2024%
0.3121%
351
0.0351%
195
78
78
78
54,480
3,335
59
21,518
21,518
35,864
0.0195%
0.0078%
0.0078%
0.0078%
5.4480%
0.3335%
0.0059%
2.1518%
2.1518%
3.5864%
636,228
63.6228%
2,152
0.2152%
% Total:
100.0000
PPM
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to
report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material
information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-04270 Rev *S
Page 14 of 17
100L –TQFP (14 x 14 mm)
Pb-Free Package
II. DECLARATION OF PACKAGING INDIRECT
MATERIALS
Type
Tape & Reel
Tray
Others
Material
Cover tape
Carrier tape
Plastic Reel
Tray
Shielding bag
Moisture Barrier
bag
Protective Band
Shipping and
Inner Box
Dessicant
Bubble Pack
Lead
PPM
Cadmium
PPM
Cr VI
PPM
Mercury
PPM
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
< 10.0
< 2.0
< 4.0
< 10.0
< 2.0
< 2.0
< 2.0
Analysis
Report
(Note2)
CoA-COVT-R
CoA-CART-R
CoA-PLRL-R
PBB
PPM
PBDE
PPM
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
<5.0
<5.0
<5.0
--------<5.0
<5.0
<5.0
<5.0
<5.0
--------<5.0
<5.0
< 2.0
< 4.0
< 2.0
< 5.0
<5.0
---------
<5.0
-----------
CoA-PROB-R
CoA-ABOX-R
< 2.0
< 2.0
< 1.0
< 2.0
< 3.0
< 100.0
< 3.0
< 90.0
CoA-DESS-R
CoA-BUBP-R
CoA-TRAY-R
CoA-SBAG –R
CoA-MBBG-R
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to
report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material
information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-04270 Rev *S
Page 15 of 17
100L –TQFP (14 x 14 mm)
Pb-Free Package
Document History Page
Document Title:
DATASHEET
Document Number:
Rev.
100L - TQFP (14 X 14 MM) PB-FREE PACKAGE MATERIAL DECLARATION
001-04270
**
*A
ECN No. Orig. of
Change
390185
GFJ
391439
GFJ
*B
1318604 MRB
*C
1521844 MRB
*D
2567367 HLR
*E
2737814 MAHA
*F
3040395
HLR
*G
*H
3219033
3340834
REYD
CMG
*I
3400881
CMG
*J
3645691
COPI
*K
3767019
HLR
Description of Change
New document
Added compliance to Directive 2002/95/EC (RoHS)
requirement in the summary. Changed the material
composition of Assembly Site 1 and in Assembly Site 2. Added
CoA references of indirect materials used in Assembly Site 2.
Added reference QTP for Automotive part on Assembly site 1.
1. Updated Cypress Logo
2. Added on the material composition the percent weight
per homogeneous material and weight of substance
3. Updated and added Lead, Cr+VI, PBB and PBDE on the
Declaration of Packaging/Indirect Materials.
4. Added note 4: the package were based on
Engineering calculation and performed on a package
family basis.
5. Deleted Declaration of Packaging/Indirect Materials on
Assembly site 1.
Added CAS number of Antimony Trioxide and Silver.
DCon: Replaced from CML to WEB in the distribution list.
Added the following for assembly site 1:
1. Package weight for B2
2. Reference QTP # 062603
3. Table B2: NiPdAu with Green Mold Compound
Changed the composition of Leadrame on Assemby Site1
(B1).
Added Assembly Site 3 – JCET
Added QTP# 111817 on Assembly Site 3 – JCET
Revised Summary statement – changed package is qualified
from “at two assembly sites” to “at three assembly sites”
Added QTP# 112302 on Assembly Site 1
Added PMDD B2 for assembly site 2 – ASE Taiwan Copper
wire qualification under QTP # 120201.
Updated the material compositions of Assembly Site 1, Site
2.B1 and Site 3 to reflect 4 decimal places on values.
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to
report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material
information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-04270 Rev *S
Page 16 of 17
100L –TQFP (14 x 14 mm)
Pb-Free Package
Rev.
*L
ECN No. Orig. of
Change
4031297 YUM
*M
4122589
JVP
*N
3932683
UDR
*O
4307613
HLR
*P
4404959
REYD
*Q
4726106
FZD
Added Assembly site name in the Assembly heading.
Changed Assembly code to Assembly Site Name.
Removed entire Tube row in the Indirect Materials Section.
Added package weight in Assembly Site 1 (B3) and Assembly
Site 2 (B3)
Added Section B3 for NiPdAu with Green Mold Compound
using CuPd Bonding Wire for Assembly Site 1, CML ,
QTP#133307
Added Section B3 for CuPd Bonding Wire for Assembly Site 2,
ASE-K, QTP#133306
Added Section B4 for Copper Wire using NiPdAu and Kyocera
Mold Compound for Assembly Site 1, CML , QTP#125105
Added B5 material composition for Assembly Site 1 in
reference to Automotive qualification for NiPdAu-Ag
termination finish (Reference QTP No. 134503).
Added B2 on Package Weight and QTP # 141302 under Site
3.
Added subsections B1.USING GOLD WIRE and B2.USING
COPPER PALLADIUM WIRE under Assembly Site 3.
Added QTP# 124804 in Assembly Site 3.
*R
5004863
HLR
Changed the substances with “-------------“to “Trade Secret”.
DCON
Removed distribution and posting in the document history
page.
Added QTP 152607 in assembly site 1.
*S
5181469
JSO
Description of Change
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to
report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material
information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-04270 Rev *S
Page 17 of 17