Features • Single Chip All-in-one Design • • • • • – MIDI Control Processor, Serial and Parallel Interface – Synthesis, General MIDI Wavetable Implementation – General MIDI Compatible Effects: Reverb + Chorus – Spatial Effect – 4-band Stereo Equalizer – Stereo DAC. DR: 86 dB min, THD+N: -80 dB max State of the art Synthesis for Products Providing Best Quality for Price – 64-voice Polyphony (without effects) – 38-voice Polyphony + Effects – On-chip CleanWave™ Wavetable Data, Firmware, RAM Delay Lines Audio Stereo Line Output Typical Applications: Battery Operated Musical Keyboards, Portable Phones, Karaokes QFN44 (7mm x 7mm) Package: Small Footprint, Small Pin Count Low Power – 75 mW typ. Operating – Single 3.3V or Single 1.8V Power Supply – Built-in Power Switch and 3.3V to 1.8V Regulator 1. Typical Hardware Configuration Figure 1-1. Audio Processing ATSAM2195 Low-power Single Chip Synthesizer with Effects Typical Hardware Configuration MIDI In ATSAM2195 Parallel MIDI Audio OUT 6308A–DRMSD–10-May-07 2. Pin Description 2.1 Pins By Function – 44-lead QFN Package Table 2-1. Power Supply Group Pin Name Pin # Type Function GND 20, 31, 33 PWR DIGITAL GROUND All pins should be connected to a ground plane PWR DIGITAL GROUND Ground supply; down bonded to the exposed die pad (heatsink). It is recommended, but not obligatory, to connect this pad to a ground plane during PCB layout PWR I/O POWER SUPPLY This pin should be connected to a nominal 3.3V power for 3.3V single supply applications. This pin should be connected to a nominal 1.8V power for 1.8V single supply applications GND VD33 exposed die pad 21 VD18 19, 30 PWR CORE POWER SUPPLY These pins should be connected to nominal 1.8V. 3.3V single supply application: If the built-in regulator is used, then these pins should be connected to the output of the regulator OUTVC18 (pin 35). 1.8V single supply application: If the built-in power switch is used for minimum power down consumption, then all these pins should be connected to the output of the power switch PWROUT (pin 39). AGND 43, 44 PWR ANALOG GROUND These pins should be connected to an analog ground plane PWR DAC PERIPHERY ANALOG SUPPLY 3.3V single supply application: This pin should be connected to a nominal 3.3V power through a serial inductor filter (better result) or a 10 ohm resistor. 1.8V single supply application: This pin should be connected to a nominal 1.8V power through a serial inductor filter (better result) or a 10 ohm resistor. PWR DAC 1.8V ANALOG SUPPLY This pin should be connected to a clean 1.8V. 3.3V single supply application: If the built-in regulator is used, then this pin should be connected to the output of the regulator OUTVC18 (pin 35) through a serial inductor filter (better result) or a 10 ohm resistor. 1.8V single supply application: If the built-in power switch is used, then this pin should be connected to the output of the power switch PWROUT (pin 39) through a serial inductor filter (better result) or a 10 ohm resistor. PWR Regulator input This pin should be connected to a nominal 3.3V power for 3.3V single supply applications. This pin should be grounded for 1.8V single supply applications PWR Power switch input. This pin should be left not connected for 3.3V single supply applications. This pin should connected to a 1.8V nominal power for 1.8V single supply applications VA33 VA18 REGIN PWRIN 2 4 2 34 38 ATSAM2195 6308A–DRMSD–10-May-07 ATSAM2195 Table 2-2. Serial MIDI, parallel MIDI (MPU-401) Pin Name Pin # Type Function MIDI IN 10 IN Serial TTL MIDI IN. Connected to the built-in synthesizer at power-up or after MPU reset. Connected to the D0-D7 bus (read mode) when MPU switched to UART mode. This pin should be tied HIGH if not used. D0-D7 15, 16, 17, 18, 22, 23, 24, 25 I/O 8 bit bi-directional bus, under control of CS, RD, WR. These pins have a built-in pull down. They should be left unconnected if not used A0 11 IN Select data(0) or control(1) for write, data(0) or status(1) for read. This pin has a built-in pull-down. It should be left unconnected if not used. CS 12 IN Chip select, active low. This pin has a built-in pull up. It should be left unconnected if not used. RD 13 IN Read, active low. When CS and RD are low, data(A0=0) or status(A0=1) is read on D0-D7. Read data is acknowledged on the rising edge of RD. This pin has a built-in pull up. It should be left unconnected if not used. WR 14 IN Write, active low. When CS and WR are low, data (A0=0) or control (A0=1) is written from the D0-D7 bus to the ATSAM2195 on the rising edge of WR. This pin has a built-in pull up. It should be left unconnected if not used. IRQ 26 OUT A rising edge indicates that a MIDI byte is available for read on D0-D7. Acknowledged by reading the byte. Table 2-3. Analog audio group Pin Name Pin # Type Function AGNDREF 42 IN These pin is used as a reference by the internal DAC. It should be connected to a clean analog ground plane VREF 41 OUT Reference voltage. Generated on-chip. Should be stabilized by external capacitors 10 µF // 100 nF to AGND. VCM 40 OUT On-chip output stage common-mode voltage. Should be stabilized by external capacitors 10 µF // 100 nF to AGND. VBG 3 OUT Bandgap voltage. Can be stabilized by capacitors 1µF // 100 nF to AGND. Can be left unconnected for low-cost application. AOUTL 1 OUT Left channel audio output AOUTR 5 OUT Right channel audio output Type Function Table 2-4. Digital audio group Pin Name Pin # OUTLEV 6 IN Selects the full scale output level for AOUTL and AOUTR. OUTLEV = 0 for 1.1Vpp OUTLEV = 1 for 2.2Vpp If 1.8V single supply (VA33 = 1.8V), OUTLEV should be tied to 0. DITH0-DITH1 7, 8 IN Activate a dither signal to reduce eventual noise tones at the output. See Dither Modes Description. 3 6308A–DRMSD–10-May-07 Table 2-5. Miscellaneous group Pin Name Pin # Type Function X1-X2 29, 28 - 9.6 MHz crystal connection. An external 9.6 MHz clock can also be used on X1 (1.95Vpp max through 47 pF capacitor). X2 cannot be used to drive external circuits. RESET 9 IN Reset input, active low. This is a Schmitt trigger input, allowing direct connection to an RC network OUTVC18 35 PWR 3.3V to 1.8 V regulator output. When 3.3V single supply application this pin can be used to power VD18 pins, and VA18 pin through a serial inductor filter (better result) or a 10 ohm resistor. Decoupling capacitors 470 pF in parallel with 2.2 or 4.7 µF must be connected between OUTVC18 and GND. PWROUT 39 PWR Power switch output. When 1.8V single supply application this pin can be used to power VD18 pins, and VA18 pin through a serial inductor filter (better result) or a 10 ohm resistor. PDWN 37 IN Power down, active low. When power down is active, all digital outputs are set to logic level 0, D0-D7 bus is set in high Z, analog outputs decrease to 0V, the PLL and crystal oscillator are stopped. 3.3V single supply application: If the built-in regulator is used then 1.8V supply is removed from the core. To exit from power down, PDWN must be set to VD33, then RESET applied. When unused this pin must be connected to VD33. 1.8V single supply application: If the built-in power switch is used then 1.8V supply is removed from the core. To exit from power down, PDWN must be set to VD18, then RESET applied. When unused this pin must be connected to VD18 TEST0-TEST1TEST2 36, 27, 32 IN Test pins. Should be grounded 4 ATSAM2195 6308A–DRMSD–10-May-07 ATSAM2195 2.2 Pinout By Pin Number - 44-lead QFN Package Table 2-6. Pinout Pin# Pin Name Pin# Pin Name Pin# Pin Name Pin# Pin Name 1 AOUTL 12 CS 23 D5 34 REGIN 2 VA18 13 RD 24 D6 35 OUTVC18 3 VBG 14 WR 25 D7 36 TEST0 4 VA33 15 D0 26 IRQ 37 PDWN 5 AOUTR 16 D1 27 TEST1 38 PWRIN 6 OUTLEV 17 D2 28 X2 39 PWROUT 7 DITH0 18 D3 29 X1 40 VCM 8 DITH1 19 VD18 30 VD18 41 VREF 9 RESET 20 GND 31 GND 42 AGNDREF 10 MIDI IN 21 VD33 32 TEST2 43 AGND 11 A0 22 D4 33 GND 44 AGND 5 6308A–DRMSD–10-May-07 3. Mechanical Dimensions – 44-lead QFN Package Notes: 1. All package dimensions are in mm. 2. R-QFN044_D - QFN 6 ATSAM2195 6308A–DRMSD–10-May-07 ATSAM2195 4. Marking FRANCE SAM2195 YYWW 58A60B XXXXXXXXX Pin 1 7 6308A–DRMSD–10-May-07 5. Absolute Maximum Ratings All voltages with respect to 0V, GND=0V. Table 5-1. Absolute Maximum Ratings* Temperature under bias.......................... -55° C to +125° C Storage Temperature ............................... -65°C to +150°C Voltage on any Input Pins except X1......................................... -0.3V to +VD33+0.3V Voltage on X1 .................................... -0.3V to VD18+0.3V *NOTICE: Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or other conditions beyond those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Supply voltage (I/O) (VD33)........................ -0.3V to +3.6V Supply voltage (core) (VD18) ................... -0.3V to +1.95V Supply voltage (DAC analog 3.3V) (VA33)......................................................... -0.3V to +3.6V Supply voltage (DAC analog 1.8V) (VA18)....................................................... -0.3V to +1.95V Maximum IOL per I/O pin........................................... 4 mA Maximun IOH per I/O pin ........................................... 4 mA Maximum Output current from PWROUT pin (max duration = 1sec) (IPWRO) ............................ 650 mA Maximum Output current from OUTVC18 pin (max duration = 1sec) (IREGO) ............................. 100 mA 8 ATSAM2195 6308A–DRMSD–10-May-07 ATSAM2195 Table 5-2. Recommended Operating Conditions Parameter Symbol Min Typ Max Unit Digital supply voltage: - OUTLEV = 1 - OUTLEV = 0 VD33 VD33 3 1.65 3.3 1.8 3.6 1.95 V V Digital supply voltage VD18 1.65 1.8 1.95 V Analog supply voltage: - OUTLEV = 1 - OUTLEV = 0 VA33 VA33 3 1.65 3.3 1.8 3.6 1.95 V V Analog supply voltage VA18 1.65 1.8 1.95 V Power switch supply PWRIN 1.75 1.80 1.95 V Regulator supply REGIN 2.7 3.3 3.6 V Power Switch output current IPWRO - - 217 mA OUTVC18 output current IREGO - 60 - mA Operating ambient temperature tA 0 - +70 °C Table 5-3. Digital Characteristics (TA=25°C, VD33=3.3V±10%, 1.65 V< VD18 < 1.95V) Parameter Symbol Min Typ Max Unit Low level input voltage (Except X1) VIL -0.3 - 0.8 V High level input voltage (Except X1) VIH 2 - 3.6 V Low level input voltage for X1 VIL -0.3 - 0.3 V High level input voltage for X1 VIH 1.2 - VD18+0.3 V Low level output voltage IOL=-2mA VOL - - 0.4 V High level output voltage IOH=2mA VOH VD33-0.4 - - V Power consumption (crystal freq.=9.6MHz) - - 75 mW Power down supply current (using power switch) - <1 µA Drop down from PWRIN to PWROUT (at IPWRO = 180mA) - Voltage on OUTVC18 (at IREGO = 60mA) VREGO 1.65 1.8 0.1 V 1.95 V 9 6308A–DRMSD–10-May-07 Table 5-4. Analog Characteristics (TA=25°C) Parameter Symbol Min Typ Max Unit Total Harmonic Distortion + Noise (at 0 dB, full scale) VA33 = 3.3V, OUTLEV = 1 VA33 = 1.8V, OUTLEV = 0 THD + N THD + N - - -80 -76 dB dB Dynamic Range (A-Weighted) VA33 = 3.3V, OUTLEV = 1 VA33 = 1.8V, OUTLEV = 0 DR DR 86 80 - - dB dB - 83 80 - - Inter-channel gain mismatch - -0.1 - +01 dB Gain drift - - ± 100 - ppm/ °C Full-scale output voltage VA33 = 3.3V, OUTLEV = 1 VA33 = 1.8V or 3.3V, OUTLEV = 0 - 2.04 1.02 2.2 1.1 2.36 1.18 Vpp Vpp VCM Maximum allowable DC current source - - - 0.1 mA VCM Nominal voltage VA33 = 3.3V, OUTLEV = 1 VA33 = 1.8V or 3.3V, OUTLEV = 0 - 1.38 0.74 1.5 0.80 1.58 0.84 V V AC-Load resistance RL 3 4.7 Load capacitance CL - 10 100 pF Parameter Symbol Min Typ Max Unit Frequency response (10Hz – 17kHz) - -0.05 - +0.05 dB Passband to -0.1dB corner to -6 dB corner PB PB 0 0 - 17 18.74 kHz kHz Stopband SB Stopband attenuation (20.49kHz – 112.5kHz) SA Group delay GD Gain drift - Inter-channel isolation (1kHz) VA33 = 3.3V, OUTLEV = 1 VA33 = 1.8V, OUTLEV = 0 Table 5-5. 10 dB kΩ Filter Characteristics (TA=25°C) 20.49 65 - kHz - 1.12 - ± 100 dB ms - ppm/ °C ATSAM2195 6308A–DRMSD–10-May-07 ATSAM2195 6. Timings 6.1 Slave 8-bit Parallel Interface This interface is typically used to connect the chip to an host processor. Figure 6-1. 8-bit Parallel Interface Read Cycle A0 tAVCS CS tCSLRDL tPRD tRDHCSH RD tRDLDV tDRH D0 - D7 IRQ Figure 6-2. 8-bit Parallel Interface Write Cycle tWRCYC A0 tAVCS CS tCSLWRL tPWR tWRHCSH WR tDWS tDWH D0 - D7 Table 6-1. Timings Parameter Symbol Min Typ Max Unit Address valid to chip select low tAVCS 0 - - ns Chip select low to RD low tCSLRDL 5 - - ns RD high to CS high tRDHCSH 5 - - ns RD pulse width tPRD 50 - - ns Data out valid from RD tRDLDV - - 20 ns Data out hold from RD tDRH 5 - 10 ns 11 6308A–DRMSD–10-May-07 Table 6-1. Timings Chip select low to WR low tCSLRWRL 5 - - ns WR high to CS high tWRHCSH 5 - - ns WR pulse width tPWR 50 - - ns Write data setup time tDWS 10 - - ns Write data hold time tDWH 0 - - ns Write cycle tWRCYC 3.5 Notes: µs 1. When data is pending on parallel port, the host should read it within 1 ms. If not, the parallel port is deactivated. Reactivating the port can be done with the following control sequence: 0FFh (Closed port), 03FFh (Open port). 2. For safe operation, write cycle time should not be lower than 3.5 µs. 12 ATSAM2195 6308A–DRMSD–10-May-07 ATSAM2195 7. Reset and Power Down During power-up, the RESET input should be held low until the crystal oscillator and PLL are stabilized, which can take about 20 ms. A typical RC/diode power-up network can be used. After RESET, the ATSAM2195 enters an initialization routine. It takes around 50 ms before a MIDI IN or MPU message can be processed. Audio begins after 500 ms, maximum. To enter power-down, Reset should be held low 500 ms min and then PDWN asserted low. In Power-down mode, the crystal oscillator and PLL are stopped. The chip enters a deep power down sleep mode. To exit power down, PDWN has to be asserted high, then RESET applied. 7.1 3.3V Single Supply Application Power down mode is managed by the internal regulator. The equivalent schematic and standard connection is shown on the diagram below. ATSAM2195 13 6308A–DRMSD–10-May-07 7.2 1.8V Single Supply Application Power down mode is managed by the internal power switch. The equivalent schematic and standard connection is shown on the diagram below. ATSAM2195 14 ATSAM2195 6308A–DRMSD–10-May-07 ATSAM2195 8. Dither Modes Description (Dithering Signal Programmability) Dithering is used to attenuate the so-called idle tones caused by correlation between DAC input signal and truncation noise. This correlation manifests as spurious signals in the audio band and hence can be perceived by the user. The addition of a random digital signal to the truncator input in the digital modulator has been proven to be very effective to reduce the presence of idle tones. However, this is actually a noisy signal so that its power must be traded-off with the required dynamic range. For better control, the ATSAM2195 allows programmability of the dithering signal power as shown below. dith[1:0] Mode description Comments 00 No dither 01 Dither signal power = -30dBFS Minimum recommended dither. 10 Dither signal power = -27dBFS Typical value 11 Dither signal power = -24dBFS Maximum recommended value. Above it dither noise may become dominant. 15 6308A–DRMSD–10-May-07 9. System Design The schematics of this section are the reference designs for applications with ATSAM2195. The conformity with these schematics ensures the best performance. 9.1 3.3V Single Supply Application ATSAM2195 16 ATSAM2195 6308A–DRMSD–10-May-07 ATSAM2195 9.2 1.8V Single Supply Application ATSAM2195 17 6308A–DRMSD–10-May-07 10. Recommended Board Layout Like all HCMOS high integration ICs, following simple rules of board layout is mandatory for reliable operations: • GND, VD33, VD18, VA33, VA18 distribution and decoupling All GND, VD33, VD18, VA33, VA18 pins should be connected. A GND plane is strongly recommended below the ATSAM2195. The board GND, VD33, VD18 distribution should be in grid form. Recommended decoupling is 0.1 µF at each VD33, VD18, VA33, VA18 pin of the IC with an additional 1µF-T between pins 30 and 31. Decoupling capacitors should be implemented close to the IC. • Crystal The paths between the crystal and the ATSAM2195 should be short and shielded. The ground return from the crystal compensation capacitors should be pin 31. • Analog section A specific AGND ground plane should be provided, which connects by a single trace to the GND ground. No digital signals should cross the AGND plane. 18 ATSAM2195 6308A–DRMSD–10-May-07 Headquarters Operations Atmel Corporation Memory 2325 Orchard Parkway San Jose, CA 95131, USA Tel: 1(408) 441-0311 Fax: 1(408) 487-2600 2325 Orchard Parkway San Jose, CA 95131, USA Tel: 1(408) 441-0311 Fax: 1(408) 436-4314 RF/Automotive Theresienstrasse 2 Postfach 3535 74025 Heilbronn, Germany Tel: (49) 71-31-67-0 Fax: (49) 71-31-67-2340 Microcontrollers International Atmel Asia Room 1219 Chinachem Golden Plaza 77 Mody Road Tsimshatsui East Kowloon Hong Kong Tel: (852) 2721-9778 Fax: (852) 2722-1369 Atmel Europe Le Krebs 8, rue Jean-Pierre Timbaud BP 309 78054 Saint-Quentin-en-Yvelines Cedex France Tel: (33) 1-30-60-70-00 Fax: (33) 1-30-60-71-11 Atmel Japan 9F, Tonetsu Shinkawa Bldg. 1-24-8 Shinkawa Chuo-ku, Tokyo 104-0033 Japan Tel: (81) 3-3523-3551 Fax: (81) 3-3523-7581 2325 Orchard Parkway San Jose, CA 95131, USA Tel: 1(408) 441-0311 Fax: 1(408) 436-4314 La Chantrerie BP 70602 44306 Nantes Cedex 3, France Tel: (33) 2-40-18-18-18 Fax: (33) 2-40-18-19-60 1150 East Cheyenne Mtn. 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