ATMEL ATA6623-TAQY

Features
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
Supply Voltage up to 40V
Operating Voltage VS = 5V to 27V
Typically 10 µA Supply Current During Sleep Mode
Typically 57 µA Supply Current in Silent Mode
Linear Low-drop Voltage Regulator:
– Normal, Fail-safe, and Silent Mode
– ATA6623: VCC = 3.3V ±2%
– ATA6625: VCC = 5.0V ±2%
– Sleep Mode: VCC is Switched Off
VCC Undervoltage Detection with Reset Open Drain Output NRES (4 ms Reset Time)
Voltage Regulator is Short-circuit and Over-temperature Protected
LIN Physical Layer According to LIN Specification Revision 2.0 and SAEJ2602-2
Wake-up Capability via LIN Bus (90 µs Dominant)
TXD Time-out Timer
Bus Pin is Overtemperature and Short-circuit Protected versus GND and Battery
Advanced EMC and ESD Performance
ESD HBM 8 kV at Pins LIN and VS Following STM5.1
Interference and Damage Protection According to ISO/CD7637
Package: SO8
1. Description
LIN Bus
Transceiver
with Integrated
Voltage
Regulator
ATA6623
ATA6625
ATA6623/ATA6625 is a fully integrated LIN transceiver, designed according to the LIN
specification 2.0, with a low-drop voltage regulator (3.3V/5V/50 mA). The combination
of voltage regulator and bus transceiver makes it possible to develop simple, but powerful, slave nodes in LIN Bus systems. ATA6623/ATA6625 is designed to handle the
low-speed data communication in vehicles (for example, in convenience electronics).
Improved slope control at the LIN driver ensures secure data communication up to
20 kBaud with an RC oscillator for the protocol handling. The bus output is designed
to withstand high voltage. Sleep Mode (voltage regulator switched off) and Silent
Mode (communication off; VCC voltage on) guarantee minimized current consumption.
4957F–AUTO–02/08
Figure 1-1.
Block Diagram
ATA6623/25
1
VS
4
LIN
8
VCC
7
NRES
VCC
RXD
Normal and
Fail-safe
Mode
Receiver
5
+
-
RF-filter
VCC
Wake-up bus timer
TXD
EN
Slew rate control
TXD
Time-out
timer
6
2
Control
unit
GND
Short circuit and
overtemperature
protection
3
Normal/Silent/
Fail-safe Mode
3.3V/50 mA/2%
5V/50 mA/2%
Sleep
mode
VCC
switched
off
Undervoltage reset
2. Pin Configuration
Figure 2-1.
Pinning SO8
VS
EN
GND
LIN
Table 2-1.
2
1
2
3
4
8
7
6
5
VCC
NRES
TXD
RXD
Pin Description
Pin
Symbol
Function
1
VS
Battery supply
2
EN
Enables Normal Mode if the input is high
3
GND
4
LIN
LIN bus line input/output
5
RXD
Receive data output
6
TXD
Transmit data input
7
NRES
Output undervoltage reset, low at reset
8
VCC
Output voltage regulator 3.3V/5V/50 mA
Ground, heat sink
ATA6623/ATA6625
4957F–AUTO–02/08
ATA6623/ATA6625
3. Functional Description
3.1
Physical Layer Compatibility
Since the LIN physical layer is independent from higher LIN layers (e.g., LIN protocol layer), all
nodes with a LIN physical layer according to revision 2.0 can be mixed with LIN physical layer
nodes, which are according to older versions (i.e., LIN 1.0, LIN 1.1, LIN 1.2, LIN 1.3) without any
restrictions.
3.2
Supply Pin (VS)
LIN operating voltage is VS = 5V to 27V. An undervoltage detection is implemented to disable
transmission if VS falls below 5V, in order to avoid false bus messages. After switching on VS,
the IC starts with the Fail-safe Mode and the voltage regulator is switched on (i.e.,
3.3V/5V/50 mA).
The supply current in Sleep Mode is typically 10 µA and 57 µA in Silent Mode.
3.3
Ground Pin (GND)
The IC is neutral on the LIN pin in the event of GND disconnection. It is able to handle a ground
shift up to 11.5% of VS.
3.4
Voltage Regulator Output Pin (VCC)
The internal 3.3V/5V voltage regulator is capable of driving loads with up to 50 mA, supplying
the microcontroller and other ICs on the PCB and is protected against overload by means of current limitation and overtemperature shut-down. Furthermore, the output voltage is monitored
and will cause a reset signal at the NRES output pin if it drops below a defined threshold Vthun.
3.5
Undervoltage Reset Output (NRES)
If the VCC voltage falls below the undervoltage detection threshold of Vthun, NRES switches to
low after tres_f (Figure 6-1 on page 11). Even if VCC = 0V the NRES stays low, because it is
internally driven from the VS voltage. If VS voltage ramps down, NRES stays low until VS < 1.5V
and then becomes highly resistant.
The implemented undervoltage delay keeps NRES low for tReset = 4 ms after VCC reaches its
nominal value.
3.6
Bus Pin (LIN)
A low-side driver with internal current limitation and thermal shutdown as well as an internal
pull-up resistor according to LIN specification 2.0 is implemented. The voltage range is from
–27V to +40V. This pin exhibits no reverse current from the LIN bus to VS, even in the event of a
GND shift or VBatt disconnection. The LIN receiver thresholds are compatible with the LIN protocol specification.
The fall time (from recessive to dominant) and the rise time (from dominant to recessive) are
slope controlled.
3
4957F–AUTO–02/08
3.7
Input Pin (TXD)
In Normal Mode the TXD pin is the microcontroller interface to control the state of the LIN output.
TXD must be pulled to ground in order to drive the LIN bus low. If TXD is high or unconnected
(internal pull-up resistor), the LIN output transistor is turned off and the bus is in the recessive
state.
3.8
Dominant Time-out Function (TXD)
The TXD input has an internal pull-up resistor. An internal timer prevents the bus line from being
driven permanently in the dominant state. If TXD is forced to low longer than tDOM > 6 ms, the
LIN bus driver is switched to the recessive state. Nevertheless, when switching to Sleep Mode,
the actual level at the TXD pin is relevant.
To reactivate the LIN bus driver, switch TXD to high (> 10 µs).
3.9
Output Pin (RXD)
The pin reports the state of the LIN-bus to the microcontroller. LIN high (recessive state) is
reported by a high level at RXD; LIN low (dominant state) is reported by a low level at RXD. The
output has an internal pull-up structure with typically 5 kΩ to VCC. The AC characteristics are
measured with an external load capacitor of 20 pF.
The output is short-circuit protected. In Unpowered Mode (that is, VS = 0V), RXD is switched off.
3.10
Enable Input Pin (EN)
This pin controls the Operation Mode of the interface. After power up of VS (battery), the IC
switches to Fail-safe Mode, even if EN is low or unconnected (internal pull-down resistor). If EN
is high, the interface is in Normal Mode.
A falling edge at EN while TXD is still high forces the device to Silent Mode. A falling edge at EN
while TXD is low forces the device to Sleep Mode.
4
ATA6623/ATA6625
4957F–AUTO–02/08
ATA6623/ATA6625
4. Mode of Operation
Figure 4-1.
Mode of Operation
a: VS > 5V
Unpowered Mode
VBatt = 0V
b
b: VS < 4V
c: Bus wake-up event
d: NRES switches to low
a
Fail-safe Mode
b
b
VCC: 3.3V/5V/50 mA
with undervoltage monitoring
Communication: OFF
d
EN = 1
c+d
EN = 1
c
Go to silent command
b
EN = 0
Silent Mode
TXD = 1
Normal Mode
Local wake-up event
EN = 1
VCC: 3.3V/5V/50 mA
with undervoltage
monitoring
VCC: 3.3V/5V/50 mA
with undervoltage monitoring
Communication: OFF
Go to sleep command
EN = 0
Communication: ON
TXD = 0
Sleep Mode
VCC: switched off
Communication: OFF
5
4957F–AUTO–02/08
Table 4-1.
4.1
Mode of Operation
Mode of
Operation
Transceiver
VCC
RXD
LIN
Fail safe
OFF
3.3V/5V
High
Recessive
Normal
ON
3.3V/5V
High
TXD depending
Silent
OFF
3.3V/5V
High
Recessive
Sleep
OFF
0V
0V
Recessive
Normal Mode
This is the normal transmitting and Receiving Mode of the LIN Interface, in accordance with LIN
specification 2.0. The VCC voltage regulator operates with a 3.3V/5V output voltage, with a low
tolerance of ±2% and a maximum output current of 50 mA.
If an undervoltage condition occurs, NRES is switched to low and the IC changes its state to
Fail-safe Mode. All features are available.
4.2
Silent Mode
A falling edge at EN while TXD is high switches the IC into Silent Mode. The TXD Signal has to
be logic high during the Mode Select window (Figure 4-2 on page 7). The transmission path is
disabled in Silent Mode. The overall supply current from V Batt is a combination of the
IVSsi = 57 µA plus the VCC regulator output current IVCCs.
The 3.3V/5V regulator with 2% tolerance can source up to 50 mA. In Silent Mode the internal
slave termination between pin LIN and pin VS is disabled to minimize the power dissipation in
case pin LIN is short-circuited to GND. Only a weak pull-up current (typically 10 µA) between pin
LIN and pin VS is present. The Silent Mode can be activated independently from the current
level on pin LIN.
If an undervoltage condition occurs, NRES is switched to low and the ATA6623/ATA6625
changes its state to Fail-safe Mode.
A voltage less than the LIN Pre-wake detection V LINL at pin LIN activates the internal LIN
receiver.
A falling edge at the LIN pin followed by a dominant bus level maintained for a certain time
period (tbus) and the following rising edge at pin LIN (see Figure 4-3 on page 7) results in a
remote wake-up request. The device switches from Silent Mode to Fail-safe Mode, then the
internal LIN slave termination resistor is switched on. The remote wake-up request is indicated
by a low level at pin RXD to interrupt the microcontroller (Figure 4-3 on page 7). EN high can be
used to switch directly to Normal Mode.
6
ATA6623/ATA6625
4957F–AUTO–02/08
ATA6623/ATA6625
Figure 4-2.
Switch to Silent Mode
Normal Mode
Silent Mode
EN
Mode select window
TXD
td = 3.2 µs
NRES
VCC
Delay time silent mode
td_sleep = maximum 20 µs
LIN
LIN switches directly to recessive mode
Figure 4-3.
LIN Wake-up Waveform Diagram from Silent Mode
Bus wake-up filtering time
tbus
Fail-safe mode
Normal mode
LIN bus
RXD
VCC
Low
High
Silent mode 3.3V/5V/50 mA
Fail-safe mode 3.3V/5V/50 mA
Normal mode
EN High
EN
NRES
Undervoltage detection active
7
4957F–AUTO–02/08
4.3
Sleep Mode
A falling edge at EN while TXD is low switches the IC into Sleep Mode. The TXD Signal has to
be logic low during the Mode Select window (Figure 4-4 on page 8).
In Sleep Mode the transmission path is disabled. Supply current from V Batt is typically
IVSsleep = 10 µA. The VCC regulator is switched off; NRES and RXD are low. The internal slave
termination between pin LIN and pin VS is disabled to minimize the power dissipation in case pin
LIN is short-circuited to GND. Only a weak pull-up current (typically 10 µA) between pin LIN and
pin VS is present. The Sleep Mode can be activated independently from the current level on pin
LIN.
A voltage less than the LIN Pre-wake detection V LINL at pin LIN activates the internal LIN
receiver.
A falling edge at the LIN pin followed by a dominant bus level maintained for a certain time
period (tbus) and a following rising edge at pin LIN respectively results in a remote wake-up
request. The device switches from Sleep Mode to Fail-safe Mode.
The VCC regulator is activated, and the internal LIN slave termination resistor is switched on. The
remote wake-up request is indicated by a low level at the RXD pin to interrupt the microcontroller
(Figure 4-5 on page 9).
EN high can be used to switch directly from Sleep/Silent to Fail-safe Mode. If EN is still high after
VCC ramp up and undervoltage reset time, the IC switches to Normal Mode.
Figure 4-4.
Switch to Sleep Mode
Normal Mode
Sleep Mode
EN
Mode select window
TXD
td = 3.2 µs
NRES
VCC
Delay time sleep mode
td_sleep = maximum 20 µs
LIN
LIN switches directly to recessive mode
8
ATA6623/ATA6625
4957F–AUTO–02/08
ATA6623/ATA6625
Figure 4-5.
LIN Wake-up Diagram from Sleep Mode
Bus wake-up filtering time
tbus
Fail-safe Mode
Low or floating
Low
Normal Mode
LIN bus
RXD
VCC
voltage
regulator
On state
Off state
Regulator wake-up time
EN High
EN
Reset
time
NRES
Low or floating
Microcontroller
start-up time delay
4.4
Fail-safe Mode
At system power-up the device automatically switches to Fail-safe Mode. The voltage regulator
is switched on (VCC = 3.3V/5V/50 mA), (see Figure 6-1 on page 11). The NRES output switches
to low for tres = 4 ms and gives a reset to the microcontroller. LIN communication is switched off.
The IC stays in this mode until EN is switched to high, and changes then to the Normal Mode. A
power down of VBatt (VS < 4V) during Silent- or Sleep Mode switches the IC into the Fail-safe
Mode after power up. A logic low at NRES switches the IC into Fail-safe Mode directly.
4.5
Unpowered Mode
If you connect battery voltage to the application circuit, the voltage at the VS pin increases
according to the block capacitor (see Figure 6-1 on page 11). After VS is higher than the VS
undervoltage threshold VSth, the IC mode changes from Unpowered Mode to Fail-safe Mode.
The VCC output voltage reaches its nominal value after tVCC. This time, tVCC, depends on the
VCC capacitor and the load.
NRES is low for the reset time delay tReset; no mode change is possible during this time.
9
4957F–AUTO–02/08
5. Fail-safe Features
• During a short-circuit at LIN to VBattery, the output limits the output current to IBUS_LIM. Due to
the power dissipation, the chip temperature exceeds TLINoff and the LIN output is switched off.
The chip cools down and after a hysteresis of Thys, switches the output on again. RXD stays
on high because LIN is high. During LIN overtemperature switch-off, the VCC regulator is
working independently.
• During a short-circuit from LIN to GND the IC can be switched into Sleep or Silent Mode. If
the short-circuit disappears, the IC starts with a remote wake-up.
• The reverse current is very low < 15 µA at pin LIN during loss of VBatt or GND. This is optimal
behavior for bus systems where some slave nodes are supplied from battery or ignition.
• During a short circuit at VCC, the output limits the output current to IVCCn. Because of
undervoltage, NRES switches to low and sends a reset to the microcontroller. The IC
switches into Fail-safe Mode. If the chip temperature exceeds the value TVCCoff, the VCC
output switches off. The chip cools down and after a hysteresis of Thys, switches the output on
again. Because of Fail-safe Mode, the VCC voltage will switch on again although EN is
switched off from the microcontroller.The microcontroller can then start with normal
operation.
• Pin EN provides a pull-down resistor to force the transceiver into Recessive Mode if EN is
disconnected.
• Pin RXD is set floating if VBatt is disconnected.
• Pin TXD provides a pull-up resistor to force the transceiver into Recessive Mode if TXD is
disconnected.
• If TXD is short-circuited to GND, it is possible to switch to Sleep Mode via ENABLE after
tdom > 20 ms.
10
ATA6623/ATA6625
4957F–AUTO–02/08
ATA6623/ATA6625
6. Voltage Regulator
Figure 6-1.
VCC Voltage Regulator: Ramp Up and Undervoltage
VS
12V
5.5V/3.8V
VCC
5V/3.3V
Vthun
tVCC
tReset
tres_f
NRES
5V/3.3V
The voltage regulator needs an external capacitor for compensation and to smooth the disturbances from the microcontroller. It is recommended to use an electrolythic capacitor with
C > 10 µF and a ceramic capacitor with C = 100 nF. The values of these capacitors can be varied by the customer, depending on the application.
With this special SO8 package (fused lead frame to pin3) an Rthja of 80 K/W is achieved.
Therefore, it is recommended to connect pin 3 with a wide GND plate on the printed board to get
a good heat sink.
The main power dissipation of the IC is created from the V CC output current IVCC , which is
needed for the application.
Figure 6-2 shows the safe operating area of the ATA6623/ATA6625.
11
4957F–AUTO–02/08
Figure 6-2.
Power Dissipation: Save Operating Area versus VCC Output Current and Supply
Voltage VS at Different Ambient Temperatures Due to Rthja = 80 K/W
60.00
Iout_85: Tamb = 85°C
50.00
Iout_85: Tamb = 95°C
IVCC (mA)
40.00
Iout_105: Tamb = 105°C
30.00
20.00
10.00
0.00
5
6
7
8
9
10
11
12
13 14
15
16
17 18
19
VS (V)
For programming purposes of the microcontroller it is potentially neccessary to supply the VCC
output via an external power supply while the VS Pin of the system basis chip is disconnected.
This behavior is no problem for the system basis chip.
12
ATA6623/ATA6625
4957F–AUTO–02/08
ATA6623/ATA6625
7. Absolute Maximum Ratings
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating
only and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of this
specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
Parameters
Symbol
Min.
Supply voltage VS
VS
–0.3
Pulse time ≤ 500 ms
Ta = 25°C
Output current IVCC ≤ 50 mA
Pulse time ≤ 2 min
Ta = 25°C
Output current IVCC ≤ 50 mA
Max.
Unit
+40
V
VS
+40
V
VS
27
V
Logic pins (RxD, TxD, EN, NRES)
Output current NRES
Typ.
–0.3
INRES
+5.5
V
+2
mA
LIN
- DC voltage
–27
+40
V
VCC
- DC voltage
–0.3
+5.5
V
According to IBEE LIN EMC
Test specification 1.0 following IEC 61000-4-2
- Pin VS, LIN to GND
±6
KV
ESD HBM following STM5.1
with 1.5 kΩ/100 pF
- Pin VS, LIN to GND
±8
KV
±3
KV
±750
V
HBM ESD
ANSI/ESD-STM5.1
JESD22-A114
AEC-Q100 (002)
CDM ESD STM 5.3.1
Junction temperature
Tj
–40
+150
°C
Storage temperature
Ts
–55
+150
°C
145
K/W
Thermal resistance junction to ambient
(free air)
Rthja
Special heat sink at GND (pin 3) on PCB
Rthja
80
K/W
Thermal shutdown of VCC regulator
TVCCoff
150
160
170
°C
Thermal shutdown of LIN output
TLINoff
150
160
170
°C
Thermal shutdown hysteresis
Thys
10
°C
13
4957F–AUTO–02/08
8. Electrical Characteristics
5V < VS < 27V, –40°C < Tj < 150°C; unless otherwise specified all values refer to GND pins.
No.
1
1.1
1.2
1.3
Parameters
Test Conditions
Pin
Symbol
Min.
Typ.
Max.
Unit
Type*
VS
VS
5
13.5
27
V
A
VS
IVSsleep
3
10
14
µA
A
Sleep Mode
VLIN > VS – 0.5V
VS < 14V (Tj = 125°C)
IVSsleep
5
11
16
µA
A
Bus recessive
VS < 14V (Tj = 25°C)
Without load at VCC
IVSsi
47
57
67
µA
A
Bus recessive
VS < 14V (Tj = 125°C)
Without load at VCC
IVSsi
56
66
76
µA
A
VS Pin
Nominal DC voltage
range
Supply current in Sleep
Mode
Supply current in Silent
Mode
Sleep Mode
VLIN > VS – 0.5V
VS < 14V (Tj = 25°C)
1.4
Bus recessive
Supply current in Normal
VS < 14V
Mode
Without load at VCC
VS
IVSrec
0.3
0.8
mA
A
1.5
Bus dominant
Supply current in Normal
VS < 14V
Mode
VCC load current 50 mA
VS
IVSdom
50
53
mA
A
1.6
VS undervoltage
threshold
VS
VSth
4.0
5
V
A
1.7
VS undervoltage
threshold hysteresis
VS
VSth_hys
V
A
RXD
IRXD
mA
A
0.4
V
A
7
kΩ
A
2
0.2
RXD Output Pin
Normal Mode
VLIN = 0V
VRXD = 0.4V
1.3
2.5
RRXD
3
5
2.1
Low level input current
2.2
Low level output voltage IRXD = 1 mA
RXD
VRXDL
2.3
Internal resistor to VCC
RXD
3
4.5
8
TXD Input Pin
3.1
Low level voltage input
TXD
VTXDL
–0.3
+0.8
V
A
3.2
High level voltage input
TXD
VTXDH
2
VCC +
0.3V
V
A
3.3
Pull-up resistor
VTXD = 0V
TXD
RTXD
125
400
kΩ
A
3.4
High level leakage
current
VTXD = 5V
TXD
ITXD
–3
+3
µA
A
4
250
EN Input Pin
4.1
Low level voltage input
EN
VENL
–0.3
+0.8
V
A
4.2
High level voltage input
EN
VENH
2
VCC +
0.3V
V
A
4.3
Pull-down resistor
VEN = 5V
EN
REN
50
200
kΩ
A
4.4
Low level input current
VEN = 0V
EN
IEN
–3
+3
µA
A
125
*) Type means: A = 100% tested, B = 100% correlation tested, C = Characterized on samples, D = Design parameter
14
ATA6623/ATA6625
4957F–AUTO–02/08
ATA6623/ATA6625
8. Electrical Characteristics (Continued)
5V < VS < 27V, –40°C < Tj < 150°C; unless otherwise specified all values refer to GND pins.
No.
5
Parameters
Test Conditions
Pin
Symbol
NRES
Min.
Typ.
Max.
Unit
Type*
VNRESL
VNRESL
0.2
0.14
V
V
A
A
0.2
V
A
6
ms
A
NRES Open Drain Output Pin
5.1
VS ≥ 5.5V
Low level output voltage INRES = 1 mA
INRES = 250 µA
5.2
Low level output low
10 kΩ to VCC
VCC = 0V
NRES
VNRESLL
5.3
Undervoltage reset time
VVS ≥ 5.5V
CNRES = 20 pF
NRES
tReset
2
5.4
Reset debounce time for VVS ≥ 5.5V
falling edge
CNRES = 20 pF
NRES
tres_f
1.5
10
µs
A
6
4
VCC Voltage Regulator ATA6623
6.1
Output voltage VCC
4V < VS < 18V
(0 mA to 50 mA)
VCC
VCCnor
3.234
3.366
V
A
6.2
Output voltage VCC at
low VS
3V < VS < 4V
VCC
VCClow
VVS –
VDrop
3.366
V
A
6.3
Regulator drop voltage
VS > 3V, IVCC = –15 mA
VCC
VDrop1
200
mV
A
6.4
Regulator drop voltage
VS > 3V, IVCC = –50 mA
VCC
VDrop2
700
mV
A
6.5
Line regulation
maximum
4V < VS < 18V
VCC
VCCline
1
%
A
6.6
Load regulation
maximum
5 mA < IVCC < 50 mA
VCC
VCCload
2
%
A
6.7
Power supply ripple
rejection
10 Hz to 100 kHz
CVCC = 10 µF
VS = 14V, IVCC = –15 mA
dB
C
6.8
Output current limitation VS > 4V
VCC
IVCCs
–200
–160
mA
A
6.9
Load capacity
1Ω < ESR < 5Ω @ 100 kHz
VCC
Cload
1.8
10
µF
D
6.10
VCC undervoltage
threshold
Referred to VCC
VS > 4V
VCC
VthunN
2.8
V
A
6.11
Hysteresis of
undervoltage threshold
Referred to VCC
VS > 4V
VCC
Vhysthun
150
mV
A
6.12
Ramp up time VS > 4V
to VCC = 3.3V
CVCC = 2.2 µF
Iload = –5 mA at VCC
VCC
tVCC
100
250
µs
A
7
500
0.5
50
3.2
VCC Voltage Regulator ATA6625
7.1
Output voltage VCC
5.5V < VS < 18V
(0 mA to 50 mA)
VCC
VCCnor
4.9
5.1
V
A
7.2
Output voltage VCC at
low VS
4V < VS < 5.5V
VCC
VCClow
VVS – VD
5.1
V
A
7.3
Regulator drop voltage
VS > 4V, IVCC = –20 mA
VCC
VD1
250
mV
A
7.4
Regulator drop voltage
VS > 4V, IVCC = –50 mA
VCC
VD2
600
mV
A
7.5
Regulator drop voltage
VS > 3.3V, IVCC = –15 mA
VCC
VD3
200
mV
A
7.6
Line regulation
maximum
5.5V < VS < 18V
VCC
VCCline
1
%
A
400
*) Type means: A = 100% tested, B = 100% correlation tested, C = Characterized on samples, D = Design parameter
15
4957F–AUTO–02/08
8. Electrical Characteristics (Continued)
5V < VS < 27V, –40°C < Tj < 150°C; unless otherwise specified all values refer to GND pins.
No.
Parameters
Test Conditions
Pin
Symbol
7.7
Load regulation
maximum
5 mA < IVCC < 50 mA
VCC
VCCload
7.8
Output current limitation VS > 5.5V
VCC
IVCCs
–200
7.9
Load capacity
1Ω < ESR < 5Ω @ 100 kHz
VCC
Cload
1.8
7.10
VCC undervoltage
threshold
Referred to VCC
VS > 5.5V
VCC
VthunN
4.2
7.11
Hysteresis of
undervoltage threshold
Referred to VCC
VS > 5.5V
VCC
Vhysthun
250
7.12
Ramp up time VS > 5.5V CVCC = 2.2 µF
Iload = –5 mA at VCC
to VCC = 5V
VCC
TVCC
130
8
Min.
Typ.
Max.
Unit
Type*
0.5
2
%
A
–160
mA
A
10
µF
D
V
A
mV
A
µs
A
VS
V
A
4.8
300
LIN Bus Driver: Bus Load Conditions:
Load 1 (Small): 1 nF, 1 kΩ; Load 2 (Large): 10 nF, 500Ω; Internal Pull-up RRXD = 5 kΩ; CRXD = 20 pF
10.5, 10.6 and 10.7 Specifies the Timing Parameters for Proper Operation at 20 Kbps
8.1
Driver recessive output
voltage
Load1/Load2
LIN
VBUSrec
8.2
Driver dominant voltage
VVS = 7V
Rload = 500Ω
LIN
V_LoSUP
1.2
V
A
8.3
Driver dominant voltage
VVS = 18V
Rload = 500Ω
LIN
V_HiSUP
2
V
A
8.4
Driver dominant voltage
VVS = 7V
Rload = 1000Ω
LIN
V_LoSUP_1k
0.6
V
A
8.5
Driver dominant voltage
VVS = 18V
Rload = 1000Ω
LIN
V_HiSUP_1k
0.8
V
A
8.6
Pull–up resistor to VS
The serial diode is
mandatory
LIN
RLIN
20
30
60
kΩ
A
8.7
LIN current limitation
VBUS = VBatt_max
LIN
IBUS_LIM
40
120
200
mA
A
8.8
Input leakage current at
the receiver including
pull-up resistor as
specified
Input Leakage current
Driver off
VBUS = 0V
VBatt = 12V
LIN
IBUS_PAS_dom
–1
–0.35
mA
A
8.9
Leakage current LIN
recessive
Driver off
8V < VBatt < 18V
8V < VBUS < 18V
VBUS ≥ VBatt
LIN
IBUS_PAS_rec
8.10
Leakage current when
control unit disconnected
from ground.
GNDDevice = VS
VBatt = 12V
Loss of local ground
0V < VBUS < 18V
must not affect
communication in the
residual network
LIN
IBUS_NO_gnd
8.11
Node has to sustain the
VBatt disconnected
current that can flow
under this condition. Bus VSUP_Device = GND
must remain operational 0V < VBUS < 18V
under this condition.
LIN
IBUS
0.9 × VS
–10
15
20
µA
A
+0.5
+10
µA
A
5
15
µA
A
*) Type means: A = 100% tested, B = 100% correlation tested, C = Characterized on samples, D = Design parameter
16
ATA6623/ATA6625
4957F–AUTO–02/08
ATA6623/ATA6625
8. Electrical Characteristics (Continued)
5V < VS < 27V, –40°C < Tj < 150°C; unless otherwise specified all values refer to GND pins.
No.
Parameters
Test Conditions
Pin
Symbol
Min.
Typ.
Max.
Unit
Type*
VBUS_CNT =
(Vth_dom + Vth_rec)/2
LIN
VBUS_CNT
0.475 ×
VS
0.5 ×
VS
0.525 ×
VS
V
A
9
LIN Bus Receiver
9.1
Center of receiver
threshold
9.2
Receiver dominant state VEN = 5V
LIN
VBUSdom
–27
0.4 × VS
V
A
9.3
Receiver recessive state VEN = 5V
LIN
VBUSrec
0.6 × VS
40
V
A
9.4
Receiver input
hysteresis
LIN
VBUShys
0.028 ×
VS
0.175 ×
VS
V
A
9.5
Pre-wake detection LIN
High level input voltage
LIN
VLINH
VS – 1V
VS +
0.3V
V
A
9.6
Pre-wake detection LIN
Low level input voltage
LIN
VLINL
–27
VS – 3.3V
V
A
10
Internal Timers
150
µs
A
20
µs
A
Vhys = Vth_rec – Vth_dom
Activates the LIN receiver
0.1 x VS
10.1
Dominant time for
wake–up via LIN bus
VLIN = 0V
tbus
30
10.2
Time delay for mode
change from Pre-normal
V = 5V
into Normal Mode via pin EN
EN
tnorm
5
10.3
Time delay for mode
change from Normal
V = 0V
Mode to Sleep Mode via EN
pin EN
tsleep
2
7
15
µs
A
10.4
TXD dominant time out
timer
tdom
6
13
20
ms
A
10.5
Time delay for mode
change from Silent Mode VEN = 5V
into Normal Mode via EN
ts_n
5
15
40
µs
A
Duty cycle 1
THRec(max) = 0.744 × VS
THDom(max) = 0.581 × VS
VS = 7.0V to 18V
tBit = 50 µs
D1 = tbus_rec(min)/(2 × tBit)
D1
0.396
Duty cycle 2
THRec(min) = 0.422 × VS
THDom(min) = 0.284 × VS
VS = 7.6V to 18V
tBit = 50 µs
D2 = tbus_rec(max)/(2 × tBit)
D2
Duty cycle 3
THRec(max) = 0.778 × VS
THDom(max) = 0.616 × VS
VS = 7.0V to 18V
tBit = 96 µs
D3 = tbus_rec(min)/(2 × tBit)
D3
Duty cycle 4
THRec(min) = 0.389 × VS
THDom(min) = 0.251 × VS
VS = 7.6V to 18V
tBit = 96 µs
D4 = tbus_rec(max)/(2 × tBit)
D4
10.6
10.7
10.8
10.9
VTXD = 0V
90
A
0.581
0.417
A
A
0.590
A
*) Type means: A = 100% tested, B = 100% correlation tested, C = Characterized on samples, D = Design parameter
17
4957F–AUTO–02/08
8. Electrical Characteristics (Continued)
5V < VS < 27V, –40°C < Tj < 150°C; unless otherwise specified all values refer to GND pins.
No.
10.10
11
Parameters
Test Conditions
Slope time falling and
rising edge at LIN
VS = 7.0V to 18V
Pin
Symbol
Min.
tSLOPE_fall
tSLOPE_rise
3.5
Typ.
Max.
Unit
Type*
22.5
µs
A
6
µs
A
+2
µs
A
Receiver Electrical AC Parameters of the LIN Physical Layer
LIN Receiver, RXD Load Conditions: Internal Pull-up RRXD = 5 kΩ; CRXD = 20 pF
VS = 7.0V to 18V
trx_pd = max(trx_pdr, trx_pdf)
11.1
Propagation delay of
receiver Figure 8-1
11.2
Symmetry of receiver
VS = 7.0V to 18V
propagation delay rising
trx_sym = trx_pdr – trx_pdf
edge minus falling edge
trx_pd
trx_sym
–2
*) Type means: A = 100% tested, B = 100% correlation tested, C = Characterized on samples, D = Design parameter
Figure 8-1.
Definition of Bus Timing Characteristics
tBit
tBit
tBit
TXD
(Input to transmitting node)
tBus_dom(max)
tBus_rec(min)
Thresholds of
receiving node1
THRec(max)
VS
(Transceiver supply
of transmitting node)
THDom(max)
LIN Bus Signal
Thresholds of
receiving node2
THRec(min)
THDom(min)
tBus_dom(min)
tBus_rec(max)
RXD
(Output of receiving node1)
trx_pdf(1)
trx_pdr(1)
RXD
(Output of receiving node2)
trx_pdr(2)
18
trx_pdf(2)
ATA6623/ATA6625
4957F–AUTO–02/08
ATA6623/ATA6625
Figure 8-2.
Application Circuit
VCC
1
ATA6623/25
VBAT
VS
VCC
RXD 5
+
Normal and
Fail-safe
Mode
Receiver
+
-
100 nF
4
22 µF
LIN-BUS
LIN
RF filter
220 pF
VCC
Microcontroller
Wake-up bus timer
TXD
EN
6
TXD
Time-out
timer
Slew rate control
2
Control
unit
GND
3
Short circuit and
overtemperature
protection
Sleep
mode
VCC
switched
off
Normal Mode
and
Silent mode
3.3V/50 mA/2%
5V/50 mA/2%
8
VCC
7
NRES
10 kΩ
Undervoltage reset
100 nF
10 µF
19
4957F–AUTO–02/08
9. Ordering Information
Extended Type Number
Package
ATA6623-TAPY
Remarks
SO8
3.3V LIN system basis chip, Pb-free, 1k, taped and reeled
ATA6625-TAPY
SO8
5V LIN system basis chip, Pb-free, 1k, taped and reeled
ATA6623-TAQY
SO8
3.3V LIN system basis chip, Pb-free, 4k, taped and reeled
ATA6625-TAQY
SO8
5V LIN system basis chip, Pb-free, 4k, taped and reeled
10. Package Information
Package: SO 8
Dimensions in mm
5±0.2
4.9±0.1
0.1+0.15
1.4
0.2
3.7±0.1
0.4
1.27
3.8±0.1
6±0.2
3.81
8
5
technical drawings
according to DIN
specifications
1
4
Drawing-No.: 6.541-5031.01-4
Issue: 1; 15.08.06
20
ATA6623/ATA6625
4957F–AUTO–02/08
ATA6623/ATA6625
11. Revision History
Please note that the following page numbers referred to in this section refer to the specific revision
mentioned, not to this document.
Revision No.
History
4957F-AUTO-02/08
• “Pre-normal Mode” in “Fail-safe Mode” changed
• Section 7 “Absolute Maximum Ratings” on page 13 changed
• Section 8 “Electrical Characteristics” numbers 10.5 to 10.10 on pages 17
to 18 changed
4957E-AUTO-10/07
• Section 9 “Ordering Information” on page 20 changed
•
•
•
•
4957D-AUTO-07/07
•
•
•
•
Features changed
Block diagram changed
Application diagram changed
Text changed under the headings:
3.2, 3.3, 3.4, 3.6, 3.7, 3.8, 3.9, 4, 4.1, 4.2, 4.3, 4.4, 4.5, 5.5, 5.6, 6
Figure 4-2, 4-3, 4-4, 4-5, 8-2: changed
Figure title 6-1: text changed
Abs. Max. Ratings: row “Output current NRES” added
El. Char. table: values changed in the following rows:
1.3, 5.1, 5.3, 5.4, 6.9, 6.12, 7.9, 11.1
•
•
•
•
•
•
•
•
•
4957C-AUTO-02/07
Features on page 1 changed
Table 2-1 “Pin Description” on page 2 changed
Section 3-1 “Physical Layer Compatibility” on page 3 added
Section 3-2 “Supply Pin (VS) on page 3 changed
Section 3-3 “Ground Pin (GND) on page 3 changed
Section 3-8 “Dominant Time-out Function (TXD)” on page 4 changed
Section 4-1 “Normal Mode” on page 5 changed
Section 4-2 “Silent Mode” on page 5 changed
Figure 4-3 “LIN Wake-up Waveform Diagram from Silent Mode” on page
6 changed
• Section 4.3 “Sleep Mode” on page 7 changed
• Section 4-5 “Unpowered Mode” on page 7 changed
• Figure 4-4 “Switch to Sleep Mode” on page 8 changed
• Figure 4-6 “VCC Voltage Regulator: Ramp up and Undervoltage” on page
9 changed
• Section 5 “Fail-safe Features on page 9 changed
• Section 6 “Voltage Regulator” on page 10 changed
• Section 7 “Absolute Maximum Ratings” on page 11 changed
• Section 8 “Electrical Characteristics” on pages 12 to 16 changed
• Section 9 “Ordering Information” on page 18 changed
21
4957F–AUTO–02/08
Headquarters
International
Atmel Corporation
2325 Orchard Parkway
San Jose, CA 95131
USA
Tel: 1(408) 441-0311
Fax: 1(408) 487-2600
Atmel Asia
Room 1219
Chinachem Golden Plaza
77 Mody Road Tsimshatsui
East Kowloon
Hong Kong
Tel: (852) 2721-9778
Fax: (852) 2722-1369
Atmel Europe
Le Krebs
8, Rue Jean-Pierre Timbaud
BP 309
78054
Saint-Quentin-en-Yvelines Cedex
France
Tel: (33) 1-30-60-70-00
Fax: (33) 1-30-60-71-11
Atmel Japan
9F, Tonetsu Shinkawa Bldg.
1-24-8 Shinkawa
Chuo-ku, Tokyo 104-0033
Japan
Tel: (81) 3-3523-3551
Fax: (81) 3-3523-7581
Technical Support
auto_control@atmel.com
Sales Contact
www.atmel.com/contacts
Product Contact
Web Site
www.atmel.com
Literature Requests
www.atmel.com/literature
Disclaimer: The information in this document is provided in connection with Atmel products. No license, express or implied, by estoppel or otherwise, to any
intellectual property right is granted by this document or in connection with the sale of Atmel products. EXCEPT AS SET FORTH IN ATMEL’S TERMS AND CONDITIONS OF SALE LOCATED ON ATMEL’S WEB SITE, ATMEL ASSUMES NO LIABILITY WHATSOEVER AND DISCLAIMS ANY EXPRESS, IMPLIED OR STATUTORY
WARRANTY RELATING TO ITS PRODUCTS INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTY OF MERCHANTABILITY, FITNESS FOR A PARTICULAR
PURPOSE, OR NON-INFRINGEMENT. IN NO EVENT SHALL ATMEL BE LIABLE FOR ANY DIRECT, INDIRECT, CONSEQUENTIAL, PUNITIVE, SPECIAL OR INCIDENTAL DAMAGES (INCLUDING, WITHOUT LIMITATION, DAMAGES FOR LOSS OF PROFITS, BUSINESS INTERRUPTION, OR LOSS OF INFORMATION) ARISING OUT OF
THE USE OR INABILITY TO USE THIS DOCUMENT, EVEN IF ATMEL HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. Atmel makes no
representations or warranties with respect to the accuracy or completeness of the contents of this document and reserves the right to make changes to specifications
and product descriptions at any time without notice. Atmel does not make any commitment to update the information contained herein. Unless specifically provided
otherwise, Atmel products are not suitable for, and shall not be used in, automotive applications. Atmel’s products are not intended, authorized, or warranted for use
as components in applications intended to support or sustain life.
© 2008 Atmel Corporation. All rights reserved. Atmel ®, logo and combinations thereof, and others are registered trademarks or trademarks of
Atmel Corporation or its subsidiaries. Other terms and product names may be trademarks of others.
4957F–AUTO–02/08