ATMEL AT24C16C-SSHM-B

Features
• Low-voltage and Standard-voltage Operation
•
•
•
•
•
•
•
•
•
•
•
•
•
– VCC = 1.7V to 5.5V
Internally Organized 2048 x 8 (16K)
Two-wire Serial Interface
Schmitt Trigger, Filtered Inputs for Noise Suppression
Bidirectional Data Transfer Protocol
1MHz (5V, 2.5V), 400kHz (1.7V) Compatibility
Write Protect Pin for Hardware Data Protection
16-byte Page Write Modes
Partial Page Writes Allowed
Self-timed Write Cycle (5ms max)
High-reliability
– Endurance: 1 Million Write Cycles
– Data Retention: 100 Years
8-lead PDIP, 8-lead JEDEC SOIC, 8-lead TSSOP, 8-lead UDFN, 8-lead XDFN,
5-lead SOT23 and 8-ball VFBGA Packages
Lead-free/Halogen-free
Die Sales: Wafer Form, Tape and Reel, and Bumped Wafers
Two-wire
Serial Electrically
Erasable and
Programmable
Read-only Memory
16K (2048 x 8)
Atmel AT24C16C
Description
The Atmel® AT24C16C provides 16,384-bits of serial electrically erasable and programmable read-only memory (EEPROM) organized as 2,048 words of 8-bits each.
The device is optimized for use in many industrial and commercial applications where
low-power and low-voltage operation are essential. The AT24C16C is available in
space-saving 8-lead PDIP, 8-lead JEDEC SOIC, 8-lead TSSOP, 8-lead UDFN, 8-lead
XDFN, 5-lead SOT23, and 8-ball VFBGA Packages and is accessed via a Two-wire
serial interface. In addition, the AT24C16C operates from 1.7V to 5.5V.
Figure 0-1.
Pin Configurations
8-lead PDIP
Pin Name
Function
NC
No Connect
NC
NC
NC
GND
SDA
Serial Data
SCL
Serial Clock Input
WP
Write Protect
GND
Ground
VCC
Power Supply
1
8
2
7
3
6
4
5
8-lead SOIC
VCC
WP
SCL
SDA
1
2
3
4
8
7
6
5
1
8
2
7
3
6
4
5
VCC
WP
SCL
SDA
8-lead UDFN
8-lead TSSOP
NC
NC
NC
GND
NC
NC
NC
GND
VCC
WP
SCL
SDA
VCC
WP
SCL
SDA
8
1 NC
7
2 NC
6
3 NC
5
4 GND
Bottom View
5-lead SOT23
8-lead XDFN
VCC
WP
SCL
SDA
8
1 NC
7
2 NC
6
3 NC
5
4 GND
Bottom View
SCL
1
GND
2
SDA
3
5
4
8-ball VFBGA
WP
VCC
VCC 8
WP 7
SCL 6
SDA 5
1
2
3
4
NC
NC
NC
GND
Bottom View
8719A–SEEPR–9/10
Absolute Maximum Ratings
*NOTICE:
Operating Temperature ........................–55°C to +125°C
Storage Temperature ...........................–65°C to +150°C
Voltage on Any Pin
with Respect to Ground........................... –1.0V to +7.0V
Maximum Operating Voltage................................. 6.25V
Stresses beyond those listed under “Absolute
Maximum Ratings” may cause permanent
damage to the device. This is a stress rating
only and functional operation of the device at
these or any other conditions beyond those
indicated in the operational sections of this
specification is not implied. Exposure to absolute maximum rating conditions for extended
periods may affect device reliability.
DC Output Current .............................................. 5.0 mA
Figure 0-2.
Block Diagram
VCC
GND
WP
START
STOP
LOGIC
SERIAL
CONTROL
LOGIC
LOAD
H.V. PUMP/TIMING
COMP
DEVICE
ADDRESS
COMPARATOR
R/W
EN
LOAD
DATA RECOVERY
INC
DATA WORD
ADDR/COUNTER
Y DEC
X DEC
SCL
SDA
EEPROM
SERIAL MUX
DOUT/ACK
LOGIC
DIN
DOUT
2
Atmel AT24C16C
8719A–SEEPR–9/10
Atmel AT24C16C
1.
Pin Description
SERIAL CLOCK (SCL): The SCL input is used to positive edge clock data into each EEPROM device and
negative edge clock data out of each device.
SERIAL DATA (SDA): The SDA pin is bidirectional for serial data transfer. This pin is open-drain driven and may
be wire-ORed with any number of other open-drain or open-collector devices.
DEVICE/PAGE ADDRESSES: The Atmel® AT24C16C does not use the device address pins, which limits the
number of devices on a single bus to one.
WRITE PROTECT (WP): The AT24C16C has a write protect pin that provides hardware data protection. The write
protect pin allows normal read/write operations when connected to ground (GND). When the write protect pin is
connected to VCC, the write protection feature is enabled and operates as shown in <blue>Table 1-1.
Table 1-1.
WP Pin
Status
Write Protect
Part of the Array Protected
24C16C
At VCC
Full (16K) Array
At GND
Normal Read/Write Operations
3
8719A–SEEPR–9/10
2.
Memory Organization
Atmel AT24C16C, 16K SERIAL EEPROM: Internally organized with 128 pages of 16-bytes each, the 16K
requires an 11-bit data word address for random word addressing.
Table 2-1.
Pin Capacitance(1)
Applicable over recommended operating range from TA = 25⋅C, f = 1.0MHz, VCC = +1.7V
Symbol
Test Condition
CI/O
CIN
Note:
Max
Units
Conditions
Input/Output Capacitance (SDA)
8
pF
VI/O = 0V
Input Capacitance (SCL)
6
pF
VIN = 0V
1. This parameter is characterized and is not 100% tested
Table 2-2.
DC Characteristics
Applicable over recommended operating range from: TAI = −40⋅C to +85⋅C, VCC = +1.7V to +5.5V
(unless otherwise noted)
Symbol
Parameter
VCC1
Supply Voltage
ICC1
Supply Current
VCC = 5.0V
READ at 400kHz
ICC2
Supply Current
VCC = 5.0V
WRITE at 400kHz
ISB1
Standby Current
ILI
Input Leakage
Current VCC = 5.0V
VIN = VCC or VSS
0.10
3.0
µA
ILO
Output Leakage
Current VCC = 5.0V
VOUT = VCC or VSS
0.05
3.0
µA
VIL
Input Low Level(1)
−0.6
VCC x 0.3
V
Min
Typ
Max
Units
5.5
V
1.0
2.0
mA
2.0
3.0
mA
1.0
µA
VCC x 0.7
VCC + 0.5
V
1.7
VCC = 1.7V
VCC = 5.5V
VIN = VCC or VSS
(1)
6.0
VIH
Input High Level
VOL1
Output Low Level
VCC = 1.7V
IOL = 0.15mA
0.2
V
VOL2
Output Low Level
VCC = 3.0V
IOL = 2.1mA
0.4
V
Note:
4
Test Condition
1. VIL min and VIH max are reference only and are not tested
Atmel AT24C16C
8719A–SEEPR–9/10
Atmel AT24C16C
Table 2-3.
AC Characteristics (Industrial Temperature)
Applicable over recommended operating range from TAI = −40⋅C to +85⋅C, VCC = +1.7V to +5.5V, CL = 100 pF
(unless otherwise noted). Test conditions are listed in Note 2.
1.7V
Min
2.5V, 5.0V
Symbol
Parameter
fSCL
Clock Frequency, SCL
tLOW
Clock Pulse Width Low
1.3
0.4
µs
tHIGH
Clock Pulse Width High
0.6
0.4
µs
tI
Noise Suppression Time(1)
tAA
Clock Low to Data Out Valid
0.05
tBUF
Time the bus must be free before a new
transmission can start(1)
1.3
0.5
µs
tHD.STA
Start Hold Time
0.6
0.25
µs
tSU.STA
Start Set-up Time
0.6
0.25
µs
tHD.DAT
Data In Hold Time
0
0
µs
tSU.DAT
Data In Set-up Time
100
100
ns
Inputs Rise Time
tR
Max
Min
400
50
(1)
(1)
0.9
0.05
Max
Units
1000
kHz
50
ns
0.55
µs
0.3
0.3
µs
300
100
ns
tF
Inputs Fall Time
tSU.STO
Stop Set-up Time
0.6
0.25
µs
tDH
Data Out Hold Time
50
50
ns
tWR
Write Cycle Time
Endurance(1)
25°C, Page Mode, 3.3V
Notes:
5
5
1,000,000
ms
Write
Cycles
1. This parameter is characterized and is not 100% tested
2. AC measurement conditions:
RL (connects to VCC): 1.3 kΩ (2.5V, 5.0V), 10 kΩ (1.7V)
Input pulse voltages: 0.3 VCC to 0.7 VCC
Input rise and fall times: ≤ 50ns
Input and output timing reference voltages: 0.5 VCC
5
8719A–SEEPR–9/10
3.
Device Operation
CLOCK and DATA TRANSITIONS: The SDA pin is normally pulled high with an external device. Data on the SDA
pin may change only during SCL low time periods (see <blue>Figure 3-4 on page 7). Data changes during SCL
high periods will indicate a start or stop condition as defined below.
START CONDITION: A high-to-low transition of SDA with SCL high is a start condition which must precede any
other command (see <blue>Figure 3-5 on page 8).
STOP CONDITION: A low-to-high transition of SDA with SCL high is a stop condition. After a read sequence, the
stop command will place the EEPROM in a standby power mode (see <blue>Figure 3-5 on page 8).
ACKNOWLEDGE: All addresses and data words are serially transmitted to and from the EEPROM in 8-bit words.
The EEPROM sends a zero to acknowledge that it has received each word. This happens during the ninth clock
cycle.
STANDBY MODE: The Atmel® AT24C16C features a low-power standby mode which is enabled:
(a) upon power-up and (b) after the receipt of the STOP bit and the completion of any internal operations.
2-WIRE SOFTWARE RESET: After an interruption in protocol, power loss or system reset, any 2-wire part can be
protocol reset by following these steps:
1. Create a start bit condition
2. Clock nine cycles
3. Create another start bit followed by stop bit condition as shown below
Figure 3-1.
Software Reset
Dummy Clock Cycles
Start bit
SCL
1
2
3
Start bit
8
Stop bit
9
SDA
6
Atmel AT24C16C
8719A–SEEPR–9/10
Atmel AT24C16C
Figure 3-2.
Bus Timing
SCL: Serial Clock, SDA: Serial Data I/O®
tHIGH
tF
tR
tLOW
tLOW
SCL
tSU.STA
tHD.STA
tHD.DAT
tSU.DAT
tSU.STO
SDA IN
tAA
tDH
tBUF
SDA OUT
Figure 3-3.
Write Cycle Timing
SCL: Serial Clock, SDA: Serial Data I/O
SCL
SDA
8th BIT
ACK
WORDn
(1)
twr
STOP
CONDITION
Note:
START
CONDITION
The write cycle time tWR is the time from a valid stop condition of a write sequence to the end of the internal
clear/write cycle
Figure 3-4.
Data Validity
SDA
SCL
DATA STABLE
DATA STABLE
DATA
CHANGE
7
8719A–SEEPR–9/10
Figure 3-5.
Start and Stop Definition
SDA
SCL
START
Figure 3-6.
STOP
Output Acknowledge
1
SCL
8
9
DATA IN
DATA OUT
START
8
ACKNOWLEDGE
Atmel AT24C16C
8719A–SEEPR–9/10
Atmel AT24C16C
4.
Device Addressing
The 16K EEPROM device requires an 8-bit device address word following a start condition to enable the chip for a
read or write operation (refer to <blue>Figure 6-1).
The device address word consists of a mandatory one, zero sequence for the first four most significant bits as
shown. This is common to all the EEPROM devices.
The next three bits used for memory page addressing and are the most significant bits of the data word address
which follows.
The eighth bit of the device address is the read/write operation select bit. A read operation is initiated if this bit is
high and a write operation is initiated if this bit is low.
Upon a compare of the device address, the EEPROM will output a zero. If a compare is not made, the chip will
return to a standby state.
5.
Write Operations
BYTE WRITE: A write operation requires an 8-bit data word address following the device address word and
acknowledgment. Upon receipt of this address, the EEPROM will again respond with a zero and then clock in the
first 8-bit data word. Following receipt of the 8-bit data word, the EEPROM will output a zero and the addressing
device, such as a microcontroller, must terminate the write sequence with a stop condition. At this time the
EEPROM enters an internally timed write cycle, tWR, to the nonvolatile memory. All inputs are disabled during this
write cycle and the EEPROM will not respond until the write is complete (see <blue>Figure 6-2 on page 10).
PAGE WRITE: The 16K EEPROM is capable of an 16-byte page write.
A page write is initiated the same as a byte write, but the microcontroller does not send a stop condition after the
first data word is clocked in. Instead, after the EEPROM acknowledges receipt of the first data word, the
microcontroller can transmit up to fifteen data words. The EEPROM will respond with a zero after each data word
received. The microcontroller must terminate the page write sequence with a stop condition (see <blue>Figure 6-3
on page 11).
The data word address lower four bits are internally incremented following the receipt of each data word. The
higher data word address bits are not incremented, retaining the memory page row location. When the word
address, internally generated, reaches the page boundary, the following byte is placed at the beginning of the
same page. If more than sixteen data words are transmitted to the EEPROM, the data word address will “roll over”
and previous data will be overwritten.
ACKNOWLEDGE POLLING: Once the internally timed write cycle has started and the EEPROM inputs are
disabled, acknowledge polling can be initiated. This involves sending a start condition followed by the device
address word. The read/write bit is representative of the operation desired. Only if the internal write cycle has
completed will the EEPROM respond with a zero allowing the read or write sequence to continue.
9
8719A–SEEPR–9/10
6.
Read Operations
Read operations are initiated the same way as write operations with the exception that the read/write select bit in
the device address word is set to one. There are three read operations: current address read, random address
read and sequential read.
CURRENT ADDRESS READ: The internal data word address counter maintains the last address accessed during
the last read or write operation, incremented by one. This address stays valid between operations as long as the
chip power is maintained. The address “roll over” during read is from the last byte of the last memory page to the
first byte of the first page. The address “roll over” during write is from the last byte of the current page to the first
byte of the same page.
Once the device address with the read/write select bit set to one is clocked in and acknowledged by the EEPROM,
the current address data word is serially clocked out. The microcontroller does not respond with an input zero but
does generate a following stop condition (see <blue>Figure 6-4 on page 11).
RANDOM READ: A random read requires a “dummy” byte write sequence to load in the data word address. Once
the device address word and data word address are clocked in and acknowledged by the EEPROM, the
microcontroller must generate another start condition. The microcontroller now initiates a current address read by
sending a device address with the read/write select bit high. The EEPROM acknowledges the device address and
serially clocks out the data word. The microcontroller does not respond with a zero but does generate a following
stop condition (see <blue>Figure 6-5 on page 11).
SEQUENTIAL READ: Sequential reads are initiated by either a current address read or a random address read.
After the microcontroller receives a data word, it responds with an acknowledge. As long as the EEPROM receives
an acknowledge, it will continue to increment the data word address and serially clock out sequential data words.
When the memory address limit is reached, the data word address will “roll over” and the sequential read will
continue. The sequential read operation is terminated when the microcontroller does not respond with a zero but
does generate a following stop condition (see <blue>Figure 6-6 on page 11).
Figure 6-1.
16K 1
0
Device Address
1
0
P2 P1
P0 R/W
MSB
LSB
Figure 6-2.
Byte Write
S
T
A
R
T
DEVICE
ADDRESS
W
R
I
T
E
WORD ADDRESS
S
T
O
P
DATA
SDA LINE
M
S
B
10
R A
/ C
W K
A
C
K
A
C
K
Atmel AT24C16C
8719A–SEEPR–9/10
Atmel AT24C16C
Figure 6-3.
Page Write
S
T
A
R
T
W
R
I
T
E WORD ADDRESS (n)
DEVICE
ADDRESS
DATA (n + 1)
DATA (n)
S
T
O
P
DATA (n + x)
SDA LINE
M
S
B
Figure 6-4.
R A
/ C
WK
A
C
K
A
C
K
A
C
K
A
C
K
Current Address Read
S
T
A
R
T
DEVICE
ADDRESS
S
T
O
P
R
E
A
D
SDA LINE
M
S
B
Figure 6-5.
R A
/ C
WK
DATA
N
O
A
C
K
Random Read
S
T
A
R
T
DEVICE
ADDRESS
W
R
I
T
E
S
T
A
R
T
WORD
ADDRESS n
DEVICE
ADDRESS
R
E
A
D
S
T
O
P
SDA LINE
M
S
B
R A
/ C
W K
A
C
K
A
C
K
DATA n
A
C
K
DUMMY WRITE
Figure 6-6.
N
O
Sequential Read
DEVICE
ADDRESS
R
E
A
D
A
C
K
A
C
K
S
T
O
P
A
C
K
SDA LINE
R A
/ C
WK
DATA n
DATA n + 1
DATA n + 2
DATA n + x
N
O
A
C
K
11
8719A–SEEPR–9/10
7.
Ordering Code Detail
AT 2 4 C 1 6 C - S S H M - B
Atmel Designator
Shipping Carrier Option
B or blank = Bulk (tubes)
T
= Tape and reel
Product Family
Operating Voltage
M
Device Density
16 = 16k
= 1.7 V to 5.5 V
Package Device Grade or
Wafer/Die Thickness
H
Device Revision
U
11
= Green, NiPdAu lead finish
Industrial Temperature range
(-40°C to +85°C)
= Green, matte Sn lead finish,
Industrial Temperature range
(-40°C to +85°C)
= 11 mil wafer thickness
Operating Voltage
P
SS
X
MA
ME
ST
C
WWU
WDT
8.
=
=
=
=
=
=
=
=
=
PDIP
JEDEC SOIC
TSSOP
UDFN
XDFN
SOT23
VFBGA
Wafer unsawn
Die in Tape and Reel
Part Markings
Atmel AT24C16C-PUM
(TOP SIDE ONLY MARK)
|---|---|---|---|---|---|---|---|
A
T
M
L
U
Y
W
W
|---|---|---|---|---|---|---|---|
1
6
C
M
@
|---|---|---|---|---|---|---|---|
ATMEL L O T N U M B E R
|---|---|---|---|---|---|---|---|
|
PIN 1 INDICATOR (DOT)
LINE 1: AT=ATMEL H=MATERIAL SET/GRADE YWW=DATE CODE
LINE 2: 16C=AT24C16C, M=1.7V to 5.5V, @=COUNTRY OF ASSEMBLY
LINE 3: ATMEL LOT NUMBER
12
Atmel AT24C16C
8719A–SEEPR–9/10
Atmel AT24C16C
Atmel AT24C16C-SSHM
|---|---|---|---|---|---|---|---|
A
T
M
L
H
Y
W
W
|---|---|---|---|---|---|---|---|
1
6
C
M
@
|---|---|---|---|---|---|---|---|
ATMEL L O T N U M B E R
|---|---|---|---|---|---|---|---|
|
PIN 1 INDICATOR (DOT)
LINE 1: ATML=ATMEL H=MATERIAL SET/GRADE YWW=DATE CODE
LINE 2: 16C=AT24C16C, M=1.7 to 5.5V, @=COUNTRY OF ASSEMBLY
LINE 3: ATMEL LOT NUMBER
Atmel AT24C16C-XHM
PIN 1 INDICATOR (DOT)
| |---|---|---|---|---|---|
*
A
T
H
Y
W
W
|---|---|---|---|---|---|
1
6
C
M
@
|---|---|---|---|---|---|---|
ATMEL L O T N U M B E R
|---|---|---|---|---|---|---|
LINE 1: AT=ATMEL, H=MATERIAL SET/GRADE, YWW=DATE CODE
LINE 2: 16C=AT24C16C, M=1.7 to 5.5V, @=COUNTRY OF ASSEMBLY
LINE 3: ATMEL LOT NUMBER
Atmel AT24C16C-MAHM
|---|---|---|
1
6
C
|---|---|---|
H
M
@
|---|---|---|
Y
X
X
|---|---|---|
*
|
PIN 1 INDICATOR (DOT)
LINE 1: 16C=AT24C16C
LINE 2: H=MATERIAL SET/GRADE, M=1.7 to 5.5V, @=COUNTRY OF ASSEMBLY
LINE 3: Y=DATE CODE, XX=Trace Code
13
8719A–SEEPR–9/10
Atmel AT24C16C-MEHM
|---|---|---|
1
6
C
|---|---|---|
Y
X
X
|---|---|---|
*
|
PIN 1 INDICATOR (DOT)
LINE 1: 16C=AT24C16C
LINE 2: Y=DATE CODE, XX=Trace Code
Atmel AT24C16C-STUM
TOP MARK
|---|---|---|---|---|
1
6
C
M
U
|---|---|---|---|---|
*
|
PIN 1 INDICATOR (DOT)
Top Mark: 16C=AT24C16C, M=1.7v to 5.5V, U=MATERIAL SET/GRADE
BOTTOM SIDE MARKING
|---|---|---|---|
Y
M
X
X
|---|---|---|---|
Bottom Mark:YM=DATE CODE
XX=Trace Code
Atmel AT24C16C-CUM
|---|---|---|---|
1
6
C
U
|---|---|---|---|
Y
M
X
X
|---|---|---|---|
|<-- PIN 1 This Corner
LINE 1: 16C=AT24C16C, U=MATERIAL SET/GRADE
LINE 2: YM=DATE CODE, XX=Trace Code
14
Atmel AT24C16C
8719A–SEEPR–9/10
Atmel AT24C16C
9.
Ordering Codes
Atmel AT24C16C Ordering Information
Ordering Codes
Voltage
Package
1.7 to 5.5
8P3
(NiPdAu Lead Finish)
1.7 to 5.5
8S1
AT24C16C-SSHM-T(2) (NiPdAu Lead Finish)
1.7 to 5.5
8S1
AT24C16C-PUM (Bulk Form Only)
AT24C16C-SSHM-B
(1)
(NiPdAu Lead Finish)
1.7 to 5.5
8A2
(2)
(NiPdAu Lead Finish)
1.7 to 5.5
8A2
AT24C16C-XHM-B
AT24C16C-XHM-T
(1)
AT24C16C-MAHM-T(2) (NiPdAu Lead Finish)
1.7 to 5.5
8Y6
AT24C16C-MEHM-T(2) (NiPdAu Lead Finish)
1.7 to 5.5
8ME1
AT24C16C-STUM-T(2) (matte Sn)
1.7 to 5.5
5TS1
1.7 to 5.5
8U3-1
1.7 to 5.5
Die Sales
AT24C16C-CUM-T
(2)
(matte Sn)
AT24C16C-WWU11M(3)
Notes:
Operating Range
Lead-Free/Halogen-Free
Industrial Temperature
(-40°C to 85°C)
Industrial Temperature
(-40°C to 85°C)
1. "-B" denotes bulk delivery
2. "-T" denotes tape and reel delivery. SOIC = 4K/reel. TSSOP, UDFN, XDFN, SOT23, and VFBGA = 5K/reel
3. For Wafer sales, please contact Atmel Sales
Package Type
8P3
8-lead, 0.300" Wide, Plastic Dual Inline Package (PDIP)
8S1
8-lead, 0.150" Wide, Plastic Gull Wing Small Outline (JEDEC SOIC)
8A2
8-lead, 4.4mm Body, Plastic, Thin Shrink Small Outline Package (TSSOP)
8Y6
8-lead, 2.00mm x 3.00mm Body, 0.50mm Pitch, Ultra Thin Dual no Lead Package (UDFN)
8ME1
8-lead, 1.80mm x 2.20mm Body, (XDFN)
5TS1
5-lead, 1.60mm Body, Plastic Thin Shrink Small Outline Package (SOT-23)
8U3-1
8-ball, 1.50mm x 2.00mm Body, 0.50mm Pitch, Small Die Ball Grid Array (VFBGA)
15
8719A–SEEPR–9/10
10.
Packaging Information
8P3 – PDIP
E
1
E1
N
Top View
c
eA
End View
COMMON DIMENSIONS
(Unit of Measure = inches)
D
e
D1
A2 A
SYMBOL
MIN
MAX
NOM
A
b2
b3
b
4 PLCS
Side View
L
NOTE
2
A2
0.115
0.130
0.195
b
0.014
0.018
0.022
5
b2
0.045
0.060
0.070
6
b3
0.030
0.039
0.045
6
c
0.008
0.010
0.014
D
0.355
0.365
0.400
D1
0.005
E
0.300
0.310
0.325
4
E1
0.240
0.250
0.280
3
3
3
e
0.100 BSC
eA
0.300 BSC
L
Notes:
0.210
0.115
0.130
4
0.150
2
1. This drawing is for general information only; refer to JEDEC Drawing MS-001, Variation BA for additional information.
2. Dimensions A and L are measured with the package seated in JEDEC seating plane Gauge GS-3.
3. D, D1 and E1 dimensions do not include mold Flash or protrusions. Mold Flash or protrusions shall not exceed 0.010 inch.
4. E and eA measured with the leads constrained to be perpendicular to datum.
5. Pointed or rounded lead tips are preferred to ease insertion.
6. b2 and b3 maximum dimensions do not include Dambar protrusions. Dambar protrusions shall not exceed 0.010 (0.25 mm).
07/19/10
TITLE
Package Drawing Contact:
8P3, 8-lead, 0.300” Wide Body, Plastic Dual
packagedrawings@atmel.com In-line Package (PDIP)
16
GPC
PTC
DRAWING NO.
8P3
REV.
C
Atmel AT24C16C
8719A–SEEPR–9/10
Atmel AT24C16C
8S1 – JEDEC SOIC
C
1
E
E1
L
N
Ø
TOP VIEW
END VIEW
e
b
A
COMMON DIMENSIONS
(Unit of Measure = mm)
A1
D
SIDE VIEW
SYMBOL
MIN
A
1.35
–
1.75
A1
0.10
–
0.25
b
0.31
–
0.51
C
0.17
–
0.25
D
4.80
–
5.05
E1
3.81
–
3.99
E
5.79
–
6.20
e
Notes: This drawing is for general information only.
Refer to JEDEC Drawing MS-012, Variation AA
for proper dimensions, tolerances, datums, etc.
MAX
NOM
NOTE
1.27 BSC
L
0.40
–
1.27
Ø
0°
–
8°
5/19/10
TITLE
Package Drawing Contact:
8S1, 8-lead (0.150” Wide Body), Plastic Gull
packagedrawings@atmel.com Wing Small Outline (JEDEC SOIC)
GPC
SWB
DRAWING NO.
8S1
REV.
F
17
8719A–SEEPR–9/10
8A2 – TSSOP
3
2 1
Pin 1 indicator
this corner
E1
E
L1
N
L
Top View
End View
COMMON DIMENSIONS
(Unit of Measure = mm)
SYMBOL
D
A
b
e
A2
NOM
MAX
NOTE
3.00
3.10
2, 5
3, 5
6.40 BSC
E1
4.30
4.40
4.50
A
–
–
1.20
A2
0.80
1.00
1.05
b
0.19
–
0.30
e
L
Side View
L1
4
0.65 BSC
0.45
0.60
0.75
1.00 REF
1. This drawing is for general information only. Refer to JEDEC Drawing MO-153, Variation AA, for proper dimensions,
tolerances, datums, etc.
2. Dimension D does not include mold Flash, protrusions or gate burrs. Mold Flash, protrusions and gate burrs shall
not exceed 0.15 mm (0.006 in) per side.
3. Dimension E1 does not include inter-lead Flash or protrusions. Inter-lead Flash and protrusions shall not exceed
0.25 mm (0.010 in) per side.
4. Dimension b does not include Dambar protrusion. Allowable Dambar protrusion shall be 0.08 mm total in excess
of the b dimension at maximum material condition. Dambar cannot be located on the lower radius of the foot.
Minimum space between protrusion and adjacent lead is 0.07 mm.
5. Dimension D and E1 to be determined at Datum Plane H.
5/19/10
TITLE
Package Drawing Contact:
8A2, 8-lead 4.4mm Body, Plastic Thin
packagedrawings@atmel.com Shrink Small Outline Package (TSSOP)
18
2.90
E
D
Notes:
MIN
GPC
TNR
DRAWING NO.
8A2
REV.
E
Atmel AT24C16C
8719A–SEEPR–9/10
Atmel AT24C16C
8Y6 – Mini Map
D2
A
b
(8X)
E
E2
Pin 1
Index
Area
Pin 1 ID
L (8X)
D
A2
e (6X)
A1
1.50 REF.
A3
COMMON DIMENSIONS
(Unit of Measure = mm)
SYMBOL
Notes: 1. This drawing is for general information only. Refer to
JEDEC Drawing MO-229, for proper dimensions,
tolerances, datums, etc.
2. Dimension b applies to metallized terminal and is
measured between 0.15 mm and 0.30 mm from the
terminal tip. If the terminal has the optional radius on the
other end of the terminal, the dimension should not be
measured in that radius area.
3. Soldering the large thermal pad is optional, but not
recommended.
No
electrical
connection
is
accomplished to the device through this pad, so if
soldered it should be tied to ground
MIN
NOM
MAX
D
2.00 BSC
E
3.00 BSC
D2
1.40
1.50
1.60
E2
–
–
1.40
A
–
–
0.60
A1
0.00
0.02
0.05
A2
–
–
0.55
A3
L
0.20 REF
0.20
e
b
NOTE
0.40
0.30
0.50 BSC
0.20
0.25
0.30
2
11/21/08
TITLE
8Y6, 8-lead, 2.0x3.0 mm Body, 0.50 mm Pitch,
Package Drawing Contact:
packagedrawings@atmel.com UltraThin Mini-MAP, Dual No Lead Package
(Sawn)(UDFN)
GPC
YNZ
DRAWING NO.
REV.
8Y6
E
19
8719A–SEEPR–9/10
8ME1 – XDFN
e1
D
8
7
6
b
5
L
E
PIN #1 ID
0.10
PIN #1 ID
0.15
1
2
3
4
A1
b
e
A
Top View
Side View
Bottom View
COMMON DIMENSIONS
(Unit of Measure = mm)
SYMBOL
MIN
NOM
MAX
A
–
–
0.40
A1
0.00
–
0.05
D
1.70
1.80
1.90
E
2.10
2.20
2.30
b
0.15
0.20
0.25
e
0.40 TYP
e1
L
NOTE
1.20 REF
0.26
0.30
0.35
8/3/09
TITLE
8ME1, 8-lead (1.80 x 2.20 mm Body)
Package Drawing Contact:
packagedrawings@atmel.com Extra Thin DFN (XDFN)
20
GPC
DTP
DRAWING NO.
REV.
8ME1
A
Atmel AT24C16C
8719A–SEEPR–9/10
Atmel AT24C16C
5TS1 – SOT23
e1
5
C
4
E1
CL
E
L1
1
3
2
End View
Top View
b
A2
SEATING
PLANE
e
A
A1
COMMON DIMENSIONS
(Unit of Measure = mm)
D
Side View
SYMBOL
Notes:
1. Dimensions D does not include mold flash, protrusions or gate
burrs. Mold flash protrusions or gate burrs shall not exceed 0.15
mm per end. Dimensions E1 does not include interlead flash or
protrusion. Interlead flasg or protrusion shall not exceed 0.15 mm
per side.
2. The package top may be smaller than the package bottom.
Dimensions D and E1 are deteremined at the outermost extremes
of the plastic body exclusive of mold flash, tie bar burrs, gate burrs,
and interlead flash, but including any mismatch between the top
and bottom of the plastic body.
3. These dimensions apply to the flat section of the lead between 0.08
mm and 0.15 mm from the lead tip.
4. Dimension “b” does not include dambar protrusion. Allowable
dambar protrusion shall be 0.80 mm total in excess of the “b”
dimension at maximum material condition. The dambar cannot be
located on the lower radius of the foot. Minimum space between
protrusion and an adjacent lead shall not be less than 0.07 mm.
5. This drawing is for general information only. Refer to JEDEC
Drawing MO-193, Variation AB for additional information.
MIN
NOM
MAX
A
–
–
1.10
A1
0.00
–
0.10
A2
0.70
0.90
1.00
c
0.08
–
0.20
NOTE
3
D
2.90 BSC
1, 2
E
2.80 BSC
1, 2
E1
1.60 BSC
1, 2
L1
0.60 REF
e
0.95 BSC
e1
b
1.90 BSC
0.30
–
0.50
3, 4
11/05/08
TITLE
5TS1, 5-lead, 1.60 mm Body, Plastic Thin
Package Drawing Contact:
packagedrawings@atmel.com Shrink Small Outline Package (Shrink SOT)
GPC
TSZ
DRAWING NO.
REV.
5TS1
B
21
8719A–SEEPR–9/10
8U3-1 – dBGA2
E
D
5.
PIN 1 BALL PAD CORNER
b
A1
A2
TOP VIEW
A
SIDE VIEW
PIN 1 BALL PAD CORNER
1
2
4
3
d
(d1)
8
6
7
5
COMMON DIMENSIONS
(Unit of Measure - mm)
e
(e1)
BOTTOM VIEW
8 SOLDER BALLS
Notes:
SYMBOL
MIN
NOM
MAX
A
0.73
0.79
0.85
A1
0.09
0.14
0.19
A2
0.40
0.45
0.50
b
0.20
0.25
0.30
1. This drawing is for general information only.
D
1.50 BSC
2. Dimension ‘b’ is measured at maximum solder ball diameter.
E
2.0 BSC
3. Solder ball composition shall be 95.5Sn-4.0Ag-.5Cu.
e
0.50 BSC
e1
0.25 REF
d
1.00 BSC
d1
0.25 REF
NOTE
2
07/14/10
TITLE
Package Drawing Contact:
8U3-1, 8-ball, 1.50 x 2.00 mm Body,
packagedrawings@atmel.com 0.50 pitch, VFBGA Package (dBGA2)
22
GPC
GXU
DRAWING NO.
8U3-1
REV.
D
Atmel AT24C16C
8719A–SEEPR–9/10
Atmel AT24C16C
11.
Revision History
Doc. Rev.
Date
Comments
8719A
09/2010
Initial document release
23
8719A–SEEPR–9/10
Product Contact
Product Line
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