PNX0161 PNX0161 personal audio IC Rev. 01 — 17 January 2008 Product data sheet 1. Introduction The Nexperia PNX0161 is an integrated IC that serves as USB audio and HID class device for a USB headset. 2. General description Recent development in mobile phones is to have the phone equipped with a USB micro A plug as a single plug for charging and connection to all enhancements (like a headset, but also for other enhancements like GPS accessories etc.) The PNX0161 is based on an ARM7TDMI CPU core with data/instruction cache of 8 kB and USB 2.0 FS device interface. 3. Features 3.1 General features n n n n Enables one chip solution for USB headset. Requires very low power. Supports FM radio input including low-power audio bypass mode. Is available in a small footprint package TFBGA88 of 7 × 7 sq. mm with 0.5 mm pitch. 3.2 Hardware features n n n n n n n n n n ARM7TDMI processor core with 8 kB data/instruction cache. Embedded SRAM, 32 kB. Embedded ROM memory for storing the boot code, 32 kB. Embedded flash memory for storing the program code, 256 kB (second production version will be ROM based). Integrated USB 2.0 full-speed device interface. Intelligent configuration power management. Embedded high-efficiency power supply unit powered from a USB supply. Supports power optimization by optimizing supply voltages. Embedded DMA controller. Digital interfaces: u Integrated stereo ADC with programmable amplifier (microphone, line input and tuner input). u Integrated IIS input and output interfaces (configurable for master/slave options). u Integrated fast UART with DMA support. PNX0161 NXP Semiconductors PNX0161 personal audio IC n n n n n u Integrated master/slave I2C interface. Analog interfaces: u Integrated stereo ADC with programmable amplifier (microphone, line input and tuner input). u Microphone bias block. u Integrated stereo DAC with Class-AB headphone amplifier for high quality audio with increased driving capabilities and for use in tuner applications. u The integrated ADC and DAC both have a 24 bits data path. Two integrated general purpose timers. Integrated watchdog timer. Low-power tuner mode with direct connection between tuner input and Class-AB headphone amplifier with analog volume control. JTAG interface with boundary scan and ARM debug access. 3.3 Software features This section lists the software features that the PNX0161 is capable of performing. n Playback: playback by the headphones of a received USB audio stream from the USB host via the DAC. n Recording: audio stream converted by the ADC from the microphone is sent via the USB audio stream to the USB host. n Phone call: in addition to the first case, simultaneously returning a USB audio stream that is converted by the ADC from the microphone. The microphone is mixed to the headphone stream, known as side-tone mixing. n Tuner listening: the FM tuner audio stream is sent to the headphones. No stream is sent or received via USB. n Tuner recording: the FM tuner audio stream is sent to the headphones. In addition the FM tuner stream is streamed to the phone via USB. n USB HID class for FM tuner RDS info. n USB device firmware upgrade. n Intelligent power management software. n Audio postprocessing features like volume control. 3.4 Software features on request This section lists the software features that the PNX0161 is capable of performing. n Audio source selection between line-in and USB audio in for playback path, by toggling GPIO pin. n Support for stereo recording from analog and I2S inputs at sample rates other than 48 kHz. n Support for stereo playback from USB audio, I2S and analog inputs at sample rates other than 48 kHz. n Option for a “direct analog link” for playback applications where only volume control is performed in the PNX0161. The “direct analog link” provides a full analog audio path through the PNX0161 from the analog stereo line input to the low output impedance buffer output through an analog volume control block. When the option is not selected, the analog stereo input is converted to the digital domain by the on-chip ADC. Audio PNX0161_1 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 01 — 17 January 2008 2 of 21 PNX0161 NXP Semiconductors PNX0161 personal audio IC postprocessing is performed in the digital domain. The processed signals are then converted back to analog by the on-chip DAC and fed to the analog outputs through the low impedance output buffer. n Digital EQ for loudspeaker characteristics compensation. n For audio rendering applications: digital bass boost, treble expander, stereo widening, FM radio acoustical performance improvement and other NXP software LifeVibes music algorithms. n For applications as USB (mobile)-phones hands-free teleconference stations: Full duplex acoustic echo cancellation, intelligibility improvement and other NXP software LifeVibes voice algorithms. 4. Applications n USB headset n FM radio USB headset n Docking station 5. Ordering information Table 1. Ordering information Type numbers PNX0161ET/N101 Package Name Description Version TFBGA88 TFBGA88: plastic thin fine-pitch ball grid array package; 88 balls; body 7 x 7 x 0.8 mm SOT951-1 6. Marking Table 2. Marking codes Lines Digits Comments A 0161ET/01 Commercial name B Diffusion batch ID DBID and ASID /wafer ID Assy sequence ID C ZPDYYWW1X Z = Fab. Location (SSMC) P = Assembly Factory (APC) D = Green product meeting RoHS (Lead and Halogen free) YYWW = date code 1 version = N1 version X = development status code (will change to ‘Y’ for production.) PNX0161_1 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 01 — 17 January 2008 3 of 21 PNX0161 NXP Semiconductors PNX0161 personal audio IC A B1 B2 C M347 0 : 10 :7 :7 : 10 7 010aaa417 Fig 1. PNX0161 marking 7. Block diagram RINGOSC PSU ARM7TDMI JTAG/TCB SDMA CACHE 8kB FC M AHB MULTI-LAYER S S S S S S S MMIO ROMI RAMI FLASHCNTRL INTC ROM 32kB RAM 32kB EMB FLASH 256kB AHB2VPB3 ASYNC AUDIO_SYSCREG AUDIO SS SUBSYSTEM SAO1 SAO2 SAI1 AHB2VPB0 ASYNC PLL'S & OSC (C18X050M C18X032k C18PL160M C18PL550M) AHB2VPB1 ASYNC AHB2VPB2 SYNC SA12 LNA PGA WATCHDOG TIMER 1 SYSCREG TIMER 2 USB 2.0 FS CGU 12CM/S UART PGA SDC PGA SDC ADC DEC DAI IOCONF M U DAO X M U INT SDAC X MICSUP EVENT ROUTER ANVC CLASS AB 010aaa407 Fig 2. PNX0161 block diagram PNX0161_1 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 01 — 17 January 2008 4 of 21 PNX0161 NXP Semiconductors PNX0161 personal audio IC 8. Pinning information 8.1 Pinning COILS/CAPACITORS SUPPLIES USB 12 4 2 ANALOG OUT RESET CLOCK_OUT 32.768 kHz XTAL'S 12 MHz/ 32.768 kHz 9 11 2 IO CORE SUPPLY SUPPLY 2 USB 2.0FS PHY PSU MIC IN LINE IN OR FM RADIO FM RADIO I2C MASTER/SLAVE 4 6 IO/CORE IOCONF MICBIAS 4 DAO IOCONF LNA/PGA/ADC IIS OUT 3 DAI IIS IN DAC/HP IOCONF(8) 8 CGU 8 MODE 0 MODE 1 PSU_STOP GPIO OSC IOCONF MULTI-ICE 6 DAO JTAG/TCB FLASH 2 1 SUPPLY 010aaa415 Fig 3. PNX0161 pin configuration diagram Table 3. Pinning list BGA pin name GPIO BGA ball Digital I/O level Application function Pin state after reset Cell type[1] Description - analog input apio (Z) 12 MHz clock input 12 MHz oscillator (fixed 4 pins) XTALH_IN - J1 XTALH_OUT - H1 - analog output apio (IO) 12 MHz clock output XTALH_VDDA18 - H2 SUP2 - - vddco Analog supply oscillators XTALH_VSSA - K2 - - - vssco Analog ground oscillators 32.768 kHz oscillator (fixed 4 pins) XTALL_IN - G1 - analog input apio (Z) 32.768 kHz clock input XTALL_OUT - F1 - analog output apio (IO) 32.768 kHz clock output XTALL_VDDA18 - E2 SUP2 - - vddco Analog supply oscillators/PLLs XTALL_GNDA - G2 - - - vssco Analog ground oscillators/PLLs I2C (fixed 2 pins) PNX0161_1 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 01 — 17 January 2008 5 of 21 PNX0161 NXP Semiconductors PNX0161 personal audio IC Table 3. Pinning list …continued BGA pin name GPIO BGA ball Digital I/O level Application function Pin state after reset Cell type[1] Description I2C_SDA - C13 0-5 VDC tolerant input/output input iic3m4sdat5v Serial data I2C I2C_SCL - C12 0-5 VDC tolerant input/output input iic3m4sdat5v Serial data I2C - A13 SUP1 - input bpts5ptpht5v USB supply detection USB_CONNECT_N - B13 0-5 VDC tolerant - output bpts5ptpht5v Soft connect output USB 2.0 FS USB_DP - A12 - - input usb 11f1 Positive USB data line USB_DM - A11 - - input usb 11f1 Negative USB data line PSU_VBUSA - N9 SUP1 analog - vddcobf USB supply voltage PSU_VBUSB - N12 SUP1 analog - vddcobf USB supply voltage PSU_VOUT33 - M13 SUP3 - - vddcobf DCDC1 3.3 V output voltage PSU_LX_VOUT33 - N10 - - - vddco Connection to DCDC1 external coil (PSU_LX1) PSU_VSS1 - M9 - - - vssco Ground for DCDC1 Nswitch (no substrate) PSU_VSS2 - M10 - - - vssco Ground for DCDC2 Nswitch (no substrate) PSU_LX_VOUT14 - N11 - analog - vddco Connection to DCDC2 3 external coil (PSU_LX2) PSU_VOUT14 - N13 SUP2 - - vddcobf DCDC1 1.4 V output voltage PSU_CLEAN - L12 - - - vssco Reference circuit ground not connected to substrate PSU_GND - M11 - - - vssco Core ground and substrate PSU_PLAY - L13 - analog - apio Play button input PSU_STOP - K13 - analog - apio Stop button input GPIO_0 Yes J13 0-5 VDC tolerant input/output input bpts5ptpht5v General purpose IO pin MODE0 (pull-down)[2] GPIO_1 Yes G12 0-5 VDC tolerant input/output input bpts5ptpht5v General purpose IO pin MODE1 (pull-down)[3] GPIO_2 Yes H13 0-5 VDC tolerant input/output input bpts5ptpht5v General purpose IO pin STOP GPIO_3 Yes G13 0-5 VDC tolerant input/output input bpts5ptpht5v General purpose IO pin GPIO_4 Yes H12 0-5 VDC tolerant input/output input bpts5ptpht5v General purpose IO pin USB interface (fixed 4 pins) USB_VBUS PSU (fixed 12 pins) GPIO (fixed 8 pins) PNX0161_1 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 01 — 17 January 2008 6 of 21 PNX0161 NXP Semiconductors PNX0161 personal audio IC Table 3. Pinning list …continued BGA pin name GPIO BGA ball Digital I/O level Application function Pin state after reset Cell type[1] Description GPIO_5 Yes F13 0-5 VDC tolerant input/output input bpts5ptpht5v General purpose IO pin GPIO_6 Yes F12 0-5 VDC tolerant input/output input bpts5ptpht5v General purpose IO pin GPIO_7 Yes E13 0-5 VDC tolerant input/output input bpts5ptpht5v General purpose IO pin DAI_DATA Yes N1 0-5 VDC tolerant input/output input (GPIO) bpts5ptpht5v I2S in data DAI_WS Yes N4 0-5 VDC tolerant input/output input (GPIO) bpts5ptpht5v I2S in wordselect DAI_BCK Yes N6 0-5 VDC tolerant input/output input (GPIO) bpts5ptpht5v I2S in bit clock DAO_DATA Yes N7 0-5 VDC tolerant input/output input (GPIO) bpts5ptpht5v I2S out data DAO_WS Yes M7 0-5 VDC tolerant input/output input (GPIO) bpts5ptpht5v I2S out wordselect DAO_BCK Yes M6 0-5 VDC tolerant input/output input (GPIO) bpts5ptpht5v I2S out bit clock DAO_CLK Yes N5 0-5 VDC tolerant input/output input (GPIO) bpts5ptpht5v I2S out clock 256 FS UART_TXD Yes K12 0-5 VDC tolerant input/output input (GPIO) bpts5ptpht5v Serial output UART_RXD Yes J12 0-5 VDC tolerant input/output input (GPIO) bpts5ptpht5v Serial input[4] RSTN_IN - K1 0-5 VDC tolerant input input bpts5ptpht5v System reset input (active low pull-up) CLK_OUT Yes J2 0-5 VDC tolerant input/output output bpts5ptpht5v 32.768 kHz clock output SUP2 - - vddco Supply DAI (fixed 3 pins) DAO (fixed 4 pins) UART (fixed 2 pins) CGU (fixed 2 pins) Embedded flash (fixed 1 pin) FLASH_VDD_HV - E12 NA - Not visible on package - - bpts5ptpht5v Duty cycle measurement - - Not visible on package - - bpts5ptpht5v Address count up (pull-down) - - Not visible on package - - apio (IO) Sense amp trip point PNX0161_1 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 01 — 17 January 2008 7 of 21 PNX0161 NXP Semiconductors PNX0161 personal audio IC Table 3. Pinning list …continued Application function Pin state after reset Cell type[1] Description Not visible on package - - apio (ZI) Measure trip point current for sense amps - Not visible on package - - bpts5ptpht5v Overrule write and erase security and protections (pull-down) - - Not visible on package - - VPEX Observe or supply positive write/erase voltage (11.5 V) - - Not visible on package - - VNEX Observe or supply negative write/erase voltage (5.5 V) BGA pin name GPIO BGA ball - - - Digital I/O level DAC/HP (fixed 11 pins) DAC_VDDA33 - B10 SUP3 - - vddco SDAC analog supply DAC_VREFP - A9 AI - - apio SDAC positive reference voltage DAC_VREFN - B9 AI - - apio SDAC negative reference voltage HP_OUTL - A5 AO - - apio Headphone left output HP_OUTR - A7 AO - - apio Headphone right output HP_FCL - B5 AI - - apio Headphone filter capacitor left HP_FCR - A8 AI - - apio Headphone filter capacitor right HP_VDDA33 - B6 Supply - - vddco Headphone analog supply class-AB - B6 Supply - - vddco Double bonding - B7 Ground - - vssco Headphone analog ground - B7 Ground - - vssco Double bonding - A6 AO - - apio Headphone common output reference Class-AB - - AO - - apio - - B8 AI - - apio Analog reference supply For headphone and DAC HP_GNDA HP_OUTC HP_VREF ADC/MIC (fixed 9 pins) ADC_MIC - A4 AI - - apio ADC microphone input ADC_VINL - A2 AI - - apio ADC line input left ADC_VINR - A1 AI - - apio ADC line input right ADC_VREF - B1 AO - - apio ADC reference voltage output ADC_VREFN - C2 AI - - apio ADC negative reference voltage PNX0161_1 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 01 — 17 January 2008 8 of 21 PNX0161 NXP Semiconductors PNX0161 personal audio IC Table 3. Pinning list …continued BGA pin name GPIO BGA ball Digital I/O level Application function Pin state after reset Cell type[1] Description ADC_VREFP - A3 AI - - apio ADC positive reference voltage ADC_VDDA18 - D1 Supply - - vddco ADC digital voltage supply ADC_VDDA33 - C1 Supply - - vddco ADC analog voltage supply ADC_GNDA - D2 Ground - - vssco ADC analog ground MicSUP (fixed 2 pins) MIC_VREFSUP - B4 AI - - apio MIC clean reference voltage MIC_OUTSUP - B3 AO - - apio MIC supply voltage Debugging (fixed 6 pins) JTAGSEL_ARM - M3 0-5 VDC tolerant input input bpts5ptpht5v JTAG selection ARM (pull-down) JTAG_TDI - M4 0-5 VDC tolerant input input bpts5ptpht5v JTAG data input (pull-up) JTAG_TCK - N2 0-5 VDC tolerant input input bpts5ptpht5v JTAG clock input (pull-up) JTAG_TMS - N3 0-5 VDC tolerant input input bpts5ptpht5v JTAG mode select input (pull-up) JTAG_TRST_N - M1 0-5 VDC tolerant input input bpts5ptpht5v JTAG reset input (pull-down) JTAG_TDO - M5 0-5 VDC tolerant input/output output bpts5ptpht5v JTAG data output Supplies (fixed 10 pins) VDDE0 - E1 SUP3 - - vdde3v3 Peripheral supply VSSE0 - F2 - - - vsse3v3 Peripheral ground VDDE1 - N8 SUP3 - - vdde3v3 Peripheral supply VSSE1 - M8 - - - vsse3v3 Peripheral ground VDDE2 - D13 SUP3 - - vdde3v3 Peripheral supply VSSE2 - D12 - - - vsse3v3 Peripheral ground VDDI0 - L1 SUP2 - - vddco Core supply VSSI0 - L2 - - - vssco Core ground VDDI1 - A10 SUP2 - - vddco Core supply VSSI1 - B11 - - - vssco Core ground - - - - - Unused BGA balls (4 pins) Not used - B2 Not used - B12 - - - - - Not used - M2 - - - - - Not used - M12 - - - - - [1] Cell types are explained in Table 5. [2] GPIO0 is a bootstrap MODE pin, for further details see application note on PNX0161. PNX0161_1 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 01 — 17 January 2008 9 of 21 PNX0161 NXP Semiconductors PNX0161 personal audio IC [3] GPIO1 is a bootstrap MODE pin, for further details see application note on PNX0161. [4] UART_TX is a bootstrap MODE pin, for further details see application note on PNX0161. 1 2 3 4 A ADC_ VINR ADC_ VINL ADC_ VREFP B ADC_ VREF #N/A MIC_ OUTSUP C ADC_V DDA33 D 9 10 11 12 13 DAC_ VREFP VDDI1 USB_DM USB_DP USB_ VBUS A DAC_ VREFN DAC_ VDDA33 VSSI1 #N/A USB_ CONNECT_ N B ADC_ VREFN I2C_SCL I2C_SDA C ADC_ VDDA18 ADC_ GNDA VSSE2 VDDE2 D E VDDE0 XTALL_ VDDA18 FLASH_ VDD_HV GPIO_7 E F XTALL_ OUT VSSE0 GPIO_6 GPIO_5 F G XTALL_ IN XTALL_ GNDA GPIO_1 GPIO_3 G H XTALH_ OUT XTALH_ VDDA18 GPIO_4 GPIO_2 H J XTALH_IN CLK_OUT UART_RXD GPIO_0 J K RSTN_IN XTALH_ VSSA UART_TXD PSU_STOP K L VDDI0 VSSI0 PSU_CLEAN PSU_PLAY L M JTAG_ TRST_N #N/A N DAI_DATA 6 7 8 ADC_ MIC HP_OUTL HP_OUTC HP_OUTR MIC_ VREFSUP HP_FCL HP_ VDDA33 HP_FCR HP_GNDA HP_VREF TFBGA88 JTAGSEL_ JTAG_TDI ARM JTAG_TCK JTAG_TMS 1 5 2 3 DAI_WS 4 JTAG_TDO DAO_BCK DAO_CLK DAI_BCK 5 6 DAO_WS VSSE1 DAO_DATA VDDE1 7 8 PSU_VSS1 PSU_VSS2 PSU_GND PSU_ VBUSA PSU_LX_ VOUT33 9 10 #N/A PSU_LX_ PSU_VBUSB VOUT14 11 12 PSU_ VOUT33 M PSU_ VOUT14 N 13 010aaa416 Fig 4. Pinning diagram Table 4. Supply domains Supply domain Typical voltage (V) Related supply pins Description SUP2 1.4 - 1.8 VDDI0, VDDI1, VDDA18 Core supply SUP3 3.0 - 3.3 VDDE0, VDDE1, VDDE2, Peripheral and analog ADC_VDDA33, supplies DAC_VDDA33, HP_VDDA33 SUP1 4.0 - 5.25 PSU_VBUS PNX0161_1 Product data sheet USB VBUS voltage © NXP B.V. 2008. All rights reserved. Rev. 01 — 17 January 2008 10 of 21 PNX0161 NXP Semiconductors PNX0161 personal audio IC Table 5. Cell types Library name[1] Function Description bpts5ptpht5v Digital input/output Bidirectional pad; plain input; 3-state output; SSO control; CMOS with programmable hysteresis and repeater. bpts5ptpht5v Digital input/output IIC cell; clock signal; cell based ESD protection. apio Analog input/output Analog pad; analog input/output. vddco Core supply - vddcobf Core supply - vddco* Core supply An adapted VDDCO pad from library with the following modification: vddi Core supply - vdde3v3 Peripheral supply - vssco Core ground - vssis Core ground - vsse3v3 Peripheral ground - [1] • Removing the capacitive coupled gate triggering of the gcNMOST protection between pad and substrate. • • • Connect the gate to substrate. Add a P-diode between ggNMOST and pad. Add a N-diode between pad and substrate. The library name is the official name of the cell in the CMOS library. To increase readability, nicknames for the cells have been created for this document. Throughout this document, the nickname is used to refer to a certain cell type instead of its official name. 9. Limiting values Table 6. Limiting values In accordance with the absolute maximum rating system (IEC 134) Symbol Parameter Conditions Min Typ Max Unit VI input voltage - −0.5 - +5.0 V VO output voltage - −0.5 - +3.6 V IO output current VDD(EXT) = 3.3 V - 4 - mA Tj junction temperature - 0 - 125 °C Tstg storage temperature - −40 - +85 °C Tamb ambient temperature - −15 +25 +70 °C −2000 - +2000 V - 500 - V All digital I/Os Temperature values Electrostatic handling VESD electrostatic discharge HBM, human body voltage mode CDM, charge, device mode PNX0161_1 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 01 — 17 January 2008 11 of 21 PNX0161 NXP Semiconductors PNX0161 personal audio IC 10. Static characteristics This chapter gives an overview of the most important static characteristics of the PNX0161. More detailed specifications will be given in future versions of this document. Table 7. Static characteristics Symbol Parameter Conditions Min Typ Max Unit VDD(EXT) external supply voltage <0,2 > 3.0 3.3 3.6 V VDD(INT) internal supply voltage <0..1 > 1.3 1.4 1.95 V VDDA(1V8) analog supply voltage 12 MHz XTAL osc/PLL (1.8 V) 1.3 1.4 1.95 V VDDA(3V3) analog supply voltage (3.3 V) 3.0 3.3 3.6 V VBUS bus supply voltage 4.0 5.0 5.25 V Table 8. Power supply unit static characteristics Symbol Parameter Conditions Min Typ Max Unit PO(VBUS) VBUS output power - 4.0 5 5.25 V VO(3V3) output voltage (3.3 V) - 2.4 3.0 3.2 V ∆VO(3V3) output voltage variation (3.3 V) - −50 - +50 mV VO(1V4) output voltage (1.4 V) - 1.3 1.4 1.95 V ∆VO(1V4) output voltage variation (1.4 V) - −50 - +50 mV IO(3V3) output current (3.3 V) - - - 50 mA IO(1V4) output current (1.4 V) - - - 50 mA ηDCDC(33) DC-to-DC converter efficiency (33 %) - - 85 - % ηDCDC(14) DC-to-DC converter efficiency (14 %) - - 81 - % fclk clock frequency - - 12 - MHz fosc oscillator frequency - 8 10 12 MHz fsw switching frequency - - 1 - MHZ Table 9. Analog in - electrical parameters DC characteristics Symbol Parameter Conditions Min Typ Max Unit IDDA(ADC)(3V3) ADC analog supply current (3.3 V) - - 2.2 - mA IDDA(ADC)(1V8) ADC analog supply current (1.8 V) - - - 20 mA Iref(neg) negative reference current - - 20 - µA Iref(pos) positive reference current - - 20 - µA IDDA(SDC) SDC analog supply current - - 0.4 - mA IDDA(PGA) PGA analog supply current - - 430 - µA GPGA PGA gain - - −1.94 - dB IDDA(bias) bias analog supply current N = 13 for all modules on - 190 + N*10 - µA IDDA(LNA) LNA analog supply current - - 0.85 1.2 mA PNX0161_1 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 01 — 17 January 2008 12 of 21 PNX0161 NXP Semiconductors PNX0161 personal audio IC Table 9. Analog in - electrical parameters DC characteristics …continued Symbol Parameter Conditions Min Typ Max Unit GLNA LNA gain in a bandwidth between 300 Hz and 5 kHz. 28 30 32 dB Rref reference resistance headphone and DAC - 11.25 - kΩ Rcom common resistance headphone - 11.25 - kΩ ∆G gain mismatch - 0 - 24 dB PNX0161_1 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 01 — 17 January 2008 13 of 21 PNX0161 NXP Semiconductors PNX0161 personal audio IC 11. Dynamic characteristics This chapter shows the audio performance characteristics of the PNX0161. A more extensive list of dynamic characteristics will be given in future versions of this document. Table 10. Symbol Timing and other characteristics Parameter Conditions Min Typ Max Unit 12 MHz oscillator (XTALH) fosc oscillator frequency - - 12 - MHz δ duty cycle - - 50 - % Ci input capacitance - - - 2 pF Co output capacitance - - - 0.74 pF tstart start time - - 500 - µs P power dissipation crystal level of drive 100 - 500 µW Table 11. Dynamic characteristics of Class AB amplifier at 3.0 V - DC mode[1] Symbol Parameter Conditions Min Typ Max Unit VO output voltage HP unloaded - 830 - mVRMS Po output power RL = 32 Ω - - 2.5 mW (THD+N)/S total harmonic distortion plus noise-to-signal ratio (measured with 20 kHz block filter) - −59 - dB at −60 dBFS, fi = 1 kHz, RL = 32 Ω - −35 −30 dBA at 0 dBFS, fi = 1 kHz, RL = 32 Ω S/N signal-to-noise ratio HP unloaded (measured with 20 kHz block filter) - 96 - dBA αripple ripple rejection RL = 32 Ω - 6 - dB αct crosstalk attenuation at 0 dBFS, fi = 1 kHz, RL = 32 Ω - −42 - dB [1] Tamb = 25 °C; unless otherwise specified. Table 12. Analog in - electrical parameters AC characteristics Symbol Parameter Conditions Min Typ Max Unit B bandwidth at 48 kHz sampling rate - - 21.7 kHz THD total harmonic distortion THD+N @ 0 dBFS; fi = 1 kHz - −73 - dB - 30 - dBA tuner, line input level = 1 V, PGA setting 0 dB THD+N @ −60 dBFS; fi = 1 kHz; A-weighted tuner, line imputatively = 1 mV, PGA setting 0 dB S/N signal-to-noise ratio tuner, line imputatively = 1 V, PGA setting 0 dB; A-weighted - 90 - dBA Zi input impedance line in/tuner mode - 12 - kΩ PNX0161_1 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 01 — 17 January 2008 14 of 21 PNX0161 NXP Semiconductors PNX0161 personal audio IC Table 12. Analog in - electrical parameters AC characteristics …continued Symbol Parameter Conditions Min Typ Max Unit total harmonic distortion THD+N @ 0 dBFS - −70 - dB - 31 - dBA - 5 - kΩ Microphone THD Vi mic = 20 µV; fi = 1 kHz THD+N @ −60 dBFS; A-weighted Vi mic = 20 µV; fi = 1 kHz Zi Table 13. input impedance - Digital - electrical parameters AC characteristics Symbol Parameter Conditions Min Typ Max Unit fARM ARM frequency - - - 48 MHz Table 14. Power figures Symbol Parameter Conditions Min Typ Max Unit Istb(susp) suspend mode standby current - - 750 - µA P power dissipation playback: by the headphones of a received USB audio stream from USB host via the DAC. - 45 - mW - 53 - mW • • • Vbus = 5 V VO(1V4) = 1.46 V VO(3V3) = 3.0 V DC-coupled (HP 32 Ω) output power adjusted to 0,5 mW using 1 kHz sine wave. normalized test MP3 file is used, tin arena, chains. playback volume: maximum volume in volume control, Vol = 35 in media player recording: audio stream converted by the ADC from the microphone is sent via USB audio stream to the USB host. • • • Vbus = 5 V VO(1V4) = 1.46 V VO(3V3) = 3.0 V PNX0161_1 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 01 — 17 January 2008 15 of 21 PNX0161 NXP Semiconductors PNX0161 personal audio IC Table 14. Power figures …continued Symbol Parameter Conditions Min Typ Max Unit P power dissipation phone call: in addition to the first case, simultaneously returning a USB audio stream that is converted by the ADC from the microphone. The microphone is mixed to the headphone stream, known as side-tone mixing. - 72 - mW tuner listening: the FM tuner audio stream is sent to the headphones. No stream is sent or received via USB. - 80 - mW tuner recording: the FM tuner audio stream is sent to the headphones. In addition the FM tuner stream is streamed to the phone via USB. THD+N @ 0 dBFS; fi = 1 kHz. - 117 - mW phone UC + max freq SYSBASE at 48 MHz and MAX volume. - 172 - mW • • • Vbus = 5 V VO(1V4) = 1.46 V VO(3V3) = 3.0 V DC-coupled (HP 32 Ω). Pmax Table 15. maximum power dissipation DFU downloading Symbol Parameter Conditions Min Typ Max Unit fbit(UHCI) UHCI bit rate limited by a USB control end point size of 8 bytes measured with 2 kB transfer. - 8 - kB fbit(OHCI) OHCI bit rate 2 kB transfer - 77 - kB PNX0161_1 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 01 — 17 January 2008 16 of 21 PNX0161 NXP Semiconductors PNX0161 personal audio IC 12. Package outline TFBGA88: plastic thin fine-pitch ball grid array package; 88 balls; body 7 x 7 x 0.8 mm B D SOT951-1 A ball A1 index area A E A2 A1 detail X e1 C ∅v ∅w b e M M C A B C y y1 C N M L e K J H e2 G F E D C B A ball A1 index area 1 2 3 4 5 6 7 8 9 10 11 12 13 X 0 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max A1 A2 b D E e e1 e2 v w y y1 mm 1.1 0.25 0.15 0.85 0.75 0.35 0.25 7.1 6.9 7.1 6.9 0.5 6 6 0.15 0.05 0.08 0.1 REFERENCES OUTLINE VERSION IEC JEDEC JEITA SOT951-1 --- MO-195 --- EUROPEAN PROJECTION ISSUE DATE 06-05-26 06-08-25 Fig 5. Package outline SOT951-1 (TFBGA88) PNX0161_1 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 01 — 17 January 2008 17 of 21 PNX0161 NXP Semiconductors PNX0161 personal audio IC 13. Abbreviations Table 16. Abbreviations Acronym Description ADC Analog to Digital Converter ADSS AuDio SubSystem AHB Advanced Peripheral Bus AVC Analog Volume Control CGU Clock Generation Unit Class-AB Class-AB headphone amplifier DAC Digital to Analog Converter DAI Digital Audio Input DAO Digital Audio Output DMA Direct Memory Access ESD ElectroStatic Discharge GPIO General Purpose Input/Output INTC INTerrupt Controller IOCONF Input Output CONFiguration ISRAM Internal RAM Memory ISROM Internal ROM memory I2C Inter IC Communication Master/Slave interface M/S JTAG Joint Test Action Group PHY PHYsical layer PLL Phase Locked Loop PSU Power Supply Unit SAI Simple Audio Input SAO Simple Audio Output SDAC Stereo Digital to Analog Converter SDMA Simple Direct Memory Access controller SysCReg System Control Registers Timer Timer module UART Universal Asynchronous Receiver Transmitter USB 2.0 FS Universal Serial Bus 2.0 Full-Speed device VPB VSLI Peripheral Bus VPB bridge AHB to VPB bridge VSLI Very Large Scale Integration Watchdog / WDOG Watchdog timer PNX0161_1 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 01 — 17 January 2008 18 of 21 PNX0161 NXP Semiconductors PNX0161 personal audio IC 14. Revision history Table 17. Revision history Document ID Release date Data sheet status Change notice Supersedes PNX0161_1 20080117 Product data sheet - - PNX0161_1 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 01 — 17 January 2008 19 of 21 PNX0161 NXP Semiconductors PNX0161 personal audio IC 15. Legal information 15.1 Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 15.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. 15.3 Disclaimers General — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. Terms and conditions of sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. 15.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. Nexperia — is a trademark of NXP B.V. 16. Contact information For additional information, please visit: http://www.nxp.com For sales office addresses, send an email to: [email protected] PNX0161_1 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 01 — 17 January 2008 20 of 21 PNX0161 NXP Semiconductors PNX0161 personal audio IC 17. Contents 1 2 3 3.1 3.2 3.3 3.4 4 5 6 7 8 8.1 9 10 11 12 13 14 15 15.1 15.2 15.3 15.4 16 17 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 General features . . . . . . . . . . . . . . . . . . . . . . . . 1 Hardware features . . . . . . . . . . . . . . . . . . . . . . 1 Software features . . . . . . . . . . . . . . . . . . . . . . . 2 Software features on request . . . . . . . . . . . . . . 2 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Ordering information . . . . . . . . . . . . . . . . . . . . . 3 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Pinning information . . . . . . . . . . . . . . . . . . . . . . 5 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 11 Static characteristics. . . . . . . . . . . . . . . . . . . . 12 Dynamic characteristics . . . . . . . . . . . . . . . . . 14 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 17 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 18 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 19 Legal information. . . . . . . . . . . . . . . . . . . . . . . 20 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 20 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 Contact information. . . . . . . . . . . . . . . . . . . . . 20 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2008. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] Date of release: 17 January 2008 Document identifier: PNX0161_1