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Document No.: ES0910-L40
GM-G320240B-BTSES W-M-T P
LCD
320x240 Graphical LCD
Blue STN, White LED Backlight
4-Wire Resistive Touch Screen
This document is a property of Evolute Solutions Pvt. Ltd. This is a completely confidential document
and cannot be copied, duplicated or re-distributed without permission from the owner. Evolute holds the
right to change the specifications without prior notice. All Rights Reserved.
Prepared By
Approved By
Customer Approval
Signature with Company Seal
Kindly return this datasheet to us with your signature and company seal within two months, or we will consider the document to be accepted by you.
Evolute Solutions Pvt. Ltd. | 125, Madhuram Industrial Estate, Sativali Road, Vasai (E) – 401 208. Ph. +91-250-3023500 Fax. +91-250-3023501 Email: info@evolute.in
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Contents
1.
2.
3.
4.
5.
6.
7.
8.
9.
10.
11.
12.
13.
14.
15.
Revision History
General Specification
Module Coding System
Interface Pin Function
Outline dimension & Block Diagram
Timing Characteristics
Optical Characteristics
Absolute Maximum Ratings
Electrical Characteristics
Backlight Information
Touch Panel Information
Reliability
Inspection specification
Precautions in use of LCD Modules
Material List of Components for RoHs
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1. Revision History
DATE
VERSION
2009/9/16
1
REVISED PAGE NO.
Note
First issue
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2. General Specification
The Features is described as follow:
„
Module dimension: 148.02 x 120.24 x 17.3 (max.) mm3
„
View area: 120.1 x 92.14 mm2
„
Active area: 115.18 x 86.38 mm2
„
Number of Dots: 320 x2 40
„
Dot size: 0.34 x 0.34 mm2
„
Dot pitch: 0.36 x 0.36 mm2
„
LCD type: STN Negative, Transmissive ,Blue
„
View direction: 6 o’clock
„
Backlight Type: LED White(high light)
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3. Module Coding System
























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4. Interface Pin Function
Pin
No.
Symbol
Level
Description
1
VSS
0V
Ground
2
VDD
5.0V
Power supply for Logic
3
VO
(Variable) Driving voltage for LCD
4
/RD
H/L
8080family: Read signal,6800 family :Enable Clock
5
/WR
H/L
8080 family: Write signal,6800 family :R/W signal
6
RD =L,WR=H A0=L: Data Read
A0=H: Status read
RD =H,WR=L A0=L: Data Write
A0=H: Command write
For80 Family
A0
RD =L,WR=H A0=L: Command write A0=H: Data read
RD =H,WR=L A0=L: Status read
A0=H: Data write
For68 Family
7~14
DB0~DB7
H/L
Data bus line
15
/CS
H/L
Chip select ,Active L
16
/RES
H/L
Controller reset signal, Active L
17
VEE
Negative voltage output
18
FGND
Frame Ground
19
NC
No connection
20
NC
No connection
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5. Outline Dimension & Block Diagram
148.02㊣0.5
4.48
139.98
4.9
136.2
122.1(VA)(T.P)
16.62
14.66
13.74
7.86
13.16
4.02
7.11
13.4
14.43
120.14(VA)
14.9
119.2(AA)(T.P)
16.91
115.18(AA)
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
17.3Max
86.38(AA)
92.14(VA)
90.30(AA)(T.P)
93.30(VA)
105.4
104.0(T.P)
112.2
120.24
48.2
Top
Left
Right
190.0㊣5.0
61.0㊣0.7
Bottom
20-? 1.0PTH
20-? 1.8PAD
4-? 3.5PTH
4-? 6.0PAD
21.06
1.6
0.36
0.34
Right
Left
Bottom
Top
0.36
0.34
1
2
3
4
22.86
2.54
5.0
1.5
(T.P)
Vss
Vdd
Vo
RD
WR
A0
DB0
DB1
DB2
DB3
DB4
DB5
DB6
DB7
CS
RES
Vee
FGND
NC
NC
DOT SIZE
SCALE 10/1
TOUCH PANEL PIN ASSIGENMENT
Driver
Power ON
Reset
Com161~240
32K
SRAM
Driver
MPU
Com81~160
Controller
Com1~80
RA8835
Driver
CL1
M
FLM
RD
WR
A0
DB0~DB7
CS
RES
320X240 DOT
VR
20K
Vee
Internal contrast adjustment.
Bias and
Power Circuit
*
Vdd
Vo
Vss
N.V.
Generator
Seg1~80
Seg81~160
Seg161~240
Seg241~320
Driver
Driver
Driver
Driver
CL2
DB0~DB3
Frame PAD
*:6800 family or 8080family interface selectable.
Document No.: ES0910-L40
FGND
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GM-G320240B-BTSECW-M-TP
*Note:
This LCD is compatible with 8080 and 6800 processor families. The default setting for this LCD is
for 6800 family, which is done by connecting a 0 Ohm resistance at location J68. To change the
compatibility to 8080 family, the 0 Ohm resistance has to be removed from location J68 and be
placed at J80. The position of J68 and J80 on the LCD are as shown below:
6. Timing Characteristics
PLEASE TO CONSULT RA8835 SPEC
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7. Optical Characteristics
ITEM
View Angle
SYMBAL
CONDITION MIN
TYP
MAX
UNIT
(V)θ
CR≧2
20
-
40
deg.
(H)φ
CR≧2
-30
-
30
deg.
-
-
3
-
-
Contrast Ratio CR
Response
T rise
-
-
200
300
ms
Time
T fall
-
-
150
200
ms
Definitions
■View Angles
■Contrast Ratio
( Visual angle direction )
Brightness at selected state ( BS )
Brightness at non-selected state ( Bns )
Selected state
CR =
φ
X
Brightness (%)
Z
Non-selected state
Bs
Bns
Operating voltage for LCD driving
θ
Y
■ Response Time
Selected Condition
Nonselected Condition
90 %
100 %
Brightness
Nonselected Condition
10 %
tr
Rise Tim e
td
Decay Tim e ( fall tim e tf )
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8. Absolute Maximum Ratings
ITEM
SYMBOL
MIN.
TYP.
MAX.
UNIT
Operating Temperature
TOP
-20
-
+70
℃
Storage Temperature
TST
-30
-
+80
℃
Input Voltage
VI
0
-
VDD
V
Supply Voltage For Logic
VDD
0
-
6.5
V
Supply Voltage For LCD
VDD-VEE
0
-
32
V
9. Electrical Characteristics
ITEM
SYMBOL
CONDITION
MIN.
TYP.
MAX.
UNIT
Logic Voltage
VDD-VSS
-
4.5
5.0
5.5
V
Ta=-20℃
-
-
25.0
V
Ta=25℃
-
23.8
-
V
Ta=70℃
23.0
-
-
V
V
Supply Voltage For
LCD
VDD-VO
Input High Volt.
VIH
-
0.5VDD
-
VDD
Input Low Volt.
VIL
-
0
-
0.2VDD V
Output High Volt.
VOH
-
2.4
-
-
V
Output Low Volt.
VOL
-
-
-
0.4
V
Supply Current
IDD
-
95.0
100.0 110.0
Document No.: ES0910-L40
mA
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GM-G320240B-BTSECW-M-TP
10. Backlight Information
Specification
PARAMETER
SYMBOL MIN
TYP
MAX
UNIT
TEST
CONDITION
Supply Current ILED
144
160
200
mA
V=3.5V
Supply Voltage V
3.4
3.5
3.6
V
-
Reverse Voltage VR
-
-
5
V
-
IV
360
380
-
cd/m2
ILED=160mA
λp
─
-
nm
ILED=160mA
Luminous
Intensity
Wave Length
ILED≦160 mA
LED Life Time
(For Reference -
50K
-
-
hr.
only)
25℃,50-60%RH,
(Note 1)
White(High light)
Color
Note:
The LED of B/L is drive by current only; drive voltage is for reference only. Drive voltage has to make
driving current under safety area (current between minimum and maximum).
LED B\L Drive Method
1.Drive from A , K
R
A
B/L
K
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11. Touch panel Information
Document No.: ES0910-L40
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GM-G320240B-BTSECW-M-TP
„ ELECTRICAL SPECIFICATIONS
ITEM
SPECIFICATION
CONDITION
ON RESISTANCE
350Ω ~ 1000Ω
DIRECTION:X
200Ω ~ 650Ω
DIRECTION:Y
INSULATION
MORE THAN
DC 25V
RESISTANCE
20MΩ
CHATTERING
LESS THAN
TIME
15 msec
LINEARITY
±1.5%
X AXIS
±1.5%
Y AXIS
100KΩ PULL-UP
„ MACHINE SPECIFICATIONS
ITEM
SPECIFICATION
CONDITION
OPERATING
LESS THAN 80g
R8.0 HS 40 °
FORCE
SILICON RUBBER
OR R0.8
POLYACETAL PEN
SURFACE
MORE THAN 2H
PENCIL TEST
LIGHT
MORE THAN
@550nm
TRANSMISSION
80 %
HITACHI U3300
DURABILITY FOR
MORE THAN
FORCE:250g
PEN SELECTIONS
1,200,000 TIMES
SPEED:2cm/sec
HARDNESS
Document No.: ES0910-L40
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12. Reliability
Content of Reliability Test (wide temperature, -20℃~70℃)
Environmental Test
Test Item
High Temperature storage
Low Temperature storage
High Temperature Operation
Low Temperature Operation
High Temperature/
Humidity Operation
Content of Test
Condition
Endurance test applying the high storage temperature for a long 80℃
time.
200hrs
Endurance test applying the high storage temperature for a long -30℃
time.
200hrs
Endurance test applying the electric stress (Voltage & Current) 70℃
and the thermal stress to the element for a long time.
Endurance
test
applying
the
electric
stress
200hrs
under
low -20℃
temperature for a long time.
200hrs
The module should be allowed to stand at 60℃,90%RH max
For 96hrs under no-load condition excluding the polarizer,
Then taking it out and drying it at normal temperature.
60℃,90%RH
96hrs
Note
2
1,2
1
1,2
The sample should be allowed stand the following 10 cycles of
operation
-20℃
25℃
70℃
Thermal shock resistance
-20℃/70℃
10 cycles
30min
5min
-
30min
1 cycle
fixed
amplitude:
15mm
Vibration.
Frequency:
Vibration test
Endurance test applying the vibration during transportation and 10~55Hz.
using.
One cycle 60
3
seconds to 3
directions of
X,Y,Z for
Each 15
minutes
VS=800V,RS=
Static electricity test
Endurance test applying the electric stress to the terminal.
1.5kΩ
CS=100pF
——
1 time
Note1: No dew condensation to be observed.
Note2: The function test shall be conducted after 4 hours storage at the normal temperature and humidity
after remove from the test chamber.
Note3: Vibration test will be conducted to the product itself without putting it in a container.
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13. Inspection specification
NO
Item
01
Electrical
Testing
02
Criterion
1.1 Missing vertical, horizontal segment, segment contrast
defect.
1.2 Missing character, dot or icon.
1.3 Display malfunction.
1.4 No function or no display.
1.5 Current consumption exceeds product specifications.
1.6 LCD viewing angle defect.
1.7 Mixed product types.
1.8 Contrast defect.
2.1 White and black spots on display ≦0.25mm, no more
Black or
than three white or black spots present.
white spots
2.2 Densely spaced: No more than two spots or lines within
on LCD
3mm
(display only)
AQL
0.65
2.5
3.1 Round type : As following drawing
Φ=( x + y ) / 2
2.5
03
04
LCD black
spots, white
spots,
contaminatio
n
3.2 Line type : (As following drawing)
(non-display)
Length
Width
Polarizer
bubbles
---
W≦0.02
L≦3.0
L≦2.5
---
0.02<W≦0.03
0.03<W≦0.05
0.05<W
If bubbles are visible,
judge using black spot
specifications, not
easy to find, must
check in specify
direction.
Size Φ
Φ≦0.20
0.20<Φ≦0.50
0.50<Φ≦1.00
1.00<Φ
Total Q TY
Document No.: ES0910-L40
Acceptable Q
TY
Accept no
dense
2.5
2
As round type
Acceptable Q
TY
Accept no
dense
3
2
0
3
2.5
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NO
05
Item
Scratches
GM-G320240B-BTSECW-M-TP
Criterion
Follow NO.3 LCD black spots, white spots, contamination
AQL
Symbols Define:
x: Chip length
y: Chip width
z: Chip thickness
k: Seal width
t: Glass thickness a: LCD side length
L: Electrode pad length:
6.1 General glass chip :
6.1.1 Chip on panel surface and crack between panels:
06
Chipped
glass
z: Chip thickness
Z≦1/2t
y: Chip width
x: Chip length
Not over viewing
x≦1/8a
area
Not
exceed
1/3k
1/2t<z≦2t
x≦1/8a
☉If there are 2 or more chips, x is total length of each chip.
2.5
6.1.2 Corner crack:
z: Chip thickness
Z≦1/2t
y: Chip width
x: Chip length
Not over viewing
x≦1/8a
area
Not exceed 1/3k
1/2t<z≦2t
x≦1/8a
☉If there are 2 or more chips, x is the total length of each chip.
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Item
GM-G320240B-BTSECW-M-TP
Criterion
AQL
Symbols :
x: Chip length
y: Chip width
z: Chip thickness
k: Seal width
t: Glass thickness a: LCD side length
L: Electrode pad length
6.2 Protrusion over terminal :
6.2.1 Chip on electrode pad :
y: Chip width
x: Chip length
y≦0.5mm
x≦1/8a
6.2.2 Non-conductive portion:
06
z: Chip thickness
0 < z≦t
Glass
crack
2.5
y: Chip width
x: Chip length
z: Chip
thickness
y≦ L
x≦1/8a
0 < z≦t
☉If the chipped area touches the ITO terminal, over 2/3 of the
ITO must remain and be inspected according to electrode
terminal specifications.
☉If the product will be heat sealed by the customer, the
alignment mark not be damaged.
6.2.3 Substrate protuberance and internal crack.
y: width
y≦1/3L
Document No.: ES0910-L40
x: length
x≦a
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07
08
09
10
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Item
Cracked
glass
Backlight
elements
Bezel
PCB、COB
GM-G320240B-BTSECW-M-TP
Criterion
AQL
The LCD with extensive crack is not acceptable.
2.5
8.1 Illumination source flickers when lit.
8.2 Spots or scratched that appear when lit must be judged.
Using LCD spot, lines and contamination standards.
8.3 Backlight doesn’t light or color wrong.
0.65
2.5
9.1 Bezel may not have rust, be deformed or have
fingerprints, stains or other contamination.
9.2 Bezel must comply with job specifications.
2.5
0.65
10.1 COB seal may not have pinholes larger than 0.2mm or
contamination.
10.2 COB seal surface may not have pinholes through to the
IC.
10.3 The height of the COB should not exceed the height
indicated in the assembly diagram.
10.4 There may not be more than 2mm of sealant outside
the seal area on the PCB. And there should be no more
than three places.
10.5 No oxidation or contamination PCB terminals.
10.6 Parts on PCB must be the same as on the production
characteristic chart. There should be no wrong parts,
missing parts or excess parts.
10.7 The jumper on the PCB should conform to the product
characteristic chart.
10.8 If solder gets on bezel tab pads, LED pad, zebra pad or
screw hold pad, make sure it is smoothed down.
10.9 The Scraping testing standard for Copper Coating of
PCB
2.5
0.65
2.5
0.65
2.5
2.5
0.65
0.65
2.5
2.5
X
Y
X * Y<=2mm2
2.5
2.5
11
Soldering
11.1 No un-melted solder paste may be present on the PCB.
11.2 No cold solder joints, missing solder connections,
oxidation or icicle.
11.3 No residue or solder balls on PCB.
11.4 No short circuits in components on PCB.
Document No.: ES0910-L40
2.5
0.65
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GM-G320240B-BTSECW-M-TP
Item
Criterion
General
appearance
12.1 No oxidation, contamination, curves or, bends on
interface Pin (OLB) of TCP.
12.2 No cracks on interface pin (OLB) of TCP.
12.3 No contamination, solder residue or solder balls on
product.
12.4 The IC on the TCP may not be damaged, circuits.
12.5 The uppermost edge of the protective strip on the
interface pin must be present or look as if it causes the
interface pin to sever.
12.6 The residual rosin or tin oil of soldering (component or
chip component) is not burned into brown or black color.
12.7 Sealant on top of the ITO circuit has not hardened.
12.8 Pin type must match type in specification sheet.
12.9 LCD pin loose or missing pins.
12.10 Product packaging must the same as specified on
packaging specification sheet.
12.11 Product dimension and structure must conform to
product specification sheet.
AQL
2.5
0.65
2.5
2.5
2.5
2.5
2.5
0.65
0.65
0.65
0.65
14. Precautions in use of LCD Modules
1. Avoid applying excessive shocks to the module or making any alterations or modifications
to it.
2. Don’t make extra holes on the printed circuit board, modify its shape or change the
components of LCD module.
3. Don’t disassemble the LCM.
4. Don’t operate it above the absolute maximum rating.
5. Don’t drop, bend or twist LCM.
6. Soldering: only to the I/O terminals.
7. Storage: please storage in anti-static electricity container and clean environment.
Document No.: ES0910-L40
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GM-G320240B-BTSECW-M-TP
15. Material List of Components for RoHs
1. We hereby declare that all of
or
part of products, including, but
not limited to, the LCM, accessories or packages, manufactured and/or delivered to your
company (including your subsidiaries and affiliated company) directly or indirectly by our
company (including our subsidiaries or affiliated companies) do not intentionally contain any
of the substances listed in all applicable EU directives and regulations, including the
following substances.
Exhibit A:The Harmful Material List
Material
(Cd)
(Pb)
(Hg)
(Cr6+)
PBBs
PBDEs
Limited
100
1000
1000
1000
1000
1000
Value
ppm
ppm
ppm
ppm
ppm
ppm
Above limited value is set up according to RoHS.
2. Process for RoHS requirement:
(1) Use the Sn/Ag/Cu soldering surface;the surface of Pb-free solder is rougher than we used
before.
(2) Heat-resistance temp.:
Reflow:250℃, 30 seconds Max.;
Connector soldering wave or hand soldering:320℃, 10 seconds max.
(3) Temp. curve of reflow, max. Temp.:235±5℃;
Recommended customer’s soldering temp. of connector:280℃, 3 seconds.
Document No.: ES0910-L40
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GM-G320240B-BTSECW-M-TP
Page: 1
LCM Sample Estimate Feedback Sheet
Module Number:
1、Panel Specification:
□ Pass
□ NG ,
1. Panel Type:
□ Pass
□ NG ,
2. View Direction:
□ Pass
□ NG ,
3. Numbers of Dots:
□ Pass
□ NG ,
4. View Area:
□ Pass
□ NG ,
5. Active Area:
6.Operating
□ Pass
□ NG ,
Temperature:
□ NG ,
7.Storage Temperature: □ Pass
8.Others:
2、Mechanical Specification:
□ Pass
□ NG ,
1. PCB Size:
□ Pass
□ NG ,
2.Frame Size:
□ Pass
□ NG ,
3.Materal of Frame:
□ Pass
□ NG ,
4.Connector Position:
□ Pass
□ NG ,
5.Fix Hole Position:
□ Pass
□ NG ,
6.Backlight Position:
□ Pass
□ NG ,
7. Thickness of PCB:
8. Height of Frame to
□ Pass
□ NG ,
PCB:
□ Pass
□ NG ,
9.Height of Module:
□ Pass
□ NG ,
10.Others:
3、Relative Hole Size:
□ Pass
□ NG ,
1.Pitch of Connector:
2.Hole size of
□ Pass
□ NG ,
Connector:
□ Pass
□ NG ,
3.Mounting Hole size:
□ NG ,
4.Mounting Hole Type: □ Pass
□ Pass
□ NG ,
5.Others:
4、Backlight Specification:
□ Pass
□ NG ,
1.B/L Type:
□ Pass
□ NG ,
2.B/L Color:
3.B/L Driving Voltage (Reference for LED Type):□ Pass □ NG ,
□ Pass
□ NG ,
4.B/L Driving Current:
□ Pass
□ NG ,
5.Brightness of B/L:
□ Pass
□ NG ,
6.B/L Solder Method:
□ Pass
□ NG ,
7.Others:
>> Go to page 2 <<
Document No.: ES0910-L40
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GM-G320240B-BTSECW-M-TP
Page: 2
Module Number:
5、Electronic Characteristics of Module:
□ Pass
□ NG ,
1.Input Voltage:
□ Pass
□ NG ,
2.Supply Current:
□ NG ,
3.Driving Voltage for LCD: □ Pass
□ Pass
□ NG ,
4.Contrast for LCD:
□ Pass
□ NG ,
5.B/L Driving Method:
6.Negative Voltage
□ Pass
□ NG ,
Output:
□ Pass
□ NG ,
7.Interface Function:
□ Pass
□ NG ,
8.LCD Uniformity:
□ Pass
□ NG ,
9.ESD test:
□ Pass
□ NG ,
10.Others:
6、Summary:
Sales signature:
Customer Signature:
Date:
Document No.: ES0910-L40
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/
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