DATA SHEET TANTALUM CAPACITOR SV/H SERIES SURFACE MOUNT RESIN MOLDED TANTALUM CHIP CAPACITORS HIGH RELIABILITY NEC’s SV/H series solid tantalum capacitor has developed for automotive application. Comparing to the former type (R Series), the higher reliability and the higher performance have been built in the same chip size with the NEC’s original technologies. FEATURES The SV/H series has the highest level of reliability and performance in the tantalum chip capacitors as shown below. • Damp heat (steady state) : 85°C, 85% RH 1000 hours • Rapid change of temperature: –55°C to +125°C, 1000 cycles • Resistance to soldering : 260°C, 10 sec (Fully immersed to solder) • Failure rate : 0.5%/1000 hours (at 85°C, rated voltage applied) APPLICATIONS • Automotive electronics • Other electronic equipment which requires high reliability and performance. DIMENSIONS L L W1 Y W1 Z Z Z W2 W2 W2 H H H L W1 Z [A Case] Z [B2 Case] Z [C, D2 Case] (Unit: mm) Case Code L W1 W2 H Z Y A 3.2 ± 0.2 1.6 ± 0.2 1.2 ± 0.1 1.6 ± 0.2 0.8 ± 0.3 – B2 3.5 ± 0.2 2.8 ± 0.2 2.3 ± 0.1 1.9 ± 0.2 0.8 ± 0.3 – C 6.0 ± 0.3 3.2 ± 0.3 1.8 ± 0.1 2.5 ± 0.3 1.3 ± 0.3 0.4C D2 5.8 ± 0.3 4.6 ± 0.3 2.4 ± 0.1 3.2 ± 0.3 1.3 ± 0.3 – The information in this document is subject to change without notice. Document No. EC0064EJ2V1DS00 (2nd edition) Date Published July 2000 P CP(K) Printed in Japan © 1990 (1996) SV/H SERIES MARKING - Upper face [A Case] [B2 Case] polarity (anode) 1 35N C105 capacitance (µF) rated voltage production date code rated voltage (V) polarity (anode) capacitance code (pF) rated voltage code [A:10 V, C:16 V, D:20 V, E:25 V, V:35 V] [C Case] [D2 Case] polarity (anode) 10 16N 6.8 35N capacitance (µF) capacitance (µF) production date code rated voltage (V) polarity (anode) production date code rated voltage (V) - Bottom face (for A case sizes) N production date code [Marking of production date code] M Jan. Feb. Mar. Apr. May Jun. Jul. Aug. Sept. Oct. Nov. Dec. 1995 a b c d e f g h j k l m 1996 n p q r s t u v w x y z 1997 A B C D E F G H J K L M 1998 N P Q R S T U V W X Y Z Y Data code will resume beginning in 1999. 2 SV/H SERIES PRODUCT LINE UP AND CASE CODE UR (Vdc) 10 V Capacitance (µF) 16 V 20 V 25 V 35 V 0.1 A 0.15 A 0.22 A 0.33 A 0.47 A 0.68 A 1 A 1.5 A 2.2 B2 B2 B2 A 3.3 B2 C B2 C 6.8 C 10 C 15 D2 D2 D2 C 22 C C B2 4.7 B2 D2 D2 33 D2 UR: Rated voltage PART NUMBER SYSTEM - Bulk – SVH B2 1V 105 M Capacitance Tolerance M : ±20 % K : ±10 % Capacitance Code in pF: First two digits represent significant figures. Third digit specifies number of zeros to follow. (105: 1 µF) Rated Voltage (1A: 10 V, 1C: 16 V, 1D: 20 V, 1E: 25 V, 1V: 35 V) Case Code Series Name - Tape and Reel - TE SVH B2 1V 105M 8 R Packing orientation R : negative terminal on sprocket hole side L : positive terminal on sprocket hole side Tape width 8 mm for A, B2 case 12 mm for C, D2 case Same as bulk part Tape and reel 3 SV/H SERIES PERFORMANCE No. Items Test Conditions 1 Operating Temp. Range –55 to +125°C 2 Rated Voltage 10 16 20 25 35 Vdc 3 Surge Voltage 13 20 26 33 46 Vdc at 85°C 4 Derated Voltage 6.3 10 13 16 22 Vdc at 125°C 5 Capacitance Range 0.1 to 33 µF 6 Capacitance Tolerance ±20%, ±10% at 120 Hz 7 Leakage Current 0.01CV (µA) or 0.5 (µA) whichever is greater Rated Voltage applied after 5 minutes. 8 Tangent of loss angle 0.1 to 4.7 µF: 0.04 MAX. 6.8 to 33 µF : 0.06 MAX. at 120 Hz 9 Surge Voltage ∆C/C : ±5% Tangent of loss angle: initial requirement Leakage Current : initial requirement at 85°C, Rs = 1 kΩ 1000 cycles 10 Charac- Temp. teristics at high ∆C/C and low Tangent of temperature loss angle Leakge Current 4 Specifications Applied voltage shall be derated over +85°C –55°C 0 % –12 +85°C +125°C +12 % 0 +15 % 0 0.1 to 4.7 µF: 0.08 MAX. 6.8 to 33 µF : 0.10 MAX. initial requirement 0.1 to 4.7 µF: 0.06 MAX. 6.8 to 33 µF : 0.08 MAX. — 0.1 CV or 5 µA MAX. 0.125 CV or 6.25 µA MAX. 11 Rapid change of temperature ∆C/C : ±10% Tangent of loss angle: initial requirement Leakage Current : initial requirement IEC68-2-14 Test N and IEC68-22-33 Guidance –55°C to +125°C, 1000 cycles 12 Resistance to Soldering ∆C/C : ±5% Tangent of loss angle: initial requirement Leakage Current : initial requirement IEC68-2-58 Test Td Fully immersion to Solder 260°C, 10 sec 13 Damp Heat (steady state) ∆C/C : ±10% Tangent of loss angle: 150% of initial requirement Leakage Current : initial requirement IEC68-2-3 Test Ca at 85°C, 85% RH, 1000 h 14 Terminal Strength There shall be no loosening or permanent damage pull of 5N in an axial direction 15 Endurance (1) ∆C/C : ±10% Tangent of loss angle: initial requirement Leakage Current : 125% of initial requirement at 85°C, Rated Voltage applied 2000 h 16 Endurance (2) ∆C/C : ±10% Tangent of loss angle: initial requirement Leakage Current : 125% of initial requirement at 125°C, Derated Voltage applied 2000 h 17 Failure Rate 0.5%/1000 h each condition of No. 15 and No. 16 above SV/H SERIES STANDARD RATINGS Rated Voltage (Vdc) 10 16 20 25 35 Capacitance (µF) Tangent of loss angle Leakage Current (µA) Case Code 2.2 0.04 0.5 A SVHA1A225M 4.7 0.04 0.5 B2 SVHB21A475M 15 0.06 1.5 C SVHC1A156M 33 0.06 3.3 D2 SVHD21A336M 1 0.04 0.5 A SVHA1C105M 1.5 0.04 0.5 A SVHA1C155M 3.3 0.04 0.5 B2 SVHB21C335M 10 0.06 1.6 C SVHC1C106M 22 0.06 3.5 D2 SVHD21C226M 0.68 0.04 0.5 A SVHA1D684M 2.2 0.04 0.5 B2 SVHB21D225M 6.8 0.06 1.4 C SVHC1D685M 15 0.06 3.0 D2 SVHD21D156M 0.47 0.04 0.5 A SVHA1E474M 1.5 0.04 0.5 B2 SVHB21E155M 4.7 0.04 1.1 C SVHC1E475M 10 0.06 2.5 D2 SVHD21E106M 0.1 0.04 0.5 A SVHA1V104M 0.15 0.04 0.5 A SVHA1V154M 0.22 0.04 0.5 A SVHA1V224M 0.33 0.04 0.5 A SVHA1V334M 0.47 0.04 0.5 B2 SVHB21V474M 0.68 0.04 0.5 B2 SVHB21V684M 1 0.04 0.5 B2 SVHB21V105M 1.5 0.04 0.5 C SVHC1V155M 2.2 0.04 0.7 C SVHC1V225M 3.3 0.04 1.2 C SVHC1V335M 4.7 0.04 1.6 D2 SVHD21V475M 6.8 0.06 2.3 D2 SVHD21V685M Part Number 5 SV/H SERIES TAPE AND REEL SPECIFICATION Carrier Tape Dimensions and Packaging Quantity sprocket hole embossed cavity E D t P K P2 W B0 F A0 P0 direction of feed (Unit: mm) ` Case Code A0 ± 0.2 B0 ± 0.2 W ± 0.3 F ± 0.05 E ± 0.1 P ± 0.1 P2 ± 0.05 A 1.9 3.5 8.0 3.5 1.75 4.0 2.0 B2 3.3 3.8 8.0 3.5 1.75 4.0 2.0 C 3.7 6.4 12.0 5.5 1.75 8.0 2.0 D2 5.1 6.2 12.0 5.5 1.75 8.0 2.0 Case Code P0 ± 0.1 D +0.1 0 K ± 0.2 t Q’ty/Reel A 4.0 φ1.5 1.9 0.2 2 000 B2 4.0 φ1.5 2.1 0.2 2 000 C 4.0 φ1.5 3.0 0.3 500 D2 4.0 φ1.5 3.6 0.4 500 Reel Dimensions W1 A C D N E R W2 Tape Width (Unit: mm) Tape Width A N C D E W1 W2 R 8 φ178 ± 2.0 φ50 Min. φ13 ± 0.5 φ21 ± 0.5 2.0 ± 0.5 10.0 ± 1.0 14.5 max. 1 12 φ178 ± 2.0 φ50 Min. φ13 ± 0.5 φ21 ± 0.5 2.0 ± 0.5 14.5 ± 1.0 18.5 max. 1 6 SV/H SERIES CHARACTERISTICS DATA 6 4 4 2 2 ∆C/C (%) 6 0 –2 –2 –4 –6 –6 0.08 0.06 0.04 0.02 0.08 0.06 0.04 0.02 0 Leakage current ( µA) 0 Leakage current ( µA) 0 –4 Tangent of loss angle Tangent of loss angle ∆C/C (%) Rapid change of temperature (–55°C to +125°C, n = 50) 0.1 0.01 0.001 0.1 0.01 0.001 initial 500 cycles 10 V/2.2 µ F 1000 cycles initial 500 cycles 1000 cycles 35 V/0.33 µF 7 SV/H SERIES 6 4 4 2 2 ∆C/C (%) 6 0 –2 –6 –6 0.08 0.06 0.04 0.02 0.08 0.06 0.04 0.02 0 Leakage current ( µA) Leakage current ( µA) –2 –4 0 0.1 0.01 0.001 0.1 0.01 0.001 initial 500 cycles 10 V/33 µ F 8 0 –4 Tangent of loss angle Tangent of loss angle ∆C/C (%) Rapid change of temperature (–55°C to +125°C, n = 50) 1000 cycles initial 500 cycles 35 V/6.8 µ F 1000 cycles SV/H SERIES 6 4 4 2 2 ∆C/C (%) 6 0 –2 –2 –4 –6 –6 0.08 0.06 0.04 0.02 0.08 0.06 0.04 0.02 0 Leakage current ( µ A) 0 Leakage current ( µA) 0 –4 Tangent of loss angle Tangent of loss angle ∆C/C (%) Damp heat (steady state) (85°C, 85% RH, n = 50) 0.1 0.01 0.001 0.1 0.01 0.001 initial 500 h 10 V/2.2 µ F 1000 h initial 500 h 1000 h 35 V/0.33 µ F 9 SV/H SERIES 6 4 4 2 2 ∆C/C (%) 6 0 –2 –6 –6 0.08 0.06 0.04 0.02 0.08 0.06 0.04 0.02 0 Leakage current ( µ A) Leakage current ( µ A) –2 –4 0 0.1 0.01 0.001 0.1 0.01 0.001 initial 500 h 10 V/33 µ F 10 0 –4 Tangent of loss angle Tangent of loss angle ∆C/C (%) Damp heat (steady state) (85°C, 85% RH, n = 50) 1000 h initial 500 h 35 V/6.8 µ F 1000 h SV/H SERIES Endurance (85°C, UR × 1.3 applied, n = 50) 6 4 4 2 2 ∆C/C (%) 6 0 –2 –2 –4 –6 –6 0.08 0.06 0.04 0.02 0.08 0.06 0.04 0.02 0 Leakage current ( µ A) 0 Leakage current ( µ A) 0 –4 Tangent of loss angle Tangent of loss angle ∆C/C (%) (reference data) 0.1 0.01 0.001 0.1 0.01 0.001 initial 500 h 10 V/2.2 µ F 1000 h initial 500 h 1000 h 35 V/0.33 µ F 11 SV/H SERIES Endurance (85°C, UR × 1.3 applied, n = 50) 6 4 4 2 2 ∆C/C (%) 6 0 –2 –6 –6 0.08 0.06 0.04 0.02 0.08 0.06 0.04 0.02 0 Leakage current ( µ A) Leakage current ( µ A) –2 –4 0 0.1 0.01 0.001 0.1 0.01 0.001 initial 500 h 10 V/33 µ F 12 0 –4 Tangent of loss angle Tangent of loss angle ∆C/C (%) (reference data) 1000 h initial 500 h 35 V/6.8 µ F 1000 h SV/H SERIES FREQUENCY CHARACTERISTIC (reference data) 100 35 V/0.33 µ F 10 |Z| (Ω) 16 V/22 µ F 35 V/1 µ F 1 10 V/33 µ F 0.1 1k 10 k 100 k 1M 10 M 40 M Frequency (Hz) 13 SV/H SERIES GUIDE TO APPLICATIONS FOR TANTALUM CHIP CAPACITORS The failure of the solid tantalum capacitor is mostly classified into a short-circuiting mode and a large leakage current mode. Refer to the following for reliable circuit design. 1. Field failure rate SV/H Series tantalum chip capacitors are typically applied to decoupling, blocking, by-passing and filtering. The SV/H Series has a very low failure rate in the field. For example, the maximum field failure rate of an SV/H Series capacitor with a DC working voltage of 16 V is 0.0002 %/1000 hour (2 Fit) at an applied voltage of 5 V, operating temperature of 25°C and series resistance of 3 Ω. The maximum failure rate in the field is estimated by following expression: V λ = λ0 V0 3 T − T0 10 × 2 λ : Maximum field failure rate λ0 : 0.5%/1000 hour (The failure rate of the SV/H Series at the full rated DC working voltage at operating V : Applied voltage in actual use temperature of 85°C and series resistance of 3 Ω.) V0 : Rated DC working voltage T : Operating temperature in actual use T0 : 85°C The nomograph is provided for quick estima- 120 1 100 10 7 4 2 Operating temperature T (˚C) 90 100 7 4 80 2 70 10–1 7 4 plied voltage ratio V/V0 of interest with a straight line. The failure rate multiplier F is 10–2 7 4 10–3 7 4 40 2 30 10–4 7 4 2 0.6 0.5 0.3 10 20 14 λ = λ0·F. Examples: Given V/V0 = 0.4 and T = 45°C, read F = 4 × 10–3. Hence, λ = 0.002%/1000 hour (20 Fit). Given V/V0 = 0.3 and T = 25°C, read F = 4 × 10–4. Hence, λ = 0.0002%/1000 hour (2 Fit). 0.2 0.1 –5 model scale. The failure rate is obtained as 0.7 2 50 given at the intersection of this line with the 1.0 0.9 0.8 0.4 2 60 Connect operating temperature T and ap- Applied voltage ratio V/V0 2 tion of maximum field failure rates. Failure rate multiplier F 110 102 7 4 SV/H SERIES 2. Series resistance As shown in Figure 1, reliability is increased by inserting a series resistance of at least 3 Ω/V into circuits where current flow is momentary (switching circuits, charge/discharge circuits, etc.). If the capacitor is in a low-impedance circuit, the voltage applied to the capacitor should be less than 1/2 to 1/3 of the rated DC working voltage. Magnification of failure 10 1 0.1 0.1 1 10 100 Series Resistance (Ω/V) Figure 1. Effects of Series Resistance 3. Ripple voltage The sum of DC voltage and peak ripple voltage should not exceed the rated DC working voltage of the capacitor. 10 100 Case: A, B2 @ 25°C 35 V 25 V 20 V 16 V 10 V Ripple voltage (Vrms) Ripple voltage (Vrms) 100 1 0.1 10 Case: C, D2 @ 25°C 35 V 25 V 20 V 16 V 10 V 1 0.1 0.1 1 10 100 Frequency (kHz) 0.1 1 10 100 Frequency (kHz) Figure 2. Permissible Ripple Voltage vs. Frequency Figure 2 is based on an ambient temperature of 25°C. For higher temperature, permissible ripple voltage shall be derated as follows. Permissible voltage @ 50°C = 0.7 × permissible voltage @25°C Permissible voltage @ 85°C = 0.5 × permissible voltage @25°C Permissible voltage @ 125°C = 0.3 × permissible voltage @25°C 15 SV/H SERIES 4. Reverse voltage Because the capacitors are polarized, reverse voltage should not be applied. If reverse voltage cannot be avoided because of circuit design, the voltage application should be for a very short time and should not exceed the following. 10% MAX. of rated DC working voltage @25°C 5% MAX. of rated DC working voltage @85°C 1% MAX. of rated DC working voltage @125°C 5. Mounting (1) Direct soldering Keep in mind the following points when soldering the capacitor by means of jet soldering or dip soldering: (a) Temporarily fixing resin Because the SV/H series solid tantalum capacitors are larger in size and subject to more force than the chip multilayer ceramic capacitors or chip resistors, more resin is required to temporarily secure the solid tantalum capacitors. However, if too much resin is used, the resin adhering to the patterns on a printed circuit board may adversely affect the solderability. (b) Pattern design b a c a Case a b c A 2.9 1.7 1.2 B2 3.0 2.8 1.6 C 4.1 2.3 2.4 D2 5.4 2.9 2.4 The above dimensions are for reference only. If the capacitor is to be mounted by this method, and if the pattern is too small, the solderability may be degraded. (c) Temperature and time Keep the peak temperature and time to within the following values: Solder temperature ............ 260°C max. Time ................................. 10 seconds max. Whenever possible, perform preheating (at 150°C max.) for smooth temperature profile. To maintain the reliability, mount the capacitor at a low temperature and in a short time whenever possible. (d) Component layout If many types of chip components are mounted on a printed circuit board which is to be soldered by means of jet soldering, solderability may not be uniform over the entire board depending on the layout and density of the components on the board (also take into consideration generation of flux gas). 16 SV/H SERIES (e) Flux Use resin-based flux. Do not use flux with strong acidity. (2) Reflow soldering Keep in mind the following points when soldering the capacitor in a soldering oven or with a hot plate: (a) Pattern design b a c a Case a b c A 1.6 1.7 1.2 B2 1.6 2.8 1.6 C 2.4 2.3 2.4 D2 2.4 2.9 2.4 The above dimensions are for reference only. Note that if the pattern is too big, the component may not be mounted in place. (b) Temperature and time Keep the peak temperature and time to within the following values: Solder temperature .............. 260°C max. Time: 10 seconds max. Whenever possible, perform preheating (at 150°C max.) for smooth temperature profile. To maintain the reliability, mount the capacitor at a low temperature and in a short time whenever possible. The peak temperature and time shown above are applicable when the capacitor is to be soldered in a soldering over or with a hot plate. When the capacitor is soldered by means of infrared reflow soldering, the internal temperature of the capacitor may rise beyond the surface temperature. (3) Using soldering iron When soldering the capacitor with a soldering iron, controlling the temperature at the tip of the soldering iron is very difficult. However, it is recommended that the following temperature and time be observed to maintain the reliability of the capacitor: Iron temperature ......... 300°C max. Time ........................... 3 seconds max. Iron power .................. 30 W max. 17 SV/H SERIES 6. Cleaning Generally, several organic solvents are used for flux cleaning of an electronic component after soldering. Many cleaning methods, such as immersion cleaning, rinse cleaning, brush cleaning, shower cleaning, vapor cleaning, and ultrasonic cleaning, are available, and one of these cleaning methods may be used alone or two or more may be used in combination. The temperature of the organic solvent may vary from room temperature to several 10°C, depending on the desired effect. If cleaning is carried out with emphasis placed only on cleaning effect, however, the marking on the electronic component cleaned may be erased, the appearance of the component may be damaged, and in the worst case, the component may be functionally damaged. It is therefore recommended that the R series solid tantalum capacitor be cleaned under the following conditions: [Recommended conditions of flux cleaning] (1) Cleaning solvent ......... Chlorosen, isopropyl alcohol (2) Cleaning method ......... Shower cleaning, rinse cleaning, vapor cleaning (3) Cleaning time .............. 5 minutes max. *Ultrasonic cleaning This cleaning method is extremely effective for eliminating dust that has been generated as a result of mechanical processes, but may pose a problem depending on the condition. As a result of an experiment conducted by NEC, it was confirmed that the external terminals of the capacitor were cut when it was cleaned with some ultrasonic cleaning machines. The cause of this phenomenon is considered metal fatigue of the capacitor terminals that occurred due to ultrasonic cleaning. To prevent the terminal from being cut, decreasing the output power of the ultrasonic cleaning machine or shortening the cleaning time may be a possible solution. However, it is difficult to specify the safe cleaning conditions because there are many factors involved such as the conversion efficiency of the ultrasonic oscillator, transfer efficiency of the cleaning bath, difference in cleaning effect depending on the location in the cleaning bath, the size and quantity of the printed circuit boards to be cleaned, and the securing states of the components on the boards. It is therefore recommended that ultrasonic cleaning be avoided as much as possible. If ultrasonic cleaning is essential, make sure through experiments that no abnormality occur as a result of the cleaning. For further information, consult NEC. 18 SV/H SERIES 7. Others (1) Do not apply excessive vibration and shock to the capacitor. (2) The solderability of the capacitor may be degraded by humidity. Store the capacitor at (–5 to +40°C) room temperature and (40 to 60% RH) humidity. (3) Exercise care that no external force is applied to the tape packaged products (if the packaging material is deformed, the capacitor may not be automatically mounted by a chip mounted). 19 SV/H SERIES No part of this document may be copied or reproduced in any form or by any means without the prior written consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in this document. NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from use of a device described herein or any other liability arising from use of such device. No license, either express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC Corporation or others. While NEC Corporation has been making continuous effort to enhance the reliability of its e l e c t r o n i c components, the possibility of defects cannot be eliminated entirely. To minimize risks of damage or injury to persons or property arising from a defect in an NEC electronic component, customers must incorporate sufficient safety measures in its design, such as redundancy, firecontainment, and anti-failure features. NEC devices are classified into the following three quality grades: "Standard," "Special," and "Specific". The Specific quality grade applies only to devices developed based on a customer designated "quality assurance program" for a specific a p p l i c a t i o n . T h e r e c o m m e n d e d applications of a device depend on its quality grade, as indicated below. Customers must check the quality grade of each device before using it in a particular application. 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(Note) (1) "NEC" as used in this statement means NEC Corporation and also includes its majorityowned subsidiaries. (2) "NEC electronic component products" means any electronic component product developed or manufactured by or for NEC (as defined above). DE0202