32l-TQFP 7x7x1.4mm Pb-free Package Material Declaration Datasheet.pdf

32L - TQFP (7X7X1.4MM)
Pb-Free Package
PACKAGE MATERIAL DECLARATION DATASHEET
Cypress Package Code
Package Weight – Site 1
AZ
B1: 152.9087 mg
B2: 179.9871 mg
Body Size (mil/mm)
Package Weight – Site 2
7x7x1.4 mm
134.0000 mg
SUMMARY
The 32L-TQFP Pb-Free package is qualified at two assembly sites. Packages from different assembly sites
may have different material composition. Cypress Ordering Part Numbers containing an “X” (e.g.
CY7C1328G-133AXI, CY2308SXC-1HT) meet the Directive 2002/95/EC (RoHS) requirement.
ASSEMBLY Site 1: Advanced Semiconductor Engineering Taiwan (ASET)
Package Qualification Report # 034101, 120201 (Note 1)
I. DECLARATION OF PACKAGED UNITS
A. BANNED SUBSTANCES
Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU
RoHS. Listed in the table below are materials that are neither contained nor intentionally added to this
product.
Substances / Compounds
Cadmium and Cadmium Compounds
Hexavalent Chromium and its Compounds
Lead and Lead Compounds
Mercury and Mercury Compounds
Polybrominated Biphenyls (PBB)
Polybrominated Diphenylethers (PBDE)
Asbestos
Azo colorants
Ozone Depleting Substances
Polychlorinated Biphenyls (PCBs)
Polychlorinated Napthalenes
Radioactive Substances
Shortchain Chlorinated Paraffins
Tributyl Tin (TBT) and Triphenyl Tin (TPT)
Tributyl Tin Oxide (TBTO)
Formaldehyde
Weight by
mg
PPM
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
0
0
0
0
0
0
0
0
0
0
Analysis
Report
(Note 2)
CoA-AZ32ASET
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural
impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor
PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-05016 Rev. *I
Page 1 of 7
32L - TQFP (7X7X1.4MM)
Pb-Free Package
B1. MATERIAL COMPOSITION (Note 3)
Using Gold wire material
Material
Purpose of
Use
Leadframe
Base Material
Lead Finish
External
Plating
Die Attach
Adhesive
Die
Circuit
Wire
Interconnect
Mold Compound
Encapsulation
Substance
Composition
CAS Number
21.8910
0.7488
0.1593
0.0391
5.0991
4.4000
% weight of
substance per
Homogenous
material
78.3500%
2.6800%
0.5700%
0.1400%
18.2500%
100.0000%
143,164
4,897
1,042
256
33,347
28,775
14.3164%
0.4897%
0.1042%
0.0256%
3.3347%
2.8775%
Weight by
mg
PPM
% weight of
substance
per package
Copper
Nickel
Silicon
Magnesium
Silver
Tin
7440-50-8
7440-02-0
7440-21-3
7439-95-4
7440-22-4
7440-31-5
Epoxy Resin
Silver
Metal
Silicon
Gold
Ion Impurities
Epoxy Resin
Phenol Resin
Aromatic
Phosphate
Silica
Others
Proprietary
7440-22-4
Proprietary
7440-21-3
7440-57-5
Proprietary
85954-11-6
26834-02-6
139189-30-3
0.1600
0.8700
0.0600
6.0000
1.4000
0.0001
5.6035
4.4716
1.6811
14.6800%
79.8200%
5.5000%
100.0000%
100.0000%
0.0100%
5.0000%
3.9900%
1.5000%
1,046
5,690
392
39,239
9,156
1
36,646
29,244
10,994
0.1046%
0.5690%
0.0392%
3.9239%
0.9156%
0.0001%
3.6646%
2.9244%
1.0994%
60676-86-0
Trade Secret
99.2044
1.1207
88.5200%
1.0000%
648,782
7,329
64.8782%
0.7329%
Package Weight (mg):
152.9087
% Total:
100.0000
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural
impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor
PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-05016 Rev. *I
Page 2 of 7
32L - TQFP (7X7X1.4MM)
Pb-Free Package
B2. MATERIAL COMPOSITION (Note 3)
Using Copper wire material
Material
Purpose of
Use
Leadframe
Base Material
Lead Finish
External
Plating
Die Attach
Die
Wire
Adhesive
Circuit
Interconnect
Mold Compound
Encapsulation
Substance
Composition
Copper
Nickel
Silicon
Magnesium
Silver
Tin
Silver
Epoxy Resin A
Epoxy Resin B
Diluent A
Diluent B
Phenolic
Hardener
Dicyandiamide
Organic
peroxide
Silicon
Copper (Cu)
Epoxy Resin A
Epoxy, Cresol
Novolac
Phenol Resin
Metal Hydroxide
Carbon Black
Silica,
Crystalline
Silica Fused B
Silica Fused A
7440-50-8
7440-02-0
7440-21-3
7439-95-4
7440-22-4
7440-31-5
67.6131
1.7925
0.3585
0.0717
1.8642
3.7400
% weight of
substance per
Homogenous
material
94.3000%
2.5000%
0.5000%
0.1000%
2.6000%
100.0000%
7440-22-4
9003-36-5
Trade Secret
Trade Secret
Trade Secret
Trade Secret
0.3874
0.0198
0.0198
0.0198
0.0198
0.0248
78.1000%
4.0000%
4.0000%
4.0000%
4.0000%
5.0000%
2152
110
110
110
110
138
0.2152%
0.0110%
0.0110%
0.0110%
0.0110%
0.0138%
461-58-5
Trade secret
0.0015
0.0030
0.3000%
0.6000%
8
17
0.0008%
0.0017%
7440-21-3
7440-50-8
Trade secret
29690-82-2
3.4810
0.1800
4.0156
4.0156
100.0000%
100.0000%
4.0000%
4.0000%
19340
1000
22311
22311
1.9340%
0.1000%
2.2311%
2.2311%
Trade secret
Trade secret
1333-86-4
14808-60-7
4.0156
4.0156
0.4016
0.2008
4.0000%
4.0000%
0.4000%
0.2000%
22311
22311
2231
1116
2.2311%
2.2311%
0.2231%
0.1116%
7631-86-9
60676-86-0
5.4211
78.3043
5.4000%
78.0000%
30119
435055
3.0119%
43.5055%
CAS Number
Package Weight (mg):
Weight by
mg
179.9871
PPM
% weight of
substance
per package
375655
9959
1992
398
10357
20779
37.5655%
0.9959%
0.1992%
0.0398%
1.0357%
2.0779%
% Total:
100.0000
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural
impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor
PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-05016 Rev. *I
Page 3 of 7
32L - TQFP (7X7X1.4MM)
Pb-Free Package
II. DECLARATION OF PACKAGING / INDIRECT MATERIALS
Type
Tape &
Reel
Tray
Others
Material
Cover tape
Carrier tape
Plastic Reel
Tray
Shielding bag
Moisture Barrier bag
Protective Band
Shipping and Inner
Box
Lead
PPM
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
Cadmium
PPM
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
Cr VI
PPM
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
Mercury
PPM
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
PBB
PPM
<5.0
<5.0
<5.0
<5.0
<5.0
<5.0
<5.0
<5.0
PBDE
PPM
<5.0
<5.0
<5.0
<5.0
<5.0
<5.0
<5.0
<5.0
Analysis Report
(Note2)
CoA-COVT-R
CoA-CART-R
CoA-PLRL-R
CoA-TRAY-R
CoA-SBAG –R
CoA-MBBG-R
CoA-PROB-R
CoA-ABOX-R
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural
impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor
PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-05016 Rev. *I
Page 4 of 7
32L - TQFP (7X7X1.4MM)
Pb-Free Package
ASSEMBLY Site 2: Amkor Technology Bupyeong Korea
Package Qualification Report # 034602 (Note 1)
I. DECLARATION OF PACKAGED UNITS
A. BANNED SUBSTANCES
Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU
RoHS. Listed in the table below are materials that are neither contained nor intentionally added to this
product.
Substances / Compounds
Cadmium and Cadmium Compounds
Hexavalent Chromium and its Compounds
Lead and Lead Compounds
Mercury and Mercury Compounds
Polybrominated Biphenyls (PBB)
Polybrominated Diphenylethers (PBDE)
Asbestos
Azo colorants
Ozone Depleting Substances
Polychlorinated Biphenyls (PCBs)
Polychlorinated Napthalenes
Radioactive Substances
Shortchain Chlorinated Paraffins
Tributyl Tin (TBT) and Triphenyl Tin (TPT)
Tributyl Tin Oxide (TBTO)
Formaldehyde
Weight by mg
PPM
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
0
0
0
0
0
0
0
0
0
0
Analysis Report
(Note 2)
CoA-AZ32Amkor
Bupyeong
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural
impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor
PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-05016 Rev. *I
Page 5 of 7
32L - TQFP (7X7X1.4MM)
Pb-Free Package
B. MATERIAL COMPOSITION (Note 3)
Material
Leadframe
Purpose of
Use
Base Material
Lead Finish
External
Plating
Die Attach
Adhesive
Die
Wire
Circuit
Interconnect
Mold
Compound
Encapsulation
Cu
7440-50-8
42.6495
% weight of
substance per
Homogenous
material
97.4400%
Cr
Sn
7440-47-3
7440-31-5
0.1313
0.1094
0.3000%
0.2500%
980
817
0.0980%
0.0817%
Zn
Ag
Pure Sn
7440-66-6
7440-22-4
7440-31-5
0.0788
0.8010
2.5300
0.1800%
1.8300%
100.0000%
588
5,978
18,881
0.0588%
0.5978%
1.8881%
Ag
Epoxy Resin
Anhydride
Si
Au
Multi-aromatic
Resin
SiO2
Carbon Black
7440-22-4
Trade Secret
Trade Secret
7440-21-3
7440-57-5
Trade Secret
0.1900
0.6700
0.0900
3.4600
1.1100
9.4507
20.0000%
70.5300%
9.4700%
100.0000%
100.0000%
11.5000%
1,418
5,000
671
25,821
8,284
70,528
0.1418%
0.5000%
0.0671%
2.5821%
0.8284%
7.0528%
72.3102
0.4191
87.9900%
0.5100%
539,628
3,128
53.9628%
0.3128%
Substance
Composition
CAS Number
60676-86-0
1333-86-4
Package Weight (mg):
Weight by
mg
134.0000
318,280
% weight of
substance
per
package
31.8280%
PPM
% Total:
100.0000
II. DECLARATION OF PACKAGING / INDIRECT MATERIALS
Type
Tape &
Reel
Tray
Others
Material
Cover tape
Carrier tape
Plastic Reel
Tray
Shielding bag
Moisture Barrier bag
Protective Band
Shipping and Inner
Box
Lead
PPM
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
Cadmium
PPM
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
Cr VI
PPM
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
Mercury
PPM
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
PBB
PPM
<5.0
<5.0
<5.0
<5.0
<5.0
<5.0
<5.0
<5.0
PBDE
PPM
<5.0
<5.0
<5.0
<5.0
<5.0
<5.0
<5.0
<5.0
Analysis Report
(Note2)
CoA-COVT-R
CoA-CART-R
CoA-PLRL-R
CoA-TRAY-R
CoA-SBAG –R
CoA-MBBG-R
CoA-PROB-R
CoA-ABOX-R
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural
impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor
PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-05016 Rev. *I
Page 6 of 7
32L - TQFP (7X7X1.4MM)
Pb-Free Package
Document History Page
Document Title:
Document Number:
32L-TQFP 7X7X1.4MM PB-FREE PACKAGE MATERIAL DECLARATION DATASHEET
001-05016
Rev. ECN No. Orig. of
Change
**
399402
YXP
*A
412826
YXP
*B
2614465 HLR
*C
*D
Dcon
2793268 HLR
3473256 HLR
*E
3560005 EBZ
*F
4032211 YUM
*G
4083873 YUM
*H
*I
4617357 HLR
5083865 HLR
MEL
Description of Change
New Specification
Combined data of PMDD with spec 001-04357 (32L-TQFP
7x7x1.0mm).
Changed spec title (deleted package size – 7x7x1.4 mm) to cover
both package sizes of 32L-TQFP.
Edited summary section, for Site 2 package weight and body size.
Updated PMDD form with the below changes:
 Added “(PMDD)” at header section
 Edited footnote
Changed Cypress Logo.
Changed the CAS Number of Gold.
Added the %weight of homogenous on material composition table.
Completed the RoHS substance on Indirect Material table.
Updated Document Title.
Replaced CML with WEB in distribution list.
Changed Assembly code for Assembly Site 2 – M to Q.
Updated the material composition table to reflect 4 decimal places
on values
Added package weight B2 for Site 1. Added Material Composition
table B2 using copper wire material for Site 1. Added reference
QTP #120201 for Site 1.
Added assembly site name in the Assembly heading in site 1 and
2.
Changed Assembly code to Assembly Site Name in site 1 and 2.
Changed the body size from “7x7mm” to “7x7x1.4mm” to align it to
the Document title.
Sunset Due – No Change
Changed the substances with “------------- “to “Trade Secret.
Removed “Distribution: WEB” and “Posting: NONE” from the
document history page.
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to
report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using
MSDS, Material Analysis Reports and Cypress Assembly site information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-05016 Rev. *I
Page 7 of 7
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