176L - TQFP Pb-Free Package PACKAGE MATERIAL DECLARATION DATASHEET Cypress Package Code Package Weight – Site 1 AZ 1,908.0100 mg Body Size (mil/mm) Package Weight – Site 2 24x24x1.4 mm N/A SUMMARY The 176-TQFP Pb-Free package is compliant to RoHS. Cypress Ordering Part Number containing an “X” (e.g. CY7C1328G-133AXI, CY2308SXC-1HT) meet the of Directive 2002/95/EC (RoHS) requirement. ASSEMBLY Site 1: Advanced Semiconductor Engineering Taiwan (ASET) Package Qualification Report # 034101 (Note 1) I. DECLARATION OF PACKAGED UNITS A. BANNED SUBSTANCES Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU RoHS. listed in the table below are materials that are neither contained nor intentionally added to this product. Substances / Compounds Cadmium and Cadmium Compounds Hexavalent Chromium and its Compounds Lead and Lead Compounds Mercury and Mercury Compounds Polybrominated Biphenyls (PBB) Polybrominated Diphenylethers (PBDE) Asbestos Azo colorants Ozone Depleting Substances Polychlorinated Biphenyls (PCBs) Polychlorinated Napthalenes Radioactive Substances Shortchain Chlorinated Paraffins Tributyl Tin (TBT) and Triphenyl Tin (TPT) Tributyl Tin Oxide (TBTO) Formaldehyde Weight by mg PPM 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 0 0 0 0 0 0 0 0 0 0 Analysis Report (Note 2) CoA-AZ176ASET As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-52676 Rev. *E Page 1 of 3 176L - TQFP Pb-Free Package B. MATERIAL COMPOSITION (Note 3) Material Base Material Lead Finish External Plating Die Attach Adhesive Die Wire Mold Compound Copper 7440-50-8 462.6547 Nickel Silicon 7440-02-0 7440-21-3 14.4279 3.1260 3.0000% 0.6500% 7,562 1,638 0.7562% 0.1638% 7439-95-4 7440-31-5 7440-22-4 Trade Secret 7440-50-8 96-48-0 0.7214 20.9000 4.5014 1.2680 0.1902 0.1902 0.1500% 100.0000% 71.0000% 20.0000% 3.0000% 3.0000% 378 10,954 2,359 665 100 100 0.0378% 1.0954% 0.2359% 0.0665% 0.0100% 0.0100% Trade Secret 0.1902 3.0000% 100 0.0100% 7440-21-3 7440-57-5 Trade Secret 85954-11-6 26834-02-6 139189-30-3 51.6200 9.9190 0.0010 66.9150 53.5320 20.0745 100.0000% 99.9900% 0.0100% 5.0000% 4.0000% 1.5000% 27,054 5,199 1 35,071 28,056 10,521 2.7054% 0.5199% 0.0001% 3.5071% 2.8056% 1.0521% 60676-86-0 Trade Secret 1184.3955 13.3830 88.5000% 1.0000% 620,749 7,014 62.0749% 0.7014% Package Weight (mg): 1908.0100 % Total: 100.0000 Purpose of Use Lead frame Circuit Interconnect Encapsulation 242,480 % weight of substance per package 24.2480% % weight of substance per Homogenous material 96.2000% Substance Composition CAS Number Magnesium Tin Silver Epoxy Resin Copper GammaButyrolactone Aromatic Hydrocarbons Silicon Au Ion Impurities Epoxy Resin Phenol Resin Aromatic Phosphate Silica (SiO2) Others Weight by mg PPM II. DECLARATION OF PACKAGING INDIRECT MATERIALS Type Tape & Reel Tray Others Material Cover tape Carrier tape Plastic Reel Tray Shielding bag Lead PPM < 2.0 < 2.0 < 5.0 < 2.0 <2.0 Cadmium PPM < 2.0 < 2.0 < 5.0 < 2.0 <2.0 Cr VI PPM < 2.0 < 2.0 < 5.0 < 2.0 <2.0 Mercury PPM < 2.0 < 2.0 < 10.0 < 2.0 <2.0 PBB PPM < 50.00 < 50.00 <50.0 < 0.0005 <5.0 PBDE PPM < 45.00 < 45.00 <45.0 < 0.0005 <5.0 Analysis Report (Note2) CoA-COVT-R CoA-CART-R CoA-PLRL-R CoA-TRAY-R CoA-SBAG –R CoA-SBAG –M Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-52676 Rev. *E Page 2 of 3 176L - TQFP Pb-Free Package Document History Page Document Title: Document Number: 176L-TQFP PB-FREE PACKAGE MATERIAL DECLARATION DATASHEET 001-52676 Rev. ECN No. Orig. of Change ** 2680822 MAHA *A 3194882 MAHA *B 3591884 HLR *C 4055294 YUM *D *E 4756622 HLR 5268684 HLR DCON Description of Change New document Deleted the information tubes on Table II. DECLARATION OF PACKAGING / INDIRECT MATERIALS. Updated Assembly Site 1 to reflect 4 decimal places on values of material composition table. Added assembly site name in the assembly heading. Changed Assembly code to assembly site name. Sunset Due – No Change Changed the substances with “------------- “ and Proprietary to “Trade Secret. Changed Cypress Logo. Removed Distribution and posting information from Document history page. Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-52676 Rev. *E Page 3 of 3