18L - SOIC Pb-Free Package PACKAGE MATERIAL DECLARATION DATASHEET Cypress Package Code Package Weight – Site 1 SZ B1: 502.0100 mg B2: 496.6998 mg B3: 495.8893 mg Body Size (mil/mm) Package Weight – Site 2 300 mils B1: 488.9902 mg B2: 489.0746 mg SUMMARY The 18L- SOIC Pb-Free package is qualified at three assembly sites. Packages from different assembly sites may have different material composition. Cypress Ordering Part Numbers containing an “X” (e.g. CY7C1328G-133AXI, CY2308SXC-1HT) meet the Directive 2002/95/EC (RoHS) requirement. ASSEMBLY Site 1: Cypress Manufacturing Limited (CML) Package Qualification Report # 041601, # 102902, # 125106 (Note 1) I. DECLARATION OF PACKAGED UNITS A. BANNED SUBSTANCES Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU RoHS. Listed in the table below are materials that are neither contained nor intentionally added to this product. Substances / Compounds Cadmium and Cadmium Compounds Hexavalent Chromium and its Compounds Lead and Lead Compounds Mercury and Mercury Compounds Polybrominated Biphenyls (PBB) Polybrominated Diphenylethers (PBDE) Asbestos Azo colorants Ozone Depleting Substances Polychlorinated Biphenyls (PCBs) Polychlorinated Napthalenes Radioactive Substances Shortchain Chlorinated Paraffins Tributyl Tin (TBT) and Triphenyl Tin (TPT) Tributyl Tin Oxide (TBTO) Formaldehyde Weight by mg 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 PPM Analysis Report (Note 2) < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 0 0 0 0 0 0 0 0 0 0 CoA-SZ18CML As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-03048 Rev. *M Page 1 of 11 18L - SOIC Pb-Free Package B1. MATERIAL COMPOSITION (Note 3) Using Standard Molding Compound Material Purpose of Use Leadframe Base Material Lead Finish External Plating Die Attach Adhesive Die Wire Circuit Interconnect Mold Compound Encapsulation Substance Composition Cu Fe P Zn Ni Pd Au Ag Bismaleimide Polymer Methacrylate Acylate ester Organic Peroxide Si Au Fused Silica Solid Epoxy Resin Phenol Resin Antimony Trioxide Crystalline Silica Carbon Black CAS Number Weight by mg % Weight of Substance per Homogeneous Material 7440-50-8 7439-89-6 7723-14-0 7440-66-6 7440-02-0 7440-05-3 7440-57-5 7440-22-4 Trade Secret Trade Secret Trade Secret Trade Secret Trade Secret 7440-21-3 7440-57-5 60676-86-0 Trade Secret 185.2836 4.5650 0.1331 0.2283 0.1930 0.0035 0.0035 0.0858 0.0121 0.0066 0.0022 0.0022 0.0011 1.5400 0.7600 228.4914 30.9190 97.4100% 2.4000% 0.0700% 0.1200% 96.5200% 1.7400% 1.7400% 78.0000% 11.0000% 6.0000% 2.0000% 2.0000% 1.0000% 100.0000% 100.0000% 73.9000% 10.0000% Trade Secret 1309-64-4 34.0109 4.0195 11.0000% 1.3000% 9.2757 3.0000% PPM 369,083 9,094 265 455 385 7 7 171 24 13 4 4 2 3,068 1,514 455,153 61,590 67,749 % Weight of Substance per Package 36.9083% 0.9094% 0.0265% 0.0455% 0.0385% 0.0007% 0.0007% 0.0171% 0.0024% 0.0013% 0.0004% 0.0004% 0.0002% 0.3068% 0.1514% 45.5153% 6.1590% 6.7749% 0.8007% 8,007 14808-60-7 1333-86-4 Package Weight (mg): 2.4735 502.0100 1.8477% 18,477 4,927 0.4927% % Total: 100.0000 0.8000% Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-03048 Rev. *M Page 2 of 11 18L - SOIC Pb-Free Package B2. MATERIAL COMPOSITION (Note 3) Using Green Molding Compound Material Purpose of Use Leadframe Base Material Lead Finish External Plating Die Attach Adhesive Die Wire Circuit Interconnect Mold Compound Encapsulation Substance Composition Cu Fe P Zn Ni Pd Au Ag Bismaleimide Polymer Methacrylate Acylate ester Organic Peroxide Si Au Fused Silica Solid Epoxy Resin Carbon Black Phenol Resin CAS Number Weight by mg % Weight of Substance per Homogeneous Material 7440-50-8 7439-89-6 7723-14-0 7440-66-6 7440-02-0 7440-05-3 7440-57-5 7440-22-4 Trade Secret Trade Secret Trade Secret Trade Secret Trade Secret 7440-21-3 7440-57-5 60676-86-0 Trade Secret 78.3639 1.9307 0.0563 0.0965 1.2090 0.0218 0.0218 0.2197 0.0247 0.0137 0.0055 0.0055 0.0055 3.8446 1.5185 364.3323 23.5383 97.4100% 2.4000% 0.0700% 0.1200% 96.5204% 1.7370% 1.7427% 80.0000% 9.0000% 5.0000% 2.0000% 2.0000% 2.0000% 100.0000% 99.9900% 89.0000% 5.7500% 1333-86-4 Trade Secret 1.0234 20.4681 0.2500% 5.0000% PPM 157,769 3,887 113 194 2,434 44 44 442 50 28 11 11 11 7,740 3,057 733,506 % Weight of Substance per Package 15.7769% 0.3887% 0.0113% 0.0194% 0.2434% 0.0044% 0.0044% 0.0442% 0.0050% 0.0028% 0.0011% 0.0011% 0.0011% 0.7740% 0.3057% 73.3506% 4.739% 47,389 Package Weight (mg): 496.6998 2,060 0.2060% 41,210 4.1210% % Total: 100.0000 Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-03048 Rev. *M Page 3 of 11 18L - SOIC Pb-Free Package B3. MATERIAL COMPOSITION (Note 3) Copper wire using Halogen-free Molding Compound Material Purpose of Use Leadframe Base Material Lead Finish External Plating Die Attach Adhesive Die Wire Circuit Interconnect Mold Compound Encapsulation Substance Composition Cu Fe P Zn Ni Pd Au Ag Bismaleimide Polymer Methacrylate Acylate ester Organic Peroxide Si Cu Fused Silica Phenol Resin Solid Epoxy Resin Carbon Black CAS Number 7440-50-8 7439-89-6 7723-14-0 7440-66-6 7440-02-0 7440-05-3 7440-57-5 7440-22-4 Trade Secret Trade Secret Trade Secret Trade Secret Trade Secret 7440-21-3 7440-50-8 60676-86-0 Trade Secret Trade Secret 1333-86-4 Package Weight (mg): Weight by mg % Weight of Substance per Homogeneou s Material PPM % Weight of Substance per Package 78.3638 1.9307 0.0563 0.0965 1.2090 0.0218 0.0218 0.2197 0.0247 0.0137 0.0055 0.0055 0.0055 3.8446 0.7081 364.3323 20.4681 97.4100% 2.4000% 0.0700% 0.1200% 96.5200% 1.7400% 1.7400% 80.0000% 9.0000% 5.0000% 2.0000% 2.0000% 2.0000% 100.0000% 100.0000% 89.0000% 5.0000% 158,027 3,893 114 195 2,438 44 44 443 50 28 11 11 11 7,753 1,426 734,705 41,276 15.8027% 0.3893% 0.0114% 0.0195% 0.2438% 0.0044% 0.0044% 0.0443% 0.0050% 0.0028% 0.0011% 0.0011% 0.0011% 0.7753% 0.1426% 73.4705% 4.1276% 23.5383 5.7500% 47,467 4.7467% 1.0234 0.2500% 2,064 0.2064% % Total: 100.0000 495.8893 Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-03048 Rev. *M Page 4 of 11 18L - SOIC Pb-Free Package II. DECLARATION OF PACKAGING / INDIRECT MATERIALS Type Tube Tape and Reel Others Material Plastic Tube End Plug Carrier Tape Moisture Barrier Bag Dessicant HIC Bubble Pack Carton Label Inner Label Shielding Bag Lead PPM <5.0 <5.0 <5.0 Cadmium PPM <5.0 <5.0 <5.0 Cr VI PPM <5.0 <5.0 <5.0 Mercury PPM <5.0 <5.0 <5.0 PBB PPM <5.0 <5.0 <5.0 PBDE PPM <5.0 <5.0 <5.0 Analysis Report (Note2) CoA-PLTB-R CoA-EPLG-R CoA-CART-R <5.0 <5.0 <5.0 <5.0 <5.0 <5.0 CoA-MBBG-R <5.0 <5.0 <5.0 <10.0 <10.0 <5.0 <5.0 <5.0 <5.0 <5.0 <5.0 < 5.0 <5.0 <5.0 <5.0 <5.0 <5.0 < 5.0 <5.0 <5.0 <5.0 <5.0 <5.0 < 5.0 <5.0 <5.0 <10.0 <5.0 <5.0 < 5.0 <5.0 <5.0 <10.0 <5.0 <5.0 < 5.0 CoA-DESS-R CoA-HIC-R CoA-BUBB-R CoA-CRTN-R CoA-LBL-R CoA-SBAG-R Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-03048 Rev. *M Page 5 of 11 18L - SOIC Pb-Free Package ASSEMBLY Site 2: Amkor Technology Philippines (P1/P2) Package Qualification Report # 044301 and Report # 124706 (Note 1) I. DECLARATION OF PACKAGED UNITS A. BANNED SUBSTANCES Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU RoHS. Listed in the table below are materials that are neither contained nor intentionally added to this product. Substances / Compounds Cadmium and Cadmium Compounds Hexavalent Chromium and its Compounds Lead and Lead Compounds Mercury and Mercury Compounds Polybrominated Biphenyls (PBB) Polybrominated Diphenylethers (PBDE) Asbestos Azo colorants Ozone Depleting Substances Polychlorinated Biphenyls (PCBs) Polychlorinated Napthalenes Radioactive Substances Shortchain Chlorinated Paraffins Tributyl Tin (TBT) and Triphenyl Tin (TPT) Tributyl Tin Oxide (TBTO) Formaldehyde Weight by mg 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 PPM < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 0 0 0 0 0 0 0 0 0 0 Analysis Report (Note 2) CoA-SZ18Amkor Philippines (P1/P2) As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-03048 Rev. *M Page 6 of 11 18L - SOIC Pb-Free Package B1. MATERIAL COMPOSITION (Note 3) Material Purpose of Use Leadframe Base Material Lead Finish External Plating Die Attach Adhesive Die Wire Circuit Interconnect Mold Compound Encapsulation Substance Composition Cu Fe P Zn Ag Sn Resin Ag Metal oxide Amine Gamma Butyrolactone Si Au Epoxy Resin SiO2 Carbon Black Epoxy, Cresol Novolac Phenol Resin 7440-50-8 7439-89-6 7723-14-0 1314-13-2 7440-22-4 7440-31-5 Trade Secret 7440-22-4 Trade Secret Trade Secret Trade Secret 125.0139 3.0233 0.0388 0.1550 0.9690 3.3300 0.3001 0.9999 0.0400 0.0400 0.0400 % Weight of Substance per Homogeneo us Material 96.7600% 2.3400% 0.0300% 0.1200% 0.7500% 100.0000% 21.1300% 70.4100% 2.8200% 2.8200% 2.8200% 7440-21-3 7440-57-5 Trade secret 60676-86-0 1333-86-4 29690-82-2 4.8700 0.4000 26.2328 300.8023 1.7489 6.9954 100.0000% 100.0000% 7.5000% 86.0000% 0.5000% 2.0000% Trade secret 13.9908 4.0000% CAS Number Package Weight (mg): Weight by mg 488.9902 PPM % Weight of Substance per Package 255,657 6,183 79.26539 317.0615 1,982 6,810 613.6646 2,045 81.89939 81.89939 25.5657% 0.6183% 0.0079% 0.0317% 0.1982% 0.6810% 0.0614% 0.2045% 0.0082% 0.0082% 81.89939 9,959 818.0122 53,647 615,150 3,576 0.0082% 0.9959% 0.0818% 5.3647% 61.5150% 0.3576% 14,306 28,612 1.4306% 2.8612% % Total: 100.0000 Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-03048 Rev. *M Page 7 of 11 18L - SOIC Pb-Free Package B2. MATERIAL COMPOSITION (Note 3) Using Copper Wire material Material Purpose of Use Leadframe Base Material Lead Finish External Plating Die Attach Adhesive Die Wire Circuit Interconnect Mold Compound Encapsulation Substance Composition Cu Fe Zn P Ag Sn Epoxy resin A Epoxy Resin B Ag Lactone Polyoxypropylene diamine 2,6-Diglycidyl phenyl allyl ether oligomer Silicon Cu Multi-aromatic Resin SiO2 Filler Carbon Black Epoxy Cresol Novolac Phenol Resin 7440-50-8 7439-89-6 7440-66-6 7723-14-0 7440-22-4 7440-31-5 Trade Secret Trade Secret Trade Secret Trade Secret 125.313 3.0868 0.1721 0.0514 0.9738 3.3255 0.0991 0.0566 1.09 0.0566 % Weight of Substance per Homogeneo us Material 96.6942% 2.3819% 0.1328% 0.0397% 0.7514% 100.0000% 7.0000% 4.0000% 77.0000% 4.0000% Trade Secret 0.0566 4.0000% 116 0.0116% Trade Secret 0.0566 4.0000% 116 0.0116% 7440-21-3 7440-50-8 4.7880 0.1175 100.0000% 100.0000% 9,790 240 0.9790% 0.0240% Trade Secret 26.2373 7.5000% 53,647 5.3647% 60676-86-0 Trade Secret 300.8547 1.7492 86.0000% 0.5000% 615,150 3,576 61.5151% 0.3576% 6.9966 2.0000% 14,306 1.4306% 13.9932 4.0000% 28,612 2.8612% CAS Number 1333-86-4 Trade Secret Package Weight (mg): Weight by mg 489.0746 PPM % Weight of Substance per Package 256,223 6,312 352 105 1,991 6,800 203 116 2229 116 25.6225% 0.6312% 0.0352% 0.0105% 0.1991% 0.6800% 0.0203% 0.0116% 0.2229% 0.0116% % Total: 100.0000 Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-03048 Rev. *M Page 8 of 11 18L - SOIC Pb-Free Package II.DECLARATION OF PACKAGING / INDIRECT MATERIALS Type Tube Tape and Reel Others Material Plastic Tube End Plug Carrier Tape Moisture Barrier Bag Dessicant HIC Bubble Pack Carton Label Inner Label Shielding Bag Lead PPM <5.0 <5.0 <5.0 Cadmium PPM <5.0 <5.0 <5.0 Cr VI PPM <5.0 <5.0 <5.0 Mercury PPM <5.0 <5.0 <5.0 PBB PPM <5.0 <5.0 <5.0 PBDE PPM <5.0 <5.0 <5.0 Analysis Report (Note2) CoA-PLTB-R CoA-EPLG-R CoA-CART-R <5.0 <5.0 <5.0 <5.0 <5.0 <5.0 CoA-MBBG-R <5.0 <5.0 <5.0 <10.0 <10.0 <5.0 <5.0 <5.0 <5.0 <5.0 <5.0 < 5.0 <5.0 <5.0 <5.0 <5.0 <5.0 < 5.0 <5.0 <5.0 <5.0 <5.0 <5.0 < 5.0 <5.0 <5.0 <10.0 <5.0 <5.0 < 5.0 <5.0 <5.0 <10.0 <5.0 <5.0 < 5.0 CoA-DESS-R CoA-HIC-R CoA-BUBB-R CoA-CRTN-R CoA-LBL-R CoA-SBAG-R Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-03048 Rev. *M Page 9 of 11 18L - SOIC Pb-Free Package Document History Page Document Title: Document Number: Rev. 18L - SOIC PB-FREE PACKAGE MATERIAL DECLARATION DATASHEET 001-03048 ** *A ECN No. Orig. of Change 385598 GFJ 400681 YXP *B *C 431302 VFR 2247167 MAHA *D 2678542 HLR *E 2882692 HLR *F 3591988 HLR Description of Change New document Edited Summary section, and added package weight to reflect assembly site 2. Added PMDD data for assembly site 2. Added “Tray” under material in Declaration of packaging/Indirect Materials. Added Note 4 on footer section. Added PMDD data for assembly site 3. 1. Changed “II. Declaration of Packaged Units” to “I. Declaration of Packaged Units” for assembly sites 1 and 2. 2. Changed “III. Declaration of Packaged Units” to “I. Declaration of Packaged Units” for assembly site 3. 3. Updated Cypress logo 4. Added “% weight of substance per Homogenous Material” and “% Weight of Substance per Package” on the Material Composition tables. 5. Completed the RoHS Substances namely: Lead, Cadmium, Mercury, Chromium VI, PBB and PBDE on Declaration of Packaging Indirect Materials table. Added CAS number for Fused Silica, Antimony Trioxide and Gold. Added CAS number for Crystalline Silica and Carbon Black on Assembly Site1. Removed Assembly Site 3 – OSE Philippines is no longer an active Subcontractor site. Updated Assembly Sites 1 and 2 to reflect 4 decimal places on values of material composition table. Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-03048 Rev. *M Page 10 of 11 18L - SOIC Pb-Free Package Document History Page Document Title: Document Number: Rev. 18L - SOIC PB-FREE PACKAGE MATERIAL DECLARATION DATASHEET 001-03048 *G ECN No. Orig. of Change 3742795 MRB *H 3978945 MRB *I 4007746 UDR *J 4065631 YUM *K 4109493 YUM *L 4186371 UDR *M 5268684 HLR DCON Description of Change Added Package weight-Site1 B2: 496.6998 mg, Package QTP report # 102902 and PMDD B2 on Assembly site 1 Deleted Antimony Trioxide, Crystalline Silica in Assembly site 1 B2 Green molding compound Added B3 for Assembly Site 1 Added QTP # 125106 at Assembly Site 1 Package Qualification Reports. Added B3. Material Composition – Using Copper Wire with Halogen-free Mold Compound. Added assembly site name in the assembly heading in site 1 and 2. Changed assembly code to assembly site name in site 1 and 2. Corrected total package weight in site 2 from “488.9900” to “488.9902” Added B2 for Assembly Site 2 Added QTP # 124706 at Assembly Site 2 Package Qualification Reports. Added B2. Material Composition – Using Copper Wire material. Changed the substances with “------------- “and Proprietary to “Trade Secret. Changed Cypress Logo. Removed Distribution and posting information from Document history page. Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-03048 Rev. *M Page 11 of 11