18L SOIC PB-FREE PACKAGE MATERIAL DECLARATION DATASHEET.pdf

18L - SOIC
Pb-Free Package
PACKAGE MATERIAL DECLARATION DATASHEET
Cypress Package Code
Package Weight – Site 1
SZ
B1: 502.0100 mg
B2: 496.6998 mg
B3: 495.8893 mg
Body Size (mil/mm)
Package Weight – Site 2
300 mils
B1: 488.9902 mg
B2: 489.0746 mg
SUMMARY
The 18L- SOIC Pb-Free package is qualified at three assembly sites. Packages from different assembly sites may
have different material composition. Cypress Ordering Part Numbers containing an “X” (e.g. CY7C1328G-133AXI,
CY2308SXC-1HT) meet the Directive 2002/95/EC (RoHS) requirement.
ASSEMBLY Site 1: Cypress Manufacturing Limited (CML)
Package Qualification Report # 041601, # 102902, # 125106 (Note 1)
I. DECLARATION OF PACKAGED UNITS
A.
BANNED SUBSTANCES
Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU RoHS. Listed
in the table below are materials that are neither contained nor intentionally added to this product.
Substances / Compounds
Cadmium and Cadmium Compounds
Hexavalent Chromium and its Compounds
Lead and Lead Compounds
Mercury and Mercury Compounds
Polybrominated Biphenyls (PBB)
Polybrominated Diphenylethers (PBDE)
Asbestos
Azo colorants
Ozone Depleting Substances
Polychlorinated Biphenyls (PCBs)
Polychlorinated Napthalenes
Radioactive Substances
Shortchain Chlorinated Paraffins
Tributyl Tin (TBT) and Triphenyl Tin (TPT)
Tributyl Tin Oxide (TBTO)
Formaldehyde
Weight by
mg
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
PPM
Analysis Report
(Note 2)
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
0
0
0
0
0
0
0
0
0
0
CoA-SZ18CML
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly
100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using
MSDS, Material Analysis Reports and Cypress Assembly sites information
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-03048 Rev. *M
Page 1 of 11
18L - SOIC
Pb-Free Package
B1. MATERIAL COMPOSITION (Note 3)
Using Standard Molding Compound
Material
Purpose of Use
Leadframe
Base Material
Lead Finish
External Plating
Die Attach
Adhesive
Die
Wire
Circuit
Interconnect
Mold Compound
Encapsulation
Substance
Composition
Cu
Fe
P
Zn
Ni
Pd
Au
Ag
Bismaleimide
Polymer
Methacrylate
Acylate ester
Organic Peroxide
Si
Au
Fused Silica
Solid Epoxy
Resin
Phenol Resin
Antimony
Trioxide
Crystalline Silica
Carbon Black
CAS Number
Weight
by mg
% Weight of
Substance per
Homogeneous
Material
7440-50-8
7439-89-6
7723-14-0
7440-66-6
7440-02-0
7440-05-3
7440-57-5
7440-22-4
Trade Secret
Trade Secret
Trade Secret
Trade Secret
Trade Secret
7440-21-3
7440-57-5
60676-86-0
Trade Secret
185.2836
4.5650
0.1331
0.2283
0.1930
0.0035
0.0035
0.0858
0.0121
0.0066
0.0022
0.0022
0.0011
1.5400
0.7600
228.4914
30.9190
97.4100%
2.4000%
0.0700%
0.1200%
96.5200%
1.7400%
1.7400%
78.0000%
11.0000%
6.0000%
2.0000%
2.0000%
1.0000%
100.0000%
100.0000%
73.9000%
10.0000%
Trade Secret
1309-64-4
34.0109
4.0195
11.0000%
1.3000%
9.2757
3.0000%
PPM
369,083
9,094
265
455
385
7
7
171
24
13
4
4
2
3,068
1,514
455,153
61,590
67,749
% Weight
of
Substance
per
Package
36.9083%
0.9094%
0.0265%
0.0455%
0.0385%
0.0007%
0.0007%
0.0171%
0.0024%
0.0013%
0.0004%
0.0004%
0.0002%
0.3068%
0.1514%
45.5153%
6.1590%
6.7749%
0.8007%
8,007
14808-60-7
1333-86-4
Package Weight (mg):
2.4735
502.0100
1.8477%
18,477
4,927
0.4927%
% Total:
100.0000
0.8000%
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly
100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using
MSDS, Material Analysis Reports and Cypress Assembly sites information
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-03048 Rev. *M
Page 2 of 11
18L - SOIC
Pb-Free Package
B2. MATERIAL COMPOSITION (Note 3)
Using Green Molding Compound
Material
Purpose of Use
Leadframe
Base Material
Lead Finish
External Plating
Die Attach
Adhesive
Die
Wire
Circuit
Interconnect
Mold Compound
Encapsulation
Substance
Composition
Cu
Fe
P
Zn
Ni
Pd
Au
Ag
Bismaleimide
Polymer
Methacrylate
Acylate ester
Organic Peroxide
Si
Au
Fused Silica
Solid Epoxy
Resin
Carbon Black
Phenol Resin
CAS Number
Weight
by mg
% Weight of
Substance per
Homogeneous
Material
7440-50-8
7439-89-6
7723-14-0
7440-66-6
7440-02-0
7440-05-3
7440-57-5
7440-22-4
Trade Secret
Trade Secret
Trade Secret
Trade Secret
Trade Secret
7440-21-3
7440-57-5
60676-86-0
Trade Secret
78.3639
1.9307
0.0563
0.0965
1.2090
0.0218
0.0218
0.2197
0.0247
0.0137
0.0055
0.0055
0.0055
3.8446
1.5185
364.3323
23.5383
97.4100%
2.4000%
0.0700%
0.1200%
96.5204%
1.7370%
1.7427%
80.0000%
9.0000%
5.0000%
2.0000%
2.0000%
2.0000%
100.0000%
99.9900%
89.0000%
5.7500%
1333-86-4
Trade Secret
1.0234
20.4681
0.2500%
5.0000%
PPM
157,769
3,887
113
194
2,434
44
44
442
50
28
11
11
11
7,740
3,057
733,506
% Weight
of
Substance
per
Package
15.7769%
0.3887%
0.0113%
0.0194%
0.2434%
0.0044%
0.0044%
0.0442%
0.0050%
0.0028%
0.0011%
0.0011%
0.0011%
0.7740%
0.3057%
73.3506%
4.739%
47,389
Package Weight (mg):
496.6998
2,060
0.2060%
41,210
4.1210%
% Total:
100.0000
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly
100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using
MSDS, Material Analysis Reports and Cypress Assembly sites information
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-03048 Rev. *M
Page 3 of 11
18L - SOIC
Pb-Free Package
B3. MATERIAL COMPOSITION (Note 3)
Copper wire using Halogen-free Molding Compound
Material
Purpose of Use
Leadframe
Base Material
Lead Finish
External Plating
Die Attach
Adhesive
Die
Wire
Circuit
Interconnect
Mold Compound
Encapsulation
Substance
Composition
Cu
Fe
P
Zn
Ni
Pd
Au
Ag
Bismaleimide
Polymer
Methacrylate
Acylate ester
Organic Peroxide
Si
Cu
Fused Silica
Phenol Resin
Solid Epoxy
Resin
Carbon Black
CAS Number
7440-50-8
7439-89-6
7723-14-0
7440-66-6
7440-02-0
7440-05-3
7440-57-5
7440-22-4
Trade Secret
Trade Secret
Trade Secret
Trade Secret
Trade Secret
7440-21-3
7440-50-8
60676-86-0
Trade Secret
Trade Secret
1333-86-4
Package Weight (mg):
Weight by
mg
% Weight of
Substance
per
Homogeneou
s Material
PPM
% Weight
of
Substance
per
Package
78.3638
1.9307
0.0563
0.0965
1.2090
0.0218
0.0218
0.2197
0.0247
0.0137
0.0055
0.0055
0.0055
3.8446
0.7081
364.3323
20.4681
97.4100%
2.4000%
0.0700%
0.1200%
96.5200%
1.7400%
1.7400%
80.0000%
9.0000%
5.0000%
2.0000%
2.0000%
2.0000%
100.0000%
100.0000%
89.0000%
5.0000%
158,027
3,893
114
195
2,438
44
44
443
50
28
11
11
11
7,753
1,426
734,705
41,276
15.8027%
0.3893%
0.0114%
0.0195%
0.2438%
0.0044%
0.0044%
0.0443%
0.0050%
0.0028%
0.0011%
0.0011%
0.0011%
0.7753%
0.1426%
73.4705%
4.1276%
23.5383
5.7500%
47,467
4.7467%
1.0234
0.2500%
2,064
0.2064%
% Total:
100.0000
495.8893
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly
100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using
MSDS, Material Analysis Reports and Cypress Assembly sites information
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-03048 Rev. *M
Page 4 of 11
18L - SOIC
Pb-Free Package
II. DECLARATION OF PACKAGING / INDIRECT MATERIALS
Type
Tube
Tape and
Reel
Others
Material
Plastic Tube
End Plug
Carrier Tape
Moisture Barrier
Bag
Dessicant
HIC
Bubble Pack
Carton Label
Inner Label
Shielding Bag
Lead
PPM
<5.0
<5.0
<5.0
Cadmium
PPM
<5.0
<5.0
<5.0
Cr VI
PPM
<5.0
<5.0
<5.0
Mercury
PPM
<5.0
<5.0
<5.0
PBB
PPM
<5.0
<5.0
<5.0
PBDE
PPM
<5.0
<5.0
<5.0
Analysis Report
(Note2)
CoA-PLTB-R
CoA-EPLG-R
CoA-CART-R
<5.0
<5.0
<5.0
<5.0
<5.0
<5.0
CoA-MBBG-R
<5.0
<5.0
<5.0
<10.0
<10.0
<5.0
<5.0
<5.0
<5.0
<5.0
<5.0
< 5.0
<5.0
<5.0
<5.0
<5.0
<5.0
< 5.0
<5.0
<5.0
<5.0
<5.0
<5.0
< 5.0
<5.0
<5.0
<10.0
<5.0
<5.0
< 5.0
<5.0
<5.0
<10.0
<5.0
<5.0
< 5.0
CoA-DESS-R
CoA-HIC-R
CoA-BUBB-R
CoA-CRTN-R
CoA-LBL-R
CoA-SBAG-R
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly
100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using
MSDS, Material Analysis Reports and Cypress Assembly sites information
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-03048 Rev. *M
Page 5 of 11
18L - SOIC
Pb-Free Package
ASSEMBLY Site 2: Amkor Technology Philippines (P1/P2)
Package Qualification Report # 044301 and Report # 124706 (Note 1)
I. DECLARATION OF PACKAGED UNITS
A. BANNED SUBSTANCES
Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU RoHS. Listed
in the table below are materials that are neither contained nor intentionally added to this product.
Substances / Compounds
Cadmium and Cadmium Compounds
Hexavalent Chromium and its Compounds
Lead and Lead Compounds
Mercury and Mercury Compounds
Polybrominated Biphenyls (PBB)
Polybrominated Diphenylethers (PBDE)
Asbestos
Azo colorants
Ozone Depleting Substances
Polychlorinated Biphenyls (PCBs)
Polychlorinated Napthalenes
Radioactive Substances
Shortchain Chlorinated Paraffins
Tributyl Tin (TBT) and Triphenyl Tin (TPT)
Tributyl Tin Oxide (TBTO)
Formaldehyde
Weight by
mg
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
PPM
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
0
0
0
0
0
0
0
0
0
0
Analysis Report
(Note 2)
CoA-SZ18Amkor
Philippines
(P1/P2)
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly
100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using
MSDS, Material Analysis Reports and Cypress Assembly sites information
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-03048 Rev. *M
Page 6 of 11
18L - SOIC
Pb-Free Package
B1. MATERIAL COMPOSITION (Note 3)
Material
Purpose of Use
Leadframe
Base Material
Lead Finish
External Plating
Die Attach
Adhesive
Die
Wire
Circuit
Interconnect
Mold Compound
Encapsulation
Substance
Composition
Cu
Fe
P
Zn
Ag
Sn
Resin
Ag
Metal oxide
Amine
Gamma
Butyrolactone
Si
Au
Epoxy Resin
SiO2
Carbon Black
Epoxy, Cresol
Novolac
Phenol Resin
7440-50-8
7439-89-6
7723-14-0
1314-13-2
7440-22-4
7440-31-5
Trade Secret
7440-22-4
Trade Secret
Trade Secret
Trade Secret
125.0139
3.0233
0.0388
0.1550
0.9690
3.3300
0.3001
0.9999
0.0400
0.0400
0.0400
% Weight of
Substance
per
Homogeneo
us Material
96.7600%
2.3400%
0.0300%
0.1200%
0.7500%
100.0000%
21.1300%
70.4100%
2.8200%
2.8200%
2.8200%
7440-21-3
7440-57-5
Trade secret
60676-86-0
1333-86-4
29690-82-2
4.8700
0.4000
26.2328
300.8023
1.7489
6.9954
100.0000%
100.0000%
7.5000%
86.0000%
0.5000%
2.0000%
Trade secret
13.9908
4.0000%
CAS Number
Package Weight (mg):
Weight by
mg
488.9902
PPM
% Weight of
Substance
per
Package
255,657
6,183
79.26539
317.0615
1,982
6,810
613.6646
2,045
81.89939
81.89939
25.5657%
0.6183%
0.0079%
0.0317%
0.1982%
0.6810%
0.0614%
0.2045%
0.0082%
0.0082%
81.89939
9,959
818.0122
53,647
615,150
3,576
0.0082%
0.9959%
0.0818%
5.3647%
61.5150%
0.3576%
14,306
28,612
1.4306%
2.8612%
% Total:
100.0000
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report
exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are
calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-03048 Rev. *M
Page 7 of 11
18L - SOIC
Pb-Free Package
B2. MATERIAL COMPOSITION (Note 3)
Using Copper Wire material
Material
Purpose of
Use
Leadframe
Base Material
Lead Finish
External Plating
Die Attach
Adhesive
Die
Wire
Circuit
Interconnect
Mold
Compound
Encapsulation
Substance
Composition
Cu
Fe
Zn
P
Ag
Sn
Epoxy resin A
Epoxy Resin B
Ag
Lactone
Polyoxypropylene
diamine
2,6-Diglycidyl
phenyl allyl ether
oligomer
Silicon
Cu
Multi-aromatic
Resin
SiO2 Filler
Carbon Black
Epoxy Cresol
Novolac
Phenol Resin
7440-50-8
7439-89-6
7440-66-6
7723-14-0
7440-22-4
7440-31-5
Trade Secret
Trade Secret
Trade Secret
Trade Secret
125.313
3.0868
0.1721
0.0514
0.9738
3.3255
0.0991
0.0566
1.09
0.0566
% Weight of
Substance
per
Homogeneo
us Material
96.6942%
2.3819%
0.1328%
0.0397%
0.7514%
100.0000%
7.0000%
4.0000%
77.0000%
4.0000%
Trade Secret
0.0566
4.0000%
116
0.0116%
Trade Secret
0.0566
4.0000%
116
0.0116%
7440-21-3
7440-50-8
4.7880
0.1175
100.0000%
100.0000%
9,790
240
0.9790%
0.0240%
Trade Secret
26.2373
7.5000%
53,647
5.3647%
60676-86-0
Trade Secret
300.8547
1.7492
86.0000%
0.5000%
615,150
3,576
61.5151%
0.3576%
6.9966
2.0000%
14,306
1.4306%
13.9932
4.0000%
28,612
2.8612%
CAS Number
1333-86-4
Trade Secret
Package Weight (mg):
Weight by
mg
489.0746
PPM
% Weight of
Substance
per
Package
256,223
6,312
352
105
1,991
6,800
203
116
2229
116
25.6225%
0.6312%
0.0352%
0.0105%
0.1991%
0.6800%
0.0203%
0.0116%
0.2229%
0.0116%
% Total:
100.0000
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report
exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are
calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-03048 Rev. *M
Page 8 of 11
18L - SOIC
Pb-Free Package
II.DECLARATION OF PACKAGING / INDIRECT MATERIALS
Type
Tube
Tape and
Reel
Others
Material
Plastic Tube
End Plug
Carrier Tape
Moisture Barrier
Bag
Dessicant
HIC
Bubble Pack
Carton Label
Inner Label
Shielding Bag
Lead
PPM
<5.0
<5.0
<5.0
Cadmium
PPM
<5.0
<5.0
<5.0
Cr VI
PPM
<5.0
<5.0
<5.0
Mercury
PPM
<5.0
<5.0
<5.0
PBB
PPM
<5.0
<5.0
<5.0
PBDE
PPM
<5.0
<5.0
<5.0
Analysis Report
(Note2)
CoA-PLTB-R
CoA-EPLG-R
CoA-CART-R
<5.0
<5.0
<5.0
<5.0
<5.0
<5.0
CoA-MBBG-R
<5.0
<5.0
<5.0
<10.0
<10.0
<5.0
<5.0
<5.0
<5.0
<5.0
<5.0
< 5.0
<5.0
<5.0
<5.0
<5.0
<5.0
< 5.0
<5.0
<5.0
<5.0
<5.0
<5.0
< 5.0
<5.0
<5.0
<10.0
<5.0
<5.0
< 5.0
<5.0
<5.0
<10.0
<5.0
<5.0
< 5.0
CoA-DESS-R
CoA-HIC-R
CoA-BUBB-R
CoA-CRTN-R
CoA-LBL-R
CoA-SBAG-R
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report
exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are
calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-03048 Rev. *M
Page 9 of 11
18L - SOIC
Pb-Free Package
Document History Page
Document Title:
Document Number:
Rev.
18L - SOIC PB-FREE PACKAGE MATERIAL DECLARATION DATASHEET
001-03048
**
*A
ECN No. Orig. of
Change
385598
GFJ
400681
YXP
*B
*C
431302
VFR
2247167 MAHA
*D
2678542 HLR
*E
2882692 HLR
*F
3591988 HLR
Description of Change
New document
Edited Summary section, and added package weight to
reflect assembly site 2.
Added PMDD data for assembly site 2.
Added “Tray” under material in Declaration of
packaging/Indirect Materials.
Added Note 4 on footer section.
Added PMDD data for assembly site 3.
1. Changed “II. Declaration of Packaged Units” to “I.
Declaration of Packaged Units” for assembly sites 1 and
2.
2. Changed “III. Declaration of Packaged Units” to “I.
Declaration of Packaged Units” for assembly site 3.
3. Updated Cypress logo
4. Added “% weight of substance per Homogenous
Material” and “% Weight of Substance per Package” on
the Material Composition tables.
5. Completed the RoHS Substances namely: Lead,
Cadmium, Mercury, Chromium VI, PBB and PBDE on
Declaration of Packaging Indirect Materials table.
Added CAS number for Fused Silica, Antimony Trioxide
and Gold.
Added CAS number for Crystalline Silica and Carbon Black
on Assembly Site1.
Removed Assembly Site 3 – OSE Philippines is no longer
an active Subcontractor site.
Updated Assembly Sites 1 and 2 to reflect 4 decimal places
on values of material composition table.
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report
exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are
calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-03048 Rev. *M
Page 10 of 11
18L - SOIC
Pb-Free Package
Document History Page
Document Title:
Document Number:
Rev.
18L - SOIC PB-FREE PACKAGE MATERIAL DECLARATION DATASHEET
001-03048
*G
ECN No. Orig. of
Change
3742795 MRB
*H
3978945 MRB
*I
4007746 UDR
*J
4065631 YUM
*K
4109493 YUM
*L
4186371 UDR
*M
5268684 HLR
DCON
Description of Change
Added Package weight-Site1 B2: 496.6998 mg, Package
QTP report # 102902 and PMDD B2 on Assembly site 1
Deleted Antimony Trioxide, Crystalline Silica in Assembly
site 1 B2 Green molding compound
Added B3 for Assembly Site 1
Added QTP # 125106 at Assembly Site 1 Package
Qualification Reports.
Added B3. Material Composition – Using Copper Wire with
Halogen-free Mold Compound.
Added assembly site name in the assembly heading in site
1 and 2.
Changed assembly code to assembly site name in site 1
and 2.
Corrected total package weight in site 2 from “488.9900” to
“488.9902”
Added B2 for Assembly Site 2
Added QTP # 124706 at Assembly Site 2 Package
Qualification Reports.
Added B2. Material Composition – Using Copper Wire
material.
Changed the substances with “------------- “and Proprietary
to “Trade Secret.
Changed Cypress Logo.
Removed Distribution and posting information from
Document history page.
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report
exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are
calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-03048 Rev. *M
Page 11 of 11