16L SOIC 300MILS PB-FREE Package Material Declaration Datasheet.pdf

16L – SOIC 300 mils
Pb-Free Package
PACKAGE MATERIAL DECLARATION DATASHEET
Cypress Package Code
Package Weight – Site 1
Package Weight – Site 3
Package Weight – Site 5
SZ / SO3
B1: 437.0084 mg
B2: 441.6503 mg
B3: 443.9196 mg
B1: 444.4001 mg
B1: 408.5801 mg
Body Size (mil/mm)
Package Weight – Site 2
300 mils
B1: 432.4737mg
Package Weight – Site 4
B1: 489.4798 mg
SUMMARY
The 16L-SOIC Pb-Free package is compliant to RoHS. Cypress Ordering Part Numbers containing an “X”
(e.g. CY7C1328G-133AXI, CY2308SXC-1HT), or “F” (e.g. S25FL256SDPMFIG10) meet the Directive
2002/95/EC (RoHS) requirement.
ASSEMBLY Site 1: Amkor Technology Philippines (P1/P2)
Package Qualification Report # 044301, 130703, 124706 (See Note 1)
I. DECLARATION OF PACKAGED UNITS
A.
BANNED SUBSTANCES
Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU
RoHS. Listed in the table below are materials that are neither contained nor intentionally added to this
product.
Substances / Compounds
Cadmium and Cadmium Compounds
Hexavalent Chromium and its Compounds
Lead and Lead Compounds
Mercury and Mercury Compounds
Polybrominated Biphenyls (PBB)
Polybrominated Diphenylethers (PBDE)
Asbestos
Azo colorants
Ozone Depleting Substances
Polychlorinated Biphenyls (PCBs)
Polychlorinated Napthalenes
Radioactive Substances
Shortchain Chlorinated Paraffins
Tributyl Tin (TBT) and Triphenyl Tin (TPT)
Tributyl Tin Oxide (TBTO)
Formaldehyde
Weight by mg
PPM
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
0
0
0
0
0
0
0
0
0
0
Analysis Report
(Note 2)
CoA-SZ16Amkor
Philippines
(P1/P2)
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural
impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress
Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-05013 Rev. *J
Page 1 of 19
16L – SOIC 300 mils
Pb-Free Package
B1. MATERIAL COMPOSITION (Note 3)
Using Gold Wire and Pure Sn Lead Finish
Material
Purpose of
Use
Leadframe
Base Material
Lead Finish
External
Plating
Die Attach
Adhesive
Die
Wire
Circuit
Interconnect
Mold
Compound
Encapsulation
Substance
Composition
CAS Number
Weight by
mg
% weight of
substance per
Homogenous
material
112.4544
2.7210
0.0349
0.1395
0.9186
2.9600
96.7100%
2.3400%
0.0300%
0.1200%
0.7900%
100.0000%
257,328
6,226
80
319
2,102
6,773
% weight of
substance
per
package
25.7328%
0.6226%
0.0080%
0.0319%
0.2102%
0.6773%
PPM
Cu
Fe
P
Zn
Ag
Sn
7440-50-8
7439-89-6
7723-14-0
7440-66-6
7440-22-4
7440-31-5
Resin
Ag
Metal oxide
Amine
Gamma
Butyrolactone
Si
Au
Multi-aromatic
Resin
SiO2 Fused
Carbon Black
Epoxy Cresol
Novolac
Phenol Resin
Trade Secret
7440-22-4
Trade Secret
Trade Secret
96-48-0
0.4000
1.3199
0.0600
0.0600
0.0600
21.0500%
69.4700%
3.1600%
3.1600%
3.1600%
915
3,020
137
137
137
0.0915%
0.3020%
0.0137%
0.0137%
0.0137%
7440-21-3
7440-57-5
Trade Secret
7.9400
0.3900
23.0663
100.0000%
100.0000%
7.5000%
18,169
892
52,782
1.8169%
0.0892%
5.2782%
264.4930
1.5378
6.1510
86.0000%
0.5000%
2.0000%
605,236
3,519
14,075
60.5236%
0.3519%
1.4075%
12.3020
4.0000%
28,150
2.8150%
60676-86-0
1333-86-4
29690-82-2
Trade Secret
Package Weight (mg):
437.0084
% Total:
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural
impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress
Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-05013 Rev. *J
Page 2 of 19
100.0000
16L – SOIC 300 mils
Pb-Free Package
B2. MATERIAL COMPOSITION (Note 3)
Using Gold Wire and NiPdAu Lead Finish
Material
Purpose of
Use
Leadframe
Base Material
Lead Finish
External
Plating
Die Attach
Adhesive
Die
Wire
Circuit
Interconnect
Mold
Compound
Encapsulation
Substance
Composition
Cu
Fe
Zn
P
Ni
Pd
Au
Epoxy Resin A
Epoxy Resin B
Ag
Lactone
Polyoxypropyle
nediamine
2,6-Diglycidyl
phenyl allyl
ether oligomer
Silicon
Au
Multi-aromatic
Resin
SiO2 Filler
Carbon Black
Epoxy Cresol
Novolac
Phenol Resin
Weight by
mg
% weight of
substance per
Homogenous
material
7440-50-8
7439-89-6
7440-66-6
7723-14-0
7440-02-0
7440-05-3
7440-57-5
Trade Secret
Trade Secret
7440-22-4
Trade Secret
Trade Secret
122.0670
3.0069
0.1676
0.0501
1.7808
0.0378
0.0091
0.1356
0.0775
1.4915
0.0775
0.0775
97.4263
2.3999
0.1338
0.0400
97.4339
2.0682
0.4979
7.0000
4.0000
77.0000
4.0000
4.0000
276,388
6,808
380
113
4,032
86
21
307
175
3,377
175
175
% weight of
substance
per
package
27.6388
0.6808
0.0380
0.0113
0.4032
0.0086
0.0021
0.0307
0.0175
0.3377
0.0175
0.0175
Trade Secret
0.0775
4.0000
175
0.0175
7440-21-3
7440-57-5
Trade Secret
10.6722
0.2506
22.6253
100.0000
100.0000
7.5000
24,167
567
51,229
2.4167
0.0567
5.1229
259.4372
1.5084
6.0334
86.0000
0.5000
2.0000
587,427
3,415
13,661
58.7427
0.3415
1.3661
12.0668
4.0000
27,322
2.7322
CAS Number
60676-86-0
1333-86-4
29690-82-2
Trade Secret
Package Weight (mg):
441.6503
PPM
% Total:
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural
impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress
Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-05013 Rev. *J
Page 3 of 19
100.0000
16L – SOIC 300 mils
Pb-Free Package
B3. MATERIAL COMPOSITION (Note 3)
Using Copper Wire and Pure Sn Lead Finish
Material
Purpose of
Use
Leadframe
Base Material
Lead Finish
External
Plating
Die Attach
Adhesive
Die
Wire
Circuit
Interconnect
Mold
Compound
Encapsulation
Substance
Composition
122.0670
3.0069
0.1676
0.0501
1.2755
2.9560
96.4445
2.3757
0.1324
0.0396
1.0077
100.0000
274,975
6,773
378
113
2,873
6,659
% weight
of
substance
per
package
27.4975
0.6773
0.0378
0.0113
0.2873
0.6659
Trade Secret
Trade Secret
7440-22-4
Trade Secret
Trade Secret
0.1356
0.0775
1.4915
0.0775
0.0775
7.0000
4.0000
77.0000
4.0000
4.0000
305
175
3,360
175
175
0.0305
0.0175
0.3360
0.0175
0.0175
Trade Secret
0.0775
4.0000
175
0.0175
7440-21-3
7440-50-8
Trade Secret
10.6722
0.1161
22.6253
100.0000
100.0000
7.5000
24,040
261
50,967
2.4040
0.0261
5.0967
259.4372
1.5084
6.0334
86.0000
0.5000
2.0000
584,424
3,398
13,591
58.4424
0.3398
1.3591
12.0668
4.0000
27,183
2.7183
% Total:
100.0000
CAS Number
Cu
Fe
Zn
P
Ag
Sn
7440-50-8
7439-89-6
7440-66-6
7723-14-0
7440-22-4
7440-31-5
Epoxy Resin A
Epoxy Resin B
Ag
Lactone
Polyoxypropyle
nediamine
2,6-Diglycidyl
phenyl allyl
ether oligomer
Silicon
Cu
Multi-aromatic
Resin
SiO2 Filler
Carbon Black
Epoxy Cresol
Novolac
Phenol Resin
60676-86-0
1333-86-4
29690-82-2
Trade Secret
Package Weight (mg):
Weight by
mg
443.9196
% weight of
substance per
Homogenous
material
PPM
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural
impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress
Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-05013 Rev. *J
Page 4 of 19
16L – SOIC 300 mils
Pb-Free Package
II. DECLARATION OF PACKAGING / INDIRECT MATERIALS
Type
Tape & Reel
Tube
Others
Material
Cover tape
Carrier tape
Plastic Reel
Plastic Tube
End Plug
Shielding bag
Moisture Barrier bag
Protective Band
Shipping and Inner
Box
Dessicant
Bubble Pack
Lead
PPM
< 2.0
< 2.0
< 2.0
< 5.0
< 5.0
< 2.0
< 2.0
< 2.0
< 10.0
Cadmium
PPM
< 2.0
< 2.0
< 2.0
< 5.0
< 5.0
< 2.0
< 2.0
< 2.0
< 4.0
Cr VI
PPM
< 2.0
< 2.0
< 2.0
< 5.0
< 5.0
< 2.0
< 2.0
< 2.0
< 4.0
Mercury
PPM
< 2.0
< 2.0
< 2.0
< 5.0
< 5.0
< 2.0
< 2.0
< 2.0
< 5.0
PBB
PPM
<5.0
<5.0
<5.0
< 1.0
< 1.0
<5.0
<5.0
<5.0
---------
PBDE
PPM
<5.0
<5.0
<5.0
< 1.0
< 1.0
<5.0
<5.0
<5.0
-----------
< 10.0
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
< 1.0
< 2.0
< 3.0
< 100.0
< 3.0
< 90.0
Analysis Report
(Note2)
CoA-COVT-R
CoA-CART-R
CoA-PLRL-R
CoA-PLTB-R
CoA-EPLG-R
CoA-SBAG –R
CoA-MBBG-R
CoA-PROB-R
CoA-ABOX-R
CoA-DESS-R
CoA-BUBP-R
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural
impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress
Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-05013 Rev. *J
Page 5 of 19
16L – SOIC 300 mils
Pb-Free Package
ASSEMBLY Site 2: UTAC Thailand Limited (UTL)
Package Qualification Report # 151502, (See Note 1)
I. DECLARATION OF PACKAGED UNITS
A. BANNED SUBSTANCES
Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU
RoHS. Listed in the table below are materials that are neither contained nor intentionally added to this
product.
Substances / Compounds
Cadmium and Cadmium Compounds
Hexavalent Chromium and its Compounds
Lead and Lead Compounds
Mercury and Mercury Compounds
Polybrominated Biphenyls (PBB)
Polybrominated Diphenylethers (PBDE)
Asbestos
Azo colorants
Ozone Depleting Substances
Polychlorinated Biphenyls (PCBs)
Polychlorinated Napthalenes
Radioactive Substances
Shortchain Chlorinated Paraffins
Tributyl Tin (TBT) and Triphenyl Tin (TPT)
Tributyl Tin Oxide (TBTO)
Formaldehyde
Weight by mg
PPM
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
0
0
0
0
0
0
0
0
0
0
Analysis Report
(Note 2)
CoA-SZ16UTAC
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural
impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress
Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-05013 Rev. *J
Page 6 of 19
16L – SOIC 300 mils
Pb-Free Package
B1. MATERIAL COMPOSITION (Note 3)
Using CuPd Wire, G605 Mold compound, 8200T D/A and Pure Sn Lead Finish
Material
Leadframe
Lead
Finish
Die Attach
Die
Wire
Purpose of
Use
Base Material
External
Plating
Adhesive
Circuit
Interconnect
Cu
Fe
Zn
7440-50-8
7439-89-6
7440-66-6
183.1200
4.3800
0.2300
% weight of
substance
per
Homogenous
material
91.3300
2.1900
0.1100
P
Sn
7723-14-0
7440-22-4
0.1500
12.6300
Sn
7440-22-4
exo-1,7,7trimethylbicyclo(2.2,1)hept2yl methacrylate
1,1-(1,3 phenylene)bis-1Hpyrrole-2.5-dione
Substance Composition
Encapsulation
% weight of
substance
per package
PPM
423423
10137
522
42.3400
1.0100
0.0500
0.0700
6.3000
338
29208
0.0300
2.9200
17.4166
100.0000
40272
4.0300
7534-94-3
0.8500
20.0000
1975
0.2000
3006-93-7
0.2800
6.5000
642
0.0600
Ag
Acrylic acid,2[methyl(1,1,2,2,3,3,4,4,4nonafluorobuty)
Silicon
Cu
7440-22-4
3.1200
73.0000
7211
0.7200
1017237-78-3
0.0200
0.5000
49
0.0000
7440-21-3
7440-50-8
4.5871
2.2500
100.0000
98.2500
10607
5206
1.0600
0.5200
Pd
7440-05-3
60676-86-0
0.0400
1.7500
93
0.0100
172.8900
85.0000
399770
39.9800
17.2900
0.2000
6.5100
8.5000
0.1000
3.2000
39977
470
15050
4.0000
0.0500
1.5100
6.5100
3.2000
15050
1.5100
Silica Filler
Mold
Compound
CAS Number
Weight
by mg
Epoxy Resin
Carbon Black
Phenol Resin A
Phenol Resin B
Trade Secret
1333-86-4
Trade Secret
Trade Secret
Package Weight (mg):
432.4737
% Total:
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural
impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress
Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-05013 Rev. *J
Page 7 of 19
100.0000
16L – SOIC 300 mils
Pb-Free Package
I.
Type
Tube
Tape and
Reel
Others
DECLARATION OF PACKAGING INDIRECT MATERIALS
Material
Plastic Tube
End Plug
Carrier Tape
Moisture Barrier
Bag
Dessicant
HIC
Bubble Pack
Carton Label
Inner Label
Shielding Bag
Lead
PPM
<5.0
<5.0
<5.0
Cadmium
PPM
<5.0
<5.0
<5.0
Cr VI
PPM
<5.0
<5.0
<5.0
Mercury
PPM
<5.0
<5.0
<5.0
PBB
PPM
<5.0
<5.0
<5.0
PBDE
PPM
<5.0
<5.0
<5.0
Analysis Report
(Note2)
CoA-PLTB-R
CoA-EPLG-R
CoA-CART-R
<5.0
<5.0
<5.0
<5.0
<5.0
<5.0
CoA-MBBG-R
<5.0
<5.0
<5.0
<10.0
<10.0
<5.0
<5.0
<5.0
<5.0
<5.0
<5.0
< 5.0
<5.0
<5.0
<5.0
<5.0
<5.0
< 5.0
<5.0
<5.0
<5.0
<5.0
<5.0
< 5.0
<5.0
<5.0
<10.0
<5.0
<5.0
< 5.0
<5.0
<5.0
<10.0
<5.0
<5.0
< 5.0
CoA-DESS-R
CoA-HIC-R
CoA-BUBB-R
CoA-CRTN-R
CoA-LBL-R
CoA-SBAG-R
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural
impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress
Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-05013 Rev. *J
Page 8 of 19
16L – SOIC 300 mils
Pb-Free Package
ASSEMBLY Site 3: Cypress Manufacturing Limited (CML)
Package Qualification Report # 154002
I. DECLARATION OF PACKAGED UNITS
A. BANNED SUBSTANCES
Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU
RoHS. Listed in the table below are materials that are neither contained nor intentionally added to this
product.
Substances / Compounds
Cadmium and Cadmium Compounds
Hexavalent Chromium and its Compounds
Lead and Lead Compounds
Mercury and Mercury Compounds
Polybrominated Biphenyls (PBB)
Polybrominated Diphenylethers (PBDE)
Asbestos
Azo colorants
Ozone Depleting Substances
Polychlorinated Biphenyls (PCBs)
Polychlorinated Napthalenes
Radioactive Substances
Shortchain Chlorinated Paraffins
Tributyl Tin (TBT) and Triphenyl Tin (TPT)
Tributyl Tin Oxide (TBTO)
Formaldehyde
Weight by
mg
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
PPM
Analysis Report
Link/s
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
0
0
0
0
0
0
0
0
0
0
CoA-SZ16CML
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural
impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress
Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-05013 Rev. *J
Page 9 of 19
16L – SOIC 300 mils
Pb-Free Package
B1. NiPdAu, Green Molding Compound, Copper-Palladium (Cu-Pd)
Material
Purpose of
Use
Lead frame
Base Material
Lead Finish
External
Plating
Die Attach
Adhesive
Die
Circuit
Wire
Interconnect
Mold
Compound
Encapsulation
Substance
Composition
Cu
Ni
Si
Mg
Nickel
Palladium
Gold
Silver
Carbocyclic
acrylate
Bismaleimide
Resin
Acrylate
Additive
Silicon
Copper
Palladium
Silica - SiO2
Epoxy Resin
Phenol Resin
CAS Number
7440-50-8
7440-02-0
7440-21-3
7439-95-4
7440-02-0
7440-05-3
7440-57-5
7440-22-4
Weight by
mg
128.4247
4.8096
0.3857
0.0798
1.0533
0.0008
0.0006
0.2842
Trade Secret
0.0429
Trade Secret
Trade Secret
Trade Secret
7440-21-3
7440-50-8
7440-05-3
60676-86-0
Trade Secret
Trade Secret
0.0166
0.0109
0.0020
6.2900
0.0134
0.0001
273.8677
16.5212
12.5966
Package Weight (mg):
444.4001
% Weight of
Substance per
Homogeneous
Material
96.0544%
3.5973%
0.2885%
0.0597%
99.8938%
0.0664%
0.0398%
79.6882%
PPM
288,985
10,823
868
180
2,370
2
1
639
28.8985%
1.0823%
0.0868%
0.0180%
0.2370%
0.0002%
0.0001%
0.0639%
97
0.0097%
37
24
5
14,1534
30
0.02
616,264
37,176
28,345
0.0037%
0.0024%
0.0005%
1.4154%
0.0030%
0.000002%
61.6264%
3.7176%
2.8345%
%Total:
100.0000
%
12.0425%
4.6543%
3.0502%
0.5648%
100.0000%
99.2592%
0.7408%
90.3897%
5.4528%
4.1575%
% Weight
of
Substance
per
package
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural
impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress
Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-05013 Rev. *J
Page 10 of 19
16L – SOIC 300 mils
Pb-Free Package
II. DECLARATION OF PACKAGING / INDIRECT MATERIALS
Type
Tape & Reel
Tube
Others
Material
Cover tape
Carrier tape
Plastic Reel
Plastic Tube
End Plug
Shielding bag
Moisture Barrier bag
Protective Band
Shipping and Inner
Box
Dessicant
Bubble Pack
Lead
PPM
< 2.0
< 2.0
< 2.0
< 5.0
< 5.0
< 2.0
< 2.0
< 2.0
< 10.0
Cadmium
PPM
< 2.0
< 2.0
< 2.0
< 5.0
< 5.0
< 2.0
< 2.0
< 2.0
< 4.0
Cr VI
PPM
< 2.0
< 2.0
< 2.0
< 5.0
< 5.0
< 2.0
< 2.0
< 2.0
< 4.0
Mercury
PPM
< 2.0
< 2.0
< 2.0
< 5.0
< 5.0
< 2.0
< 2.0
< 2.0
< 5.0
PBB
PPM
<5.0
<5.0
<5.0
< 1.0
< 1.0
<5.0
<5.0
<5.0
---------
PBDE
PPM
<5.0
<5.0
<5.0
< 1.0
< 1.0
<5.0
<5.0
<5.0
-----------
< 10.0
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
< 1.0
< 2.0
< 3.0
< 100.0
< 3.0
< 90.0
Analysis Report
(Note2)
CoA-COVT-R
CoA-CART-R
CoA-PLRL-R
CoA-PLTB-R
CoA-EPLG-R
CoA-SBAG –R
CoA-MBBG-R
CoA-PROB-R
CoA-ABOX-R
CoA-DESS-R
CoA-BUBP-R
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural
impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress
Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-05013 Rev. *J
Page 11 of 19
16L – SOIC 300 mils
Pb-Free Package
ASSEMBLY Site 6: ASE Chung-Li, Taiwan
Package Qualification Report # 160807 (Note 1)
I.
DECLARATION OF PACKAGED UNITS
A. BANNED SUBSTANCES
Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU
RoHS. Listed in the table below are materials that are neither contained nor intentionally added to this
product.
Substances / Compounds
Cadmium and Cadmium Compounds
Hexavalent Chromium and its Compounds
Lead and Lead Compounds
Mercury and Mercury Compounds
Polybrominated Biphenyls (PBB)
Polybrominated Diphenylethers (PBDE)
Asbestos
Azo colorants
Ozone Depleting Substances
Polychlorinated Biphenyls (PCBs)
Polychlorinated Napthalenes
Radioactive Substances
Shortchain Chlorinated Paraffins
Tributyl Tin (TBT) and Triphenyl Tin (TPT)
Tributyl Tin Oxide (TBTO)
Formaldehyde
Weight by
mg
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
PPM
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
0
0
0
0
0
0
0
0
0
0
Analysis
Report Link/s
CoA-SO3ASECL
As per MSDS
As per MSdS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural
impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress
Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-05013 Rev. *J
Page 12 of 19
16L – SOIC 300 mils
Pb-Free Package
B1. MATERIAL COMPOSITION (Note 3)
USING Cu WIRE
Material
Leadframe
Lead Finish
Die Attach
Die
Wire
Mold
Compound
Copper (Cu)
Iron(Fe)
Phosphorus (P)
Zinc (Zn)
Silver Plating
(Internal)
7440-50-8
7439-89-6
7723-14-0
7440-66-6
155.3288
1.4969
0.0161
0.0966
% Weight of
Substance per
Homogeneous
Material
96.5000%
0.9300%
0.0100%
0.0600%
7440-22-4
4.0241
Matte Sn
7440-31-5
Purpose of
Use
Base Material
External
Plating
Adhesive
Circuit
Interconnect
Encapsulation
Substance
Composition
Silver flake
Acrylic resin
Polybutadiene
derivative
Butadiene
copolymer
Acrylate
Epoxy resin
Peroxide
Additive
Silicon
Copper
Silica Fused
Epoxy Resin-1
Epoxy Resin-2
Epoxy Resin-3
Hardener
Carbon Black
CAS Number
Weight by
mg
PPM
54057
111
3019
344
5.4057%
0.0111%
0.3019%
0.0344%
2.5000%
162
0.0162%
1.0814
100.0000%
81
0.0081%
7440-22-4
trade secret
1.4779
0.1686
74.5003%
8.5002%
223
101
0.0223%
0.0101%
trade secret
0.0794
4.0001%
41
0.0041%
trade secret
0.0397
1.9998%
81
0.0081%
trade secret
trade secret
trade secret
trade secret
7440-21-3
7440-50-8
60676-86-0
trade secret
trade secret
trade secret
trade secret
1333-86-4
0.1091
0.0496
0.0198
0.0397
26.4600
0.0543
270.5387
4.1851
1.1958
11.9575
10.4628
0.5979
5.4998%
2.4999%
1.0001%
1.9998%
100.0000%
100.0000%
90.5000%
1.4000%
0.4000%
4.0000%
3.5000%
0.2000%
317334
3058
33
197
8221
552707
8550
2443
24429
21375
1221
2209
31.7334%
0.3058%
0.0033%
0.0197%
0.8221%
55.2707%
0.8550%
0.2443%
2.4429%
2.1375%
0.1221%
0.2209%
% Total:
100.0000%
Package Weight (mg):
489.4798
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural
impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress
Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-05013 Rev. *J
% Weight of
Substance
per Package
Page 13 of 19
16L – SOIC 300 mils
Pb-Free Package
II.
Type
Tube
Tape and
Reel
Others
DECLARATION OF PACKAGING INDIRECT MATERIALS
Material
Plastic Tube
End Plug
Carrier Tape
Moisture Barrier
Bag
Dessicant
HIC
Bubble Pack
Carton Label
Inner Label
Shielding Bag
Lead
PPM
<5.0
<5.0
<5.0
Cadmium
PPM
<5.0
<5.0
<5.0
Cr VI
PPM
<5.0
<5.0
<5.0
Mercury
PPM
<5.0
<5.0
<5.0
PBB
PPM
<5.0
<5.0
<5.0
PBDE
PPM
<5.0
<5.0
<5.0
Analysis Report
(Note2)
CoA-PLTB-R
CoA-EPLG-R
CoA-CART-R
<5.0
<5.0
<5.0
<5.0
<5.0
<5.0
CoA-MBBG-R
<5.0
<5.0
<5.0
<10.0
<10.0
<5.0
<5.0
<5.0
<5.0
<5.0
<5.0
< 5.0
<5.0
<5.0
<5.0
<5.0
<5.0
< 5.0
<5.0
<5.0
<5.0
<5.0
<5.0
< 5.0
<5.0
<5.0
<10.0
<5.0
<5.0
< 5.0
<5.0
<5.0
<10.0
<5.0
<5.0
< 5.0
CoA-DESS-R
CoA-HIC-R
CoA-BUBB-R
CoA-CRTN-R
CoA-LBL-R
CoA-SBAG-R
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural
impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress
Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-05013 Rev. *J
Page 14 of 19
16L – SOIC 300 mils
Pb-Free Package
ASSEMBLY Site 5: Zhen Kun Technology Limited (ZKT)
Package Qualification Report # 160807 (Note 1)
I.
DECLARATION OF PACKAGED UNITS
A. BANNED SUBSTANCES
Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU
RoHS. Listed in the table below are materials that are neither contained nor intentionally added to this
product.
Substances / Compounds
Cadmium and Cadmium Compounds
Hexavalent Chromium and its Compounds
Lead and Lead Compounds
Mercury and Mercury Compounds
Polybrominated Biphenyls (PBB)
Polybrominated Diphenylethers (PBDE)
Asbestos
Azo colorants
Ozone Depleting Substances
Polychlorinated Biphenyls (PCBs)
Polychlorinated Napthalenes
Radioactive Substances
Shortchain Chlorinated Paraffins
Tributyl Tin (TBT) and Triphenyl Tin (TPT)
Tributyl Tin Oxide (TBTO)
Formaldehyde
Weight by
mg
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
PPM
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
0
0
0
0
0
0
0
0
0
0
Analysis
Report Link/s
CoA-SO3-ZKT
As per MSDS
As per MSdS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural
impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress
Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-05013 Rev. *J
Page 15 of 19
16L – SOIC 300 mils
Pb-Free Package
B1. MATERIAL COMPOSITION (Note 3)
USING Cu WIRE
Material
Leadframe
Lead Finish
Die Attach
Base Material
External
Plating
Adhesive
Die
Circuit
Wire
Interconnect
Mold
Compound
CAS Number
Weight by
mg
% Weight of
Substance per
Homogeneous
Material
PPM
% Weight of
Substance
per Package
Copper (Cu)
Iron(Fe)
Phosphorus (P)
Zinc (Zn)
Silver Plating
(Internal)
7440-50-8
7439-89-6
7723-14-0
7440-66-6
78.1601
1.9869
0.0698
0.1057
92.4425%
2.3500%
0.0825%
0.1250%
93617
966
35
639
9.3617%
0.0966%
0.0035%
0.0639%
7440-22-4
4.2275
5.0000%
67
0.0067%
Matte Sn
7440-31-5
13
0.0013%
Purpose of
Use
Encapsulation
Substance
Composition
Silver flake
substituted
dimethacrylate
substituted
polyamine
bisphenol F
2-Ethylhexyl
glycidyl ether
Silicon
Copper (Cu)
Palladium(Pd)
Silica Fused
Epoxy Resin
Phenol Resin
Carbon Black
7440-22-4
8.5621
100.0000%
0.2610
76.0000%
63
0.0063%
0.0275
8.0000%
59
0.0059%
0.0052
1.5000%
191297
19.1297%
28064-14-4
0.0258
7.5000%
4863
0.4863%
2461-15-6
0.0240
7.0000%
171
0.0171%
7440-21-3
7440-50-8
7440-05-3
60676-86-0
38.2500
0.3946
0.0141
243.2899
17.4173
14.9292
0.8294
100.0000%
96.5500%
3.4500%
88.0000%
6.3000%
5.4000%
0.3000%
259
10347
595452
42629
36539
2030
20956
0.0259%
1.0347%
59.5452%
4.2629%
3.6539%
0.2030%
2.0956%
Trade Secret
Trade Secret
Trade Secret
Trade Secret
1333-86-4
Package Weight (mg):
408.5801
% Total:
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural
impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress
Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-05013 Rev. *J
Page 16 of 19
100.0000%
16L – SOIC 300 mils
Pb-Free Package
II.
Type
Tube
Tape and
Reel
Others
DECLARATION OF PACKAGING INDIRECT MATERIALS
Material
Plastic Tube
End Plug
Carrier Tape
Moisture Barrier
Bag
Dessicant
HIC
Bubble Pack
Carton Label
Inner Label
Shielding Bag
Lead
PPM
<5.0
<5.0
<5.0
Cadmium
PPM
<5.0
<5.0
<5.0
Cr VI
PPM
<5.0
<5.0
<5.0
Mercury
PPM
<5.0
<5.0
<5.0
PBB
PPM
<5.0
<5.0
<5.0
PBDE
PPM
<5.0
<5.0
<5.0
Analysis Report
(Note2)
CoA-PLTB-R
CoA-EPLG-R
CoA-CART-R
<5.0
<5.0
<5.0
<5.0
<5.0
<5.0
CoA-MBBG-R
<5.0
<5.0
<5.0
<10.0
<10.0
<5.0
<5.0
<5.0
<5.0
<5.0
<5.0
< 5.0
<5.0
<5.0
<5.0
<5.0
<5.0
< 5.0
<5.0
<5.0
<5.0
<5.0
<5.0
< 5.0
<5.0
<5.0
<10.0
<5.0
<5.0
< 5.0
<5.0
<5.0
<10.0
<5.0
<5.0
< 5.0
CoA-DESS-R
CoA-HIC-R
CoA-BUBB-R
CoA-CRTN-R
CoA-LBL-R
CoA-SBAG-R
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural
impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress
Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-05013 Rev. *J
Page 17 of 19
16L – SOIC 300 mils
Pb-Free Package
Document History Page
Document Title:
Document Number:
Rev.
16L - SOIC 300MILS PB-FREE PACKAGE MATERIAL DECLARATION
DATASHEET
001-05013
**
*A
ECN No. Orig. of
Change
410529
YXP
2264970 HLR
*B
DCon
3242150 HLR
*C
3600532 HLR
*D
4009716 YUM
VFR
*E
4158625 HLR
*F
*G
4764230 HLR
4961657 PRCH
*H
5012224 RODP
Description of Change
New specification.
Updated Cypress Logo
Added % weight of substance per Homogenous Material
and % weight of substance per package on the Material
Composition.
Completed the RoHS Substances namely; Lead Cadmium,
Mercury, Chromium VI, PBB and PBDE on Declaration of
Packaging Indirect Materials table
Replaced CML with WEB in distribution list.
Removed Tray Based on Indirect Materials Declaration
table.
Updated Assembly Site 1 to reflect 4 decimal places on
values of material composition table.
Added assembly site name in the assembly heading.
Changed Assembly code to assembly site name.
Added Assy Site 2 B2 – Material Composition with Au wire
and NiPdAu Lead finish, reference QTP # 130703 and B3
– Material Composition with Cu wire and Pure Sn Lead
finish, reference QTP # 124706.
Corrected the % weight for homogenous materials for
NiPdAu material for Assembly Site 1.B2 Material
Composition.
Sunset Due – No Change.
Added UTL for Site 2 CuPd wire G605 mold compound
and Pure Sn plating
Removed “Distribution: WEB” and “Posting: NONE” from
the document history page.
Added CML as Site 3 B1 Material composition with
NiPdAu, Green Molding Compound, Copper-Palladium
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural
impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress
Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-05013 Rev. *J
Page 18 of 19
16L – SOIC 300 mils
Pb-Free Package
Rev.
ECN No. Orig. of
Change
*I
*J
5157936 CHAL
5277649 HLR
Description of Change
(Cu-Pd), ref. QTP # 154002
Added SOIC 16L (SO3016) ASECL and ZKT assembly.
Changed Cypress Logo.
Changed the substances with “------------- “ and Proprietary
to “Trade Secret".
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural
impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress
Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-05013 Rev. *J
Page 19 of 19
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