100L –TQFP (14 x 20 mm) Pb-Free Package PACKAGE MATERIAL DECLARATION DATASHEET Cypress Package Code Package Weight – Site 1 Package Weight – Site 3 AZ B1 : 936.0100 mg B2 : 887.0200 mg B3: 1097.9804 mg B4: 918.3334 mg B1: 887.0200 mg B2: 841.5800 mg Body Size (mil/mm) Package Weight – Site 2 14 x 20 mm B1: 942.0000 mg B2: 939.5877 mg *** B3: 942.5000 mg SUMMARY *** The 100L-TQFP package is qualified at three assembly sites. Packages from different assembly sites may have different material composition. Cypress Ordering Part Numbers containing an “X” (e.g. CY7C1328G133AXI, CY2308SXC-1HT) meet the Directive 2002/95/EC (RoHS) requirement. ASSEMBLY Site 1: Cypress Manufacturing Limited (CML) Package Qualification Report # 040806, 062603, 112602, 125105, 150503 (See Note 1) I. DECLARATION OF PACKAGED UNITS A. BANNED SUBSTANCES Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU RoHS. Listed in the table below are materials that are neither contained nor intentionally added to this product. Substances / Compounds Cadmium and Cadmium Compounds Hexavalent Chromium and its Compounds Lead and Lead Compounds Mercury and Mercury Compounds Polybrominated Biphenyls (PBB) Polybrominated Diphenylethers (PBDE) Asbestos Azo colorants Ozone Depleting Substances Polychlorinated Biphenyls (PCBs) Polychlorinated Napthalenes Radioactive Substances Shortchain Chlorinated Paraffins Tributyl Tin (TBT) and Triphenyl Tin (TPT) Tributyl Tin Oxide (TBTO) Formaldehyde Weight by mg PPM 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 0 0 0 0 0 0 0 0 0 0 Analysis Report (Note 2) CoA-AZ100CML As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-04358 Rev *O Page 1 of 15 100L –TQFP (14 x 20 mm) Pb-Free Package B1. MATERIAL COMPOSITION (Note 3) Using NiPdAu with Standard Molding Compound Material Leadframe Weight by mg Cu 7440-50-8 107.9120 Mg 7439-95-4 0.1607 0.1400% 172 0.0172% Si 7440-21-3 1.2628 1.1000% 7440-02-0 7439-89-6 7440-66-6 7440-02-0 7440-05-3 7440-57-5 7440-22-4 -----------------------------------------------------------------7440-21-3 7440-57-5 60676-86-0 --------------------------- 4.0869 0.2296 1.1480 0.1875 0.0095 0.0031 1.9900 0.2800 0.1499 0.0500 0.0500 0.0301 35.7000 3.1300 686.0744 38.9815 38.9815 3.5600% 0.2000% 1.0000% 93.7400% 4.7400% 1.5200% 78.0400% 10.9800% 5.8800% 1.9600% 1.9600% 1.1800% 100.0000% 100.0000% 88.0000% 5.0000% 5.0000% 1,349 4,366 245 1,226 200 10 3 2,126 299 160 54 54 32 38,141 3,344 732,978 41,646 41,646 0.1349% Ni Fe Zn Ni Pd Au Ag Bismaleimide Polymer Methacrylate Acylate ester Organic Peroxide Si Au SiO2 Epoxy Resin Phenol Resin Brominated Epoxy Resin Antimony Trioxide Others -------------- 6.2370 0.8000% 1309-64-4 -------------- 3.1185 6.2370 0.4000% 0.8000% Purpose of Use Base Material Lead Finish External Plating Die Attach Adhesive Die Wire Circuit Interconnect Mold Compound CAS Number % Weight of Substance per Homogenous Material 94.0000% Encapsulation Substance Composition Package Weight (mg): 936.0100 % Weight of Substance per Package PPM 115,289 11.5289% 0.4366% 0.0245% 0.1226% 0.0200% 0.0010% 0.0003% 0.2126% 0.0299% 0.0160% 0.0053% 0.0053% 0.0032% 3.8141% 0.3344% 73.2978% 4.1646% 4.1646% 0.6663% 6,664 3,332 6,664 % Total: 0.3332% 0.6663% 100.0000 Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-04358 Rev *O Page 2 of 15 100L –TQFP (14 x 20 mm) Pb-Free Package B2. MATERIAL COMPOSITION (Note 3) Using NiPdAu with Green Molding Compound Material Purpose of Use Leadframe Based Material Lead Finish External Plating Die Attach Adhesive Die Wire Circuit Interconnect Mold Compound Encapsulation Substance Composition Cu Si Mg Ni Ni Pd Au Ag Bismaleimide Polymer Methacrylate Acylate ester Organic Peroxide Si Au Silica Epoxy Resin Phenol Resin CAS Number 7440-50-8 7440-21-3 7439-95-4 7440-02-0 7440-02-0 7440-05-3 7440-57-5 7440-22-4 -----------------------------------------------------------------7440-21-3 7440-57-5 60676-86-0 --------------------------- Package Weight (mg): Weight by mg 147.1668 0.9943 0.2295 4.5894 1.8500 0.0300 0.0300 6.2203 0.7003 0.3903 0.1597 0.1597 0.1597 108.7900 2.6100 545.5166 36.7764 30.6470 887.0200 % Weight of Substance per Homogenous Material 96.2000% 0.6500% 0.1500% 3.0000% 96.8600% 1.5700% 1.5700% 79.8500% 8.9900% 5.0100% 2.0500% 2.0500% 2.0500% 100.0000% 100.0000% 89.0000% 6.0000% 5.0000% % Weight of Substance per Package PPM 165,911 1,121 259 5,174 2,086 34 34 7,013 789 440 180 180 180 122,647 2,942 614,999 41,461 34,550 16.5911% 0.1121% 0.0259% 0.5174% 0.2086% 0.0034% 0.0034% 0.7013% 0.0790% 0.0440% 0.0180% 0.0180% 0.0180% 12.2647% 0.2942% 61.4999% 4.1461% 3.4551% % Total: 100.0000 Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-04358 Rev *O Page 3 of 15 100L –TQFP (14 x 20 mm) Pb-Free Package B3. MATERIAL COMPOSITION (Note 3) Using Copper wire with NiPdAu and Kyocera Molding Compound Material Purpose of Use Leadframe Based Material Lead Finish External Plating Die Attach Adhesive Die Wire Circuit Interconnect Mold Compound Encapsulation Substance Composition Cu Si Mg Ni Ni Pd Au Ag Bismaleimide Polymer Methacrylate Acylate ester Organic Peroxide Si Cu SiO2 Phenol Resin Epoxy Resin Carbon Black CAS Number 7440-50-8 7440-21-3 7439-95-4 7440-02-0 7440-02-0 7440-05-3 7440-57-5 7440-22-4 -----------------------------------------------------------------7440-21-3 7440-50-8 60676-86-0 ----------------------------1333-86-4 Package Weight (mg): Weight by mg 184.7981 4.5531 0.1328 0.2277 2.2862 0.0412 0.0412 7.7283 0.8694 0.4830 0.1932 0.1932 0.1932 134.9113 1.2171 676.4991 38.0056 43.7064 1.9003 1097.9804 % Weight of Substance per Homogenous Material 97.4100 2.4000 0.0700 0.1200 96.5200 1.7400 1.7400 80.0000 9.0000 5.0000 2.0000 2.0000 2.0000 100.0000 100.0000 89.0000 5.0000 5.7500 0.2500 % Weight of Substance per Package PPM 168,307 4,147 121 207 2,082 38 38 7,039 792 440 176 176 176 122,872 1,108 616,130 34,614 39,806 1,731 16.8307 0.4147 0.0121 0.0207 0.2082 0.0038 0.0038 0.7039 0.0792 0.0440 0.0176 0.0176 0.0176 12.2872 0.1108 61.6130 3.4614 3.9806 0.1731 % Total: 100.0000 Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-04358 Rev *O Page 4 of 15 100L –TQFP (14 x 20 mm) Pb-Free Package B4. MATERIAL COMPOSITION (Note 3) Using NiPdAu with Green Molding Compound Material Purpose of Use Leadframe Based Material Lead Finish External Plating Die Attach Adhesive Die Circuit Wire Interconnect Mold Compound Encapsulation Substance Composition Cu Si Mg Ni Ni Pd Au Ag Bismaleimide Polymer Methacrylate Acylate ester Organic Peroxide Si Cu Pd Silica Epoxy Resin Phenol Resin CAS Number 7440-50-8 7440-21-3 7439-95-4 7440-02-0 7440-02-0 7440-05-3 7440-57-5 7440-22-4 -----------------------------------------------------------------7440-21-3 7440-50-8 7440-05-3 60676-86-0 --------------------------- Package Weight (mg): Weight by mg 233.7660 1.5795 0.3645 7.2900 2.9382 0.0476 0.0476 8.1447 0.9170 0.5110 0.2091 0.2091 0.2091 21.1000 2.7000 0.3000 567.8200 38.2800 31.9000 % Weight of Substance per Homogenous Material 96.2000% 0.6500% 0.1500% 3.0000% 96.8600% 1.5700% 1.5700% 79.8500% 8.9900% 5.0100% 2.0500% 2.0500% 2.0500% 100.0000% 99.0000% 1.0000% 89.0000% 6.0000% 5.0000% 918.3334 % Weight of Substance per Package PPM 254,555 1,720 397 7,938 3,199 52 52 8,869 999 556 228 228 228 22,976 2,940 327 618,316 41,684 34,737 25.4555% 0.1720% 0.0397% 0.7938% 0.3199% 0.0052% 0.0052% 0.8869% 0.0999% 0.0556% 0.0228% 0.0228% 0.0228% 2.2976% 0.2940% 0.0327% 61.8316% 4.1684% 3.4737% % Total: 100.0000 II. DECLARATION OF PACKAGING / INDIRECT MATERIALS Type Tape & Reel Tray Others Material Cover tape Carrier tape Plastic Reel Tray Moisture Barrier Bag Lead PPM Cadmium PPM Cr VI PPM Mercury PPM PBB PPM PBDE PPM < 2.0 < 2.0 < 5.0 < 2.0 < 2.0 < 2.0 < 5.0 < 2.0 < 2.0 < 2.0 < 5.0 < 2.0 < 2.0 < 2.0 < 10.0 < 2.0 < 50.00 < 50.00 <50.0 < 0.0005 < 45.00 < 45.00 <45.0 < 0.0005 <2.0 <2.0 <2.0 <2.0 <5.0 <5.0 Analysis Report (Note2) CoA-COVT-R CoA-CART-R CoA-PLRL-R CoA-TRAY-R CoA-MBBG –R Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-04358 Rev *O Page 5 of 15 100L –TQFP (14 x 20 mm) Pb-Free Package *** ASSEMBLY Site 2: Advanced Semiconductor Engineering Taiwan (ASET) Package Qualification Report # 034101, 120201, 152602 (Note 1) I. DECLARATION OF PACKAGED UNITS A. BANNED SUBSTANCES Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU RoHS. Listed in the table below are materials that are neither contained nor intentionally added to this product. Substances / Compounds Cadmium and Cadmium Compounds Hexavalent Chromium and its Compounds Lead and Lead Compounds Mercury and Mercury Compounds Polybrominated Biphenyls (PBB) Polybrominated Diphenylethers (PBDE) Asbestos Azo colorants Ozone Depleting Substances Polychlorinated Biphenyls (PCBs) Polychlorinated Napthalenes Radioactive Substances Shortchain Chlorinated Paraffins Tributyl Tin (TBT) and Triphenyl Tin (TPT) Tributyl Tin Oxide (TBTO) Formaldehyde Weight by mg PPM 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 0 0 0 0 0 0 0 0 0 0 Analysis Report (Note 2) CoA-100AZASET As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-04358 Rev *O Page 6 of 15 100L –TQFP (14 x 20 mm) Pb-Free Package B1. MATERIAL COMPOSITION (Note 3) Using Gold Wire Material Leadframe Cu 7440-50-8 227.9492 % Weight of Substance per Homogenous Material 94.1900% Ni 7440-02-0 7.0667 2.9200% 7,502 0.7502% Si 7440-21-3 1.5247 0.6300% 1,619 0.1619% Mg Ag Pure Sn Ag Epoxy Resin Cu GammaButyrolactone Aromatic Hydrocarbons Si Au Epoxy Resin Phenol Resin SiO2 Aromatic Phosphate Others 7439-95-4 7440-22-4 7440-31-5 7440-22-4 Proprietary 7440-50-8 0.3872 5.0822 16.4900 2.4502 0.6601 0.0899 0.1600% 2.1000% 100.0000% 72.4900% 19.5300% 2.6600% 411 5,395 17,505 2,601 701 95 0.0411% 0.5395% 1.7505% 0.2601% 0.0701% 0.0095% ---------------- 0.0899 2.6600% 95 0.0095% ---------------- 0.0899 2.6600% 95 0.0095% 7440-21-3 7440-57-5 85954-11-6 26834-02-6 60676-86-0 20.7200 4.5200 32.7440 26.1952 579.5033 100.0000% 100.0000% 5.0000% 4.0000% 88.4900% 21,996 4,798 34,760 27,808 615,184 2.1996% 0.4798% 3.4760% 2.7808% 61.5184% 139189-30-3 9.8232 1.5000% 10,428 1.0428% ---------------- 6.6143 1.0100% 7,022 0.7022% % Total: 100.0000 Purpose of Use Base Material Lead Finish External Plating Die Attach Adhesive Die Wire Circuit Interconnect Mold Compound Encapsulation Substance Composition CAS Number Package Weight (mg): Weight by mg 942.0000 % Weight of Substance per Package PPM 241,985 24.1984% Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-04358 Rev *O Page 7 of 15 100L –TQFP (14 x 20 mm) Pb-Free Package B2. MATERIAL COMPOSITION (Note 3) Using Copper Wire Material Leadframe Purpose of Use Base Material Lead Finish External Plating Die Attach Adhesive Die Wire Circuit Interconnect Mold Compound Encapsulation Substance Composition Cu Ni Si Mg Ag Sn Ag Epoxy resin A Epoxy resin B Diluent A Diluent B Phenolic Hardener Dicyandiamide Organic peroxide Si Copper Epoxy resin A Epoxy,Cresol Novolac Phenol resin Metal Hydroxide Carbon Black Silica Fused A Silica Fused B Silica,crystalline CAS Number Weight by mg 7440-50-8 7440-02-0 7440-21-3 7439-95-4 7440-22-4 7440-31-5 7440-22-4 9003-36-5 Trade Secret Trade Secret Trade Secret 227.9492 7.0667 1.5247 0.3872 5.0822 16.4900 2.5012 0.1352 0.2028 0.1352 0.2028 % Weight of Substance per Homogenous Material 94.1900% 2.9200% 0.6300% 0.1600% 2.1000% 100.0000% 74.0000% 4.0000% 6.0000% 4.0000% 6.0000% Trade Secret 0.1690 5.0000% 180 0.0180% 461-58-5 Trade Secret 7440-21-3 7440-50-8 Trade Secret 0.0169 0.0169 20.7200 2.1078 32.7440 0.5000% 0.5000% 100.0000% 100.0000% 5.0000% 18 18 22,052 2,243 34,849 0.0018% 0.0018% 2.2052% 0.2243% 3.4849% 29690-82-2 32.7440 5.0000% 34,849 3.4849% Trade Secret Trade Secret 1333-86-4 60676-86-0 7631-86-9 14808-60-7 32.7440 32.7440 1.9646 454.4867 65.4880 1.9646 5.0000% 5.0000% 0.3000% 69.4000% 10.0000% 0.3000% 34,849 34,849 2,091 483,709 69,699 2,091 3.4849% 3.4849% 0.2091% 48.3709% 6.9699% 0.2091% % Total: 100.0000 Package Weight (mg): 939.5877 % Weight of Substance per Package PPM 242,606 7,521 1,623 412 5,409 17,550 2,662 144 216 144 216 24.2606% 0.7521% 0.1623% 0.0412% 0.5409% 1.7550% 0.2662% 0.0144% 0.0216% 0.0144% 0.0216% Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-04358 Rev *O Page 8 of 15 100L –TQFP (14 x 20 mm) Pb-Free Package *** B3. MATERIAL COMPOSITION (Note 3) Using Copper Palladium Wire, Sumitomo Die Attach and Mold Compound Material Purpose of Use Leadframe Base Material Lead Finish External Plating Die Attach Adhesive Die Circuit Wire Interconnect Mold Compound Encapsulation Substance Composition Cu Ni Si Mg Ag Sn Ag Epoxy resin A Epoxy resin B Diluent A Diluent B Phenolic Hardener Dicyandiamide Organic peroxide Si Copper Palladium Epoxy resin A Epoxy Resin B Phenol resin Carbon Black Silica Fused A Silica Fused B Silica,crystalline CAS Number Weight by mg 7440-50-8 7440-02-0 7440-21-3 7439-95-4 7440-22-4 7440-31-5 7440-22-4 9003-36-5 Trade Secret Trade Secret Trade Secret 321.3000 11.2000 4.2000 1.0500 12.2500 16.6000 3.9050 0.2000 0.2000 0.2000 0.2000 % Weight of Substance per Homogenous Material 91.8000% 3.2000% 1.2000% 0.3000% 3.5000% 100.0000% 78.1000% 4.0000% 4.0000% 4.0000% 4.0000% Trade Secret 0.2500 5.0000% 266 0.0266% 461-58-5 Trade Secret 7440-21-3 7440-50-8 7440-05-3 Trade Secret Trade Secret Trade Secret 1333-86-4 60676-86-0 7631-86-9 14808-60-7 0.0150 0.0300 18.1000 0.7752 0.0248 16.5300 16.5300 27.5500 1.6530 459.5340 27.5500 1.6530 0.3000% 0.6000% 100.0000% 96.9000% 3.1000% 3.0000% 3.0000% 5.0000% 0.3000% 83.4000% 5.0000% 0.3000% 16 32 19225 823 26 17,557 17,557 29,262 1,756 488,087 29,262 1,756 0.0016% 0.0032% 1.9225% 0.0823% 0.0026% 1.7557% 1.7557% 2.9262% 0.1756% 48.8087% 2.9262% 0.1756% % Total: 100.0000 Package Weight (mg): 941.5000 % Weight of Substance per Package PPM 341,264 11,896 4,461 1,115 13,011 17,632 4,148 212 212 212 212 34.1264% 1.1896% 0.4461% 0.1115% 1.3011% 1.7632% 0.4148% 0.0212% 0.0212% 0.0212% 0.0212% Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-04358 Rev *O Page 9 of 15 100L –TQFP (14 x 20 mm) Pb-Free Package ASSEMBLY Site 3: Jiangsu Changjiang Electronics Technology (JCET) Package Qualification Report # 110909, 111803, 141302 (Note 1) DECLARATION OF PACKAGED UNITS A. BANNED SUBSTANCES Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU RoHS. Listed in the table below are materials that are neither contained nor intentionally added to this product. Substances / Compounds Cadmium and Cadmium Compounds Hexavalent Chromium and its Compounds Lead and Lead Compounds Mercury and Mercury Compounds Polybrominated Biphenyls (PBB) Polybrominated Diphenylethers (PBDE) Asbestos Azo colorants Ozone Depleting Substances Polychlorinated Biphenyls (PCBs) Polychlorinated Napthalenes Radioactive Substances Shortchain Chlorinated Paraffins Tributyl Tin (TBT) and Triphenyl Tin (TPT) Tributyl Tin Oxide (TBTO) Formaldehyde Weight by mg PPM 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 0 0 0 0 0 0 0 0 0 0 Analysis Report (Note 2) CoA-AZ100JCET As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-04358 Rev *O Page 10 of 15 100L –TQFP (14 x 20 mm) Pb-Free Package B. MATERIAL COMPOSITION (Note 3) B1.USING GOLD WIRE Material Purpose of Use Leadframe Based Material Lead Finish External Plating Die Attach Adhesive Die Wire Circuit Interconnect Mold Compound Encapsulation Substance Composition Cu Si Mg Ni Ni Pd Au Ag Bismaleimide Polymer Methacrylate Acylate ester Organic Peroxide Si Au Silica Epoxy Resin Phenol Resin CAS Number 7440-50-8 7440-21-3 7439-95-4 7440-02-0 7440-02-0 7440-05-3 7440-57-5 7440-22-4 -----------------------------------------------------------------7440-21-3 7440-57-5 60676-86-0 --------------------------- Package Weight (mg): Weight by mg 147.1668 0.9943 0.2295 4.5894 1.8500 0.0300 0.0300 6.2203 0.7003 0.3903 0.1597 0.1597 0.1597 108.7900 2.6100 545.5166 36.7764 30.6470 887.0200 % Weight of Substance per Homogenous Material 96.2000% 0.6500% 0.1500% 3.0000% 96.8600% 1.5700% 1.5700% 79.8500% 8.9900% 5.0100% 2.0500% 2.0500% 2.0500% 100.0000% 100.0000% 89.0000% 6.0000% 5.0000% % Weight of Substance per Package PPM 165,911 1,121 259 5,174 2,086 34 34 7,013 789 440 180 180 180 122,647 2,942 614,999 41,461 34,550 16.5911% 0.1121% 0.0259% 0.5174% 0.2086% 0.0034% 0.0034% 0.7013% 0.0789% 0.0440% 0.0180% 0.0180% 0.0180% 12.2647% 0.2942% 61.4999% 4.1461% 3.4550% % Total: 100.0000 Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-04358 Rev *O Page 11 of 15 100L –TQFP (14 x 20 mm) Pb-Free Package B2.USING COPPER PALLADIUM WIRE Material 7440-02-0 7440-21-3 7439-95-4 7440-22-4 7440-50-8 4.4000 0.9000 0.3000 4.6000 189.8000 Tin Silver Proprietary Bismaleimide Proprietary Polymer Methacrylate Acrylate Ester Organic Peroxide Silicon Copper Palladium Epoxy Resin A Epoxy Resin B Phenol Resin Silica(Amorphous) Carbon Black 7440-31-5 7440-22-4 15.0000 6.2203 100.0000% 79.8500% 0.7003 8.9900% Proprietary Proprietary Proprietary 7440-21-3 7440-50-8 7440-05-3 Trade Secret Trade Secret Trade Secret 60676-86-0 1333-86-4 0.3903 0.1597 0.1597 0.1597 108.7900 4.9125 0.0875 15.1500 15.1500 25.2500 447.9350 1.5150 5.0100% 2.0500% 2.0500% 2.0500% 100.0000% 98.2500% 1.7500% 3.0000% 3.0000% 5.0000% 88.7000% 0.3000% Package Weight (mg): 841.5800 Purpose of Use Leadframe Base Material Lead Finish External Plating Die Attach Nickel Silicon Magnesium Silver Copper % weight of substance per Homogeneo us 2.2000% 0.4500% 0.1500% 2.3000% 94.9000% Adhesive Die Circuit Wire Interconnect Mold Compound Encapsulation Substance Composition CAS Number Proprietary Proprietary Weight by mg 5,228 1,069 356 5,466 225,528 %% Weight of Substance per package 0.5228% 0.1069% 0.0356% 0.5466% 22.5528% 17,824 1.7824% 7,391 0.7391% 832 0.0832% 464 0.0464% 190 190 190 129,269 5,837 104 18,002 18,002 30,003 532,255 1,800 0.0190% 0.0190% 0.0190% 12.9269% 0.5837% 0.0104% 1.8002% 1.8002% 3.0003% 53.2255% 0.1800% % Total: 100.0000 PPM Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-04358 Rev *O Page 12 of 15 100L –TQFP (14 x 20 mm) Pb-Free Package II. DECLARATION OF PACKAGING / INDIRECT MATERIALS Type Tape & Reel Tray Others Material Cover tape Carrier tape Plastic Reel Tray Moisture Barrier Bag Lead PPM < 2.0 < 2.0 < 5.0 < 2.0 Cadmium PPM < 2.0 < 2.0 < 5.0 < 2.0 Cr VI PPM < 2.0 < 2.0 < 5.0 < 2.0 Mercury PPM < 2.0 < 2.0 < 10.0 < 2.0 PBB PPM < 50.00 < 50.00 <50.0 < 0.0005 PBDE PPM < 45.00 < 45.00 <45.0 < 0.0005 <2.0 <2.0 <2.0 <2.0 <5.0 <5.0 Analysis Report (Note2) CoA-COVT-R CoA-CART-R CoA-PLRL-R CoA-TRAY-R CoA-MBBG –R Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-04358 Rev *O Page 13 of 15 100L –TQFP (14 x 20 mm) Pb-Free Package Document History Page Document Title: DATASHEET Document Number: Rev. 100L-TQFP 14X20MM PB-FREE PACKAGE MATERIAL DECLARATION 001-04358 ** *A ECN No. Orig. of Change 391439 GFJ 494016 ERI *B *C 513923 ERI 2581994 JARG *D *E *F 3219040 REYD 3342623 HLR 3412074 JARG *G *H 3453706 NKZ 3645691 COPI *I 3805192 JARG Description of Change New document Added 1. Add QTP Reference 062603 2. B1 : NiPdAu with Standard Molding Compound 3. B2 : NiPdAu with Green Molding Compound Corrected Table B2; Removed values for Br and Sb Added column for %weight of substance per homogeneous material in material composition tables 1, 2 and 3. Updated and added Lead, Cr+VI, PBB and PBDE on the Declaration of Packaging/Indirect Materials table assembly sites 1 and 2. Updated Cypress Logo. Add CAS number for Antimony Trioxide in material composition table 1. Added Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Added Assembly Site 3 – JCET Added Reference QTP No. 112602 on Assembly Site 1. Updated Material Composition Tables for Assembly Site 1 - Tables B1 and B2, Assembly Site 2 - Table B and Assembly Site 3 – Table B to reflect 4 decimal places on values. Added Automotive QTP reference 111803 in assembly 3. Added PMDD B2 for assembly site 2 – ASE Taiwan Copper wire qualification under QTP # 120201. Assembly Site 3: Corrected material composition table to meet the total of 100.0000% weight of substance per package. Document History Page Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-04358 Rev *O Page 14 of 15 100L –TQFP (14 x 20 mm) Pb-Free Package Document Title: DATASHEET Document Number: Rev. *J *K *L 100L-TQFP14X20MM PB-FREE PACKAGE MATERIAL DECLARATION 001-04358 ECN No. Orig. of Change 4075211 YUM Description of Change Added assembly site name in the Assembly heading in site 1, 2 and 3. Changed Assembly Code to Assembly Site Name in site 1, 2 and 3. Removed entire Tube row in the Indirect Materials Section. 4081278 UDR/YUM Added B3 on Package Weight - Site 1. Added QTP # 125105 on Assembly Site 1 Package Qualification Reports. Added B3 on Assembly Site 1 Material Composition. 4327794 REYD Added PMDD for Assembly Site 3-B2 – JCET Copper Qualification under QTP # 141302. Added subsections under Assembly Site 3-B: B1.USING GOLD WIRE and B2.USING COPPER PALLADIUM WIRE under Assembly Site 3-B. Transferred Material Composition Table under Assembly Site 3-B to 3-B1. *M 4404935 REYD *N 4722722 RODP *O 5004871 CS DCON Added B2 value in the Package Weight- Site 3. Updated Material Composition Table under Assembly Site 3-B2. Added B4 on Package Weight - Site 1. Added QTP # 150503 on Assembly Site 1 Package Qualification Reports. Added B4 on Assembly Site 1 Material Composition. Sunset Review - Added Site 2 Package B3 Weight, QTP152602 and Material Composition table. Also updated the summary from two assemble sites to 3. Removed distribution and posting in the document history page. Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-04358 Rev *O Page 15 of 15