14L -SOIC Pb-Free Package PACKAGE MATERIAL DECLARATION DATASHEET Cypress Package Code Package Weight – Site 1 SZ 139.0000 mg Body Size (mil/mm) Package Weight – Site 2 150 mils 120.9098 mg SUMMARY The 14L- SOIC Pb-Free package is compliant to RoHS. Cypress Ordering Part Numbers containing an “X” (e.g. CY7C1328G-133AXI, CY2308SXC-1HT) meet the Directive 2002/95/EC (RoHS) requirement. ASSEMBLY Site 1: Amkor Technology Philippines Package Qualification Report # 033203 (Note 1) I. DECLARATION OF PACKAGED UNITS A. BANNED SUBSTANCES Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU RoHS. Listed in the table below are materials that are neither contained nor intentionally added to this product. Substances / Compounds Cadmium and Cadmium Compounds Hexavalent Chromium and its Compounds Lead and Lead Compounds Mercury and Mercury Compounds Polybrominated Biphenyls (PBB) Polybrominated Diphenylethers (PBDE) Asbestos Azo colorants Ozone Depleting Substances Polychlorinated Biphenyls (PCBs) Polychlorinated Napthalenes Radioactive Substances Shortchain Chlorinated Paraffins Tributyl Tin (TBT) and Triphenyl Tin (TPT) Tributyl Tin Oxide (TBTO) Formaldehyde Weight by mg PPM 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 0 0 0 0 0 0 0 0 0 0 Analysis Report (Note 2) CoA-SZ14-Amkor Philippines As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No.001-04307 Rev. *F Page 1 of 6 14L -SOIC Pb-Free Package B. MATERIAL COMPOSITION (Note 3) Material Purpose of Use Leadframe Base Material Leadfinish External Plating Die Attach Die Wire Mold Compound Adhesive Circuit Interconnect Encapsulation Substance Composition 49.4095 1.1995 0.0103 0.0615 0.5792 2.3800 % weight of substance per Homogenous material 96.3900% 2.3400% 0.0200% 0.1200% 1.1300% 100.0000% ------------------7440-22-4 ------------------------------------------------------- 0.1700 0.5600 0.0300 0.0300 0.0300 7440-21-3 7440-57-5 ------------------60676-86-0 ------------------1309-64-4 1.8600 0.2400 5.7708 71.7228 2.4732 2.4732 CAS Number Cu Fe P Zn Ag Pure Sn 7440-50-8 7439-89-6 7723-14-0 7440-66-6 7440-22-4 7440-31-5 Resin Ag Metal Oxide Amine Gamma Butyrolactone Si Au Dicyclopentadi SiO2 Phenol Resin Antimony Trioxide Package Weight (mg): Weight by mg 355,464 8,629 74 443 4,167 17,122 % weight of substance per package 35.5464% 0.8629% 0.0074% 0.0443% 0.4167% 1.7122% 20.7300% 68.2900% 3.6600% 3.6600% 3.6600% 1,223 4,029 216 216 216 0.1223% 0.4029% 0.0216% 0.0216% 0.0216% 100.0000% 100.0000% 7.0000% 87.0000% 3.0000% 3.0000% 13,381 1,727 41,517 515,991 17,793 17,793 1.3381% 0.1727% 4.1517% 51.5991% 1.7793% 1.7793% 139.0000 PPM % Total: 100.0000 II. DECLARATION OF PACKAGING INDIRECT MATERIALS Type Tape & Reel Tube Others Material Cover tape Carrier tape Plastic Reel Plastic Tube End Plug Shielding bag Moisture Barrier bag Protective Band Shipping and Inner Box Dessicant Bubble Pack Lead PPM < 2.0 < 2.0 < 2.0 < 5.0 < 5.0 < 2.0 < 2.0 < 2.0 < 10.0 Cadmium PPM < 2.0 < 2.0 < 2.0 < 5.0 < 5.0 < 2.0 < 2.0 < 2.0 < 4.0 Cr VI PPM < 2.0 < 2.0 < 2.0 < 5.0 < 5.0 < 2.0 < 2.0 < 2.0 < 4.0 Mercury PPM < 2.0 < 2.0 < 2.0 < 5.0 < 5.0 < 2.0 < 2.0 < 2.0 < 5.0 PBB PPM <5.0 <5.0 <5.0 < 1.0 < 1.0 <5.0 <5.0 <5.0 --------- PBDE PPM <5.0 <5.0 <5.0 < 1.0 < 1.0 <5.0 <5.0 <5.0 ----------- < 10.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 1.0 < 2.0 < 3.0 < 100.0 < 3.0 < 90.0 Analysis Report (Note2) CoA-COVT-R CoA-CART-R CoA-PLRL-R CoA-PLTB-R CoA-EPLG-R CoA-SBAG –R CoA-MBBG-R CoA-PROB-R CoA-ABOX-R CoA-DESS-R CoA-BUBP-R Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No.001-04307 Rev. *F Page 2 of 6 14L -SOIC Pb-Free Package ASSEMBLY Site 2: RAMTRON I. DECLARATION OF PACKAGED UNITS A. BANNED SUBSTANCES Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU RoHS. Listed in the table below are materials that are neither contained nor intentionally added to this product. Substances / Compounds Cadmium and Cadmium Compounds Hexavalent Chromium and its Compounds Lead and Lead Compounds Mercury and Mercury Compounds Polybrominated Biphenyls (PBB) Polybrominated Diphenylethers (PBDE) Asbestos Azo colorants Ozone Depleting Substances Polychlorinated Biphenyls (PCBs) Polychlorinated Napthalenes Radioactive Substances Shortchain Chlorinated Paraffins Tributyl Tin (TBT) and Triphenyl Tin (TPT) Tributyl Tin Oxide (TBTO) Formaldehyde Weight by mg PPM 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 0 0 0 0 0 0 0 0 0 0 Analysis Report (Note 2) CoA-SZ14Ramtron As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No.001-04307 Rev. *F Page 3 of 6 14L -SOIC Pb-Free Package B. MATERIAL COMPOSITION (Note 3) Material Purpose of Use Leadframe Base Material Leadfinish External Plating Die Attach Adhesive Die 1 Die 2 Wire Mold Compound Circuit Circuit Interconnect Encapsulation Substance Composition Cu Fe P Ag Sn Pb Acrylate Resin Ag Heterocyclic organic compound Treated Silica Si Si Au Silica Fused Epoxy Resin Phenol Resin A Phenol Resin B Carbon Black 7440-50-8 7439-89-6 7723-14-0 7440-22-4 7440-31-5 7439-92-1 Trade Secret 7440-22-4 Trade Secret 34.0600 0.7800 0.0100 0.0500 4.8990 0.0010 0.0460 0.2320 0.0060 % weight of substance per Homogenous material 97.5931% 2.2350% 0.0287% 0.1433% 99.9796% 0.0204% 15.8621% 80.0000% 2.0690% 60676-86-0 7440-21-3 7440-21-3 7440-57-5 60676-86-0 Trade Secret Trade Secret 0.0060 3.2100 2.1200 1.8998 66.2400 5.1500 0.8800 Trade Secret 1333-86-4 CAS Number Package Weight (mg): 281698 6451 83 414 40518 8 380 1919 50 % weight of substance per package 28.1698% 0.6451% 0.0083% 0.0414% 4.0518% 0.0008% 0.0380% 0.1919% 0.0050% 2.0690% 100.0000% 100.0000% 100.0000% 90.0122% 6.9982% 1.1958% 50 26549 17534 15713 547846 42594 7278 0.0050% 2.6549% 1.7534% 1.5713% 54.7846% 4.2594% 0.7278% 1.2500 1.6986% 10338 1.0338% 0.0700 0.0951% 579 0.0579% Weight by mg 120.9098 PPM % Total: 100.0000 Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No.001-04307 Rev. *F Page 4 of 6 14L -SOIC Pb-Free Package II. DECLARATION OF PACKAGING INDIRECT MATERIALS Type Tape & Reel Tube Others Material Cover tape Carrier tape Plastic Reel Plastic Tube End Plug Shielding bag Moisture Barrier bag Protective Band Shipping and Inner Box Dessicant Bubble Pack Lead PPM < 2.0 < 2.0 < 2.0 < 5.0 < 5.0 < 2.0 < 2.0 < 2.0 < 10.0 Cadmium PPM < 2.0 < 2.0 < 2.0 < 5.0 < 5.0 < 2.0 < 2.0 < 2.0 < 4.0 Cr VI PPM < 2.0 < 2.0 < 2.0 < 5.0 < 5.0 < 2.0 < 2.0 < 2.0 < 4.0 Mercury PPM < 2.0 < 2.0 < 2.0 < 5.0 < 5.0 < 2.0 < 2.0 < 2.0 < 5.0 PBB PPM <5.0 <5.0 <5.0 < 1.0 < 1.0 <5.0 <5.0 <5.0 --------- PBDE PPM <5.0 <5.0 <5.0 < 1.0 < 1.0 <5.0 <5.0 <5.0 ----------- < 10.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 1.0 < 2.0 < 3.0 < 100.0 < 3.0 < 90.0 Analysis Report (Note2) CoA-COVT-R CoA-CART-R CoA-PLRL-R CoA-PLTB-R CoA-EPLG-R CoA-SBAG –R CoA-MBBG-R CoA-PROB-R CoA-ABOX-R CoA-DESS-R CoA-BUBP-R Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No.001-04307 Rev. *F Page 5 of 6 14L -SOIC Pb-Free Package Document History Page Document Title: Document Number: Rev. 14L-SOIC PB-FREE PACKAGE MATERIAL DECLARATION DATASHEET 001-04307 ** *A ECN No. Orig. of Change 390185 GFJ 2519841 HLR *B *C *D DCON 2712138 HLR 3298123 HLR 3666168 HLR *E 4045978 YUM *F 5278692 YUM DCON Description of Change New document Added the CAS Number of Silicon Oxide and Antimony Trioxide Changed Cypress Logo Added % weight of substance per Homogenous Material and % weight of substance per package on the Material Composition table. Completed the RoHS Substances namely; Lead Cadmium, Mercury, Chromium VI, PBB and PBDE on Declaration of Packaging Indirect Materials table. Replaced E-CML to WEB in distribution list. Added Note 4 on Footer Section. Sunset Due – No Change Updated the material composition table to reflect 4 decimal places on values. Changed Assembly Code to Assembly Site Name. Removed End Pin in the Indirect Materials Section. Added material composition for Assembly Site 2: RAMTRON. Removed Distribution and posting information from Document history page. Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No.001-04307 Rev. *F Page 6 of 6