119 - PBGA Pb-Free Package PACKAGE MATERIAL DECLARATION DATASHEET *** Cypress Package Code Package Weight – Site 1 BY B1 : 945.9899 mg B2 : 1,092.1404 mg B3 : 912.9759 mg Body Size (mil/mm) Package Weight – Site 2 14 X 22mm B1 : 956.3201 mg B2 : 948.8302 mg SUMMARY The 119- BGA Pb-Free package is compliant to RoHS. Cypress Ordering Part Numbers containing an “X” (e.g. CY7C1328G-133AXI, CY2308SXC-1HT) meet the Directive 2002/95/EC (RoHS) requirement. *** ASSEMBLY Site 1: Advanced Semiconductor Engineering Taiwan (ASET) Package Qualification Report #s 041103, 131010 (Note 1) I. DECLARATION OF PACKAGED UNITS A. BANNED SUBSTANCES Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU RoHS. Listed in the table below are materials that are neither contained nor intentionally added to this product. Substances / Compounds Cadmium and Cadmium Compounds Hexavalent Chromium and its Compounds Lead and Lead Compounds Mercury and Mercury Compounds Polybrominated Biphenyls (PBB) Polybrominated Diphenylethers (PBDE) Asbestos Azo colorants Ozone Depleting Substances Polychlorinated Biphenyls (PCBs) Polychlorinated Napthalenes Radioactive Substances Shortchain Chlorinated Paraffins Tributyl Tin (TBT) and Triphenyl Tin (TPT) Tributyl Tin Oxide (TBTO) Formaldehyde Weight by mg 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 PPM < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 0 0 0 0 0 0 0 0 0 0 Analysis Report (Note 2) CoA-BY119-ASET As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data Document No. 001-05023 Rev.*J Page 1 of 10 119 - PBGA Pb-Free Package B1. MATERIAL COMPOSITION (Note 3) Using Non-Green Substrate Material Material Purpose of Use Substrate Base Material Solder Ball External Plating Die Attach Adhesive Die Wire Circuit Interconnect Mold Compound Encapsulation Substance Composition CAS Number Weight by mg % weight of substance per Homogenous material PPM % weight of substance per package SiO2 60676-86-0 22.5561 10.5000% 23,844 2.3844% Acrylic 29690-82-2 19.7634 9.2000% 20,892 2.0892% Epoxy 68541-56-0 Bisphenol Triazol Cu Ni Au Br Sn Ag Cu Silver Epoxy Resin Functionalized Esters Diester Si Au Silica Fused Epoxy Resin A Epoxy Resin B Phenolic Resin Metal Hydroxide Carbon Black 13676-54-5 25722-66-1 7440-50-8 7440-02-0 7440-57-5 7726-95-6 7440-31-5 7440-22-4 7440-50-8 7440-22-4 -------------------- 13.1040 32.2230 38.4528 84.5746 3.0075 1.0311 0.1074 192.5280 8.0640 1.0080 8.1302 0.5724 6.1000% 15.0000% 17.9000% 39.3700% 1.4000% 0.4800% 0.0500% 95.5000% 4.0000% 0.5000% 76.7000% 5.4000% 13,852 34,063 40,648 89,403 3,179 1,090 114 203,520 8,524 1,066 8,594 605 1.3852% 3.4063% 4.0648% 8.9403% 0.3179% 0.1090% 0.0114% 20.3520% 0.8524% 0.1066% 0.8594% 0.0605% -------------------7440-21-3 7440-57-5 60676-86-0 ----------------------------------------------------------------------------1333-86-4 0.5724 1.3250 64.9900 4.9200 377.2104 20.2077 20.2077 20.2077 8.9812 2.2453 5.4000% 12.5000% 100.0000% 100.0000% 84.0000% 4.5000% 4.5000% 4.5000% 2.0000% 0.5000% 605 1,401 68,701 5,201 398,747 21,361 21,361 21,361 9,494 2,373 0.0605% 0.1401% 6.8701% 0.5201% 39.8747% 2.1361% 2.1361% 2.1361% 0.9494% 0.2373% Package Weight (mg): 945.9899 -------------------- % Total: 100.0000 Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data Document No. 001-05023 Rev.*J Page 2 of 10 119 - PBGA Pb-Free Package *** B2. MATERIAL COMPOSITION (Note 3) Using Green Substrate Material Material Purpose of Use Substance Composition Base Material Solder Ball External Plating Die Attach Adhesive Die Wire Circuit Interconnect Mold Compound Encapsulation % weight of substance per Homogenous material PPM % weight of substance per package SiO2 60676-86-0 36.0898 10.4900% 33045 3.3045% Acrylic Trade Secret 29690-82-2, 68541-56-0, 25068-38-6 13676-54-5 25722-66-1 7440-50-8 7440-02-0 7440-57-5 7440-31-5 7440-22-4 7440-50-8 7440-22-4 -------------------- 31.6517 9.2000% 28981 2.8981% 21.1241 51.5372 61.8584 135.3110 4.7822 1.6858 185.5565 7.7720 0.9715 4.6972 0.3203 6.1400% 14.9800% 17.9800% 39.3300% 1.3900% 0.4900% 95.5000% 4.0000% 0.5000% 77.0000% 5.2500% 19342 47189 56640 123895 4379 1544 169902 7116 890 4301 293 1.9342% 4.7189% 5.6640% 12.3895% 0.4379% 0.1544% 16.9902% 0.7116% 0.0890% 0.4301% 0.0293% 0.3203 0.7625 21.9300 2.2700 444.9750 20.9400 20.9400 20.9400 10.4700 2.0940 3.1410 5.2500% 12.5000% 100.0000% 100.0000% 85.0000% 4.0000% 4.0000% 4.0000% 2.0000% 0.4000% 0.6000% 293 698 20080 2078 407434 19173 19173 19173 9587 1917 2876 0.0293% 0.0698% 2.0080% 0.2078% 40.7434% 1.9173% 1.9173% 1.9173% 0.9587% 0.1917% 0.2876% % Total: 100.0000 Epoxy Substrate CAS Number Weight by mg Bisphenol Triazol Copper (Cu) Nickel (Ni) Gold (Au) Sn Ag Cu Silver Epoxy Resin Functionalized Esters Diester Si Au Silica (fused) Epoxy resinA Epoxy resinB Phenolic resin Metal Hydroxide Carbon Black Others --------------------------------------7440-21-3 7440-57-5 60676-86-0 Trade Secret Trade Secret Trade Secret Trade Secret 1333-86-4 Trade Secret Package Weight (mg): 1092.1405 Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data Document No. 001-05023 Rev.*J Page 3 of 10 119 - PBGA Pb-Free Package *** B3. MATERIAL COMPOSITION (Note 3) Using Green Substrate Material and Palladium-Coated Copper Wire Material Purpose of Use Substrate Base Material Solder Ball External Plating Die Attach Adhesive Die Circuit Wire Interconnect Mold Compound Encapsulation Substance Composition CAS Number Weight by mg 51.5782 61.9076 135.4185 4.7860 1.6871 94.9984 2.9842 0.4974 1.6784 0.1144 39,561 34,696 23,156 56,495 67,809 148,327 5,242 1,848 104,054 3,269 545 1,838 125 3.9561% 3.4696% 2.3156% 5.6495% 6.7809% 14.8327% 0.5242% 0.1848% 10.4054% 0.3269% 0.0545% 0.1838% 0.0125% 0.1144 5.2500% 125 0.0125% 0.2725 9.9788 2.0919 0.0580 12.5000% 100.0000% 97.3000% 2.7000% 3.0000% 1.7500% 2.2500% 2.2500% 0.2000% 90.5500% 298 10,930 2,291 64 14,980 8,738 11,235 11,235 999 452,141 0.0298% 1.0930% 0.2291% 0.0064% 1.4980% 0.8738% 1.1235% 1.1235% 0.0999% 45.2141% 60676-86-0 Trade Secret Trade Secret 36.1185 31.6768 21.1409 Bisphenol Triazine Copper Nickel Gold Tin Silver Copper Silver Epoxy Resin Functionalized Ester Diester Silicon Copper Palladium 13676-54-5 25722-66-1 7440-50-8 7440-02-0 7440-57-5 7440-31-5 7440-22-4 7440-50-8 7440-22-4 Trade Secret Epoxy Resin 1 Epoxy Resin 2 Hardener 1 Hardener 2 Carbon Black Silica Trade Secret Trade Secret Trade Secret Trade Secret 1333-86-4 60676-86-0 Package Weight (mg): PPM % Weight of Substance per Package 10.4900% 9.2000% 6.1400% 14.9800% 17.9800% 39.3300% 1.3900% 0.4900% 96.4646% 3.0303% 0.5051% 77.0000% 5.2500% SiO2 Acrylic Epoxy Trade Secret Trade Secret 7440-21-3 7440-50-8 7440-05-3 % Weight of Substance per Homogenous Material 13.6762 7.9778 10.2572 10.2572 0.9117 412.7937 912.9758 % Total: 100.0000 Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data Document No. 001-05023 Rev.*J Page 4 of 10 119 - PBGA Pb-Free Package II. DECLARATION OF PACKAGING / INDIRECT MATERIALS Type Tape & Reel Tray Others Material Cover tape Carrier tape Plastic Reel Tray Shielding bag Moisture Barrier bag Protective Band Shipping and Inner Box Lead PPM < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 10.0 Cadmium PPM < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 4.0 Cr VI PPM < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 4.0 Mercury PPM < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 5.0 PBB PPM <5.0 <5.0 <5.0 --------<5.0 <5.0 <5.0 --------- PBDE PPM <5.0 <5.0 <5.0 --------<5.0 <5.0 <5.0 ----------- Analysis Report (Note2) CoA-COVT-R CoA-CART-R CoA-PLRL-R CoA-TRAY-R CoA-SBAG –R CoA-MBBG-R CoA-PROB-R CoA-ABOX-R Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data Document No. 001-05023 Rev.*J Page 5 of 10 119 - PBGA Pb-Free Package ASSEMBLY Site 2: PT UNISEM Batam Package Qualification Report # 073702 (Note 1) I. DECLARATION OF PACKAGED UNITS A. BANNED SUBSTANCES Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU RoHS. Listed in the table below are materials that are neither contained nor intentionally added to this product. Substances / Compounds Cadmium and Cadmium Compounds Hexavalent Chromium and its Compounds Lead and Lead Compounds Mercury and Mercury Compounds Polybrominated Biphenyls (PBB) Polybrominated Diphenylethers (PBDE) Asbestos Azo colorants Ozone Depleting Substances Polychlorinated Biphenyls (PCBs) Polychlorinated Napthalenes Radioactive Substances Shortchain Chlorinated Paraffins Tributyl Tin (TBT) and Triphenyl Tin (TPT) Tributyl Tin Oxide (TBTO) Formaldehyde Weight by mg 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 PPM < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 0 0 0 0 0 0 0 0 0 0 Analysis Report (Note 2) CoA-BY119-PT UNISEM As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data Document No. 001-05023 Rev.*J Page 6 of 10 119 - PBGA Pb-Free Package B1. MATERIAL COMPOSITION (Note 3) Using SAC105 Solder Ball Composition Material Substrate Gold 7440-57-5 1.0418 % weight of substance per Homogenous material 0.3600% Nickel 7440-02-0 7.3218 Copper 7440-50-8 Solder Mask Plug epoxy ---------------------------13676-54-5 25722-66-1 65997-17-3 7440-31-5 7440-22-4 7440-50-8 ----------------------------9003-36-5 --------------1333-86-4 461-58-5 7440-21-3 7440-57-5 60676-86-0 ----------------------------1333-86-4 14808-60-7 --------------- Purpose of Use Base Material Substance Composition BT Resin Solder Ball External Plating Die Attach Adhesive Die Wire Circuit Interconnect Mold Compou nd Encapsulation Fibrous Glass wool Tin Silver Copper Bismaleimide Silicon Resin Epoxy Resin Diluent Carbon Black Dicyandiamide Silicon Gold Fused Silica Solid Epoxy Resin Phenol Resin Carbon Black Crystalline Silica Metal Hydro Oxide CAS Number Package Weight (mg): 1,089 % weight of substance per package 0.1089 2.5300% 7,656 0.7656 60.0505 20.7500% 62,793 6.2793 50.7897 1.5628 75.3598 17.5500% 0.5400% 26.0400% 53,110 1,634 78,802 5.3110 0.1634 7.8802 93.2736 222.3539 2.2574 1.1287 6.1380 2.5575 1.0230 0.4092 0.0512 0.0512 43.0500 6.7800 362.0640 7.6224 1.9056 3.8112 3.8112 1.9056 32.2300% 98.5000% 1.0000% 0.5000% 60.0000% 25.0000% 10.0000% 4.0000% 0.5000% 0.5000% 100.0000% 100.0000% 95.0000% 2.0000% 0.5000% 1.0000% 1.0000% 0.5000% 97,534 232,510 2,361 1,180 6,418 2,674 1,070 428 53 53 45,016 7,090 378,601 7,971 1,993 3,985 3,985 1,993 9.7534 23.2510 0.2361 0.1180 0.6418 0.2674 0.1070 0.0428 0.0053 0.0053 4.5016 0.7090 37.8601 0.7971 0.1993 0.3985 0.3985 0.1993 Weight by mg 956.3201 PPM % Total: 100.0000 Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data Document No. 001-05023 Rev.*J Page 7 of 10 119 - PBGA Pb-Free Package B2. MATERIAL COMPOSITION (Note 3) Using SAC405 Solder Ball Composition Material Substrate Purpose of Use Base Material Substance Composition External Plating Die Attach Adhesive Die Wire Circuit Interconnect Mold Compound Encapsulation % weight of substance per Homogenous material PPM % weight of substance per package Gold 7440-57-5 1.0418 0.3600% 1,098 0.1098 Nickel 7440-02-0 7.3218 2.5300% 7,717 0.7717 Copper 7440-50-8 60.0505 20.7500% 63,289 6.3289 Solder Mask Plug epoxy ---------------------------13676-54-5 25722-66-1 65997-17-3 7440-31-5 7440-22-4 7440-50-8 ----------------------------9003-36-5 --------------1333-86-4 461-58-5 7440-21-3 7440-57-5 60676-86-0 ----------------------------1333-86-4 14808-60-7 --------------- 50.7897 1.5628 75.3598 17.5500% 0.5400% 26.0400% 53,529 1,647 79,424 5.3529 0.1647 7.9424 93.2736 208.4288 8.7300 1.0913 6.1380 2.5575 1.0230 0.4092 0.0512 0.0512 43.0500 6.7800 362.0640 7.6224 1.9056 3.8112 3.8112 1.9056 32.2300% 95.5000% 4.0000% 0.5000% 60.0000% 25.0000% 10.0000% 4.0000% 0.5000% 0.5000% 100.0000% 100.0000% 95.0000% 2.0000% 0.5000% 1.0000% 1.0000% 0.5000% 98,304 219,669 9,201 1,150 6,469 2,695 1,078 431 54 54 45,372 7,146 381,590 8,033 2,008 4,017 4,017 2,008 9.8304 21.9669 0.9201 0.1150 0.6469 0.2695 0.1078 0.0431 0.0054 0.0054 4.5372 0.7146 38.1590 0.8033 0.2008 0.4017 0.4017 0.2008 BT Resin Solder Ball CAS Number Weight by mg Fibrous Glass wool Tin Silver Copper Bismaleimide Silicon Resin Epoxy Resin Diluent Carbon Black Dicyandiamide Silicon Gold Fused Silica Solid Epoxy Resin Phenol Resin Carbon Black Crystalline Silica Metal Hydro Oxide Package Weight (mg): 948.8302 % Total: 100.0000 Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data Document No. 001-05023 Rev.*J Page 8 of 10 119 - PBGA Pb-Free Package II. DECLARATION OF PACKAGING / INDIRECT MATERIALS Type Tape & Reel Tray Others Material Cover tape Carrier tape Plastic Reel Tray Moisture Barrier Bag Lead PPM < 2.0 < 2.0 < 5.0 < 2.0 <2.0 Cadmiu m PPM < 2.0 < 2.0 < 5.0 < 2.0 <2.0 Cr VI PPM Mercury PPM < 2.0 < 2.0 < 5.0 < 2.0 <2.0 < 2.0 < 2.0 < 10.0 < 2.0 <2.0 PBB PPM PBDE PPM < 50.00 < 50.00 <50.0 < 0.0005 <5.0 < 45.00 < 45.00 <45.0 < 0.0005 <5.0 Analysis Report (Note2) CoA-COVT-R CoA-CART-R CoA-PLRL-R CoA-TRAY-R CoA-MBBG –R Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data Document No. 001-05023 Rev.*J Page 9 of 10 119 - PBGA Pb-Free Package Document History Page Document Title: 119-PBGA PB-FREE PACKAGE MATERIAL DECLARATION DATASHEET Document Number: 001-05023 Rev. ECN No. Orig. of Change ** 399031 GFJ *A 2569056 HLR *B 2597814 LJN *C *D *E *F *G 2751570 2768585 2779662 3001245 3734953 *H 4043324 YUM *I 4088359 YUM *J 4123120 CMG HLR VFR MAHA HLR HLR Description of Change New document Changed Cypress Logo. Added % weight of substance per Homogenous Material and % weight of substance per package on the Material Composition table. Completed the RoHS Substances namely; Lead Cadmium, Mercury, Chromium VI, PBB and PBDE on Declaration of Packaging Indirect Materials table. Added CAS No. of Bromine. Correct title on document history page to match title page, DMS and CMS. Updated CAS number of Gold (Au) Added Material Declaration for Site 2 and 3. Added material declaration for assembly site 4. Changed reference package QTP report for assembly Site 1. Updated the material composition tables to reflect 4 decimal places on values. Removed the material name for AIT Assembly Removed Assembly Site 3 and added the material composition table to Assembly Site 2. Removed Assembly Site 4 and added the material composition table to Assembly Site 1. Added Assembly Site Name in the Assembly heading in site 1 and 2. Changed Assembly code to Assembly Site Name in site 1 and 2. Removed entire Tube row in the Indirect Materials section. Corrected material composition in Site1:B2 from “1092.1402” to “1092.1404”. Added material composition for PBGA 119 14x22 package assembly at ASE, Taiwan using green substrate and Palladiumcoated Copper wire with reference QTP# 131010 Corrected total weight of Assembly Site 1 – B2 Distribution: WEB Posting: None Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data Document No. 001-05023 Rev.*J Page 10 of 10