119-PBGA PB-FREE PACKAGE MATERIAL DECLARATION DATASHEET

119 - PBGA
Pb-Free Package
PACKAGE MATERIAL DECLARATION DATASHEET
***
Cypress Package Code
Package Weight – Site 1
BY
B1 : 945.9899 mg
B2 : 1,092.1404 mg
B3 : 912.9759 mg
Body Size (mil/mm)
Package Weight – Site 2
14 X 22mm
B1 : 956.3201 mg
B2 : 948.8302 mg
SUMMARY
The 119- BGA Pb-Free package is compliant to RoHS. Cypress Ordering Part Numbers containing an “X” (e.g.
CY7C1328G-133AXI, CY2308SXC-1HT) meet the Directive 2002/95/EC (RoHS) requirement.
***
ASSEMBLY Site 1: Advanced Semiconductor Engineering Taiwan (ASET)
Package Qualification Report #s 041103, 131010 (Note 1)
I. DECLARATION OF PACKAGED UNITS
A. BANNED SUBSTANCES
Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU RoHS. Listed
in the table below are materials that are neither contained nor intentionally added to this product.
Substances / Compounds
Cadmium and Cadmium Compounds
Hexavalent Chromium and its Compounds
Lead and Lead Compounds
Mercury and Mercury Compounds
Polybrominated Biphenyls (PBB)
Polybrominated Diphenylethers (PBDE)
Asbestos
Azo colorants
Ozone Depleting Substances
Polychlorinated Biphenyls (PCBs)
Polychlorinated Napthalenes
Radioactive Substances
Shortchain Chlorinated Paraffins
Tributyl Tin (TBT) and Triphenyl Tin (TPT)
Tributyl Tin Oxide (TBTO)
Formaldehyde
Weight by
mg
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
PPM
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
0
0
0
0
0
0
0
0
0
0
Analysis Report
(Note 2)
CoA-BY119-ASET
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly
100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using
MSDS, Material Analysis Reports and Cypress Assembly sites information
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data
Document No. 001-05023 Rev.*J
Page 1 of 10
119 - PBGA
Pb-Free Package
B1. MATERIAL COMPOSITION (Note 3)
Using Non-Green Substrate Material
Material
Purpose of
Use
Substrate
Base Material
Solder Ball
External
Plating
Die Attach
Adhesive
Die
Wire
Circuit
Interconnect
Mold
Compound
Encapsulation
Substance
Composition
CAS Number
Weight by
mg
% weight of
substance per
Homogenous
material
PPM
% weight of
substance
per
package
SiO2
60676-86-0
22.5561
10.5000%
23,844
2.3844%
Acrylic
29690-82-2
19.7634
9.2000%
20,892
2.0892%
Epoxy
68541-56-0
Bisphenol
Triazol
Cu
Ni
Au
Br
Sn
Ag
Cu
Silver
Epoxy Resin
Functionalized
Esters
Diester
Si
Au
Silica Fused
Epoxy Resin A
Epoxy Resin B
Phenolic Resin
Metal Hydroxide
Carbon Black
13676-54-5
25722-66-1
7440-50-8
7440-02-0
7440-57-5
7726-95-6
7440-31-5
7440-22-4
7440-50-8
7440-22-4
--------------------
13.1040
32.2230
38.4528
84.5746
3.0075
1.0311
0.1074
192.5280
8.0640
1.0080
8.1302
0.5724
6.1000%
15.0000%
17.9000%
39.3700%
1.4000%
0.4800%
0.0500%
95.5000%
4.0000%
0.5000%
76.7000%
5.4000%
13,852
34,063
40,648
89,403
3,179
1,090
114
203,520
8,524
1,066
8,594
605
1.3852%
3.4063%
4.0648%
8.9403%
0.3179%
0.1090%
0.0114%
20.3520%
0.8524%
0.1066%
0.8594%
0.0605%
-------------------7440-21-3
7440-57-5
60676-86-0
----------------------------------------------------------------------------1333-86-4
0.5724
1.3250
64.9900
4.9200
377.2104
20.2077
20.2077
20.2077
8.9812
2.2453
5.4000%
12.5000%
100.0000%
100.0000%
84.0000%
4.5000%
4.5000%
4.5000%
2.0000%
0.5000%
605
1,401
68,701
5,201
398,747
21,361
21,361
21,361
9,494
2,373
0.0605%
0.1401%
6.8701%
0.5201%
39.8747%
2.1361%
2.1361%
2.1361%
0.9494%
0.2373%
Package Weight (mg):
945.9899
--------------------
% Total:
100.0000
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly
100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using
MSDS, Material Analysis Reports and Cypress Assembly sites information
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data
Document No. 001-05023 Rev.*J
Page 2 of 10
119 - PBGA
Pb-Free Package
***
B2. MATERIAL COMPOSITION (Note 3)
Using Green Substrate Material
Material
Purpose of
Use
Substance
Composition
Base Material
Solder Ball
External
Plating
Die Attach
Adhesive
Die
Wire
Circuit
Interconnect
Mold Compound
Encapsulation
% weight of
substance per
Homogenous
material
PPM
% weight of
substance
per
package
SiO2
60676-86-0
36.0898
10.4900%
33045
3.3045%
Acrylic
Trade Secret
29690-82-2,
68541-56-0,
25068-38-6
13676-54-5
25722-66-1
7440-50-8
7440-02-0
7440-57-5
7440-31-5
7440-22-4
7440-50-8
7440-22-4
--------------------
31.6517
9.2000%
28981
2.8981%
21.1241
51.5372
61.8584
135.3110
4.7822
1.6858
185.5565
7.7720
0.9715
4.6972
0.3203
6.1400%
14.9800%
17.9800%
39.3300%
1.3900%
0.4900%
95.5000%
4.0000%
0.5000%
77.0000%
5.2500%
19342
47189
56640
123895
4379
1544
169902
7116
890
4301
293
1.9342%
4.7189%
5.6640%
12.3895%
0.4379%
0.1544%
16.9902%
0.7116%
0.0890%
0.4301%
0.0293%
0.3203
0.7625
21.9300
2.2700
444.9750
20.9400
20.9400
20.9400
10.4700
2.0940
3.1410
5.2500%
12.5000%
100.0000%
100.0000%
85.0000%
4.0000%
4.0000%
4.0000%
2.0000%
0.4000%
0.6000%
293
698
20080
2078
407434
19173
19173
19173
9587
1917
2876
0.0293%
0.0698%
2.0080%
0.2078%
40.7434%
1.9173%
1.9173%
1.9173%
0.9587%
0.1917%
0.2876%
% Total:
100.0000
Epoxy
Substrate
CAS Number
Weight by
mg
Bisphenol
Triazol
Copper (Cu)
Nickel (Ni)
Gold (Au)
Sn
Ag
Cu
Silver
Epoxy Resin
Functionalized
Esters
Diester
Si
Au
Silica (fused)
Epoxy resinA
Epoxy resinB
Phenolic resin
Metal Hydroxide
Carbon Black
Others
--------------------------------------7440-21-3
7440-57-5
60676-86-0
Trade Secret
Trade Secret
Trade Secret
Trade Secret
1333-86-4
Trade Secret
Package Weight (mg): 1092.1405
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly
100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using
MSDS, Material Analysis Reports and Cypress Assembly sites information
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data
Document No. 001-05023 Rev.*J
Page 3 of 10
119 - PBGA
Pb-Free Package
***
B3. MATERIAL COMPOSITION (Note 3)
Using Green Substrate Material and Palladium-Coated Copper Wire
Material
Purpose of
Use
Substrate
Base Material
Solder Ball
External
Plating
Die Attach
Adhesive
Die
Circuit
Wire
Interconnect
Mold Compound
Encapsulation
Substance
Composition
CAS Number
Weight by
mg
51.5782
61.9076
135.4185
4.7860
1.6871
94.9984
2.9842
0.4974
1.6784
0.1144
39,561
34,696
23,156
56,495
67,809
148,327
5,242
1,848
104,054
3,269
545
1,838
125
3.9561%
3.4696%
2.3156%
5.6495%
6.7809%
14.8327%
0.5242%
0.1848%
10.4054%
0.3269%
0.0545%
0.1838%
0.0125%
0.1144
5.2500%
125
0.0125%
0.2725
9.9788
2.0919
0.0580
12.5000%
100.0000%
97.3000%
2.7000%
3.0000%
1.7500%
2.2500%
2.2500%
0.2000%
90.5500%
298
10,930
2,291
64
14,980
8,738
11,235
11,235
999
452,141
0.0298%
1.0930%
0.2291%
0.0064%
1.4980%
0.8738%
1.1235%
1.1235%
0.0999%
45.2141%
60676-86-0
Trade Secret
Trade Secret
36.1185
31.6768
21.1409
Bisphenol
Triazine
Copper
Nickel
Gold
Tin
Silver
Copper
Silver
Epoxy Resin
Functionalized
Ester
Diester
Silicon
Copper
Palladium
13676-54-5
25722-66-1
7440-50-8
7440-02-0
7440-57-5
7440-31-5
7440-22-4
7440-50-8
7440-22-4
Trade Secret
Epoxy Resin 1
Epoxy Resin 2
Hardener 1
Hardener 2
Carbon Black
Silica
Trade Secret
Trade Secret
Trade Secret
Trade Secret
1333-86-4
60676-86-0
Package Weight (mg):
PPM
% Weight of
Substance
per
Package
10.4900%
9.2000%
6.1400%
14.9800%
17.9800%
39.3300%
1.3900%
0.4900%
96.4646%
3.0303%
0.5051%
77.0000%
5.2500%
SiO2
Acrylic
Epoxy
Trade Secret
Trade Secret
7440-21-3
7440-50-8
7440-05-3
% Weight of
Substance
per
Homogenous
Material
13.6762
7.9778
10.2572
10.2572
0.9117
412.7937
912.9758
% Total:
100.0000
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly
100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using
MSDS, Material Analysis Reports and Cypress Assembly sites information
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data
Document No. 001-05023 Rev.*J
Page 4 of 10
119 - PBGA
Pb-Free Package
II. DECLARATION OF PACKAGING / INDIRECT MATERIALS
Type
Tape &
Reel
Tray
Others
Material
Cover tape
Carrier tape
Plastic Reel
Tray
Shielding bag
Moisture Barrier bag
Protective Band
Shipping and Inner
Box
Lead
PPM
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
< 10.0
Cadmium
PPM
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
< 4.0
Cr VI
PPM
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
< 4.0
Mercury
PPM
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
< 5.0
PBB
PPM
<5.0
<5.0
<5.0
--------<5.0
<5.0
<5.0
---------
PBDE
PPM
<5.0
<5.0
<5.0
--------<5.0
<5.0
<5.0
-----------
Analysis Report
(Note2)
CoA-COVT-R
CoA-CART-R
CoA-PLRL-R
CoA-TRAY-R
CoA-SBAG –R
CoA-MBBG-R
CoA-PROB-R
CoA-ABOX-R
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly
100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using
MSDS, Material Analysis Reports and Cypress Assembly sites information
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data
Document No. 001-05023 Rev.*J
Page 5 of 10
119 - PBGA
Pb-Free Package
ASSEMBLY Site 2: PT UNISEM Batam
Package Qualification Report # 073702 (Note 1)
I.
DECLARATION OF PACKAGED UNITS
A. BANNED SUBSTANCES
Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU RoHS. Listed
in the table below are materials that are neither contained nor intentionally added to this product.
Substances / Compounds
Cadmium and Cadmium Compounds
Hexavalent Chromium and its Compounds
Lead and Lead Compounds
Mercury and Mercury Compounds
Polybrominated Biphenyls (PBB)
Polybrominated Diphenylethers (PBDE)
Asbestos
Azo colorants
Ozone Depleting Substances
Polychlorinated Biphenyls (PCBs)
Polychlorinated Napthalenes
Radioactive Substances
Shortchain Chlorinated Paraffins
Tributyl Tin (TBT) and Triphenyl Tin (TPT)
Tributyl Tin Oxide (TBTO)
Formaldehyde
Weight by
mg
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
PPM
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
0
0
0
0
0
0
0
0
0
0
Analysis Report
(Note 2)
CoA-BY119-PT
UNISEM
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly
100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using
MSDS, Material Analysis Reports and Cypress Assembly sites information
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data
Document No. 001-05023 Rev.*J
Page 6 of 10
119 - PBGA
Pb-Free Package
B1. MATERIAL COMPOSITION (Note 3)
Using SAC105 Solder Ball Composition
Material
Substrate
Gold
7440-57-5
1.0418
% weight of
substance per
Homogenous
material
0.3600%
Nickel
7440-02-0
7.3218
Copper
7440-50-8
Solder Mask
Plug epoxy
---------------------------13676-54-5
25722-66-1
65997-17-3
7440-31-5
7440-22-4
7440-50-8
----------------------------9003-36-5
--------------1333-86-4
461-58-5
7440-21-3
7440-57-5
60676-86-0
----------------------------1333-86-4
14808-60-7
---------------
Purpose of
Use
Base Material
Substance
Composition
BT Resin
Solder
Ball
External
Plating
Die
Attach
Adhesive
Die
Wire
Circuit
Interconnect
Mold
Compou
nd
Encapsulation
Fibrous Glass wool
Tin
Silver
Copper
Bismaleimide
Silicon Resin
Epoxy Resin
Diluent
Carbon Black
Dicyandiamide
Silicon
Gold
Fused Silica
Solid Epoxy Resin
Phenol Resin
Carbon Black
Crystalline Silica
Metal Hydro Oxide
CAS Number
Package Weight (mg):
1,089
% weight of
substance
per
package
0.1089
2.5300%
7,656
0.7656
60.0505
20.7500%
62,793
6.2793
50.7897
1.5628
75.3598
17.5500%
0.5400%
26.0400%
53,110
1,634
78,802
5.3110
0.1634
7.8802
93.2736
222.3539
2.2574
1.1287
6.1380
2.5575
1.0230
0.4092
0.0512
0.0512
43.0500
6.7800
362.0640
7.6224
1.9056
3.8112
3.8112
1.9056
32.2300%
98.5000%
1.0000%
0.5000%
60.0000%
25.0000%
10.0000%
4.0000%
0.5000%
0.5000%
100.0000%
100.0000%
95.0000%
2.0000%
0.5000%
1.0000%
1.0000%
0.5000%
97,534
232,510
2,361
1,180
6,418
2,674
1,070
428
53
53
45,016
7,090
378,601
7,971
1,993
3,985
3,985
1,993
9.7534
23.2510
0.2361
0.1180
0.6418
0.2674
0.1070
0.0428
0.0053
0.0053
4.5016
0.7090
37.8601
0.7971
0.1993
0.3985
0.3985
0.1993
Weight by
mg
956.3201
PPM
% Total:
100.0000
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly
100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using
MSDS, Material Analysis Reports and Cypress Assembly sites information
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data
Document No. 001-05023 Rev.*J
Page 7 of 10
119 - PBGA
Pb-Free Package
B2. MATERIAL COMPOSITION (Note 3)
Using SAC405 Solder Ball Composition
Material
Substrate
Purpose of
Use
Base Material
Substance
Composition
External
Plating
Die Attach
Adhesive
Die
Wire
Circuit
Interconnect
Mold
Compound
Encapsulation
% weight of
substance per
Homogenous
material
PPM
% weight of
substance
per
package
Gold
7440-57-5
1.0418
0.3600%
1,098
0.1098
Nickel
7440-02-0
7.3218
2.5300%
7,717
0.7717
Copper
7440-50-8
60.0505
20.7500%
63,289
6.3289
Solder Mask
Plug epoxy
---------------------------13676-54-5
25722-66-1
65997-17-3
7440-31-5
7440-22-4
7440-50-8
----------------------------9003-36-5
--------------1333-86-4
461-58-5
7440-21-3
7440-57-5
60676-86-0
----------------------------1333-86-4
14808-60-7
---------------
50.7897
1.5628
75.3598
17.5500%
0.5400%
26.0400%
53,529
1,647
79,424
5.3529
0.1647
7.9424
93.2736
208.4288
8.7300
1.0913
6.1380
2.5575
1.0230
0.4092
0.0512
0.0512
43.0500
6.7800
362.0640
7.6224
1.9056
3.8112
3.8112
1.9056
32.2300%
95.5000%
4.0000%
0.5000%
60.0000%
25.0000%
10.0000%
4.0000%
0.5000%
0.5000%
100.0000%
100.0000%
95.0000%
2.0000%
0.5000%
1.0000%
1.0000%
0.5000%
98,304
219,669
9,201
1,150
6,469
2,695
1,078
431
54
54
45,372
7,146
381,590
8,033
2,008
4,017
4,017
2,008
9.8304
21.9669
0.9201
0.1150
0.6469
0.2695
0.1078
0.0431
0.0054
0.0054
4.5372
0.7146
38.1590
0.8033
0.2008
0.4017
0.4017
0.2008
BT Resin
Solder Ball
CAS Number
Weight by
mg
Fibrous Glass wool
Tin
Silver
Copper
Bismaleimide
Silicon Resin
Epoxy Resin
Diluent
Carbon Black
Dicyandiamide
Silicon
Gold
Fused Silica
Solid Epoxy Resin
Phenol Resin
Carbon Black
Crystalline Silica
Metal Hydro Oxide
Package Weight (mg):
948.8302
% Total:
100.0000
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly
100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using
MSDS, Material Analysis Reports and Cypress Assembly sites information
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data
Document No. 001-05023 Rev.*J
Page 8 of 10
119 - PBGA
Pb-Free Package
II. DECLARATION OF PACKAGING / INDIRECT MATERIALS
Type
Tape &
Reel
Tray
Others
Material
Cover tape
Carrier tape
Plastic Reel
Tray
Moisture
Barrier Bag
Lead
PPM
< 2.0
< 2.0
< 5.0
< 2.0
<2.0
Cadmiu
m
PPM
< 2.0
< 2.0
< 5.0
< 2.0
<2.0
Cr VI
PPM
Mercury
PPM
< 2.0
< 2.0
< 5.0
< 2.0
<2.0
< 2.0
< 2.0
< 10.0
< 2.0
<2.0
PBB
PPM
PBDE
PPM
< 50.00
< 50.00
<50.0
< 0.0005
<5.0
< 45.00
< 45.00
<45.0
< 0.0005
<5.0
Analysis Report
(Note2)
CoA-COVT-R
CoA-CART-R
CoA-PLRL-R
CoA-TRAY-R
CoA-MBBG –R
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly
100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using
MSDS, Material Analysis Reports and Cypress Assembly sites information
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data
Document No. 001-05023 Rev.*J
Page 9 of 10
119 - PBGA
Pb-Free Package
Document History Page
Document Title:
119-PBGA PB-FREE PACKAGE MATERIAL DECLARATION DATASHEET
Document Number: 001-05023
Rev. ECN No. Orig. of
Change
**
399031
GFJ
*A
2569056 HLR
*B
2597814 LJN
*C
*D
*E
*F
*G
2751570
2768585
2779662
3001245
3734953
*H
4043324 YUM
*I
4088359 YUM
*J
4123120 CMG
HLR
VFR
MAHA
HLR
HLR
Description of Change
New document
Changed Cypress Logo.
Added % weight of substance per Homogenous Material and %
weight of substance per package on the Material Composition
table.
Completed the RoHS Substances namely; Lead Cadmium,
Mercury, Chromium VI, PBB and PBDE on Declaration of
Packaging Indirect Materials table.
Added CAS No. of Bromine.
Correct title on document history page to match title page, DMS
and CMS.
Updated CAS number of Gold (Au)
Added Material Declaration for Site 2 and 3.
Added material declaration for assembly site 4.
Changed reference package QTP report for assembly Site 1.
Updated the material composition tables to reflect 4 decimal places
on values.
Removed the material name for AIT Assembly
Removed Assembly Site 3 and added the material composition
table to Assembly Site 2.
Removed Assembly Site 4 and added the material composition
table to Assembly Site 1.
Added Assembly Site Name in the Assembly heading in site 1 and
2.
Changed Assembly code to Assembly Site Name in site 1 and 2.
Removed entire Tube row in the Indirect Materials section.
Corrected material composition in Site1:B2 from “1092.1402” to
“1092.1404”.
Added material composition for PBGA 119 14x22 package
assembly at ASE, Taiwan using green substrate and Palladiumcoated Copper wire with reference QTP# 131010
Corrected total weight of Assembly Site 1 – B2
Distribution: WEB
Posting:
None
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly
100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using
MSDS, Material Analysis Reports and Cypress Assembly sites information
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data
Document No. 001-05023 Rev.*J
Page 10 of 10