32L - SOIC 300 MILS PB-FREE Package Material Declaration Datasheet.pdf

32L – SOIC 300mils
Pb-Free Package
PACKAGE MATERIAL DECLARATION DATASHEET
Cypress Package Code
Package Weight – Site 1
SZ
B1: 855.9900 mg
B2: 1,116.3653 mg
Body Size (mil/mm)
Package Weight – Site 2
300 mil
B1: 874.4800 mg
B2: 874.4705 mg
SUMMARY
The 32L-SOIC Pb-Free package is compliant to RoHS. Cypress Ordering Part Number containing an “X”
(e.g. CY7C1328G-133AXI, CY2308SXC-1HT) meet the requirements of Directive 2002/95/EC (RoHS).
ASSEMBLY Site 1: Amkor Technology Philippines (P1/P2)
Package Qualification Report #s 070802 / 124706 (Note 1)
I. DECLARATION OF PACKAGED UNITS
A. BANNED SUBSTANCES
Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU
RoHS. Listed in the table below are materials that are neither contained nor intentionally added to this
product.
Substances / Compounds
Cadmium and Cadmium Compounds
Hexavalent Chromium and its Compounds
Lead and Lead Compounds
Mercury and Mercury Compounds
Polybrominated Biphenyls (PBB)
Polybrominated Diphenylethers (PBDE)
Asbestos
Azo colorants
Ozone Depleting Substances
Polychlorinated Biphenyls (PCBs)
Polychlorinated Napthalenes
Radioactive Substances
Shortchain Chlorinated Paraffins
Tributyl Tin (TBT) and Triphenyl Tin (TPT)
Tributyl Tin Oxide (TBTO)
Formaldehyde
Weight by mg
PPM
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
0
0
0
0
0
0
0
0
0
0
Analysis Report
(Note 2)
CoA-SZ32Amkor
Philippines
(P1/P2)
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to
report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material
information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-56713 Rev. *I
Page 1 of 9
32L – SOIC 300mils
Pb-Free Package
B1. MATERIAL COMPOSITION (Note 3)
USING Au WIRE
Material
Purpose of
Use
Lead frame
Base Material
Lead Finish
External Plating
Die Attach
Adhesive
Die
Wire
Circuit
Interconnect
Mold
Compound
Encapsulation
Substance
Composition
CAS Number
Cu
Fe
P
Zn
Ag
Sn
Resin
Ag
Metal Oxide
Amine
Gamma
Butyrolactone
Si
Au
Multi-aromatic
Resin
SiO2 Filler
7440-50-8
7439-89-6
7723-14-0
7440-66-6
7440-22-4
7440-31-5
Trade Secret
7440-22-4
Trade Secret
Trade Secret
Carbon Black
Epoxy Cresol
Novolac
Phenol Resin
Weight by
mg
% weight of
substance per
Homogeneou
s material
PPM
% Weight of
Substance
per package
218.2400
5.2600
0.0700
0.2700
1.3500
5.9100
0.5400
1.8100
0.0800
0.0800
96.9137%
2.3358%
0.0311%
0.1199%
0.5995%
100.0000%
20.8494%
69.8842%
3.0888%
3.0888%
254,956
6,145
82
315
1,577
6,904
631
2,115
94
94
25.4956%
0.6145%
0.0082%
0.0315%
0.1577%
0.6904%
0.0631%
0.2115%
0.0094%
0.0094%
0.0800
3.0888%
94
0.0094%
7440-21-3
7440-57-5
13.0900
1.3500
100.0000%
100.0000%
15,292
1,577
1.5292%
0.1577%
Trade Secret
45.5900
7.5001%
53,260
5.3260%
522.7600
86.0001%
610,708
61.0708%
1333-86-4
3.0400
0.5001%
3,551
0.3551%
29690-82-2
12.1600
2.0004%
14,205
1.4205%
Trade Secret
24.3100
3.9993%
28,400
2.8400%
% Total:
100.0000%
96-48-0
60676-86-0
Package Weight (mg):
855.9900
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to
report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material
information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-56713 Rev. *I
Page 2 of 9
32L – SOIC 300mils
Pb-Free Package
B2. MATERIAL COMPOSITION (Note 3)
USING Cu WIRE
Material
Lead frame
Lead Finish
Die Attach
Die
Wire
Purpose of
Use
Base Material
External
Plating
Adhesive
Circuit
Interconnect
Mold
Compound
Encapsulation
Copper (Cu)
Iron (Fe)
Zinc (Z)
Phosphorus (P)
Silver (Ag)
7440-50-8
7439-89-6
7440-66-6
7723-14-0
7440-22-4
247.2072
6.0882
0.3044
0.0761
0.6007
% weight of
substance per
Homogenous
material
97.2199
2.3943
0.1197
0.0299
0.2362
Tin (Sn)
7440-31-5
5.9120
100.0000
5,295
0.5295
Trade Secret
Trade Secret
7440-22-4
Trade Secret
0.0520
0.0297
0.5723
0.0297
7.0000
4.0000
77.0000
4.0000
47
27
513
27
0.0047
0.0027
0.0513
0.0027
Trade Secret
0.0297
4.0000
27
0.0027
Trade Secret
0.0297
4.0000
27
0.0027
7440-21-3
7440-50-8
1.0659
0.2744
100.0000
100.0000
954
245
0.0954
0.0245
Substance
Composition
Epoxy Resin A
Epoxy Resin B
Silver (Ag)
Lactone
Polyoxypropylenedi
amine
2,6-Diglycidyl
phenyl allyl ether
oligomer
Silicon
Copper (Cu)
Multi-aromatic
Resin
SiO2 Filler
Carbon Black
Epoxy Cresol
Novolac
Phenol Resin
CAS Number
Weight by mg
% weight of
substance per
package
PPM
221,439
5,454
273
68
538
22.1439
0.5454
0.0273
0.0068
0.0538
Trade Secret
64.0570
7.5000
57,380
5.738
60676-86-0
1333-86-4
734.5202
4.2705
86.0000
0.5000
657,957
3,825
65.7957
0.3825
Trade Secret
17.0819
2.0000
15,301
1.5301
Trade Secret
34.1637
4.0000
30,603
3.0603
Package Weight (mg):
1,116.3653
% Total:
100.0000
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to
report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material
information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-56713 Rev. *I
Page 3 of 9
32L – SOIC 300mils
Pb-Free Package
II. DECLARATION OF PACKAGING INDIRECT MATERIALS
Type
Tube
Tape and
Reel
Others
Material
Plastic Tube
End Plug
Carrier Tape
Moisture Barrier
Bag
Dessicant
HIC
Bubble Pack
Carton Label
Inner Label
Shielding Bag
Lead
PPM
<5.0
<5.0
<5.0
Cadmium
PPM
<5.0
<5.0
<5.0
Cr VI
PPM
<5.0
<5.0
<5.0
Mercury
PPM
<5.0
<5.0
<5.0
PBB
PPM
<5.0
<5.0
<5.0
PBDE
PPM
<5.0
<5.0
<5.0
Analysis Report
(Note2)
CoA-PLTB-R
CoA-EPLG-R
CoA-CART-R
<5.0
<5.0
<5.0
<5.0
<5.0
<5.0
CoA-MBBG-R
<5.0
<5.0
<5.0
<10.0
<10.0
<5.0
<5.0
<5.0
<5.0
<5.0
<5.0
< 5.0
<5.0
<5.0
<5.0
<5.0
<5.0
< 5.0
<5.0
<5.0
<5.0
<5.0
<5.0
< 5.0
<5.0
<5.0
<10.0
<5.0
<5.0
< 5.0
<5.0
<5.0
<10.0
<5.0
<5.0
< 5.0
CoA-DESS-R
CoA-HIC-R
CoA-BUBB-R
CoA-CRTN-R
CoA-LBL-R
CoA-SBAG-R
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to
report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material
information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-56713 Rev. *I
Page 4 of 9
32L – SOIC 300mils
Pb-Free Package
***
ASSEMBLY Site 2: UTAC Thailand Limited (UTL)
Package Qualification Report # 153004, 153005 (Note 1)
I. DECLARATION OF PACKAGED UNITS
A. BANNED SUBSTANCES
Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU
RoHS. Listed in the table below are materials that are neither contained nor intentionally added to this
product.
Substances / Compounds
Cadmium and Cadmium Compounds
Hexavalent Chromium and its Compounds
Lead and Lead Compounds
Mercury and Mercury Compounds
Polybrominated Biphenyls (PBB)
Polybrominated Diphenylethers (PBDE)
Asbestos
Azo colorants
Ozone Depleting Substances
Polychlorinated Biphenyls (PCBs)
Polychlorinated Napthalenes
Radioactive Substances
Shortchain Chlorinated Paraffins
Tributyl Tin (TBT) and Triphenyl Tin (TPT)
Tributyl Tin Oxide (TBTO)
Formaldehyde
Weight by mg
PPM
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
0
0
0
0
0
0
0
0
0
0
Analysis Report
(Note 2)
CoA-SZ323UTAC Thailand
Limited (UTL)
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to
report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material
information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-56713 Rev. *I
Page 5 of 9
32L – SOIC 300mils
Pb-Free Package
B1. MATERIAL COMPOSITION (Note 3)
USING Au WIRE
Material
Lead frame
Lead Finish
Die Attach
Iron
7439-89-6
9.2300
2.1900%
1
% Weight
of
Substance
per
package
1.0600%
Phosphrus
7723-14-0
0.3100
0.0700%
0
0.0400%
Zinc
7440-66-6
0.4700
0.1100%
0
0.0500%
Copper
7440-50-8
385.6000
91.3300%
44
44.0900%
Silver
7440-22-4
26.6000
6.3000%
3
3.0400%
Sn
7440-22-4
0.1200
100.0000%
0
0.0100%
Silver
7440-22-4
1.5135
81.5000%
0
0.1731%
(Octahydro-4,
7-methano-1 Hindenediyl)
bis(methylene)
diacrylate
42594-17-2
0.1114
6.0000%
0
0.0127%
exo-1,7,7trimethylbicyclo[2.2.1]
hept-2-yl methacrylate
7534-94-3
0.1114
6.0000%
0
0.0127%
Isobornyl acrylate
5888-33-5
0.1114
6.0000%
0
0.0127%
Bis(.alpha.,.alpha.Dimethylbenzyl)
peroxide
80-43-3
0.0093
0.5000%
0
0.0110%
Purpose of
Use
Base Material
External
Plating
Adhesive
Substance
Composition
CAS
Number
Weight
by mg
% weight of
substance per
Homogeneous
material
PPM
Die
Circuit
Si
7440-21-3
4.3330
100.0000%
0
0.5000%
Wire
Interconnect
Au
0.0000
100.0000%
0
0.0034%
11.1500
2.5000%
1
1.2700%
11.1500
2.5000%
1
1.2700%
11.1500
2.5000%
1
1.2700%
Carbon Black
7440-57-5
Trade
secret
Trade
Secret
Trade
secret
1333-86-4
0.4500
0.1000%
0
0.0500%
Silica Fused
60676-86-0
412.0600
92.4000%
47
47.1200%
Epoxy Resin A
Epoxy Resin B
Mold
Compound
Encapsulation
Phenol Resin
Package Weight (mg):
874.4800
% Total:
100.0000%
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to
report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material
information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-56713 Rev. *I
Page 6 of 9
32L – SOIC 300mils
Pb-Free Package
B2. MATERIAL COMPOSITION (Note 3)
USING Cu WIRE
Material
Lead frame
Lead Finish
Die Attach
Iron
7439-89-6
9.2316
2.1865%
1
% Weight
of
Substance
per
package
1.0556%
Phosphrus
7723-14-0
0.3082
0.0730%
0
0.0352%
Zinc
7440-66-6
0.4750
0.1125%
0
0.0543%
Copper
7440-50-8
385.5969
91.3280%
44
44.0934%
Silver
7440-22-4
26.5993
6.3000%
3
3.0417%
Sn
7440-22-4
0.1200
100.0000%
0
0.0137%
Silver
7440-22-4
1.5135
81.5000%
0
0.1731%
(Octahydro-4,
7-methano-1 Hindenediyl)
bis(methylene)
diacrylate
42594-17-2
0.1114
6.0000%
0
0.0127%
exo-1,7,7trimethylbicyclo[2.2.1]
hept-2-yl methacrylate
7534-94-3
0.1114
6.0000%
0
0.0127%
Isobornyl acrylate
5888-33-5
0.1114
6.0000%
0
0.0127%
Bis(.alpha.,.alpha.Dimethylbenzyl)
peroxide
80-43-3
0.0093
0.5000%
0
0.0011%
Purpose of
Use
Base Material
External
Plating
Adhesive
Substance
Composition
CAS
Number
Weight
by mg
% weight of
substance per
Homogeneous
material
PPM
Die
Circuit
Si
7440-21-3
4.3330
100.0000%
0
0.4955%
Wire
Interconnect
Cu
0.0005
100.0000%
0
0.0034%
11.1487
2.5000%
1
1.2749%
11.1487
2.5000%
1
1.2749%
11.1487
2.5000%
1
1.2749%
Carbon Black
7440-05-3
Trade
secret
Trade
Secret
Trade
secret
1333-86-4
0.4459
0.1000%
0
0.0510%
Silica Fused
60676-86-0
412.0569
92.4000%
47
47.1191%
Epoxy Resin A
Epoxy Resin B
Mold
Compound
Encapsulation
Phenol Resin
Package Weight (mg):
874.4705
% Total:
100.0000%
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to
report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material
information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-56713 Rev. *I
Page 7 of 9
32L – SOIC 300mils
Pb-Free Package
II. DECLARATION OF PACKAGING INDIRECT MATERIALS
Type
Tube
Tape and
Reel
Others
Material
Plastic Tube
End Plug
Carrier Tape
Moisture Barrier
Bag
Dessicant
HIC
Bubble Pack
Carton Label
Inner Label
Shielding Bag
Lead
PPM
<5.0
<5.0
<5.0
Cadmium
PPM
<5.0
<5.0
<5.0
Cr VI
PPM
<5.0
<5.0
<5.0
Mercury
PPM
<5.0
<5.0
<5.0
PBB
PPM
<5.0
<5.0
<5.0
PBDE
PPM
<5.0
<5.0
<5.0
Analysis Report
(Note2)
CoA-PLTB-R
CoA-EPLG-R
CoA-CART-R
<5.0
<5.0
<5.0
<5.0
<5.0
<5.0
CoA-MBBG-R
<5.0
<5.0
<5.0
<10.0
<10.0
<5.0
<5.0
<5.0
<5.0
<5.0
<5.0
< 5.0
<5.0
<5.0
<5.0
<5.0
<5.0
< 5.0
<5.0
<5.0
<5.0
<5.0
<5.0
< 5.0
<5.0
<5.0
<10.0
<5.0
<5.0
< 5.0
<5.0
<5.0
<10.0
<5.0
<5.0
< 5.0
CoA-DESS-R
CoA-HIC-R
CoA-BUBB-R
CoA-CRTN-R
CoA-LBL-R
CoA-SBAG-R
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to
report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material
information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-56713 Rev. *I
Page 8 of 9
32L – SOIC 300mils
Pb-Free Package
Document History Page
Document Title:
Document Number:
Rev.
32L - SOIC 300 MILS PB-FREE PACKAGE MATERIAL DECLARATION
DATASHEET
001-56713
**
*A
*B
*C
ECN No. Orig. of
Change
2771965 MAHA
2823411 MAHA
3042785 MAHA
3420294 MAHA
*D
3770961 JARG
*E
3925886 VFR
*F
4056672 YUM
*G
*H
4185000 HLR
5007167 MRB
DCON
*I
5142219 DEST
Description of Change
New specification.
Added the CAS number of Sn.
Corrected the CAS number of Cu.
Expressed the weight by mg, package weight, % weight
of substance per Homogeneous material, and % weight
of substance per package in four decimal places.
Fix Material Composition Table.
Corrected computation to meet 100.0000% Weight of
Substance per Package.
Added B.2 for Site 1: Amkor-M Copper wire qualification,
reference QTP # 124706
Added assembly site name in the assembly heading.
Changed assembly code to assembly site name.
Changed the CAS number of Silver (Ag) for Die Attach.
Changed CAS # from Proprietary to Trade Secret on
Assy site 1_B1 and “---------“ to Trade Secret on Assy site
1_B2
Removed distribution and posting from the document
history page.
Added UTAC Thailand Limited (UTL) for Assembly Site 2
using Au wire and using Cu wire
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to
report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material
information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-56713 Rev. *I
Page 9 of 9