32L – SOIC 300mils Pb-Free Package PACKAGE MATERIAL DECLARATION DATASHEET Cypress Package Code Package Weight – Site 1 SZ B1: 855.9900 mg B2: 1,116.3653 mg Body Size (mil/mm) Package Weight – Site 2 300 mil B1: 874.4800 mg B2: 874.4705 mg SUMMARY The 32L-SOIC Pb-Free package is compliant to RoHS. Cypress Ordering Part Number containing an “X” (e.g. CY7C1328G-133AXI, CY2308SXC-1HT) meet the requirements of Directive 2002/95/EC (RoHS). ASSEMBLY Site 1: Amkor Technology Philippines (P1/P2) Package Qualification Report #s 070802 / 124706 (Note 1) I. DECLARATION OF PACKAGED UNITS A. BANNED SUBSTANCES Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU RoHS. Listed in the table below are materials that are neither contained nor intentionally added to this product. Substances / Compounds Cadmium and Cadmium Compounds Hexavalent Chromium and its Compounds Lead and Lead Compounds Mercury and Mercury Compounds Polybrominated Biphenyls (PBB) Polybrominated Diphenylethers (PBDE) Asbestos Azo colorants Ozone Depleting Substances Polychlorinated Biphenyls (PCBs) Polychlorinated Napthalenes Radioactive Substances Shortchain Chlorinated Paraffins Tributyl Tin (TBT) and Triphenyl Tin (TPT) Tributyl Tin Oxide (TBTO) Formaldehyde Weight by mg PPM 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 0 0 0 0 0 0 0 0 0 0 Analysis Report (Note 2) CoA-SZ32Amkor Philippines (P1/P2) As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-56713 Rev. *I Page 1 of 9 32L – SOIC 300mils Pb-Free Package B1. MATERIAL COMPOSITION (Note 3) USING Au WIRE Material Purpose of Use Lead frame Base Material Lead Finish External Plating Die Attach Adhesive Die Wire Circuit Interconnect Mold Compound Encapsulation Substance Composition CAS Number Cu Fe P Zn Ag Sn Resin Ag Metal Oxide Amine Gamma Butyrolactone Si Au Multi-aromatic Resin SiO2 Filler 7440-50-8 7439-89-6 7723-14-0 7440-66-6 7440-22-4 7440-31-5 Trade Secret 7440-22-4 Trade Secret Trade Secret Carbon Black Epoxy Cresol Novolac Phenol Resin Weight by mg % weight of substance per Homogeneou s material PPM % Weight of Substance per package 218.2400 5.2600 0.0700 0.2700 1.3500 5.9100 0.5400 1.8100 0.0800 0.0800 96.9137% 2.3358% 0.0311% 0.1199% 0.5995% 100.0000% 20.8494% 69.8842% 3.0888% 3.0888% 254,956 6,145 82 315 1,577 6,904 631 2,115 94 94 25.4956% 0.6145% 0.0082% 0.0315% 0.1577% 0.6904% 0.0631% 0.2115% 0.0094% 0.0094% 0.0800 3.0888% 94 0.0094% 7440-21-3 7440-57-5 13.0900 1.3500 100.0000% 100.0000% 15,292 1,577 1.5292% 0.1577% Trade Secret 45.5900 7.5001% 53,260 5.3260% 522.7600 86.0001% 610,708 61.0708% 1333-86-4 3.0400 0.5001% 3,551 0.3551% 29690-82-2 12.1600 2.0004% 14,205 1.4205% Trade Secret 24.3100 3.9993% 28,400 2.8400% % Total: 100.0000% 96-48-0 60676-86-0 Package Weight (mg): 855.9900 Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-56713 Rev. *I Page 2 of 9 32L – SOIC 300mils Pb-Free Package B2. MATERIAL COMPOSITION (Note 3) USING Cu WIRE Material Lead frame Lead Finish Die Attach Die Wire Purpose of Use Base Material External Plating Adhesive Circuit Interconnect Mold Compound Encapsulation Copper (Cu) Iron (Fe) Zinc (Z) Phosphorus (P) Silver (Ag) 7440-50-8 7439-89-6 7440-66-6 7723-14-0 7440-22-4 247.2072 6.0882 0.3044 0.0761 0.6007 % weight of substance per Homogenous material 97.2199 2.3943 0.1197 0.0299 0.2362 Tin (Sn) 7440-31-5 5.9120 100.0000 5,295 0.5295 Trade Secret Trade Secret 7440-22-4 Trade Secret 0.0520 0.0297 0.5723 0.0297 7.0000 4.0000 77.0000 4.0000 47 27 513 27 0.0047 0.0027 0.0513 0.0027 Trade Secret 0.0297 4.0000 27 0.0027 Trade Secret 0.0297 4.0000 27 0.0027 7440-21-3 7440-50-8 1.0659 0.2744 100.0000 100.0000 954 245 0.0954 0.0245 Substance Composition Epoxy Resin A Epoxy Resin B Silver (Ag) Lactone Polyoxypropylenedi amine 2,6-Diglycidyl phenyl allyl ether oligomer Silicon Copper (Cu) Multi-aromatic Resin SiO2 Filler Carbon Black Epoxy Cresol Novolac Phenol Resin CAS Number Weight by mg % weight of substance per package PPM 221,439 5,454 273 68 538 22.1439 0.5454 0.0273 0.0068 0.0538 Trade Secret 64.0570 7.5000 57,380 5.738 60676-86-0 1333-86-4 734.5202 4.2705 86.0000 0.5000 657,957 3,825 65.7957 0.3825 Trade Secret 17.0819 2.0000 15,301 1.5301 Trade Secret 34.1637 4.0000 30,603 3.0603 Package Weight (mg): 1,116.3653 % Total: 100.0000 Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-56713 Rev. *I Page 3 of 9 32L – SOIC 300mils Pb-Free Package II. DECLARATION OF PACKAGING INDIRECT MATERIALS Type Tube Tape and Reel Others Material Plastic Tube End Plug Carrier Tape Moisture Barrier Bag Dessicant HIC Bubble Pack Carton Label Inner Label Shielding Bag Lead PPM <5.0 <5.0 <5.0 Cadmium PPM <5.0 <5.0 <5.0 Cr VI PPM <5.0 <5.0 <5.0 Mercury PPM <5.0 <5.0 <5.0 PBB PPM <5.0 <5.0 <5.0 PBDE PPM <5.0 <5.0 <5.0 Analysis Report (Note2) CoA-PLTB-R CoA-EPLG-R CoA-CART-R <5.0 <5.0 <5.0 <5.0 <5.0 <5.0 CoA-MBBG-R <5.0 <5.0 <5.0 <10.0 <10.0 <5.0 <5.0 <5.0 <5.0 <5.0 <5.0 < 5.0 <5.0 <5.0 <5.0 <5.0 <5.0 < 5.0 <5.0 <5.0 <5.0 <5.0 <5.0 < 5.0 <5.0 <5.0 <10.0 <5.0 <5.0 < 5.0 <5.0 <5.0 <10.0 <5.0 <5.0 < 5.0 CoA-DESS-R CoA-HIC-R CoA-BUBB-R CoA-CRTN-R CoA-LBL-R CoA-SBAG-R Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-56713 Rev. *I Page 4 of 9 32L – SOIC 300mils Pb-Free Package *** ASSEMBLY Site 2: UTAC Thailand Limited (UTL) Package Qualification Report # 153004, 153005 (Note 1) I. DECLARATION OF PACKAGED UNITS A. BANNED SUBSTANCES Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU RoHS. Listed in the table below are materials that are neither contained nor intentionally added to this product. Substances / Compounds Cadmium and Cadmium Compounds Hexavalent Chromium and its Compounds Lead and Lead Compounds Mercury and Mercury Compounds Polybrominated Biphenyls (PBB) Polybrominated Diphenylethers (PBDE) Asbestos Azo colorants Ozone Depleting Substances Polychlorinated Biphenyls (PCBs) Polychlorinated Napthalenes Radioactive Substances Shortchain Chlorinated Paraffins Tributyl Tin (TBT) and Triphenyl Tin (TPT) Tributyl Tin Oxide (TBTO) Formaldehyde Weight by mg PPM 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 0 0 0 0 0 0 0 0 0 0 Analysis Report (Note 2) CoA-SZ323UTAC Thailand Limited (UTL) As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-56713 Rev. *I Page 5 of 9 32L – SOIC 300mils Pb-Free Package B1. MATERIAL COMPOSITION (Note 3) USING Au WIRE Material Lead frame Lead Finish Die Attach Iron 7439-89-6 9.2300 2.1900% 1 % Weight of Substance per package 1.0600% Phosphrus 7723-14-0 0.3100 0.0700% 0 0.0400% Zinc 7440-66-6 0.4700 0.1100% 0 0.0500% Copper 7440-50-8 385.6000 91.3300% 44 44.0900% Silver 7440-22-4 26.6000 6.3000% 3 3.0400% Sn 7440-22-4 0.1200 100.0000% 0 0.0100% Silver 7440-22-4 1.5135 81.5000% 0 0.1731% (Octahydro-4, 7-methano-1 Hindenediyl) bis(methylene) diacrylate 42594-17-2 0.1114 6.0000% 0 0.0127% exo-1,7,7trimethylbicyclo[2.2.1] hept-2-yl methacrylate 7534-94-3 0.1114 6.0000% 0 0.0127% Isobornyl acrylate 5888-33-5 0.1114 6.0000% 0 0.0127% Bis(.alpha.,.alpha.Dimethylbenzyl) peroxide 80-43-3 0.0093 0.5000% 0 0.0110% Purpose of Use Base Material External Plating Adhesive Substance Composition CAS Number Weight by mg % weight of substance per Homogeneous material PPM Die Circuit Si 7440-21-3 4.3330 100.0000% 0 0.5000% Wire Interconnect Au 0.0000 100.0000% 0 0.0034% 11.1500 2.5000% 1 1.2700% 11.1500 2.5000% 1 1.2700% 11.1500 2.5000% 1 1.2700% Carbon Black 7440-57-5 Trade secret Trade Secret Trade secret 1333-86-4 0.4500 0.1000% 0 0.0500% Silica Fused 60676-86-0 412.0600 92.4000% 47 47.1200% Epoxy Resin A Epoxy Resin B Mold Compound Encapsulation Phenol Resin Package Weight (mg): 874.4800 % Total: 100.0000% Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-56713 Rev. *I Page 6 of 9 32L – SOIC 300mils Pb-Free Package B2. MATERIAL COMPOSITION (Note 3) USING Cu WIRE Material Lead frame Lead Finish Die Attach Iron 7439-89-6 9.2316 2.1865% 1 % Weight of Substance per package 1.0556% Phosphrus 7723-14-0 0.3082 0.0730% 0 0.0352% Zinc 7440-66-6 0.4750 0.1125% 0 0.0543% Copper 7440-50-8 385.5969 91.3280% 44 44.0934% Silver 7440-22-4 26.5993 6.3000% 3 3.0417% Sn 7440-22-4 0.1200 100.0000% 0 0.0137% Silver 7440-22-4 1.5135 81.5000% 0 0.1731% (Octahydro-4, 7-methano-1 Hindenediyl) bis(methylene) diacrylate 42594-17-2 0.1114 6.0000% 0 0.0127% exo-1,7,7trimethylbicyclo[2.2.1] hept-2-yl methacrylate 7534-94-3 0.1114 6.0000% 0 0.0127% Isobornyl acrylate 5888-33-5 0.1114 6.0000% 0 0.0127% Bis(.alpha.,.alpha.Dimethylbenzyl) peroxide 80-43-3 0.0093 0.5000% 0 0.0011% Purpose of Use Base Material External Plating Adhesive Substance Composition CAS Number Weight by mg % weight of substance per Homogeneous material PPM Die Circuit Si 7440-21-3 4.3330 100.0000% 0 0.4955% Wire Interconnect Cu 0.0005 100.0000% 0 0.0034% 11.1487 2.5000% 1 1.2749% 11.1487 2.5000% 1 1.2749% 11.1487 2.5000% 1 1.2749% Carbon Black 7440-05-3 Trade secret Trade Secret Trade secret 1333-86-4 0.4459 0.1000% 0 0.0510% Silica Fused 60676-86-0 412.0569 92.4000% 47 47.1191% Epoxy Resin A Epoxy Resin B Mold Compound Encapsulation Phenol Resin Package Weight (mg): 874.4705 % Total: 100.0000% Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-56713 Rev. *I Page 7 of 9 32L – SOIC 300mils Pb-Free Package II. DECLARATION OF PACKAGING INDIRECT MATERIALS Type Tube Tape and Reel Others Material Plastic Tube End Plug Carrier Tape Moisture Barrier Bag Dessicant HIC Bubble Pack Carton Label Inner Label Shielding Bag Lead PPM <5.0 <5.0 <5.0 Cadmium PPM <5.0 <5.0 <5.0 Cr VI PPM <5.0 <5.0 <5.0 Mercury PPM <5.0 <5.0 <5.0 PBB PPM <5.0 <5.0 <5.0 PBDE PPM <5.0 <5.0 <5.0 Analysis Report (Note2) CoA-PLTB-R CoA-EPLG-R CoA-CART-R <5.0 <5.0 <5.0 <5.0 <5.0 <5.0 CoA-MBBG-R <5.0 <5.0 <5.0 <10.0 <10.0 <5.0 <5.0 <5.0 <5.0 <5.0 <5.0 < 5.0 <5.0 <5.0 <5.0 <5.0 <5.0 < 5.0 <5.0 <5.0 <5.0 <5.0 <5.0 < 5.0 <5.0 <5.0 <10.0 <5.0 <5.0 < 5.0 <5.0 <5.0 <10.0 <5.0 <5.0 < 5.0 CoA-DESS-R CoA-HIC-R CoA-BUBB-R CoA-CRTN-R CoA-LBL-R CoA-SBAG-R Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-56713 Rev. *I Page 8 of 9 32L – SOIC 300mils Pb-Free Package Document History Page Document Title: Document Number: Rev. 32L - SOIC 300 MILS PB-FREE PACKAGE MATERIAL DECLARATION DATASHEET 001-56713 ** *A *B *C ECN No. Orig. of Change 2771965 MAHA 2823411 MAHA 3042785 MAHA 3420294 MAHA *D 3770961 JARG *E 3925886 VFR *F 4056672 YUM *G *H 4185000 HLR 5007167 MRB DCON *I 5142219 DEST Description of Change New specification. Added the CAS number of Sn. Corrected the CAS number of Cu. Expressed the weight by mg, package weight, % weight of substance per Homogeneous material, and % weight of substance per package in four decimal places. Fix Material Composition Table. Corrected computation to meet 100.0000% Weight of Substance per Package. Added B.2 for Site 1: Amkor-M Copper wire qualification, reference QTP # 124706 Added assembly site name in the assembly heading. Changed assembly code to assembly site name. Changed the CAS number of Silver (Ag) for Die Attach. Changed CAS # from Proprietary to Trade Secret on Assy site 1_B1 and “---------“ to Trade Secret on Assy site 1_B2 Removed distribution and posting from the document history page. Added UTAC Thailand Limited (UTL) for Assembly Site 2 using Au wire and using Cu wire Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-56713 Rev. *I Page 9 of 9