P4 ! #$ &-#())./01203 % & ' ())* +#* )(4 &-#())./(-203 )(5 % +#* , -0 Dimensions in mm Heatsink For stud devices P4 Features 1 & - ' ()1 ,# 28-10-2004 SCT © by SEMIKRON P4 Fig.1 Thermal resistance vs.dissipated power, natural cooling Fig.2a Thermal resistance per component vs.length, natural cooling Fig.2b Thermal resistance per component vs.length, natural cooling Fig.2c Thermal resistance per component vs.length, natural cooling Fig.2d Thermal resistance per component vs.length, natural cooling Fig.9 Transient thermal impedance vs.time 2 28-10-2004 SCT © by SEMIKRON P4 Dimensions in mm 0 2 -2 # 12 , & -#()) , Dimensions in mm ( 2 (2 # 62 , & -#-)) , 3 28-10-2004 SCT © by SEMIKRON