INTEGRATED CIRCUITS NE1619 HECETA4 Temperature and voltage monitor Product data sheet Supersedes data of 2004 May 10 2004 Oct 05 Philips Semiconductors Product data sheet HECETA4 Temperature and voltage monitor NE1619 FEATURES • Monitor local and remote temperatures • Temperature accuracy of ±2 °C for local, and ±3 °C for remote channel • Temperature resolution of 1 °C • 2.8 V to 5.5 V supply range • Monitor different power supplies: 12 V, 5 V, 3.3 V, 2.5 V, VCCP, VDD • VIN accuracy of ±2% of full scale • Differential non-linearity of ±1LSB • No calibration required • Programmable temperature and voltage limits for alarms • Programmable Reset low state pulse output • SMBus 2-wire serial interface • Small 16-lead SSOP (QSOP) package • Compatible with Intel “Heceta 4” specification and reference GENERAL DESCRIPTION The NE1619 is designed for monitoring the temperatures and supply voltages of microprocessor-based systems by measuring those parameters and comparing the readings with programmable limits. The device provides five possible analog inputs, a remote temperature sensor input and on-board local temperature sensor. The device also monitors its own power supply and provides digital inputs for the Pentium/PRO power supply ID code. The device communicates with the system controller via an SMBus (System Management bus) by which it can be programmed for operation and data collection. Readings come from conversions of the on-board A-to-D converter which cycles through all measurements in sequence in approximately one second when the conversion is started. The device includes a number of registers to store data of the device configuration, status, readings and limits. Except for the temperature-related data which are in 8-bit digital 2’s complement format, all the data are in 8-bit digital straight format. designs utilizing it • ESD protection exceeds 2000 V HBM per JESD22-A114, 250 V MM per JESD22-A115 and 1000 V CDM per JESD22-C101 • Latch-up testing is done to JESDEC Standard JESD78 which exceeds 100 mA APPLICATIONS • System thermal and hardware monitor • Desktop computers • Notebook computers • Industrial controllers • Telecom equipment ORDERING INFORMATION Tamb = 0 °C to +125 °C Type number NE1619DS Topside mark NE1619 Package Name Description Version SSOP16 (QSOP) plastic shrink small outline package; 16 leads; body width 3.9 mm; lead pitch 0.635 mm SOT519-1 Standard packing quantities and other packaging data are available at www.standardproducts.philips.com/packaging. 2004 Oct 05 2 Philips Semiconductors Product data sheet HECETA4 Temperature and voltage monitor NE1619 PINNING Pin Configuration SDA 1 16 A0/RESET/NTEST_OUT SCL 2 15 VCCPVIN GND 3 14 2.5VIN VDD/3.3VSB 4 13 3.3VIN VID0 5 12 5VIN VID1 6 11 12VIN/VID4 VID2 7 10 D+ VID3 8 9 D–/NTEST_IN SL01228 Figure 1. Pin configuration Pin Description PIN # SYMBOL FUNCTION DESCRIPTION 1 SDA Digital I/O. SMBus serial bi-directional data. Open-drain output. 2 SCL Digital Input. SMBus serial clock input. 3 GND Ground. To be connected to system ground. 4 VDD/3.3VSB Power supply. Can be connected to +3.3 V standby power if monitoring in low power states is required. This pin also serves as the analog input to monitor the VDD voltage level. 5 VID0 Digital Input. For Voltage ID readouts from the processor. This value is read into the VID status register (LSB bit). 6 VID1 Digital Input. For Voltage ID readouts from the processor. This value is read into the VID status register. 7 VID2 Digital Input. For Voltage ID readouts from the processor. This value is read into the VID status register. 8 VID3 Digital Input. For Voltage ID readouts from the processor. This value is read into the VID status register. 9 D–/NTEST_IN Analog/Digital Input. This pin is connected to the negative terminal of the remote temperature sensor for analog input. If this pin is held high at power-up, for digital input, it enables the NAND-TREE test mode. 10 D+ 11 12VIN/VID4 Analog Input. This pin is connected to the positive terminal of the remote temperature sensor. Analog/Digital Input. Defaults at power-up to analog input for monitoring the +12 V supply. This pin is programmable to be a digital input for voltage ID readouts from the processor. Its state is read into the VID4 status register. 12 5VIN 13 3.3VIN Analog Input. For monitoring the +3.3 V supply. 14 2.5VIN Analog Input. For monitoring the +2.5 V supply. 15 VCCPVIN 16 A0/RESET/NTEST_OUT 2004 Oct 05 Analog Input. For monitoring the +5 V supply. Analog Input. For monitoring the processor voltage supply (0 to 3.0 V) Digital I/O. At power-up, the logic input of this pin defines the LSB bit of the device slave address. This pin can be configured to give a low pulse reset output of 20ms minimum. This pin also functions as the output in the NAND–TREE test mode. 3 Philips Semiconductors Product data sheet HECETA4 Temperature and voltage monitor NE1619 FUNCTIONAL BLOCK DIAGRAM NE1619 D+ D-/ NTEST_IN Address Decoder and Register Local Temp Sensor Control Logic Configuration Register Command Pointer Register Temp Mux Local Temp RDG Register Local Temp HL Register Local Temp LL Register Status Register 1 A-to-D Converter Remote Temp RDG Register Remote Temp HL Register Remote Temp LL Register Status Register 2 Voltage Mux VDD Reading Register VDD HL Register VDD LL Register Company # Register VCCP Reading Register VCCP HL Register VCCP LL Register Step Version Register 2.5 V Reading Register 2.5 V HL Register 2.5 V LL Register Test Register 3.3 V Reading Register 3.3 V HL Register 3.3 V LL Register Reset Pulse Circuit Switch 5 V Reading Register 5 V HL Register 5 V LL Register VID 0-3 Register Vid4 Register 12 V Reading Register 12 V HL Register 12 V LL Register A0/ RESET/ NTEST_OUT GND VDD VCCVIN 2.5 VIN VIN Attenuators 3.3 VIN 5 VIN 12 VIN/ VID4 NTEST Circuit SMBus Interface SCL SDA SL01229 Figure 2. Functional block diagram 2004 Oct 05 VID3 VID2 VID1 VID0 4 Philips Semiconductors Product data sheet HECETA4 Temperature and voltage monitor NE1619 TYPICAL APPLICATION CIRCUIT Remote Sensor VDD 0.1 µF 10 kΩ 10 kΩ 100 kΩ 4 Ground VDD/3.3VSB µP On-Board PNP Transistor SMBus SCL 10 D+ SDA 2 1 CLOCK DATA See Note 1 9 D– A0/RESET/ 16 NTEST_OUT or Discrete NPN Transistor NE1619 System Power Supplies VCCP 15 2.5 V 14 13 3.3 V 12 5.0 V VCCPVIN Processor Voltage ID Code VID0 2.5VIN VID1 3.3VIN VID2 5VIN VID3 5 6 7 8 12.0 V 11 Selectable A0/RESET/NTEST_OUT VID0 VID1 VID2 VID3 VID4 12VIN/VID4 GND 3 Ground SL01230 NOTE: 1. Should be placed close to D+ and D– pins. May be required in noisy environment, about 1 nF. Figure 3. Typical application circuit ABSOLUTE MAXIMUM RATINGS PARAMETER MIN. MAX. UNIT VDD to GND –0.3 6 V 12VIN to GND –0.3 18 V 5VIN, 3.3VIN, 2.5VIN, VCCP to GND –0.3 6 V Other pins to GND –0.3 VDD+0.3 V Input current at any pin –5 5 mA Package input current –20 20 mA 0 +125 °C – +150 °C –65 +150 °C Operating temperature range Maximum junction temperature Storage temperature range 2004 Oct 05 5 Philips Semiconductors Product data sheet HECETA4 Temperature and voltage monitor NE1619 20 100 15 80 5 from D+ pin to GND Stdby Supply Current (uA) Remote Temp Error(deg. C) 10 0 –5 –10 from D+ pin to VDD –15 –20 –25 –30 60 40 20 0 1 10 100 0 1 2 Leakage Resistance (Mohm) 3 4 5 6 Supply Voltage (V) SL01245 SL01243 Figure 4. Temp Error versus PC Board Leakage Resistance Figure 6. Standby Current versus Supply Voltage 50 0 –1 40 –3 Stdby Supply Current (uA) Temperature Error (deg. C) –2 –4 –5 –6 –7 –8 –9 –10 1 2.2 3.3 4.7 6.8 10 22 33 47 VDD = 5.0 V 30 VDD = 3.8 V VDD = 3.3 V 20 VDD = 2.8 V 10 0 –50 D+ to D– Capacitance (nF) –25 0 25 50 75 100 125 Temperatures (deg. C) SL01242 SL01244 Figure 5. Temp Error versus D+D– Capacitance 2004 Oct 05 Figure 7. Standby Current versus Temperature 6 Philips Semiconductors Product data sheet HECETA4 Temperature and voltage monitor NE1619 250 10 9 Temperature Error (deg. C) Stdby Supply Current (uA) 200 150 VDD = 5 V 100 50 VDD = 3.3 V 6 5 4 3 2 1 0 –1 1k 0 1k 10 k 100 k NOISE=10MVP–P SQ.WAVE APPLIED BETWEEN D+ & D– PINS 8 7 10 k 100 k 1000 k 10000 k 100000 k Noise Frequency (Hz) 1000 k SCLK Frequency (Hz) SL01246 SL01240 Figure 10. Temp error versus Different Mode Noise Frequency Figure 8. Standby Current versus SCLK Frequency 30 20 Temp Reading (Decimal) Temperature Error (deg. C) 125 NOISE IS AC COUPLED TO D– PINS 25 15 10 NOISE=100MVPP NOISE=50MVPP 5 0 –5 –10 100 75 50 25 0 1k 10 k 100 k 1000 k 10000 k 100000 k 0 25 50 75 100 125 Noise Frequency (Hz) Temperature (deg. C) SL01247 SL01241 Figure 11. Relationship between Temperature and Temp reading Figure 9. Temp Error versus Common Mode Noise 2004 Oct 05 7 Philips Semiconductors Product data sheet HECETA4 Temperature and voltage monitor NE1619 DC ELECTRICAL CHARACTERISTICS VDD = 3.3 V (see Note 4); Tamb = 0 °C to +125 °C unless otherwise specified. SYMBOL PARAMETER CONDITION MIN. TYP. MAX. UNIT 2.8 3.3 5.5 V VDD Supply voltage IDD Supply current Standby mode – 100 – µA IDD Supply current Operating mode – 250 500 µA tC Total monitoring cycle time1 All conversions – 0.25 0.50 sec TR Temperature resolution Local and Remote – ±1.0 – °C – Internal temperature accuracy Tamb = 25 °C – TAI ±2.0 °C Tamb = 0 °C to +120 °C – – ±3.0 °C – External temperature accuracy Tamb = 25 °C – TAE ±3.0 °C Tamb = 0 °C to +120 °C – – ±5.0 °C High level – 100 – µA Low level – 10 – µA IS Remote source current Voltage-to-Digital converter (12VIN, 5VIN, 3.3VIN, 2.5VIN, VCCP, VDD) VUE Unadjusted error – – ±2.0 %FS VDNL Differential non-linearity error – ±1.0 – LSB VRIN VIN input resistance 100 200 – kΩ VPSS VIN power supply sensitivity – ±1.0 – %/V Digital output (SDA, A02) VOH Output High voltage IOUT = –3.0 mA, VDD = 2.8 V – – 2.4 V VOL Output Low voltage IOUT = 3.0 mA, VDD = 3.8 V 0.4 – – V IOH Output High leakage current VOUT = VDD – 0.1 10.0 µA – – 0.6VDD V – – 0.3VDD V SMB digital input voltages (SDA, SCL) VIH Input High voltage VIL Input Low voltage Digital input voltages (A0, VID0–4, NT_IN3) VIH Input High voltage – – 2.0 V VIL Input Low voltage 0.4 – – V Digital input current (all digital inputs) IIH Input High current VIN = VDD –1.0 – – µA IIL Input Low current VIN = GND – – 1.0 µA CIN Input capacitance – 20.0 – pF NOTES: 1. Total monitoring cycle time includes all temperature conversions and all voltage conversions. 2. When A0 is selected as output in NAND-TREE test mode. 3. When D– is selected as input in NAND-TREE test mode. 4. Operating the device at 2.8 V to 5.5 V is allowed, but parameter values in characteristics table are not guaranteed. 2004 Oct 05 8 Philips Semiconductors Product data sheet HECETA4 Temperature and voltage monitor NE1619 SMBus INTERFACE AC CHARACTERISTICS VDD = 3.3 V, Tamb = 0 °C to +125 °C unless otherwise specified. SYMBOL PARAMETER CONDITION MIN. TYP. MAX. UNIT – – 400 kHz tSCL SCL clock frequency tBUF SMBus free time 4.7 – – µs tLOW SCL Low time 4.7 – – µs tHIGH SCL High time 4.0 – – µs tSU:STA Start set-up time 100 – – ns tHD:STA Start hold time 100 – – ns tSU:STO Stop set-up time 4.0 – – µs tSU:DAT Data set-up time 250 – – ns tHD:DAT Data hold time 0 – – ns tF Fall time – – 1.0 µs NOTE: 1. These specifications are guaranteed by design and not tested in production. TIMING DIAGRAM tHIGH tLOW SCL tHD:STA tSU:STO tSU:DAT tSU:STA tHD:DAT SDA tBUF P tF S S S: Start Condition P: Stop Condition 2004 Oct 05 P SL01231 9 Philips Semiconductors Product data sheet HECETA4 Temperature and voltage monitor NE1619 Table 1. List of registers NAME COMMAND OR ADDRESS R/W POR STATE DESCRIPTION CR 40h R/W 0000 1000 Configuration register SR1 41h Read only 0000 0000 Status register #1 SR2 42h Read only 0000 0000 Status register #2 VID 47h Read only 0000 xxxx VID register, xxxx = VID3–VID0 VID4 49h Read only 1000 000x VID4 register, x = VID4 CID 3Eh Read only 1010 0001 Company number SID 3Fh Read only 0010 0001 Stepping version number TEST 15h R/W N/A Manufacturer test register 2.5VR 20h Read only N/A 2.5VIN reading register VCCPR 21h Read only N/A VCCPVIN reading register 3.3VR 22h Read only N/A 3.3VIN reading register 5VR 23h Read only N/A 5VIN reading register 12VR 24h Read only N/A 12VIN reading register VDDR 25h Read only N/A VDD reading register ETR 26h Read only N/A External or remote temperature reading register ITR 27h Read only N/A Internal or local temperature reading register 2.5VHL 2Bh R/W 0000 0000 2.5VIN high limit register 2.5VLL 2Ch R/W 0000 0000 2.5VIN low limit register VCCPHL 2Dh R/W 0000 0000 VCCPVIN high limit register VCCPLL 2Eh R/W 0000 0000 VCCPVIN low limit register 3.3VHL 2Fh R/W 0000 0000 3.3VIN high limit register 3.3VLL 30h R/W 0000 0000 3.3VIN low limit register 5VHL 31h R/W 0000 0000 5VIN high limit register 5VLL 32h R/W 0000 0000 5VIN low limit register 12VHL 33h R/W 0000 0000 12VIN high limit register 12VLL 34h R/W 0000 0000 12VIN low limit register VDDHL 35h R/W 0000 0000 VDDVIN high limit register VDDLL 36h R/W 0000 0000 VDDVIN low limit register ETHL 37h R/W 0000 0000 External or remote temperature high limit register ETLL 38h R/W 0000 0000 External or remote temperature low limit register ITHL 39h R/W 0000 0000 Internal or local temperature high limit register ITLL 3Ah R/W 0000 0000 Internal or local temperature low limit register 2004 Oct 05 10 Philips Semiconductors Product data sheet HECETA4 Temperature and voltage monitor NE1619 Table 2. Configuration Register (CR, 40h, default = 0000 1000) BIT 0 NAME START R/W R/W DESCRIPTION Logic 1 enables startup of monitor device, logic 0 places the device in standby mode. Power–up default = 0. At startup, limit checking functions and scanning begins. Note, all High and Low limits should be set into the ASIC prior turning on this bit. 1 Reserved Read Power-up default = 0. 2 Reserved Read Power-up default = 0. 3 Reserved Read Power-up default = 1. 4 RESET R/W Setting this bit generates a minimum 20ms low pulse on the Reset pin, if the reset function is enabled. Power-up default = 0. 5 12VIN/VID4 SELECT R/W Selects whether pin 11 acts as a 12 volt analog input monitoring pin, or as a VID[4] input. This pin defaults to the 12 volt analog input. Power–up default = 0. 6 Reserved Read Power–up default = 0. 7 Initialization R/W Logic 1 restores power–up default values to the configuration register and the status registers. This bit automatically clears itself. Power–up default = 0. Table 3. Status Register 1 (SR1, 41h, default = 0000 0000) BIT NAME R/W DESCRIPTION 0 +2.5V_ERROR Read A one indicates 2.5VIN High or Low limit has been exceeded. 1 VCCP_ERROR Read A one indicates VCCPVIN High or Low limit has been exceeded. 2 +3.3V_ERROR Read A one indicates 3.3VIN High or Low limit has been exceeded. 3 +5V_ERROR Read A one indicates 5VIN High or Low limit has been exceeded. 4 Internal Temp Error Read A one indicates internal or local temp High or Low limit has been exceeded. 5 External Temp Error Read A one indicates external or remote temp High or Low limit has been exceeded. 6 Reserved Read 7 Reserved Read Table 4. Status Register 2 (SR2, 42h, default = 0000 0000) BIT NAME R/W DESCRIPTION 0 +12V_ERROR Read A one indicates 12VIN High or Low limit has been exceeded. 1 VDD_ERROR Read A one indicates VDD High or Low limit has been exceeded. 2 Reserved Read Undefined. 3 Reserved Read Undefined. 4 Reserved Read Undefined. 5 Reserved Read Undefined. 6 Remote Diode Fault Read A one indicates either a short or open circuited fault on the remote thermal diode inputs. 7 Reserved Read Undefined. Table 5. VID (VID, 47h, default = 0000 VID[3:0] ) BIT NAME R/W DESCRIPTION 0–3 VID[0:3] Read The VID[0:3] inputs from Pentium/PRO power supplies ID to indicate the operating voltage (e.g. 1.5V to 2.9V). Power-up default = VID[0:3]. 4–6 Reserved Read Undefined. RESET ENABLE Read When set to 1, enables the RESET pin output function. This bit defaults to 0 at Power–up and enables addressing function. 7 Table 6. VID4 (VID4, 49h, default = 1000 000VID[4] ) BIT 0 1–7 NAME R/W DESCRIPTION VID4 Read VID4 input, if selected, from Pentium/PRO power supplied ID. Power-up default = 0 and pin 11 is not selected for VID4. Reserved Read Power-up default = 1000 000 2004 Oct 05 11 Philips Semiconductors Product data sheet HECETA4 Temperature and voltage monitor Because all limit registers are reset to zero, writing limits into the limits registers should usually be the first action to be performed after power-on reset. FUNCTIONAL DESCRIPTION SMBus serial interface The NE1619 can be connected to a compatible 2-wire serial interface SMBus as a slave device under the control of a master device or controller, using two device terminals SCL and SDA. The controller will provide a clock signal to the device SCL pin and write/read data to/from the device through the SDA pin. Initialization Initialization or software reset of the NE1619 can be initiated by setting bit 7 of the configuration register. This bit automatically clears itself after being set. The initialization performs a similar reset function to power-on reset, except that the reading and limit registers are not reset. Data of 8-bit digital byte or word are used for communication between the controller and the device. Starting conversion Notice that external pull-up resistors, about 10 kΩ, are needed for the two terminals SCL and SDA. The NE1619 monitoring function is started by setting (to 1) the START bit (bit 0) of the configuration register. The device then performs a loop of monitoring about every second. In monitoring function, the device cycles sequentially through all measurements of temperatures and voltages and also performs the comparisons between readings and limits accordingly. The inputs are sampled in this order: Remote diode temperature, Local temperature, VDDVIN, 12VIN, 5VIN. 3.3VIN, 2.5VIN and VCCPVIN. Slave address The NE1619 slave address on the SMBus is defined by the hardware connection applied to the device pin 16. At power-up this pin is automatically reset to its address sensing function A0. This logic input will set up the value of the LSB bit of the 7-bit address. Because A0 is a two-level digital input and the other 6 bits of the address are predefined to 010110, only two slave addresses can be used as listed below for the device: Measured values are stored in reading registers and results of limit comparison are reflected by the state of the flag bits in the status registers. Reading and status data can be read at any time. Limit values should be written into limit registers before starting conversion to avoid false conditions of the status. Table 7. A0 connection (Pin 16) Slave address GND 0101100 VDD 0101101 Resetting (to 0) the START bit (bit 0) of the configuration register will stop the monitoring function and put the device into its standby mode thereby reducing power consumption. Temperature measurement Because the logic is sampled and latched into the device storage only at power-up, the device pin 16 can be programmed for different functions while power is on without effecting the address definition. The NE1619 contains an on-chip temperature sensor to measure the local or internal temperature and provides input pins (D– and D+) to measure the remote or external temperature with the use of a remote diode-type sensor. The remote sensor should be connected to the D– and D+ pins properly. Registers The NE1619 contains a number of registers, as listed in Table 1, in order to store data of the device setup and operation results. The table indicates the command value and read/write capability of each register for SMBus communication and also the power-up default values for some registers. It includes: – Configuration register to provide control and configuration as well as initialization the NE1619, – Status registers to provide the flags resulting from limit comparisons, – Reading registers to store results of measurements, – Limit registers to store programmable limit data, – ID and test registers. The method of temperature measurement is based on the change of the diode VBE at two different operating current levels given by: ∆VBE = (KT/q)*LN(N) where: K: Boltzmann’s constant T: absolute temperature in °K q: charge on the electron N: ratio of the two currents LN: natural logarithm The NE1619 provides two current sources of about 10 µA and 100 µA during the measurement of the remote diode VBE and the sensed voltage between two pins D– and D+ is limited within 0.25 V and 0.95 V. Data are stored in registers by 8-bit digital byte, either in 2’s complement format for temperature-related data or in straight format for others. Writing and reading registers will be done on the SMBus by a controller using the SMBus protocols that will be described more in the last section of this functional description. Notice that attempting to write to a “Read only” register will produce an invalid result. The external diode should be selected to meet this current and voltage requirements. The diode-connected PNP transistor provided on the Pentium series microprocessor is typically used, or the discrete diode-connected transistor 2N3904 is recommended. Power-on reset For temperature measurement, local or remote, the ∆VBE is converted into digital data by the on-chip sigma-delta A-to-D converter. The result is stored in the temperature reading register and is also compared with the limits stored in the temperature limit registers in order to set the temperature flag bits in the status register as described in Table 3. When the power is applied to the NE1619, also called hardware reset, the registers are reset to their default value, if defined, as shown in Table 1. The content of registers which have indeterminate default value such as reading registers will be unknown. The on-board A-to-D converter is disabled and the monitoring function is not started. The device enters standby mode and draws a supply current less than 100 µA. 2004 Oct 05 NE1619 12 Philips Semiconductors Product data sheet HECETA4 Temperature and voltage monitor necessary. No external resistor-divider should be used for the VIN pins because of the effect of the internal input resistors, about 140 kΩ at each pin, on the divider accuracy. Temperature data is represented by a digital 8-bit byte or word in two’s complement format with a resolution of 1 °C. Theoretically, the temperature value can be from –128 °C to +127 °C but, practically, the operation range is limited to (0 °C, 120 °C). Here are some of temperature values and data: Processor Voltage ID (VID) The NE1619 provides 5 digital pins (VID0–VID4) to read the processor voltage ID code and store it into the VID registers so that the code can be read over the SMBus: Table 8. TEMPERATURE VALUE (°C) TEMPERATURE DATA +127 0111 1111 +126 0111 1110 +100 0110 0100 +25 0001 1001 +1 0000 0001 0 0000 0000 –1 1111 1111 VID register: VID4 register: bit 0–bit3 bit 0 reflect VID0–VID3 respectively reflects VID4 Because the VID4 function of 12VIN/VID4 pin (Pin 11) is not selected at power-up (default function of this pin is 12VIN), the process of selecting this pin must be performed, if VID4 is needed, by setting (to 1) bit 5 (12VIN/VID4 SELECT) of the configuration register. The default value of bit 0 of the VID4 register is 0. –25 1110 0111 The VID inputs should not be left floating because they are not internally biased. If they are not used then they should be connected to either GND or VDD with resistors. –50 1100 1110 Limit data High and Low limits for temperatures and voltages should be programmed into the limit registers using the format as described above. During monitoring cycle, the measured data is automatically compared with the limits and flag bits in the status registers are set accordingly to the results. The assignment of the status bits are listed in Tables 3 and 4. Voltage measurement The NE1619 provides 5 analog inputs for directly monitoring the power supplies typically found in a PC or multiservice equipment, having nominal values of +2.5 V, +3.3 V, +5.0 V, +12.0 V and VCCP (2.25 V). The device also monitors its own VDD whose nominal value is 3.3 V. Note: at power-up, the device Pin 11 is defaulted to its 12VIN function. These inputs are internally attenuated by on-chip resistor networks to the reference levels that are then multiplexed to a 8-bit Delta-Sigma A-to-D converter for converting into digital data. Each VIN input is overall scaled in such a way that the decimal value of the data for its nominal voltage value is equal to 192. It means that the overall step size of the conversion for each VIN is equal to 1/ 192 of its nominal value. Reading data are stored in the VIN reading registers and are also compared with the limits stored in the VIN limit registers in order to set the voltage flag bits in the status registers as described in Tables 3 and 4. Status registers Results of limits comparisons are reflected by status or flag bits stored in the status register 1 and 2. If the reading is within the limits then the corresponding flag bit will be cleared to 0. Otherwise, it will be set to 1. Status data can be read over the SMBus. Notice that because the flag bits are automatically updated at every monitoring cycle, their states only reflect the last measurements. Diode fault status The hardware connection at the diode pins (D+ and D–) are also checked at the measurement of external temperature and the fault condition is indicated by the flag bit 6 of the status register 2. This bit is set to 1 if either short or open circuit fault is detected. The VIN data, different from the temperature data, is represented by a digital 8-bit byte or word in straight format with a resolution LSB equal to 1/192 of the nominal value, and has any value from 0 to 255. This is how to calculate the VIN error from the VIN reading at any input including VDD: RESET output function The NE1619 Pin 16 can be selected as a reset pulse output. When this function is selected and the reset pulse is initiated, this pin will output a single (minimum 20 ms) low state pulse. Resolution in volts: LSB = (VIN nominal in volt)/192 Full scale in volts: FS= 255 * LSB Reading value in volts: VIN value = (decimal value of VIN reading) * LSB Reading error in volts: VIN error = (VIN value) – (VIN applied) VIN error in % of FS: VIN error % = 100*(VIN error)/FS Applied value < 0 results in a reading of about 0 Applied value > FS results in a reading of about 255 The reset output function is selected by setting (to 1) the RESET ENABLE bit (bit 7) of the VID register. Thereafter, the reset pulse is generated whenever the RESET bit (bit 4) of the configuration register is programmed to change from 0 to 1. Because Pin 16 becomes an open-drain output when it is selected as an output, an external pull-up resistor, about 100 kΩ is needed for the output operation. This will restrict the address function on Pin 16 to being high at power-up. Therefore, if multiple NE1619’s are connected on the same bus, only one can have this function enabled at one time. Input safety Since the power supply voltages will appear directly at VIN pins, a small external resistor, about 500 Ω, should be connected in series with each pin in order to prevent damaging the power supplies due to accidental short. These resistors are recommended but not 2004 Oct 05 NE1619 13 Philips Semiconductors Product data sheet HECETA4 Temperature and voltage monitor NE1619 To perform a NAND tree test all pins should be initially driven low. Then one-by-one toggle them high (and keep them high), starting with the input closest to the output, cycling toward the farthest, the NAND tree output will toggle with each input change. NAND-tree test A NAND tree is provided in the NE1619 for Automated Test Equipment (ATE) board level connectivity testing. The device is placed into NAND tree test mode by powering up with Pin 9 (D–/NTEST_IN) held high. In this test mode Pin 16 (A0/RESET/NTEST_OUT) becomes the NAND-tree output and all input pins become NAND-tree inputs as illustrated in Figure 12. SDA SCL VID0 VID1 VID2 NTEST_OUT VID3 VID4 SL01232 Figure 12. NAND-tree circuitry Table 9. NAND-tree test vectors VECTOR # SDA SCL VID0 VID1 VID2 VID3 VID4 NTEST_OUT 1 L L L L L L L H 2 L L L L L L H L 3 L L L L L H H H 4 L L L L H H H L 5 L L L H H H H H 6 L L H H H H H L 7 L H H H H H H H 8 H H H H H H H L 2004 Oct 05 14 Philips Semiconductors Product data sheet HECETA4 Temperature and voltage monitor NE1619 • The 7-bit slave address is replaced by the selected address of the SMBus interface protocol The NE1619 can communicate over a compatible 2-wire serial interface SMBus using the two device pins SCL and SDA. The device employs three standard SMBus protocols: Write Byte, Read Byte and Receive byte. device. • The command byte is replaced by the selected command of the device register. • The receive byte format is used for quickly transfer data from a Data formats of those protocols are shown below with following notices: • The SMBus controller initiates data transfer by establishing a start reading register which was previously selected by a read. • During the transition between start and stop conditions, data must condition (S) and terminates data transfer by generating a stop condition (P). be stable and valid when the SCL is high. • Data is sent over the serial bus in sequence of 9 clock pulses for each 8-bit data byte followed by 1-bit status of the device acknowledgement (A). Write Byte Format: 1 2 3 4 5 6 7 8 9 1 2 3 4 5 6 7 8 9 SCL (TO NEXT) SDA 0 1 0 1 1 0 a0 S D7 W D6 D5 D4 D3 D2 D1 (TO NEXT) D0 A A DEVICE ADDRESS DEVICE REGISTER COMMAND 1 2 3 4 5 6 7 8 D7 D6 D5 D4 D3 D2 D1 D0 9 SCL (continued) SDA (continued) A P DATA TO BE WRITTEN TO REGISTER Read Byte Format: 1 2 3 4 5 6 7 8 9 1 2 3 4 5 6 7 8 9 SCL (TO NEXT) SDA 0 1 0 1 1 0 a0 S D7 W D6 D5 D4 D3 D2 D1 D0 A (TO NEXT) A DEVICE ADDRESS DATA REGISTER COMMAND 1 2 3 4 5 6 7 0 1 0 1 1 0 a0 8 9 R A P STOP 1 2 3 4 5 6 7 8 D7 D6 D5 D4 D3 D2 D1 D0 9 SCL (continued) SDA (continued) S RESTART NA P STOP DATA FROM DEVICE REGISTER DEVICE ADDRESS Receive Byte Format: 1 2 3 4 5 6 7 0 1 0 1 1 0 a0 8 9 R A 1 2 3 4 5 6 7 8 D7 D6 D5 D4 D3 D2 D1 D0 9 SCL SDA S DEVICE ADDRESS NA (end) Figure 13. NE1619 SMBus interface protocols 2004 Oct 05 P DATA FROM DEVICE REGISTER 15 SL01233 Philips Semiconductors Product data sheet HECETA4 Temperature and voltage monitor NE1619 5. Place a bypass capacitor of 100 nF close to the VDD pin and an input filter capacitor of 2200 pF close to the D+ and D– pins. Printed Circuit Board layout considerations Care must be taken in PCB layout to minimize noise induced at the remote temperature sensor inputs, especially in extremely noisy environments, such as a computer motherboard. Noise induced in the traces running between the device sensor inputs and the remote diode can cause temperature conversion errors. Typical sensor signal levels to the NE1619 is a few microvolts. The following guidelines are recommended: 6. If the remote sensor is operating in a noisy environment and located several feet away from the NE1619, a shielded twisted pair cable is recommended. Make sure the shield of the cable is connected to the NE1619 ground pin, and leave the shield at the remote end unconnected. Shield connecting to ground of both ends could create a ground loop (refer to Figure 15) and defeat the purpose of the shielded cable. Also, cold soldered joints and damaged cable could introduce series resistance and reslult in measurement error. For instance, a 1 Ω resistance can introduce a change of temperature of about 0.5 °C. 1. Place the NE1619 as close as possible to the remote sensor. It can be from 4 to 8 inches, as long as the worst noise sources such as clock generator, data and address buses, CRTs are avoided. 2. Route the D+ and D– lines parallel and close together with ground guards enclosing them (see Figure 14). SHIELDED TWISTED PAIR 3. Leakage currents due to PC board contamination must be considered. Error can be introduced by these leakage currents. D+ NE1619 4. Use wide traces to reduce inductance and noise pickup. Narrow traces more readily pickup noise. The minimum width of 10 mil and space of 10 mil are recommended. D– REMOTE SENSOR GND SL02156 GND D+ Figure 15. Using shielded twisted pair D– GND SL01218 Figure 14. PCB layout for D+ and D– 2004 Oct 05 16 Philips Semiconductors Product data sheet HECETA4 Temperature and voltage monitor SSOP16: plastic shrink small outline package; 16 leads; body width 3.9 mm; lead pitch 0.635 mm 2004 Oct 05 17 NE1619 SOT519-1 Philips Semiconductors Product data sheet HECETA4 Temperature and voltage monitor NE1619 REVISION HISTORY Rev Date Description _4 20041005 Product data sheet (9397 750 14175). Supersedes data of 2004 May 10 (9397 750 13254). Modifications: • “Features” section on page 2: add ESD and Latch-up bullets to bottom of list. • “Ordering information” table: change temperature range from “Tamb = 0 °C to +120 °C” to “Tamb = 0 °C to +125 °C” • Add figure titles to Pin configuration, Functional block diagram, Typical application circuit. • Section “Typical operating circuit” re-named to “Typical application circuit”; figure modified. • “Absolute maximum ratings” table: change Operating temperature range maximum from +120 °C to +125 °C • Figure 4 re-titled • “DC electrical characteristics” table: add Note 4 and its reference at table description line. • “SMBus interface AC characteristics” table: change temperature range from “Tamb = 0 °C to +120 °C” to “Tamb = 0 °C to +125 °C” • Section “Printed Circuit Board layout condiserations”: – paragraph 5: change from “Place a bypass capacitor of 10 nF close to ...” to “Place a bypass capacitor of 100 nF close to ...” – paragraph 6 re-written – add Figure 15 _3 20040510 Product data (9397 750 13254). Supersedes data of 2001 Aug 29. _2 20010829 Product data (9397 750 08874). Supersedes data of 2000 Jul 13. _1 20000713 Product specification (9397 750 07323). 2004 Oct 05 18 Philips Semiconductors Product data sheet HECETA4 Temperature and voltage monitor NE1619 Purchase of Philips I2C components conveys a license under the Philips’ I2C patent to use the components in the I2C system provided the system conforms to the I2C specifications defined by Philips. This specification can be ordered using the code 9398 393 40011. Data sheet status Level Data sheet status [1] Product status [2] [3] Definitions I Objective data sheet Development This data sheet contains data from the objective specification for product development. Philips Semiconductors reserves the right to change the specification in any manner without notice. II Preliminary data sheet Qualification This data sheet contains data from the preliminary specification. Supplementary data will be published at a later date. Philips Semiconductors reserves the right to change the specification without notice, in order to improve the design and supply the best possible product. III Product data sheet Production This data sheet contains data from the product specification. Philips Semiconductors reserves the right to make changes at any time in order to improve the design, manufacturing and supply. Relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN). [1] Please consult the most recently issued data sheet before initiating or completing a design. [2] The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com. [3] For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status. Definitions Short-form specification — The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. Limiting values definition — Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information — Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Disclaimers Life support — These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application. Right to make changes — Philips Semiconductors reserves the right to make changes in the products—including circuits, standard cells, and/or software—described or contained herein in order to improve design and/or performance. When the product is in full production (status ‘Production’), relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN). Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no license or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified. Koninklijke Philips Electronics N.V. 2004 All rights reserved. Printed in U.S.A. Contact information For additional information please visit http://www.semiconductors.philips.com. Fax: +31 40 27 24825 Date of release: 10-04 For sales offices addresses send e-mail to: [email protected]. Document order number: 2004 Oct 05 19 9397 750 14175