16L - QFN 3X3X0.6MM CHIP ON LEADS (SAW VERSION) PB-FREE PACKAGE MATERIAL DECLARATION DATASHEET

16L – QFN 3x3x0.6mm
Chip On Leads (Saw Version)
Pb-Free Package
PACKAGE MATERIAL DECLARATION DATASHEET
Cypress Package Code
Package Weight – Site 1
Package Weight – Site 3
LG
B1 : 13.9899 mg
B2 : 15.1901 mg
16.7999 mg
Package Weight – Site 5
12.7001 mg
Body Size (mil/mm)
Package Weight – Site 2
3x3x0.6mm
20.5801 mg
Package Weight – Site 4
B1 : 13.8347 mg
B2 : 13.0455 mg
B3 : 19.7932 mg
SUMMARY
The QFN COL 16L Pb-Free package is compliant to RoHS. Cypress Ordering Part Numbers containing an
“X” (e.g. CY7C1328G-133AXI, CY2308SXC-1HT) meet the Directive 2002/95/EC (RoHS) requirement.
ASSEMBLY Site 1: Amkor Technology Philippines (P1/P2)
Package Qualification Report #063602, 104001 (See Note 1)
I. DECLARATION OF PACKAGED UNITS
A. BANNED SUBSTANCES
Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU
RoHS. Listed in the table below are materials that are neither contained nor intentionally added to this
product.
Substances / Compounds
Cadmium and Cadmium Compounds
Hexavalent Chromium and its Compounds
Lead and Lead Compounds
Mercury and Mercury Compounds
Polybrominated Biphenyls (PBB)
Polybrominated Diphenylethers (PBDE)
Asbestos
Azo colorants
Ozone Depleting Substances
Polychlorinated Biphenyls (PCBs)
Polychlorinated Napthalenes
Radioactive Substances
Shortchain Chlorinated Paraffins
Tributyl Tin (TBT) and Triphenyl Tin (TPT)
Tributyl Tin Oxide (TBTO)
Formaldehyde
Weight by mg
PPM
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
0
0
0
0
0
0
0
0
0
0
Analysis Report
(Note 2)
CoA-LG16Amkor
Philippines
(P1/P2)
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural
impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress
Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-11888 Rev. *K
Page 1 of 15
16L – QFN 3x3x0.6mm
Chip On Leads (Saw Version)
Pb-Free Package
B. MATERIAL COMPOSITION (Note 3)
B1 : NiPdAu with Hitachi Mold Compound
Material
Leadframe
Purpose of Use
Base Material
Frame Plating
Lead Finish
Die Attach
External Plating
Adhesive
Die
Wire
Circuit
Interconnect
Mold
Compound
Encapsulation
Substance
Composition
Cu
Si
Mg
Ag
Ni
Pd
Au
Specific
EpoxyResin
Bisphenol A
Glycidylether
Fused Silica
Additive
Si
Au
Epoxy Resin-1
Epoxy Resin-2
Phenol resin
Silica Fused
Carbon Black
Metal Hydroxide
Others
CAS Number
7440-50-8
7440-21-3
7439-95-4
7440-22-4
7440-02-0
7440-05-3
7440-57-5
( Trade secret )
25068-38-6
60676-86-0
-------------------7440-21-3
7440-57-5
( Trade secret )
( Trade secret )
( Trade secret )
60676-86-0
1333-86-4
( Trade secret )
--------------------
Package Weight (mg):
Weight by
mg
5.9079
0.0401
0.0090
0.0329
0.1867
0.0031
0.0002
0.0210
% weight of
substance per
Homogeneous
material
98.6300%
0.6700%
0.1500%
0.5500%
98.2400%
1.6300%
0.1300%
422,297
2,869
642
2,355
13,342
221
18
1,501
% weight
of
substance
per
package
42.2297%
0.2869%
0.0642%
0.2355%
1.3342%
0.0221%
0.0018%
0.1501%
500
0.0500%
7,005
1,001
85,061
4,289
18,356
9,178
13,767
379,969
918
22,945
13,767
0.7005%
0.1001%
8.5061%
0.4289%
1.8356%
0.9178%
1.3767%
37.9969%
0.0918%
2.2945%
1.3767%
% Total:
100.0000
PPM
15.0000%
0.0070
0.0980
0.0140
1.1900
0.0600
0.2568
0.1284
0.1926
5.3158
0.0128
0.3210
0.1926
13.9899
5.0000%
70.0000%
10.0000%
100.0000%
100.0000%
4.0000%
2.0000%
3.0000%
82.8000%
0.2000%
5.0000%
3.0000%
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural
impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress
Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-11888 Rev. *K
Page 2 of 15
16L – QFN 3x3x0.6mm
Chip On Leads (Saw Version)
Pb-Free Package
B2 : NiPdAu-Ag with Sumitomo Mold Compound
Material
Substance
Composition
Purpose of Use
Leadframe
Base Material
Lead Finish
External Plating
Cu
Si
Ni
Mg
Ni
Pd
Au-Ag
Die Attach
Adhesive
Die
Circuit
Wire
Interconnect
Mold
Compound
Encapsulation
Epoxy
Silica
Bisphenol
Additive
Si
Au
Others
Silica Fused
Epoxy Resin
Phenol resin
Carbon Black
CAS Number
7440-50-8
7440-21-3
7440-02-0
7439-95-4
7440-02-0
7440-05-3
7440-57-5
7440-22-4
Proprietary
7631-86-9
Proprietary
Proprietary
7440-21-3
7440-57-5
--------------------60676-86-0
( Trade secret )
( Trade secret )
1333-86-4
Package Weight (mg):
7.0996
0.0480
0.2214
0.0111
0.0098
0.0002
% weight of
substance per
Homogeneous
material
96.2000%
0.6500%
3.0000%
0.1500%
97.5400%
2.0700%
467384
3158
14575
729
642
14
46.7384%
0.3158%
1.4575%
0.0729%
0.0642%
0.0014%
0.0000
0.3900
3
0.0003%
0.0300
0.1400
0.0100
0.0200
0.4100
0.0693
0.0007
6.1944
0.5340
0.3560
0.0356
15.0000%
70.0000%
5.0000%
10.0000%
100.0000%
99.0400%
0.9600%
87.0000%
7.5000%
5.0000%
0.5000%
1975
9217
658
1317
26991
4564
44
407795
35155
23436
2344
0.1975%
0.9217%
0.0658%
0.1317%
2.6991%
0.4564%
0.0044%
40.7795%
3.5155%
2.3436%
0.2344%
Weight
by mg
15.1901
% weight of
substance
per package
PPM
% Total:
100.0000
II. DECLARATION OF PACKAGING / INDIRECT MATERIALS
Type
Tape & Reel
Tray
Others
Material
Cover tape
Carrier tape
Plastic Reel
Tray
Shielding bag
Lead
PPM
< 2.0
< 2.0
< 5.0
< 5.0
<2.0
Cadmium
PPM
< 2.0
< 2.0
< 5.0
< 0.5
<2.0
Cr VI
PPM
< 2.0
< 2.0
< 5.0
< 0.16
<2.0
Mercury
PPM
< 2.0
< 2.0
< 10.0
< 0.5
<2.0
PBB
PPM
<0.0005
<0.0005
<50.0
------<5.0
PBDE
PPM
<0.0005
<0.0005
<45.0
-------<5.0
Analysis Report
(Note2)
CoA-COVT-R
CoA-CART-R
CoA-PLRL-R
CoA-TRAY-R
CoA-SBAG –R
CoA-SBAG –M
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural
impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress
Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-11888 Rev. *K
Page 3 of 15
16L – QFN 3x3x0.6mm
Chip On Leads (Saw Version)
Pb-Free Package
ASSEMBLY Site 2 – CARSEM Malaysia
Package Qualification Report #100303 (See Note 1)
I.
DECLARATION OF PACKAGED UNITS
A. BANNED SUBSTANCES
Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU
RoHS. Listed in the table below are materials that are neither contained nor intentionally added to this
product.
Substances / Compounds
Cadmium and Cadmium Compounds
Hexavalent Chromium and its Compounds
Lead and Lead Compounds
Mercury and Mercury Compounds
Polybrominated Biphenyls (PBB)
Polybrominated Diphenylethers (PBDE)
Asbestos
Azo colorants
Ozone Depleting Substances
Polychlorinated Biphenyls (PCBs)
Polychlorinated Napthalenes
Radioactive Substances
Shortchain Chlorinated Paraffins
Tributyl Tin (TBT) and Triphenyl Tin (TPT)
Tributyl Tin Oxide (TBTO)
Formaldehyde
Weight by mg
PPM
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
0
0
0
0
0
0
0
0
0
0
Analysis Report
(Note 2)
CoA-LG16CARSEM
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural
impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress
Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-11888 Rev. *K
Page 4 of 15
16L – QFN 3x3x0.6mm
Chip On Leads (Saw Version)
Pb-Free Package
B. MATERIAL COMPOSITION (Note 3)
Material
Purpose of Use
Leadframe
Base Material
Lead Finish
External Plating
Die Attach
Adhesive
Die
Wire
Circuit
Interconnect
Mold
Compound
Encapsulation
Substance
Composition
Cu
Si
Ni
Mg
Ni
Pd
Au
Treated silica
Glycol ethers
Metal Oxide
Curing agent &
hardener
Epoxy resin
Si
Au
Silica Fused
Epoxy Resin
Phenol resin
Carbon Black
7440-50-8
7440-21-3
7440-02-0
7439-95-4
7440-02-0
7440-05-3
7440-57-5
Proprietary
Proprietary
Proprietary
Proprietary
9.2927
0.0485
0.3392
0.0097
0.1091
0.0095
0.0014
0.0024
0.0066
0.0093
0.0024
95.9000%
0.5000%
3.5000%
0.1000%
90.9100%
7.9100%
1.1900%
8.0000%
22.0000%
31.0000%
8.0000%
451,541
2,354
16,480
471
5,301
461
69
117
321
452
117
% weight
of
substance
per
package
45.1541%
0.2354%
1.6480%
0.0471%
0.5301%
0.0461%
0.0069%
0.0117%
0.0321%
0.0452%
0.0117%
-------------------7440-21-3
7440-57-5
60676-86-0
( Trade secret )
( Trade secret )
1333-86-4
0.0093
0.4100
0.2000
9.4918
0.3039
0.3039
0.0304
31.0000%
100.0000%
100.0000%
93.7000%
3.0000%
3.0000%
0.3000%
452
19,922
9,718
461,215
14,767
14,767
1,477
0.0452%
1.9922%
0.9718%
46.1215%
1.4767%
1.4767%
0.1477%
CAS Number
Package Weight (mg):
% weight of
substance per
Homogeneous
material
Weight by
mg
20.5801
PPM
% Total:
100.0000
II. DECLARATION OF PACKAGING / INDIRECT MATERIALS
Type
Tape & Reel
Tray
Others
Material
Cover tape
Carrier tape
Plastic Reel
Tray
Shielding bag
Lead
PPM
< 2.0
< 2.0
< 5.0
< 5.0
<2.0
Cadmium
PPM
< 2.0
< 2.0
< 5.0
< 0.5
<2.0
Cr VI
PPM
< 2.0
< 2.0
< 5.0
< 0.16
<2.0
Mercury
PPM
< 2.0
< 2.0
< 10.0
< 0.5
<2.0
PBB
PPM
<0.0005
<0.0005
<50.0
------<5.0
PBDE
PPM
<0.0005
<0.0005
<45.0
-------<5.0
Analysis Report
(Note2)
CoA-COVT-R
CoA-CART-R
CoA-PLRL-R
CoA-TRAY-R
CoA-SBAG –R
CoA-SBAG –M
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In
order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are
calculated using MSDS, Material Analysis Reports and Cypress Assembly site information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-11888 Rev. *K
Page 5 of 15
16L – QFN 3x3x0.6mm
Chip On Leads (Saw Version)
Pb-Free Package
ASSEMBLY Site 3: Amkor Technology Seoul Korea
Package Qualification Report 104205 (See Note 1)
I.
DECLARATION OF PACKAGED UNITS
A. BANNED SUBSTANCES
Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU RoHS.
Listed in the table below are materials that are neither contained nor intentionally added to this product.
Substances / Compounds
Cadmium and Cadmium Compounds
Hexavalent Chromium and its Compounds
Lead and Lead Compounds
Mercury and Mercury Compounds
Polybrominated Biphenyls (PBB)
Polybrominated Diphenylethers (PBDE)
Asbestos
Azo colorants
Ozone Depleting Substances
Polychlorinated Biphenyls (PCBs)
Polychlorinated Napthalenes
Radioactive Substances
Shortchain Chlorinated Paraffins
Tributyl Tin (TBT) and Triphenyl Tin (TPT)
Tributyl Tin Oxide (TBTO)
Formaldehyde
Weight by mg
PPM
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
0
0
0
0
0
0
0
0
0
0
Analysis Report
(Note 2)
CoA-LG16-AMKOR
Seoul
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In
order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are
calculated using MSDS, Material Analysis Reports and Cypress Assembly site information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-11888 Rev. *K
Page 6 of 15
16L – QFN 3x3x0.6mm
Chip On Leads (Saw Version)
Pb-Free Package
B. MATERIAL COMPOSITION (Note 3)
Material
Purpose
Leadframe
Base material
Leadfinish
External Plating
Die Attach
Die
Wire
Mold
compound
Adhesive
Circuit
Interconnect
Encapsulation
% weight of
substance per
Homogenous
material
% weight
of
substance
per
package
Substance
Composition
CAS
Number
Weight by
mg
Copper (Cu)
Nickel (Ni)
Silicon (Si)
Magnesium (Mg)
Nickel (Ni)
Palladium (Pd)
7440-50-8
7440-02-0
7440-21-3
7439-95-4
7440-02-0
7440-05-3
7.0997
0.2001
0.0478
0.0103
0.2162
0.0051
96.4900%
2.7200%
0.6500%
0.1400%
96.9400%
2.2800%
422603
11913
2847
613
12868
303
42.2603%
1.1913%
0.2847%
0.0613%
1.2868%
0.0303%
Gold-Silver (Au-Ag)
7440-57-5 /
7440-22-4
Epoxy resin
Silica
Silicon
Gold (Au)
Epoxy resin
Phenolic resin
Proprietary
Proprietary
7440-21-3
7440-57-5
Proprietary
Proprietary
0.0017
0.2058
0.0042
1.8600
0.0750
0.5298
0.3502
0.7800%
98.0000%
2.0000%
100.0000%
100.0000%
7.4900%
4.9500%
104
12250
250
110714
4464
31538
20843
0.0104%
1.2250%
0.0250%
11.0714%
0.4464%
3.1538%
2.0843%
Silica, vitreous
(SiO2)
60676-86-0
Carbon black
1333-86-4
6.1600
0.0198
87.0800%
0.2800%
366669
1179
36.6669%
0.1179%
Bismuth
compounds
Proprietary
0.0071
0.1000%
421
0.0421%
Organic
phosphorous
compounds
Proprietary
0.0071
0.1000%
421
0.0421%
% Total:
100.0000
Package Weight (mg):
16.7999
PPM
II. DECLARATION OF PACKAGING / INDIRECT MATERIALS
Type
Tape & Reel
Tray
Others
Material
Cover tape
Carrier tape
Plastic Reel
Tray
Shielding bag
Lead
PPM
< 2.0
< 2.0
< 5.0
< 5.0
<2.0
Cadmium
PPM
< 2.0
< 2.0
< 5.0
< 0.5
<2.0
Cr VI
PPM
< 2.0
< 2.0
< 5.0
< 0.16
<2.0
Mercury
PPM
< 2.0
< 2.0
< 10.0
< 0.5
<2.0
PBB
PPM
<0.0005
<0.0005
<50.0
------<5.0
PBDE
PPM
<0.0005
<0.0005
<45.0
-------<5.0
Analysis Report
(Note2)
CoA-COVT-R
CoA-CART-R
CoA-PLRL-R
CoA-TRAY-R
CoA-SBAG –R
CoA-SBAG –M
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity.
In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are
calculated using MSDS, Material Analysis Reports and Cypress Assembly site information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-11888 Rev. *K
Page 7 of 15
16L – QFN 3x3x0.6mm
Chip On Leads (Saw Version)
Pb-Free Package
ASSEMBLY Site 4: Advanced Semiconductor Engineering Taiwan (ASET)
Package Qualification Report # 112603, 114903, 132901 (See Note 1)
I.
DECLARATION OF PACKAGED UNITS
A. BANNED SUBSTANCES
Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU RoHS.
Listed in the table below are materials that are neither contained nor intentionally added to this product.
Substances / Compounds
Cadmium and Cadmium Compounds
Hexavalent Chromium and its Compounds
Lead and Lead Compounds
Mercury and Mercury Compounds
Polybrominated Biphenyls (PBB)
Polybrominated Diphenylethers (PBDE)
Asbestos
Azo colorants
Ozone Depleting Substances
Polychlorinated Biphenyls (PCBs)
Polychlorinated Napthalenes
Radioactive Substances
Shortchain Chlorinated Paraffins
Tributyl Tin (TBT) and Triphenyl Tin (TPT)
Tributyl Tin Oxide (TBTO)
Formaldehyde
Weight by mg
PPM
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
0
0
0
0
0
0
0
0
0
0
Analysis Report
(Note 2)
CoA-LG16ASET
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity.
In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are
calculated using MSDS, Material Analysis Reports and Cypress Assembly site information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-11888 Rev. *K
Page 8 of 15
16L – QFN 3x3x0.6mm
Chip On Leads (Saw Version)
Pb-Free Package
B. MATERIAL COMPOSITION (Note 3)
B1: Gold Wire
Material
Purpose
Leadframe
Base material
Leadfinish
External Plating
Die Attach
Die
Wire
Mold
compound
Adhesive
Circuit
Interconnect
Encapsulation
% weight of
substance per
Homogenous
material
% weight
of
substance
per
package
Substance
Composition
CAS
Number
Weight by
mg
Nickel (Ni)
Silicon (Si)
Magnesium (Mg)
Copper (Cu)
Nickel (Ni)
Palladium (Pd)
7440-02-0
7440-21-3
7439-95-4
7440-50-8
7440-02-0
7440-05-3
0.1648
0.0386
0.0093
4.9378
0.1201
0.0049
3.2000%
0.7500%
0.1800%
95.8800%
93.8500%
3.8400%
11,912
2,792
670
356,911
8,681
355
1.1912
0.2792
0.0670
35.6911
0.8681
0.0355
Gold-Silver (Au-Ag)
7440-57-5
7440-22-4
Epoxy Resin
Phenol Resin
SiO2 Filler
Acrylic copolymer
Silicon (Si)
Gold (Au)
Epoxy Resin A
Epoxy Resin B
64425-84-4
Proprietary
Proprietary
Proprietary
7440-21-3
7440-57-5
Proprietary
Proprietary
0.0030
0.1638
0.1638
0.0683
0.9694
0.9000
0.0500
0.2808
0.1872
2.3100%
12.0000%
12.0000%
5.0000%
71.0000%
100.0000%
100.0000%
4.5000%
3.0000%
214
11,843
11,843
4,935
70,072
65,053
3,614
20,300
13,533
0.0214
1.1843
1.1843
0.4935
7.0072
6.5053
0.3614
2.0300
1.3533
Phenol Resin
Proprietary
Carbon Black
1333-86-4
0.4119
0.0312
6.6000%
0.5000%
29,773
2,256
2.9773
0.2256
Silica Fused
60676-86-0
5.3298
85.4000%
385,244
38.5244
Package Weight (mg):
13.8347
PPM
% Total:
100.0000
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity.
In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are
calculated using MSDS, Material Analysis Reports and Cypress Assembly site information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-11888 Rev. *K
Page 9 of 15
16L – QFN 3x3x0.6mm
Chip On Leads (Saw Version)
Pb-Free Package
B2: Copper Wire
Material
Leadframe
Purpose
Base material
Substance
Composition
Nickel
Silicon
Magnesium
Copper
External Plating
Adhesive
Circuit
Interconnect
12630
2960
710
378438
1.2630%
0.2960%
0.0710%
37.8438%
0.0030
0.0050
2.3485%
3.9379%
230
386
0.0230%
0.0386%
Nickel
7440-02-0
0.1198
93.7136%
9185
0.9185%
Epoxy Resin
64425-84-4
Trade
Secret
Trade
Secret
Trade
Secret
7440-21-3
7440-50-8
Trade
secret
Trade
secret
Trade
secret
0.0468
12.0000%
3587
0.3587%
0.0468
12.0000%
3587
0.3587%
0.0195
5.0000%
1495
0.1495%
0.2769
71.0000%
21226
2.1226%
1.5280
100.0000%
117130
11.7130%
0.0200
100.0000%
1533
0.1533%
0.2624
4.5000%
20111
2.0111%
0.1749
3.0000%
13407
1.3407%
Palladium
SiO2 Filler
Si
Copper
Epoxy Resin A
Epoxy Resin B
Mold
compound
Encapsulation
PPM
% weight
of
substance
per
package
3.1997%
0.7499%
0.1800%
95.8704%
Acrylic Copolymer
Die
Wire
% weight of
substance per
Homogenous
material
0.1648
0.0386
0.0093
4.9369
Phenol Resin
Die Attach
Weight by
mg
7440-02-0
7440-21-3
7439-95-4
7440-50-8
7440-57-5
7440-22-4
7440-05-3
Gold-Silver
Leadfinish
CAS
Number
Phenol Resin
Carbon Black
1333-86-4
0.3848
0.0292
6.6000%
0.5000%
29496
2235
2.9496%
0.2235%
Silica Fused
60676-86-0
4.9788
85.4000%
381654
38.1654%
Package Weight (mg):
13.0455
% Total:
100.0000
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity.
In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are
calculated using MSDS, Material Analysis Reports and Cypress Assembly site information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-11888 Rev. *K
Page 10 of 15
16L – QFN 3x3x0.6mm
Chip On Leads (Saw Version)
Pb-Free Package
B3: Copper-Palladium Wire
Material
Purpose
Leadframe
Base material
Leadfinish
External Plating
Die Attach
Adhesive
Die
Wire
Mold
compound
Circuit
Interconnect
Encapsulation
Substance
Composition
Copper
Nickel
Silicon
Magnesium
Sn
Phenol Resin
Novolak Epoxy
Resin
Amorphous
Silica
Acrylic
Copolymer
Si
Copper
Palladium
Epoxy Resin
Phenol Resin
CAS Number
% weight of
substance per
Homogenous
material
Weight by
mg
7440-50-8
7440-02-0
7440-21-3
7439-95-4
7440-57-5
Trade Secret
6.8302
0.2130
0.0462
0.0107
1.9000
0.0748
96.2000
3.0000
0.6500
0.1500
100.0000
12.0000
Trade Secret
0.0748
12.0000
68611-44-9
0.0374
6.0000
Trade Secret
0.4361
70.0000
7440-21-3
7440-50-8
7440-05-3
Trade Secret
Trade Secret
1.9200
0.6099
0.0001
0.6112
0.4584
100.0000
99.9800
0.0200
8.0000
6.0000
Carbon Black
1333-86-4
0.0229
0.3000
Silica Fused
60676-86-0
6.5475
85.7000
Package Weight (mg):
19.7932
PPM
% weight of
substance
per
package
345,078
10,761
2,334
541
95,993
3,779
34.5078
1.0761
0.2334
0.0541
9.5993
0.3779
3,779
0.3779
1,890
0.1890
22,033
97,003
30,814
5
30,879
23,159
2.2033
9.7003
3.0814
0.0005
3.0879
2.3159
1,157
330,795
0.1157
33.0795
% Total:
100.0000
II. DECLARATION OF PACKAGING / INDIRECT MATERIALS
Type
Tape & Reel
Tray
Others
Material
Cover tape
Carrier tape
Plastic Reel
Tray
Shielding bag
Lead
PPM
< 2.0
< 2.0
< 5.0
< 5.0
<2.0
Cadmium
PPM
< 2.0
< 2.0
< 5.0
< 0.5
<2.0
Cr VI
PPM
< 2.0
< 2.0
< 5.0
< 0.16
<2.0
Mercury
PPM
< 2.0
< 2.0
< 10.0
< 0.5
<2.0
PBB
PPM
<0.0005
<0.0005
<50.0
------<5.0
PBDE
PPM
<0.0005
<0.0005
<45.0
-------<5.0
Analysis Report
(Note2)
CoA-COVT-R
CoA-CART-R
CoA-PLRL-R
CoA-TRAY-R
CoA-SBAG –R
CoA-SBAG –M
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity.
In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are
calculated using MSDS, Material Analysis Reports and Cypress Assembly site information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-11888 Rev. *K
Page 11 of 15
16L – QFN 3x3x0.6mm
Chip On Leads (Saw Version)
Pb-Free Package
ASSEMBLY Site 5: Cypress Manufacturing Ltd. (CML)
Package Qualification Report # 132703 (See Note 1)
I.
DECLARATION OF PACKAGED UNITS
A. BANNED SUBSTANCES
Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU RoHS.
Listed in the table below are materials that are neither contained nor intentionally added to this product.
Substances / Compounds
Cadmium and Cadmium Compounds
Hexavalent Chromium and its Compounds
Lead and Lead Compounds
Mercury and Mercury Compounds
Polybrominated Biphenyls (PBB)
Polybrominated Diphenylethers (PBDE)
Asbestos
Azo colorants
Ozone Depleting Substances
Polychlorinated Biphenyls (PCBs)
Polychlorinated Napthalenes
Radioactive Substances
Shortchain Chlorinated Paraffins
Tributyl Tin (TBT) and Triphenyl Tin (TPT)
Tributyl Tin Oxide (TBTO)
Formaldehyde
Weight by mg
PPM
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
0
0
0
0
0
0
0
0
0
0
Analysis Report
(Note 2)
CoA-LG16CML
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity.
In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are
calculated using MSDS, Material Analysis Reports and Cypress Assembly site information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-11888 Rev. *K
Page 12 of 15
16L – QFN 3x3x0.6mm
Chip On Leads (Saw Version)
Pb-Free Package
B. MATERIAL COMPOSITION (Note 3)
Copper-Palladium Wire
Material
Purpose
Leadframe
Base material
Leadfinish
External Plating
Die Attach
Adhesive
Die
Circuit
Wire
Interconnect
Mold
compound
Substance
Composition
CAS Number
Weight by
mg
% weight of
substance per
Homogenous
material
% weight of
substance
per
package
PPM
Copper
Nickel
Silicon
Magnesium
Nickel
Palladium
7440-50-8
7440-02-0
7440-21-3
7439-95-4
7440-02-0
7440-05-3
2.9699
0.0926
0.0201
0.0046
0.0620
0.0011
96.2000
3.0000
0.6500
0.1500
96.5204
1.7370
233,853
7,293
1,580
365
4,883
88
23.3853
0.7293
0.1580
0.0365
0.4883
0.0088
Gold
7440-57-5
0.0006
0.8713
44
0.0044
Silver
7440-22-4
0.0006
0.1823
0.0391
0.8713
70.0000
15.0000
44
14,354
3,076
0.0044
1.4354
0.3076
13.0000
2.0000
100.0000
99.0000
1.0000
87.7500
5.0000
2,666
410
287,089
17,272
174
374,524
21,340
0.2666
0.0410
28.7089
1.7272
0.0174
37.4524
2.1340
7.0000
0.2500
29,877
1,067
2.9877
0.1067
Fused Silica
Epoxy Resin
Bisphenol A
Glycidylether
Additive
Si
Copper
Palladium
60676-86-0
Trade Secret
25068-38-6
Trade Secret
7440-21-3
7440-50-8
7440-05-3
SiO2
Phenol Resin
60676-86-0
Trade secret
0.0339
0.0052
3.6460
0.2194
0.0022
4.7565
0.2710
Epoxy Resin
Carbon Black
Trade secret
1333-86-4
0.3794
0.0136
Encapsulation
Package Weight (mg):
12.7001
% Total:
100.0000
II. DECLARATION OF PACKAGING / INDIRECT MATERIALS
Type
Tape & Reel
Tray
Others
Material
Cover tape
Carrier tape
Plastic Reel
Tray
Shielding bag
Lead
PPM
< 2.0
< 2.0
< 5.0
< 5.0
<2.0
Cadmium
PPM
< 2.0
< 2.0
< 5.0
< 0.5
<2.0
Cr VI
PPM
< 2.0
< 2.0
< 5.0
< 0.16
<2.0
Mercury
PPM
< 2.0
< 2.0
< 10.0
< 0.5
<2.0
PBB
PPM
<0.0005
<0.0005
<50.0
------<5.0
PBDE
PPM
<0.0005
<0.0005
<45.0
-------<5.0
Analysis Report
(Note2)
CoA-COVT-R
CoA-CART-R
CoA-PLRL-R
CoA-TRAY-R
CoA-SBAG –R
CoA-SBAG –M
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural
impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress
Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-11888 Rev. *K
Page 13 of 15
16L – QFN 3x3x0.6mm
Chip On Leads (Saw Version)
Pb-Free Package
Document History Page
Document Title:
16L - QFN 3X3X0.6MM CHIP ON LEADS (SAW VERSION) PB-FREE PACKAGE
MATERIAL DECLARATION DATASHEET
Document Number:
001-11888
Rev.
**
*A
ECN No. Orig. of
Change
602896
EBZ
2741730 MAHA
*B
Dcon
2889372 EBZ
*C
3072300 JSO
*D
*E
3103478 NKZ
3210958 MAHA
*F
*G
*H
3260116 VFR
3304831 VFR
3422772 HLR
*I
3464531 EBZ
*J
4052625 YUM
*K
4113495 HLR
Description of Change
Initial spec release.
Corrected the package weight of assembly site 1 on
page 1. Corrected the following data on the material
composition table of assembly site 1:
a. Weight by mg
b. % weight of substance per Homogeneous material
c. % weight of substance per package
d. Package weight
Change CML to WEB in distribution list.
Included additional assembly site Carsem Malaysia (CA)
Corrected title in the document history page to match the
title in the header.
Included assembly site #3
Added B2
Corrected Material Composition in Assembly 3.
Corrected the QTP number of assembly site 2 from
0100303 to 100303.
Added QTP # 104903 to Assembly Site 3
Added PMDD for Site 4.
Updated the material composition table for
Assembly Sites 1 to 4 to reflect 4 decimal places on
values.
Added QTP # 114903 to Assembly Site 4. Added
package weight B2 for Site 4. Added B1 Gold Wire for
Material Composition table for Site-4. Added Material
Composition table B2 Copper Wire for Site-4
Added assembly site name in the Assembly heading in
site 1, 2, 3 and 4.
Changed Assembly code to Assembly site name in site
1, 2, 3 and 4.
Removed entire Tube row in the Indirect materials
section.
Added CuPd material composition for Assembly Site 4.
Added Assembly Site 5 for CML – CuPd.
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural
impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress
Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-11888 Rev. *K
Page 14 of 15
16L – QFN 3x3x0.6mm
Chip On Leads (Saw Version)
Pb-Free Package
Distribution: WEB
Posting:
None
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural
impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress
Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-11888 Rev. *K
Page 15 of 15
Similar pages
40L - QFN PB-FREE PACKAGE MATERIAL DECLARATION DATASHEET
32L QFN 5X5X1.0 MM (SAW VERSION) PB-FREE Package Material Declaration Datasheet.pdf
32l-TQFP 7x7x1.4mm Pb-free Package Material Declaration Datasheet.pdf
001-47080.pdf
32L QFN 5X5X0.6 MM (SAW VERSION) PB- FREE PACKAGE MATERIAL DECLARATION DATASHEET.pdf
8L QFN 1.7X1.7X0.6MM CHIP ON LEADS (SAW VERSION) PB-FREE PACKAGE MATERIAL DECLARATION DATASHEET.pdf
40L QFN 6X6X0.6 MM (SAW VERSION) PB- FREE PACKAGE MATERIAL DECLARATION DATASHEET.pdf
8L-PDIP PB-FREE PACKAGE MATERIAL DECLARATION DATASHEET
44L - QFN 5X5X0.6MM (SAW VERSION) PB-FREE PACKAGE MATERIAL DECLARATION DATASHEET
16L SOIC 300MILS PB-FREE Package Material Declaration Datasheet.pdf
176L TQFP PB-FREE PACKAGE MATERIAL DECLARATION DATASHEET.pdf
20L PDIP Pb-Free Package Material Declaration Datasheet.pdf
56L QFN PB-FREE PACKAGE MATERIAL DECLARATION DATASHEET.pdf
64 bGA (13x11mm) Pb-free Package Material Declaration Datasheet.pdf
44L TQFP PB-FREE PACKAGE MATERIAL DECLARATION DATASHEET.pdf
28L - TSOP I REVERSE OPTION PB-FREE PACKAGE MATERIAL DECLARATION DATASHEET.pdf
24L - QFN 4.0 X 4.0 MM (SAW VERSION) PB- FREE PACKAGE MATERIAL DECLARATION DATASHEET
388-FCBGA NON PB-FREE Package Material Declaration Datasheet.pdf
56L-SSOP PB-FREE Package Material Declaration Datasheet.pdf
56L - QFN 6X6X0.6 MM (SAW VERSION) PB- FREE PACKAGE MATERIAL DECLARATION DATASHEET.pdf
28L - PDIP PB-FREE PACKAGE MATERIAL DECLARATION DATASHEET
28L SOIC PB-FREE Package Material Declaration Datasheet.pdf