32L – QFN 5X5X0.40 mm (Saw Version) Pb-Free Package PACKAGE MATERIAL DECLARATION DATASHEET Cypress Package Code Package Weight – Site 1 LN 29.2902 mg Body Size (mil/mm) Package Weight – Site 2 5x5 mm N/A SUMMARY The 32L-QFN Pb-Free package is compliant to RoHS. Cypress Ordering Part Numbers containing an “X” (e.g. CY7C1328G-133AXI, CY2308SXC-1HT) meet the Directive 2002/95/EC (RoHS) requirement ASSEMBLY Site 1: CARSEM Malaysia Package Qualification Report # 082008 (Note 1) I. DECLARATION OF PACKAGED UNITS A. BANNED SUBSTANCES Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU RoHS. Listed in the table below are materials that are neither contained nor intentionally added to this product. Substances / Compounds Cadmium and Cadmium Compounds Hexavalent Chromium and its Compounds Lead and Lead Compounds Mercury and Mercury Compounds Polybrominated Biphenyls (PBB) Polybrominated Diphenylethers (PBDE) Asbestos Azo colorants Ozone Depleting Substances Polychlorinated Biphenyls (PCBs) Polychlorinated Napthalenes Radioactive Substances Shortchain Chlorinated Paraffins Tributyl Tin (TBT) and Triphenyl Tin (TPT) Tributyl Tin Oxide (TBTO) Formaldehyde Weight by mg PPM 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 0 0 0 0 0 0 0 0 0 0 Analysis Report (Note 2) CoA-LN32ACARSEM As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-47080 Rev. *C Page 1 of 3 32L – QFN 5X5X0.40 mm (Saw Version) Pb-Free Package B. MATERIAL COMPOSITION (Note 3) Material Purpose of Use Base Material Leadframe Lead Finish External Plating Die Attach Adhesive Die Circuit Wire Interconnect Mold Compound Encapsulation Substance Composition Cu Si Mg Ni Ni Pd Au Resin Ag Carbocycllic Acrylate Acrylate Additive Si Au Others Phenol Resin Epoxy Resin Carbon Black Silica Fused CAS Number 7440-50-8 7440-21-3 7439-95-4 7440-02-0 7440-02-0 7440-05-3 7440-57-5 ------------------7440-22-4 ------------------- Weight by mg 9.7716 0.0816 0.0204 0.3264 0.1182 0.0103 0.0016 0.0141 0.3337 0.0940 %weight of substance per Homogene ous material 95.8000 0.8000 0.2000 3.2000 90.9000 7.9000 1.2000 3.0000 71.0000 20.0000 ------------------------------------7440-21-3 0.0141 0.0141 1.2700 3.0000 3.0000 100.0000 481 481 43,360 0.0481 0.0481 4.3360 7440-57-5 ------------------(Trade secret ) (Trade secret ) (1333-86-4) 60676-86-0 0.4700 0.0000 0.5025 0.5025 0.0503 15.6948 99.9900 0.0100 3.0000 3.0000 0.3000 93.7000 16,045 2 17,156 17,156 1,716 535,840 1.6045 0.0002 1.7156 1.7156 0.1716 53.5840 % Total: 100.0000 Package Weight (mg): 29.2902 PPM 333,616 2,786 696 11,144 4,034 351 53 481 11,393 3,209 % weight of substance per package 33.3616 0.2786 0.0696 1.1144 0.4034 0.0351 0.0053 0.0481 1.1393 0.3209 II. DECLARATION OF PACKAGING INDIRECT MATERIALS Type Tape & Reel Tray Others Material Cover tape Carrier tape Plastic Reel Tray Shielding bag Lead PPM < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 Cadmium PPM < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 Cr VI PPM < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 Mercury PPM < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 PBB PPM <5.0 <5.0 <0.0005 <5.0 <5.0 PBDE PPM <5.0 <5.0 <0.0005 <5.0 <5.0 Analysis Report (Note2) CoA-COVT-R CoA-CART-R CoA-PLRL-R CoA-TRAY-R CoA-SBAG –R Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-47080 Rev. *C Page 2 of 3 32L – QFN 5X5X0.40 mm (Saw Version) Pb-Free Package Document History Page Document Title: Document Number: 32L - QFN 5X5X0.40 MM (SAW VERSION) PB- FREE PACKAGE MATERIAL DECLARATION DATASHEET 001-47080 Rev. ECN No. Orig. of Description of Change Change ** 2520463 JSO New Specification *A 3307443 HLR Updated the material composition to reflect the values on 4 decimal places. Removed Tube material on Indirect materials table. *B 3683405 HLR Corrected the CAS number of Palladium and total package weight for Assembly Site 1. *C 4055135 YUM Added assembly site name in the Assembly heading. Changed assembly code to assembly site name. Distribution: WEB Posting: None Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-47080 Rev. *C Page 3 of 3