Document No.001-89465 Rev. *A ECN # 4516853 Cypress Semiconductor Package Qualification Report QTP# 050701VERSION*A September 2014 8/14/16-Lead SOIC Package (150 mil) NiPdAu, MSL3 235C & 260C Reflow OSE-Taiwan (T) FOR ANY QUESTIONS ON THIS REPORT, PLEAE CONTACT [email protected] or via a CYLINK CRM CASE Prepared By: Honesto Sintos Reliability Engineer Reviewed By: Rene Rodgers Reliability Manager Approved By: Richard Oshiro Reliability Director Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 1 of 7 Document No.001-89465 Rev. *A ECN # 4516853 PACKAGE QUALIFICATION HISTORY QUAL REPORT DESCRIPTION OF QUALIFICATION PURPOSE DATE COMP. 050701 8/14/16-lead (150 mil) SOIC package, NiPdAu Leadfinish, MSL1, 260C Reflow, OSETaiwan Assembly May 05 050701 Cypress established policy requiring MSL and Reflow Peak Temperature alignment for Cypress and its Assembly Subcontractors. Downgrade from MSL1 to MSL3 Nov 06 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 2 of 7 Document No.001-89465 Rev. *A ECN # 4516853 MAJOR PACKAGE INFORMATION USED IN THIS QUALIFICATION Package Designation: Package Outline, Type, or Name: Mold Compound Name/Manufacturer: Mold Compound Flammability Rating: S16 16-Lead Plastic Small Outline IC Package (SOIC) Hitachi CEL9220THF V-O per UL94 Oxygen Rating Index: None Lead Frame Material: Copper base Lead Finish, Composition / Thickness: NiPdAu Die Backside Preparation Method/Metallization: Backgrinding Die Separation Method: Sawing Die Attach Supplier: Hitatchi Die Attach Material: EN4900G Die Attach Method: Epoxy Wire Bond Method: Thermosonic Wire Material/Size: 1.0mil Thermal Resistance Theta JA °C/W: 131°C/W Package Cross Section Yes/No: N/A Assembly Process Flow: 49-35999M Name/Location of Assembly (prime) facility: OSE-Taiwan (T) MSL Level 3 Reflow Profile 235C & 260C ELECTRICAL TEST / FINISH DESCRIPTION Test Location: Cypress Philippines (CML-R) Note: Please contact a Cypress Representative for other packages availability Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 3 of 7 Document No.001-89465 Rev. *A ECN # 4516853 RELIABILITY TESTS PERFORMED PER SPECIFICATION REQUIREMENTS Stress/Test Test Condition (Temp/Bias) Temperature Cycle MIL-STD-883C, Method 1010, Condition C, -65°C to 150°C Precondition: JESD22 Moisture Sensitivity MSL 1 Pressure Cooker 121°C, 100%RH, 15 Psig Precondition: JESD22 Moisture Sensitivity MSL 1 Result P/F P 168 Hrs., 85°C/85%RH+3IR-Reflow, 260°C+0, -5°C P 168 Hrs., 85°C/85%RH+3IR-Reflow, 260°C+0, -5°C High Accelerated Saturation Test (HAST) 130°C, 3.3V, 85%RH Precondition: JESD22 Moisture Sensitivity MSL 1 P 168 Hrs., 85°C/85%RH+3IR-Reflow, 260°C+0, -5°C Acoustic Microscopy J-STD-020 P Adhesion of Lead Finish MIL-STD-883, Method 2025 P Ball Shear JESD22-B116A P Bond Pull MIL-STD-883 – Method 2011 P External Visual MIL-PRF-38535, MILSTD-883, METHOD 2009 P Internal Visual MIL-STD-883-2014 P Lead Integrity JESD22-B105, MIL STD 883 P Physical Dimensions MIL-STD-1835, JESD22-B100 P Solderability J-STD-002, JESD22-B102 P SEM X-Section MIL-STD-883, Method 883-2018-2 P Wetting Balance Mil-Std-883F Method 2022.2 P X-Ray MIL-STD-883C, Method 2012 P Company Confidential A printed copy of this document is considered uncontrolled. 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Page 4 of 7 Document No.001-89465 Rev. *A ECN # 4516853 Reliability Test Data QTP #:050701 Device Fab Lot # Assy Lot # Assy Loc Duration Samp W129AGT (W129DF) 8410347 610421810 TAIWAN-T COMP 15 0 W129AGT (W129DF) 8410347 610421811 TAIWAN-T COMP 15 0 W129AGT (W129DF) 8410347 610421812 TAIWAN-T COMP 15 0 STRESS: STRESS: Rej ACOUSTIC , MSL1 ADHESION OF LEAD FINISH W129AGT (W129DF) 8410347 610421810 TAIWAN-T COMP 3 0 W129AGT (W129DF) 8410347 610421811 TAIWAN-T COMP 3 0 W129AGT (W129DF) 8410347 610421812 TAIWAN-T COMP 3 0 8410347 610421810 TAIWAN-T COMP 10 0 8410347 610421810 TAIWAN-T COMP 10 0 W W129AGT (W129DF) 8410347 610421810 TAIWAN-T COMP 15 0 129AGT (W129DF) 8410347 610421811 TAIWAN-T COMP 15 0 8410347 610421810 TAIWAN-T COMP 3 0 8410347 610421810 TAIWAN-T COMP 3 0 STRESS: BALL SHEAR W129AGT (W129DF) STRESS: BOND PULL W129AGT (W129DF) STRESS: STRESS: Failure Mechanism EXTERNAL VISUAL INTERNAL VISUAL W129AGT (W129DF) STRESS: LEAD INTEGRITY W129AGT (W129DF) STRESS: PHYSICAL DIMENSIONS W129AGT (W129DF) 8410347 610421810 TAIWAN-T COMP 5 0 W129AGT (W129DF) 8410347 610421811 TAIWAN-T COMP 5 0 W129AGT (W129DF) 8410347 610421812 TAIWAN-T COMP 5 0 W129AGT (W129DF) 8410347 610421810 TAIWAN-T COMP 3 0 W129AGT (W129DF) 8410347 610421811 TAIWAN-T COMP 3 0 W129AGT (W129DF) 8410347 610421812 TAIWAN-T COMP 3 0 W129AGT (W129DF) 8410347 610421810 TAIWAN-T COMP 5 0 W129AGT (W129DF) 8410347 610421811 TAIWAN-T COMP 5 0 W129AGT (W129DF) 8410347 610421812 TAIWAN-T COMP 5 0 STRESS: SOLDERABILITY STRESS: SEM X-SECTION Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 5 of 7 Document No.001-89465 Rev. *A ECN # 4516853 Reliability Test Data QTP #:050701 Device STRESS: Fab Lot # Assy Lot # Assy Loc Duration Samp Rej Failure Mechanism HI-ACCEL SATURATION TEST, 130C, 3.3V, 85%RH, PRE COND 168 HR 85C/85%RH, MSL 1 W129AGT (W129DF) 8410347 610421810 TAIWAN-T 128 47 0 W129AGT (W129DF) 8410347 610421811 TAIWAN-T 128 48 0 STRESS: PRESSURE COOKER TEST, 121C, 100%RH, 15 Psig, PRE COND 168 HR 85C/85%RH, MSL1 W129AGT (W129DF) STRESS: 8410347 610421810 TAIWAN-T 168 50 0 TC COND. C -65C TO 150C, PRE COND 168 HRS 85C/85%RH, MSL1 W129AGT (W129DF) 8410347 610421810 TAIWAN-T 300 50 0 W129AGT (W129DF) 8410347 610421810 TAIWAN-T 1000 50 0 W129AGT (W129DF) 8410347 610421811 TAIWAN-T 300 50 0 W129AGT (W129DF) 8410347 610421811 TAIWAN-T 1000 50 0 W129AGT (W129DF) 8410347 610421812 TAIWAN-T 300 50 0 W129AGT (W129DF) 8410347 610421812 TAIWAN-T 1000 50 0 W129AGT (W129DF) 8410347 610421810 TAIWAN-T COMP 5 0 W129AGT (W129DF) 8410347 610421811 TAIWAN-T COMP 5 0 W129AGT (W129DF) 8410347 610421812 TAIWAN-T COMP 5 0 8410347 610421810 TAIWAN-T COMP 15 0 STRESS: STRESS: WETTING BALANCE X-RAY W129AGT (W129DF) Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 6 of 7 Document No.001-89465 Rev. *A ECN # 4516853 Document History Page Document Title: QTP#050701:8/14/16-Lead SOIC Package (150 mil) NiPdAu, MSL3 235C & 260C Reflow OSE-Taiwan (T) Document Number: 001-89465 Rev. ECN Orig. of No. Change ** 4142063 HSTO *A 4516853 HSTO Description of Change Initial Spec Release Initiate report as per memo LGQ-622. Align qualification report based on the new template in the front page Distribution: WEB Posting: None Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 7 of 7